JP2006351606A - Terminal box for solar cell module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a use amount of insulating resin and to protect a bypass diode. <P>SOLUTION: In a terminal box for solar cell module, a plurality of terminal boards 30 which electrically repeat the plus electrode and the minus electrode of the solar cell module, and an outer connection cable 60 corresponding to both electrodes, are arranged on a substrate 11 in parallel, and a bypass diode 80 is suspended between the two corresponding terminal boards 30. A peripheral wall 73 is installed on the substrate 11 so that it surrounds the periphery of the bypass diode 80. A fixing member 40 is disposed to cover the opening of the peripheral wall 73. The terminal boards 30 are pressed and fixed with the substrate 11 by the fixing member 40. Since the outer side of the peripheral wall 73 is filled with insulating resin, insulating resin can be saved with which an inner side of the peripheral wall 73 is filled. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a terminal box for a solar cell module.

  The solar power generation system is configured to supply a direct current from a solar cell panel laid on the roof of a house to each electrical appliance via an inverter or the like. A solar cell panel consists of a plurality of solar cell modules, and has a structure in which the electrodes of each solar cell module are connected in series or in parallel via a terminal box.

As a conventional terminal box, one end is connected to the substrate of the box body, and one end is connected to a plus electrode and a minus electrode drawn from the back side of the solar cell module, and the other end is connected to a cable for external connection. There are known two terminal boards and a reverse-flow bypass diode that is bridged between the two terminal boards (see, for example, Patent Document 1 below).
A hole is formed in the terminal plate, and a chrysanthemum is formed on the inner periphery of the hole. And the terminal board is being fixed on the board | substrate by making the tooth | gear of a star bear bite into the protrusion standing on the board | substrate. The bypass diode has conductor pieces extending in opposite directions while sandwiching the bare chip in the thickness direction, and is connected to both terminal boards by soldering both conductor pieces onto the corresponding terminal boards. Further, an insulating resin such as silicon resin is filled so as to cover the entire terminal board and bypass diode, and the inside of the box body is sealed with resin.
Japanese Patent No. 3498945

  By the way, in the above case, since the insulating resin is filled so as to spread over substantially the entire box body, a large amount of relatively expensive insulating resin is required, and there is a hate that the cost is increased. Further, since the bypass diode is in an exposed state until the resin is sealed, there is a concern that the bypass diode may be damaged due to interference with external foreign matter.

  The present invention has been completed based on the above situation, and an object thereof is to reduce the amount of insulating resin used and to further protect the bypass diode.

  As means for achieving the above object, the invention of claim 1 is a plurality of terminals for electrically relaying between a positive electrode and a negative electrode of a solar cell module and an external connection cable corresponding to both electrodes. In the solar cell module terminal box in which a plate is juxtaposed on the substrate, and a rectifying element for bypass during reverse load is bridged between the corresponding two terminal plates, the substrate has a periphery of the rectifying device. And a fixing member that is formed integrally with or separately from the peripheral wall and presses and fixes the terminal plate between the peripheral board and the opening so as to cover the opening of the peripheral wall. It is characterized by its configuration.

  According to a second aspect of the present invention, in the first aspect, the two terminal plates over which the rectifying element is bridged are connected to each other by a connecting piece so as to be detachable from each other, and the connecting piece has the peripheral wall. It is characterized in that it is disposed so as to protrude outward from the terminal board, and is displaced from the terminal board by being displaced in a direction intersecting the board surface direction of the terminal board after the fixing member is mounted.

The invention of claim 3 is characterized in that, in the invention of claim 1 or 2, the fixing member is provided with fins for heat dissipation.
According to a fourth aspect of the invention, there is provided the method according to any one of the first to third aspects, wherein the peripheral wall is arranged so as to be able to abut in a length direction and a width direction of a connection region of the rectifying element in the terminal plate. Thus, the terminal board is characterized by restricting the movement of the terminal board.

