JP2006165017A - Terminal box for solar cell module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the used amount of a resin material, and to prevent the fault of the rectifying functionality by the resin material. <P>SOLUTION: In a terminal box for a solar cell module, a plurality of terminal boards 30 are arranged side by side on a substrate 11 of the main body 10 of the box. Between the adjoining terminal boards 30, a bypass diode 50 is installed. On the substrate 11, a partition wall member 70 is so set up as to encompass a bare chip diode portion. Outside the partition wall member 70 inside the main body 10 of the box, a resin sealing portion 75 is formed of the resin material introduced into the main body 10 of the box. Since it is not necessary to fill up the interior of the partition wall member 70 with the resin sealing portion 75, the used amount of the resin material can be reduced by just that much. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a terminal box for a solar cell module.

  The solar power generation system supplies a direct current from a solar cell panel laid on the roof of a house to each electrical appliance via an inverter or the like. A solar cell panel consists of a plurality of solar cell modules, and has a structure in which the electrodes of each solar cell module are connected in series or in parallel via a terminal box.

  As a conventional terminal box, one end is arranged adjacent to the inside of the box body, and one end is connected to a plus electrode and a minus electrode drawn from the back side of the solar cell module, and the other end is connected to an external connection cable. One having two terminal plates and a bypass diode bridged between the two terminal plates is known (for example, see Patent Document 1 below). The bypass diode is for short-circuiting the reverse current at the time of reverse load from one side of the external connection cable to the other, and the chip-like rectification function part and the rectification function part are sandwiched between the rectification function part. It consists of a pair of conductor pieces to be connected. Both conductor pieces have a contact portion with the rectifying function portion between the overlapping regions, and extend in a direction away from the contact portion, and are connected to a corresponding terminal plate by soldering or the like during the extension. .

The box body is filled with a resin material for sealing after the terminal plates are arranged side by side. The upper surface of the filled resin material is set at a height position substantially the same as the upper edge of the side wall of the box, so that the connection portion and the like with the solar cell module are hermetically sealed.
Japanese Patent No. 3498945

  By the way, in the above case, since the resin material is filled over the entire area of the box body, there is a concern that the amount of the resin material used increases and the cost increases. Further, when a molten resin material is deposited on the rectifying function part, the rectifying function part may be thermally damaged.

  The present invention has been completed based on the above-described circumstances, and an object of the present invention is to reduce the amount of resin material used and prevent the rectifying function from causing a malfunction due to the resin material.

  As means for achieving the above-mentioned object, the invention of claim 1 includes a positive electrode and a negative electrode of a solar cell module arranged on the substrate of the box body, and an external connection cable corresponding to both electrodes. Resin material introduced into the box body, comprising a terminal plate that electrically relays between and a rectifying element for reverse load bypassing between two corresponding terminal plates The resin sealing portion is formed by the at least one of the rectifying elements, and the resin sealing portion is disposed at a position away from the rectifying element main body in a non-contact state with the rectifying element main body having a rectifying function. It is characterized by its configuration.

  According to a second aspect of the present invention, in the first aspect, prior to the introduction of the resin material, the rectifying element main body and the resin sealing portion surround the periphery of the rectifying element main body on the substrate. A partition wall for partitioning between the two is attached, and the resin sealing portion is provided outside the partition wall.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the resin sealing portion is provided at a connection portion between each lead from the positive electrode and the negative electrode of the solar cell module and the terminal plate. Characterized by where it is attached.

  According to a fourth aspect of the present invention, the upper surface of the connection portion is set at a position lower than the lower surface of the rectifying element, and the upper surface of the resin sealing portion is the resin material. It is characterized in that it is set between the upper surface of the connecting portion and the lower surface of the rectifying element by adjusting the amount of introduction.

  The invention according to claim 5 is characterized in that, in the apparatus according to any one of claims 1 to 4, the rectifying element body is previously covered with a resin mold portion.

<Invention of Claim 1>
A resin sealing portion is formed in the box main body by a resin material introduced into the box main body, and the resin sealing portion is separated from at least a rectifying element main body having a rectifying function among the rectifying elements. Therefore, the amount of resin material used can be reduced by at least the amount of resin material required around the rectifying element body in the prior art. Further, since the high temperature resin material does not adhere around the rectifying element body and the rectifying element body, it is possible to avoid the rectifying element body from being thermally damaged.

<Invention of Claim 2>
Prior to the introduction of the resin material, a partition wall for surrounding the periphery of the rectifier element body and partitioning the rectifier element body and the resin sealing portion is attached on the substrate. It is possible to bring the rectifying element body and the resin sealing portion inside the partition wall into a non-contact state simply by introducing.

<Invention of Claim 3>
Since the resin sealing portion is attached to the connection portion between each lead and the terminal plate from the positive electrode and the negative electrode of the solar cell module, it is possible to prevent the rainwater from being attached to the connection portion or damage due to external force.

<Invention of Claim 4>
Since the upper surface of the resin sealing portion is set between the upper surface of the connection portion and the lower surface of the rectifying element by adjusting the introduction amount of the resin material, the amount of resin material used can be greatly reduced.

<Invention of Claim 5>
Since the rectifying element main body is preliminarily attached by the resin mold portion, the resin mold portion provides a resin sealing function for the rectifying element main body. The resin mold portion in this case is, for example, a form in which only the periphery of the rectifying element body is resin-molded in a rectifying element including a rectifying element body and a pair of conductor pieces sandwiching the rectifying element body and extending in opposite directions. (See those disclosed in Japanese Patent Application Laid-Open Nos. 11-150286 and 2000-216421, etc.).

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. The terminal box for a solar cell module according to the present embodiment is attached to the back side of a solar cell module (not shown) in which a large number of solar cells connected in series on the surface are arranged. And a plurality of terminal plates 30 arranged in parallel on the substrate 11 of the box body 10 and a reverse-flow bypass diode 50 (corresponding to the rectifying element of the present invention) bridged between the adjacent terminal plates 30. Is done. Further, a partition wall member 70 is attached later on the substrate 11 of the box body 10.

  The box body 10 is formed of a synthetic resin material in a box shape having an open top surface, filled with an insulating resin, and covered with a cover (not shown) from above. Specifically, as shown in FIG. 1, the box body 10 includes a substantially rectangular substrate 11 on which a plurality of terminal plates 30 are placed side by side, and a side plate 12 that is raised from the peripheral edge of the substrate 11 and surrounds the four sides. And a partition wall 13 that is raised from a predetermined position on the substrate 11 and partitions the adjacent terminal plates 30. A plurality of substantially rectangular openings 14 are formed in the substrate 11, and the end portions of the terminal plates 30 corresponding to the openings 14 face each other. Leads 77 connected to both the positive electrode and the negative electrode of the solar cell module are inserted into each opening 14 of the substrate 11, and each inserted lead 77 can be connected to the tip of the terminal plate 30 by soldering. Has been.

On the upper surface of the substrate 11, there is provided a locking projection 19 that can be closely fitted in a locked hole 35 provided in the terminal plate 30. The locking projection 19 is formed in a substantially rectangular shape in plan view. A pair of bendable locking pieces 17 project from two positions on both sides of the substrate 11 with the locking protrusion 19 interposed therebetween. Each locking piece 17 is configured to be vertically raised from the substrate 11 and then folded inward, and the upper surface of the terminal board 30 is pressed against the substrate 11 at the folded end. . The locking piece 17 is elastically expanded and deformed by sliding contact with both side portions of the corresponding terminal plate 30 in the process in which the terminal plate 30 is placed on the substrate 11, and the terminal plate 30 is placed on the substrate 11. Accordingly, the folded end is brought into contact with both side portions of the upper surface of the terminal board 30, and the terminal board 30 is pressed and fixed to the substrate 11 side.
Further, notches 20 are provided on both side portions on one end side (the lower side shown in FIG. 1) of the side plate 12, and an external output cable 60 is fitted into the notch 20 from above, and further, a cable pressing member 65 is provided from above. The cable 60 is fixed by being fitted. The partition wall 13 is partitioned and formed along the outer edge shape of the terminal plate 30.