<Invention of Claim 1>
Since the peripheral wall surrounding the periphery of the rectifying element is provided on the substrate, the insulating resin can be saved by filling the outer side of the peripheral wall with the insulating resin. , Can reduce costs. In addition, since the fixing member is mounted on the substrate so as to cover the opening of the peripheral wall, the rectifying element can be protected from external foreign matter. In addition, since this fixing member has a function of pressing and fixing the terminal plate between the fixing member and the substrate, the number of parts can be reduced.

<Invention of Claim 2>
After connecting the two terminal plates that span the rectifying element with a connecting piece, the rectifying element is inserted inside the peripheral wall together with the connection region of the rectifying element in the terminal plate, and the connecting piece protrudes outside the peripheral wall. Arrange. After that, a fixing member is mounted so as to cover the opening of the peripheral wall, and from the state where the terminal plate is fixed on the substrate, the connecting piece is picked and displaced in a direction crossing the plate surface direction of the terminal plate, and the connecting piece is then packed. Fold it away from the terminal board. According to the second aspect of the present invention, during the assembling operation to the substrate, the two terminal plates over which the rectifying element is bridged are kept at a constant interval by the connecting piece, so that a torsional force or the like is unnecessary for the rectifying element. The rectifying element can be protected without applying force.

<Invention of Claim 3>
Since the heat radiating fin is provided on the fixing member, the heat generated by the rectifying element can be efficiently radiated through the heat radiating fin.
<Invention of Claim 4>
Since the peripheral wall abuts in the length direction and the width direction of the connection region of the rectifying element in the terminal plate, the terminal plate is juxtaposed on the substrate in a state in which its movement is restricted, so the positioning of the terminal plate is ensured Made.

<Embodiment>
An embodiment of the present invention will be described with reference to FIGS. The terminal box for a solar cell module according to the present embodiment is attached to the back side of a solar cell module (not shown) in which a large number of solar cells connected in series on the surface are arranged. And a large number of terminal plates 30 disposed in the box body 10 and a reverse-flow bypass diode 80 (corresponding to the rectifying element of the present invention) bridged between the adjacent terminal plates 30. In the following description, the upper and lower directions will be described with reference to FIG. 5, and the upper and lower directions will be described with the upper side of FIG.

  The box body 10 is formed in a box shape with an open top surface by a synthetic resin material, and after a predetermined region partitioning the inside is filled with an insulating resin, a cover (not shown) is covered from above. It has become. Specifically, as shown in FIG. 1A, the box main body 10 is raised from the peripheral portion of the substrate 11 and a substantially rectangular substrate 11 on which a plurality of terminal boards 30 can be placed side by side. The surrounding side plate 12 is provided with a partition wall 13 that rises from a predetermined position on the upper surface of the substrate 11 and positions the terminal plate 30.

  At the front end of the substrate 11, an opening 14 is opened over substantially the entire width, and the tip of each terminal plate 30 faces the opening 14. Leads (not shown) connected to both the positive electrode and the negative electrode of the solar cell module are inserted into the opening 14 of the substrate 11, and each inserted lead is soldered to the tip of the corresponding terminal plate 30. Connection is possible by attaching. A partition piece 19 is formed in the opening 14 of the substrate 11 so as to project each terminal plate 30 by extending the front end of the partition wall 13 forward.

Cutouts 20 are provided on both side portions of the rear end of the side plate 12, and an external output cable 60 is fitted into the cutout portion 20 from above, and a cable pressing member 65 is fitted from above to fix the cable 60. It is like that.
Further, a case 70 separate from the box body 10 is attached to the box body 10, and the attached case 70 is placed on the placement surface of the substrate 11. The mounting surface of the substrate 11 is configured to have a large area substantially at the center of the substrate 11, and a protruding piece receiving groove (not shown) that can receive the protruding piece 71 formed on the case 70 behind the mounting surface. )). The projecting piece receiving grooves are recessed at both end portions of the partition wall 13 traversing the substrate 11, and the tip portions of the projecting pieces 71 formed on the case 70 are inserted into the projecting piece receiving grooves from the substrate 11 of the case 70. The rise of is now regulated.