  The terminal plate 30 is formed in a long strip shape from one end to the other end by a conductive metal plate. Corresponding external connection cables 60 are connected to the terminal boards 30 arranged on both sides of the substrate 11. The core wire 62 is exposed at the end of the cable 60 due to the peeling of the covering 61, and the barrel portion 31 formed at the end of the terminal plate 30 is caulked to the core wire 62, whereby the cable 60 and the terminal plate 30. And are to be connected. A connector portion (not shown) is connected to the end of the cable 60.

  Adjacent terminal plates 30 (excluding the terminal plates 30 arranged on both side portions of the substrate 11) are connected together at one end via a connecting portion 32. Of these, one terminal plate 30 does not have a contact point with the solar cell module side, is formed shorter than the other terminal plate 30, and is surrounded by a partition wall 13 around the tip. The heat radiation effect of the heat generated by the bypass diode 50 is enhanced by the amount that the one terminal board 30 is detoured. Attached portions 33 are provided on both side edges of the terminal plate 30 so as to protrude sideways, and the leading edge of the attached portion 33 is arranged in an opposing manner between the adjacent terminal plates 30.

In addition, a bypass diode 50 is bridged between adjacent terminal boards 30 so as to cover the attachment portion 33. In the illustrated case, three bypass diodes 50 are arranged in series across the terminal board 30.
As shown in FIG. 3, the bypass diode 50 is composed of a mesa-type bare chip diode (corresponding to the rectifying device body of the present invention, not shown) and a pair of conductor pieces 51. The two conductor pieces 51 are overlapped with each other. It is electrically connected to the bare chip diode by sandwiching the bare chip diode between them. The bare chip diode has a structure in which an N-type region (cathode electrode) and a P-type region (anode electrode) are stacked in a trapezoidal shape (Mount Fuji) in order from bottom to top, and a glass film (not shown) is formed around the stacked structure. Z)). An N-side conductor piece 51A is disposed at a position facing the N-type region of both the conductor pieces 51, and a P-side conductor piece 51B is disposed at a position facing the P-type region.

In the case of the present embodiment, the N-side conductor piece 51A is superposed below the bare chip diode, and the P-side conductor piece 51B is superposed above the bare chip diode. In addition, a resin mold portion (not shown) made of silicon resin or the like is piled up at the step portion from the upper surface of the N-side conductor piece 51A to the upper surface of the P-side conductor piece 51B in this overlapping region to protect the bare chip diode. It is formed in a shape. The resin mold part is configured as a transparent or translucent elastic body.
Then, the N-side conductor piece 51A and the P-side conductor piece 51B extend in a direction away from the overlapping region with the bare chip diode, and solder welding, resistance welding, or the like on the corresponding terminal plate 30 at the extension end side It is connected by ultrasonic welding.

  The N-side conductor piece 51A is thicker than the P-side conductor piece 51B, and heat dissipation from the N-side conductor piece 51A is performed efficiently. Further, in the middle of the extending direction of the P-side conductor piece 51B, a stress relaxation portion 51E made of a narrow strip extending along the width direction is provided, and welding to the terminal plate 30 is performed by the stress relaxation portion 51E. The stress that occurs sometimes is absorbed. In addition, the bypass diode 50 is penetrated with the terminal board 30 by the positioning pin 15 standingly arranged on the board | substrate 11, and, thereby, positioning is made together with the positioning function of the positioning protection wall 13B mentioned later.

  On the substrate 11, a partition wall member 70 (corresponding to the partition wall of the present invention) is attached so as to surround the periphery of the overlapping region (hereinafter referred to as a bare chip diode portion) sandwiching the bare chip diode in the bypass diode 50. It has been. The partition wall member 70 is formed in a box shape whose upper and lower surfaces are opened by a synthetic resin material and surrounds only the periphery of the bare chip diode portion. Specifically, the partition wall member 70 is placed so as to straddle the both attachment portions 33 of the adjacent terminal plates 30 and includes two pairs of side walls 72 facing each other.