  The case 70 is formed of a synthetic resin material in a box shape with an open top surface, and includes a bottom wall 72 having a substantially rectangular shape and a peripheral wall 73 raised from the peripheral edge of the bottom wall 72. The top surfaces of the bottom wall 72 are separated from each other by a partition wall 74 extending in the front-rear direction. The upper surface of the bottom wall 72 is configured to have a width corresponding to the size of the terminal plate 30 placed here, and the left side is wider than the right side. The extending end of the partition wall 74 is integrally joined with the peripheral wall 73, and an escape recess 75 in which the bypass diode 80 is arranged across is provided in the middle of the extension. In addition, escape recesses 75 for the bypass diode 80 are also provided on both side walls of the peripheral wall 73, and an escape recess 75 for allowing the front end of the terminal plate 30 to face the opening 14 is formed on the front side wall of the peripheral wall 73. On the rear side wall of the peripheral wall 73, relief recesses 75 are provided in order to avoid interference with the fractured portion 26 formed in the connecting piece 25 that bridges the two terminal plates 30. On both sides of the rear side wall of the peripheral wall 73, a pair of projecting pieces 71 are formed to protrude rearward. Both projecting pieces 71 can be inserted into the projecting piece receiving grooves of the substrate 11 by sliding from the front.

  A window hole 77 that communicates the bottom wall 72 and the substrate 11 is formed in a substantially central portion in the front-rear direction of the bottom wall 72 so as to extend in the width direction. The window hole 77 is disposed at a position corresponding to the bypass diode 80, and an insulating resin portion (not shown) is interposed between the bypass diode 80 and the solar cell module when the insulating resin enters from below the peripheral wall 73. Can be interposed. Therefore, the heat generated by the bypass diode 80 can be radiated to the solar cell module side through the insulating resin portion.

  The case 70 is covered with a fixing member 40 as a lid member. The fixing member 40 is attached to the case 70 and thus the substrate 11 so as to cover the opening of the peripheral wall 73, and the terminal plate 30 is sandwiched between the fixing member 40 and the substrate 11 (the bottom wall 72 of the case 70) in accordance with the attaching operation. It has become. Specifically, as shown in FIGS. 9 to 11, the fixing member 40 includes a covering wall 41 having a substantially rectangular shape, and a hanging wall 42 extending downward from the periphery of the covering wall 41, and the hanging wall 42 has a peripheral wall. 73 can be internally fitted. At a position near the square on the lower surface of the cover wall 41, an apron-shaped pressing piece 43 provided with a plate surface along the width direction is suspended. The pressing pieces 43 are arranged in a total of four strips on the left and right sides at the positions corresponding to the intermediate terminals 31 (described later) accommodated in the case 70, and the intermediate terminals 31 corresponding to the ones located on the front and rear are arranged. The intermediate terminal 31 is restricted from being lifted by pressing the front and rear two positions.

  A pair of overhanging pieces 44 are formed to project outward from both sides in the width direction from the hanging wall 42. Similarly, two front and rear pressing pieces 43 are suspended from the lower surface of the overhanging piece 44, and the pressing piece 43 presses a cable connection terminal 33 (described later) placed outside the case 70. The floating of the cable connection terminal 33 is restricted. In addition, on the upper surface (outer surface) of the covering wall 41 of the case 70, a heat radiation fin 45 having a bowl-shaped unevenness is formed. The heat radiation fins 45 have a large number of streaks extending in the width direction, and are formed over the entire length from the covering wall 41 to the overhanging piece 44. When the bypass diode 80 generates heat, the heat can be efficiently radiated through the heat radiating fins 45.

  Similarly, the leading end of the terminal plate 30, the bypass diode 80, and the breaking portion 26 of the connecting piece 25 are inserted into the drooping wall 42 at positions corresponding to the relief recesses 75 formed in the peripheral wall 73 of the case 70. A relief recess 46 is provided to allow the above. Of these, the relief recess 46 corresponding to the broken portion 26 of the connecting piece 25 is cut out from the drooping wall 42 to a part of the cover wall 41, and the cutout piece thus formed extends vertically. A pair of slits 47 are formed at the lower edge of the wall 42. The notch piece is formed with a first locking piece 48 that can be bent and deformed between the slits 47.

  As shown in FIG. 5, the lower end of the bottom surface 72 of the bottom wall 72 of the case 70 is engaged with the small hole 17 penetrating the substrate 11 at the front end portion (hanging lower end portion) of the first locking piece 48. An inward locking claw 48A that is elastically locked in a hooked state is formed. Second locking pieces 49 </ b> A and 49 </ b> B are formed at positions facing the first locking pieces 48 on the hanging wall 42. The second locking pieces 49A and 49B are composed of a front locking piece 49A located on the front side and a rear locking piece 49B located on the rear side, and have a bending space therebetween and sandwich this bending space. Are arranged symmetrically. At the front end portion of the rear side locking piece 49B, it is engaged with the large hole 18 larger than the small hole 17 penetrating the substrate 11, and is elastically locked in a state of being hooked on the lower surface front end portion of the bottom wall 72 of the case 70. An inward locking claw 49E is formed. On the other hand, an outward locking claw 49F that is engaged with the same large hole 18 and elastically locked in the recessed portion 13A in the root portion of the partition wall 13 is formed at the tip of the front locking piece 49A. ing.

  When the fixing member 40 is assembled to the case 70, the first locking piece 48 and the rear locking piece 49 </ b> B are arranged along the peripheral wall 73 and the locking claws 48 </ b> A and 49 </ b> E are formed on the bottom wall 72 of the case 70. By being elastically locked to the lower surface, the fixing member 40 is held in a state of being prevented from coming off from the case 70, and the outward locking claw 49F of the front locking piece 49A is elastically locked to the root portion of the partition wall 13. As a result, the fixing member 40 is held together with the case 70 with respect to the substrate 11 in a state of being prevented from coming off. Therefore, in the case 70, the protrusion 71 is inserted into the protrusion receiving groove and the front side locking piece 49A is locked to the base portion of the partition wall 13, so that the front and rear ends thereof are restricted from rising. It is fixed to the substrate 11 in a state.

  The terminal plate 30 is formed in a substantially strip shape by cutting a conductive metal plate material or the like. The terminal boards 30 arranged at both ends of the substrate 11 are configured as cable connection terminals 33 to which external connection cables 60 are connected. A core wire 61 is exposed at the end of the cable 60 by peeling off the covering portion 62, and the barrel portion 32 formed at the rear end portion of the cable connection terminal 33 is caulked to the core wire 61, whereby the cable 60 And the cable connection terminal 33 are connected. A connector portion (not shown) is connected to the extended end of the cable 60.

  The cable connection terminal 33 is narrow from the second half to the first half via a step 33A, and the partition wall 13 of the substrate 11 extends along the step 33A, so that its play is restricted with respect to the substrate 11. Is positioned. Further, the cable connection terminal 33 is provided with a through hole 33 </ b> B at a position corresponding to the bypass diode 80. An extension piece 34 that is bent into a substantially L shape from one hole edge of the thickness reduction hole 33B is formed inside the thickness reduction hole 33B, and is raised by raising the tip end side of the extension portion 34. A piece 35 is formed. The cut and raised piece 35 penetrates the positioning hole 88 of the bypass diode 80 and is connected to the bypass diode 80 in a conductive manner by being soldered there. At this time, since the heat propagation by the solder is effectively blocked by the hole 33B, the soldering operation time can be shortened and the bare chip 81 (described later) of the bypass diode 80 can be prevented from being damaged by heat. It is like that.