  An escape portion 71 for avoiding interference with the bypass diode 50 is cut out at the lower end edge of the pair of side walls 72 of the two pairs of side walls 72, and the lower end edges of the remaining pair of side walls 72 are formed. Is formed with a positioning portion 72 that can be fitted into a guide groove 13A provided in the substrate 11 in a notch. 13 A of guide grooves are provided in the part which continues between a pair of positioning protection wall 13B for protecting a bare chip diode part, and the partition wall 13 standingly arranged facing this positioning protection wall 13B, A groove width corresponding to the plate thickness of the side wall 72 of the partition wall member 70 is provided. When the partition wall member 70 is placed on the substrate 11, the positioning portion 72 and the guide groove 13 </ b> A are closely fitted to prevent the partition wall member 70 from moving in the plane direction. Further, the box body 11 is filled with an insulating resin material such as a silicone resin, but in the case of the present embodiment, a resin sealing portion 75 made of a resin material is formed outside the partition wall member 70, A simple air layer without the resin sealing portion 75 is formed inside the partition wall member 70.

  Next, the manufacturing method and effects of this embodiment will be described. First, the terminal board 30 and the cable 60 are caulked and connected by caulking the barrel portion 31 of the terminal board 30 to the core wire 62 exposed at the end of the cable 60. Subsequently, the terminal board 30 is placed on the substrate 11 from above. In the process of placing the terminal plate 30 on the substrate 11, the locking projection 19 on the substrate 11 is fitted into the locked hole 35 of the terminal plate 30 and the locking piece 17 on the substrate 11 is brought into contact with the terminal plate 30. Then, it is elastically expanded and deformed by contact, and then the locking projection 19 is closely fitted in the locked hole 35 in a loosely controlled state, and the terminal plate 30 is restrained from being lifted by restoring the locking piece 17. In this state, it is pressed and fixed to the substrate 11 side. And regarding the terminal board 30 distribute | arranged to the both sides of the board | substrate 11, it attaches, covering the cable holding member 65 from the upper part on the cable 60, and fixes the cable 60 on the board | substrate 11. FIG.

Subsequently, the bypass diode 50 is placed between the adjacent terminal plates 30. At this time, the bypass diode 50 is lowered onto the terminal board 30 while keeping the bypass diode 50 along the positioning protection wall 13B. Thereafter, both conductor pieces 51 are connected to the terminal plate 30 by performing solder welding, resistance welding, or ultrasonic welding on both conductor pieces 51 of the bypass diode 50.
Next, the box body 10 is fixed to the back surface side of the solar cell module with an adhesive or a bolt. In the process of attachment, the lead 77 connected to both electrodes of the solar cell module is drawn into the box body 10 through the opening 14 of the substrate 11, and the lead 77 is soldered to the tip of the terminal board 30.

  Thereafter, as shown in FIGS. 2 and 3, the partition wall member 70 is placed on the substrate 11 in the box body 10, specifically on the terminal plate 11, so as to cover the periphery of the bare chip diode portion. Then, the resin material in the melt flow state is poured onto the terminal plate 11 in the partition wall 13 in the box body 10 and into the region outside the partition wall member 70, and then the resin material is solidified as shown in FIG. By doing so, the resin sealing portion 75 is formed. Since the resin sealing portion 75 is partitioned from the bare chip diode portion by the partition wall member 70, the resin sealing portion 75 is disposed in a non-contact state with the bare chip diode portion.

  As described above, according to the present embodiment, since the resin sealing portion 75 provided in the box body 10 is disposed at a position away from the bare chip diode, it is conventionally necessary around the bare chip diode. The amount of the resin material used can be reduced by the amount of the resin material filled, and the raw material cost can be reduced. In addition, the presence of the partition wall member 70 prevents the resin material in the molten state from being deposited on the bare chip diode and its surroundings, so that the bare chip diode can be prevented from being thermally damaged. Moreover, since the bare chip diode is covered with the resin mold portion in advance, the resin-sealed state is formed without depending on the resin sealing portion 75.