  One of the two terminal plates 30 (intermediate terminals 31) located in the middle excluding the cable connection terminal 33 is a wide large terminal 31A, and the other is narrower than the large terminal 31A and smaller than the cable connection terminal 33. The middle-sized terminal 31B is wide. The intermediate terminal 31 is thicker than the cable connection terminal 33, and its rear half is a wide part 31E (corresponding to the connection region of the bypass diode 80 in the terminal plate 30 of the present invention), while its first half The portion is a narrow portion 31F that is narrower than the wide portion 31E, and a stepped shoulder portion 31G is formed from the wide portion 31E to the narrow portion 31F. The wide portion 31E can be fitted into the case 70 without rattling, the wide portion 31E of the large terminal 31A is supported by the support protrusion 79 in the left region of the case 70, and the wide portion 31E of the medium-sized terminal 31B is the case. 70 is supported by the support protrusion 79 in the right region. The support protrusion 79 is disposed so as to be displaced from the pressing piece 43 in the vertical direction.

  The bypass diode 80 includes a bare chip 81 that exhibits a rectifying function and a thin plate-like conductor piece 82 that is connected to the bare chip 81. The conductor pieces 82 are arranged so as to bridge between the two adjacent terminal plates 30, and in the illustrated case, the three conductor pieces 82 are arranged on substantially the same straight line across the terminal plates 30. One end of the conductor piece 82 is connected to one of the terminal plates 30 by soldering, and the other end of the conductor piece 82 is sandwiched between the other (the wide portion 31E in the intermediate terminal 31) and the bare chip 81 is sandwiched. The other is soldered and connected. A positioning hole 88 is formed through one end of the conductor piece 82 connected to the cable connection terminal 33. After the cut and raised piece 35 is inserted through the positioning hole 88, solder welding is performed on the root portion of the cut and raised piece 35. Applied.

  The bare chip 81 has a structure in which an N-type region (cathode electrode) and a P-type region (anode electrode) are stacked, and is placed on the other terminal board 30 and then covered with a conductor piece 82. According to such a configuration, the heat generated in the bare chip 81 can be directly and quickly radiated to the terminal board 30, and the heat dissipation characteristics are better than when the conductor piece 82 is interposed.

  Two bare chips 81 are placed on both side edges of the large terminal 31A. Of these, one bare chip 81 can abut the N-shaped region on the large terminal 31A, while the other bare chip 81 can abut the P-shaped region on the large terminal 31A, and thus has one large terminal. The size is reduced by allowing current to flow between the cable connection terminals 33 through 31A. The reason why the large terminals 31A are formed wide is to efficiently dissipate the heat generated by the two bare chips 81.

  The large terminal 31 </ b> A and the middle terminal 31 </ b> B are connected to each other via a connecting piece 25. Therefore, the separation distance between the large terminal 31A and the small terminal is always kept constant so that unnecessary stress is not generated in the bypass diode 80 bridged between the two. Specifically, the connecting piece 25 is connected to both rear end edges of the large terminal 31 </ b> A and the middle terminal 31 </ b> B and protrudes backward, and is connected to the protruding ends of the both broken parts 26 and extends in the width direction. And an operation unit 27. As shown in FIG. 7, the breaking portion 26 has a cut groove 28 in the width direction and can be broken by using the cut groove 28 as a trigger. Further, the operation portion 27 can be induced to cause a breaking operation of the breaking portion 26 by being moved upward or downward by picking up the operation portion 27.

  When the fixing member 40 is put on the case 70 after the intermediate terminal 31 with the bypass diode 80 is received, the intermediate terminals 31 are fixed by the fixing member 40, respectively. In this state, the operation portion 27 of the connecting piece 25 is exposed outside the peripheral wall 73 of the case 70. Thereafter, when the exposed operating portion 27 is picked and pulled upward, the breaking portion 26 is broken and separated from the intermediate terminal 31.

  Next, the manufacturing method of this embodiment is demonstrated. First, the large terminal 31A and the medium terminal 31B are connected by the connecting piece 25, and then the bare chip 81 and the conductor piece 82 are sequentially placed on both side edges of the large terminal 31A, and the large terminal is mounted on the left edge of the medium terminal 31B. The conductor piece 82 extending from the 31A side is placed, and further, the bare chip 81 and the conductor piece 82 are placed in order on the right edge of the middle-sized terminal 31B, so that the three bypass diodes 80 are arranged on a straight line in the width direction. Connect by hand soldering or reflow soldering. Then, these are integrated to form the terminal unit W shown in FIG.

  On the other hand, the barrel portion 32 of the cable connection terminal 33 is caulked to the core wire 61 exposed at the end of the cable 60, and the terminal plate 30 and the cable 60 are caulked and connected. Subsequently, the cable connection terminal 33 is placed on the substrate 11 while being fitted into the corresponding partition wall 13, and in this state, the cable 60 is covered with the cable pressing member 65 from above to fix the cable 60. Further, the projecting piece 71 of the case 70 is slid and inserted into the projecting piece receiving groove of the partition wall 13, and the case 70 is positioned on the mounting surface of the substrate 11. Then, the terminal unit W is fitted into the case 70 from above, and the intermediate terminal 31 is placed on the upper surface of the bottom wall 72. Then, the intermediate terminal 31 is in a state in which the play in the front-rear direction and the width direction is restricted by the peripheral wall 73, whereby the intermediate terminal 31 is reliably positioned.

  As the terminal unit W is accommodated in the case 70, the cut and raised pieces 35 of the cable connection terminal 33 are passed through the positioning holes 88 in the conductor pieces 82 protruding outward in the width direction of the intermediate terminal 31. Solder welding is performed on the base portion of 35. Next, as shown in FIG. 2 to FIG. 3, the fixing member 40 is put on the case 70 from above, and the first locking piece 48 and the second locking piece of the fixing member 40 are attached to predetermined portions of the case 70 and the substrate 11. 49A and 49B are elastically locked. Then, as shown in FIGS. 5 and 6, the fixing member 40 is fixed to the substrate 11 together with the case 70 in a state in which the lifting of the fixing member 40 is restricted, and each terminal plate 30 is formed between the pressing piece 43 and the support protrusion 79. It is fixed with being sandwiched between them.

  In a state where the intermediate terminal 31 is fixed in this manner, as shown in FIGS. 7 to 8, the operation portion 27 of the connecting piece 25 is picked and lifted upward, that is, the connecting piece 25 intersects the plate surface direction of the terminal plate 30. Accordingly, the breaking portion 26 of the connecting piece 25 is broken so as to be snapped with the cut groove 28 as a boundary. Then, as shown in FIG. 4, the connecting piece 25 is disconnected from the intermediate terminal 31, and the large terminal 31 </ b> A and the middle-sized terminal 31 </ b> B are electrically insulated except for the path by the bypass diode 80.

  Thereafter, the box body 10 is fixed to the solar cell module with an adhesive, a double-sided tape, or a bolt. In the process of attachment, the lead connected to the electrode of the solar cell module is drawn into the box body 10 through the opening 14 of the substrate 11, and the lead is soldered to the tip of the terminal plate 30. Then, an insulating resin such as a silicone resin is filled in the area inside the box body 10 and outside the peripheral wall 73, and the cover is further covered to complete the assembly. At this time, since the inside of the case 70 is covered with the fixing member 40, the insulating resin flowing into the window hole 77 can be prevented from filling the inside of the case 70 with the insulating resin. In addition, by filling the box body 10 with an insulating resin, a solder connection portion with the lead in the terminal plate 30 and a caulking connection portion with the cable 60 in the cable connection terminal 33 are hermetically sealed.