<Embodiment 2>
FIG. 5 shows a second embodiment of the present invention. The second embodiment is characterized in that a resin sealing portion 75 is locally formed in a portion of the box body 10 where resin sealing is truly required. In the second embodiment, the same structural parts as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted.

  That is, in the second embodiment, the resin sealing is performed only around the connection portion 80 formed by solder welding the tip portion of each lead 77 connected to the plus electrode and the minus electrode of the solar cell module and the tip portion 30P of the terminal plate 30. A stop 75 is formed. Here, the upper surface of the connection portion 80 is set at a position lower than the lower surface of the bypass diode 50, and the filling is performed so that the resin material is filled to a level between the upper surface of the connection portion 80 and the lower surface of the bypass diode 50. By adjusting the amount, the resin sealing portion 75 covers the connection portion 80 but is in a non-contact state with the bypass diode 50.

  Specifically, the tip 30P of the terminal board 30 is disposed at a position one step lower than the cable 60 side through a step 39 provided in the middle of the terminal board 30 in the length direction, and enters the opening 14 of the board 11. The bottom surface is aligned with the bottom surface of the substrate 11. Therefore, the resin sealing portion 75 can cover the connection portion 80 by filling the inside of the partition wall 13 and the inside of the opening 14 in the box body 10 with the resin material substantially by the thickness of the substrate 11. The amount of resin material used can be greatly reduced.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) In the present invention, a partition wall member is installed so as to surround a portion where the resin sealing portion is really required (for example, a connection portion with a solar cell module), and a resin material is placed inside the partition wall member. The resin sealing portion may be formed by pouring.

  (2) The present invention can also be applied to a package diode in which a resin mold portion is formed in a large square block shape.

The top view which shows the internal structure of a box main body in Embodiment 1 of this invention Sectional view of the box body before resin sealing Perspective view of main part before attaching partition wall member Cross section of box body sealed with resin Sectional drawing of the box main body resin-sealed in Embodiment 2 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Box main body 11 ... Board | substrate 12 ... Side wall 14 ... Opening 30 ... Terminal board 50 ... Bypass diode (rectifier element)
60 ... Cable 70 ... Division wall member (division wall)
75 ... Resin sealing part 77 ... Lead

Claims (5)

A terminal plate that is arranged in parallel on the substrate of the box body and electrically relays between the positive and negative electrodes of the solar cell module and the external connection cable corresponding to both electrodes, and between the corresponding two terminal plates And a rectifying element for bypass at the time of reverse load,
A resin sealing portion is formed in the box main body by a resin material introduced into the box main body, and the resin sealing portion is not in contact with at least the rectifying element main body having a rectifying function among the rectifying elements. A terminal box for a solar cell module, wherein the terminal box is disposed at a position away from the rectifying device main body in a state. Prior to the introduction of the resin material, a partition wall is attached to the substrate to surround the rectifying element body and to partition the rectifying element body and the resin sealing portion. The stop part is provided in the outer side of the said division wall, The terminal box for solar cell modules of Claim 1 characterized by the above-mentioned. The said resin sealing part is adhere | attached on the connection part of each lead | read | reed from the plus electrode and minus electrode of the said solar cell module, and the said terminal board, The Claim 1 or Claim 2 characterized by the above-mentioned. Terminal box for solar cell modules. The upper surface of the connecting portion is set at a position lower than the lower surface of the rectifying element, and the upper surface of the resin sealing portion is adjusted to the upper surface of the connecting portion and the rectifying element by adjusting the introduction amount of the resin material. The terminal box for a solar cell module according to claim 3, wherein the terminal box is set between the lower surface of the solar cell module. The terminal box for a solar cell module according to any one of claims 1 to 4, wherein the rectifying element main body is previously covered with a resin mold portion.

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