  As described above, according to the present embodiment, by filling the outer side of the peripheral wall 73 with the insulating resin, it is possible to save the amount of the insulating resin that is filled inside the peripheral wall 73 and to reduce the cost. it can. Further, since the fixing member 40 is mounted so as to cover the opening of the peripheral wall 73, the bypass diode 80 is protected from external foreign substances until the resin sealing is performed. In addition, since the fixing member 40 has a function of pressing and fixing the terminal plate 30 between the fixing member 40 and the substrate 11, the number of parts can be reduced as compared with the case where the fixing member 40 has such a function.

  Further, until the terminal plate 30 is fixed by the fixing member 40, the large-sized terminal 31A and the medium-sized terminal 31B are held at a constant interval by the connecting piece 25, so that unnecessary force such as torsional force is applied to the bypass diode 80. Therefore, the bypass diode 80 can be protected.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) According to the present invention, the peripheral wall may be integrated with the fixing member such that it also serves as a hanging wall of the fixing member. In this case, there may be no case.
(2) According to the present invention, the peripheral wall may be erected integrally on the substrate. In this case, there may be no case.
(3) In the above embodiment, the terminal unit is accommodated in the case after the case is placed on the substrate. However, according to the present invention, after the terminal unit is accommodated in the case, the case with the terminal unit is disposed on the substrate. You may put it on.

(4) Although the bare chip diode is used as the bypass diode in the above embodiment, a known package diode may be used according to the present invention. When a bare chip diode is used, the bare chip may be sandwiched between two conductor pieces, and both conductor pieces may be soldered to adjacent terminal plates.
(5) In the above embodiment, the peripheral wall surrounds the wide portion of the intermediate terminal. However, according to the present invention, the peripheral wall only needs to surround at least the periphery of the bypass diode. This is because the bypass diode can be protected.

(A) Plan view showing the internal structure of the box body of this embodiment (B) Plan view of the terminal unit The top view which shows the state which accommodated the terminal unit The top view which shows the state which covered the fixing member The top view which shows the state which disconnected the connection piece AA sectional view of FIG. Sectional view showing cable connection terminals BB sectional view of FIG. Sectional view when the connecting piece is cut from the state shown in FIG. Bottom view of fixing member Rear view of fixing member Front view of fixing member

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Box main body 11 ... Board | substrate 13 ... Partition wall 14 ... Opening part 25 ... Connection piece 26 ... Breaking part 31 ... Intermediate | middle terminal 31E ... Wide part 40 ... Fixing member 41 ... Cover wall 43 ... Holding piece 70 ... Case 72 ... Bottom Wall 73 ... Surrounding wall

Claims (4)

A plurality of terminal plates that are electrically connected between the positive and negative electrodes of the solar cell module and the external connection cables corresponding to both electrodes are arranged in parallel on the substrate, and the two corresponding terminal plates are reversed. In the terminal box for the solar cell module in which the rectifying element for bypassing the load is bridged,
A peripheral wall surrounding the periphery of the rectifying element is provided on the substrate, and a fixing member that is formed integrally with or separate from the peripheral wall and presses and fixes the terminal plate between the substrate and the substrate. A terminal box for a solar cell module, which is mounted so as to cover the opening of the peripheral wall. The two terminal plates spanned by the rectifying element are connected to each other by a connecting piece so as to be separable from each other,
The connecting piece is disposed to protrude outward from the peripheral wall, and after the fixing member is mounted, the connecting piece is displaced in a direction intersecting a plate surface direction of the terminal plate and cut from the terminal plate. The terminal box for solar cell modules of Claim 1. The terminal box for a solar cell module according to claim 1, wherein the fixing member is provided with fins for heat dissipation. The said surrounding wall is distribute | arranged so that the contact direction of the connection area | region of the said rectifying element in the said terminal board can be contact | abutted, The play of this terminal board is controlled. The terminal box for solar cell modules in any one of.

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