JP3904114B2 - Manufacturing method of terminal box for solar cell module - Google Patents

Manufacturing method of terminal box for solar cell module Download PDF

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JP3904114B2
JP3904114B2 JP2004128432A JP2004128432A JP3904114B2 JP 3904114 B2 JP3904114 B2 JP 3904114B2 JP 2004128432 A JP2004128432 A JP 2004128432A JP 2004128432 A JP2004128432 A JP 2004128432A JP 3904114 B2 JP3904114 B2 JP 3904114B2
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terminal
conductor piece
box
solar cell
terminal board
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JP2005311181A (en
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和樹 内藤
裕之 吉川
誠 東小薗
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住友電装株式会社
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-RED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30Electrical components
    • H02S40/34Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H02S40/345Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-RED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30Electrical components
    • H02S40/34Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00Integration of renewable energy sources in buildings
    • Y02B10/10Photovoltaic [PV]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Description

本発明は、太陽電池モジュール用端子ボックス及びその太陽電池モジュール用端子ボックスの製造方法に関する。   The present invention relates to a solar cell module terminal box and a method of manufacturing the solar cell module terminal box.
太陽光発電システムは、家屋の屋根上に敷設した太陽電池パネルからの直流電流をインバータ等を介して各電器製品に供給する構成とされる。太陽電池パネルは複数の太陽電池モジュールからなり、各太陽電池モジュールの電極を端子ボックスを介して直列または並列接続した構造となっている。   The solar power generation system is configured to supply a direct current from a solar cell panel laid on the roof of a house to each electrical appliance via an inverter or the like. A solar cell panel consists of a plurality of solar cell modules, and has a structure in which the electrodes of each solar cell module are connected in series or in parallel via a terminal box.
従来の端子ボックスとしては、ボックス内に隣接して配されて一端が太陽電池モジュールの裏面側から引き出されたプラス電極及びマイナス電極に接続されるとともに他端が外部接続用ケーブルに接続される端子板と、この端子板間に架け渡されるバイパスダイオードとを備えたものが知られている(例えば、以下の特許文献1を参照)。バイパスダイオードは、逆負荷時の逆電流を外部接続用ケーブルの一方から他方へ短絡するためのものであって、チップ状のダイオード機能部とこのダイオード機能部を挟み込むようにして同ダイオード機能部に接続される一対の導体片とからなる。各導体片は、互いの重合部間にダイオード機能部との接点部を有し、この接点部から互いに反対方向へ延出しその延出端側で対応する端子板に半田付け等により接続されている。ここで、各導体片の接点部は、隣接する端子板間にてボックスの底面に下支えされた状態もしくは浮いた状態で配されるようになっている。
特許第3498945号公報
As a conventional terminal box, a terminal which is arranged adjacent to the box and has one end connected to a plus electrode and a minus electrode drawn from the back side of the solar cell module and the other end connected to an external connection cable A device including a board and a bypass diode bridged between the terminal boards is known (for example, see Patent Document 1 below). The bypass diode is for short-circuiting the reverse current at the time of reverse load from one side of the external connection cable to the other, and the chip-like diode function part is sandwiched between the diode function part and the diode function part. It consists of a pair of conductor pieces to be connected. Each conductor piece has a contact portion with the diode function portion between the overlapping portions, and extends in the opposite direction from this contact portion and is connected to the corresponding terminal plate by soldering or the like on the extended end side. Yes. Here, the contact portion of each conductor piece is arranged between the adjacent terminal plates in a state of being supported on the bottom surface of the box or in a floating state.
Japanese Patent No. 3498945
ところで、上記の場合は、ダイオード機能部で発生した熱を各導体片を通じて端子板側へ放熱させる必要性があるため、速やかな熱伝導性を確保し難いという事情があった。そのため、ダイオード機能部側に熱がこもってダイオード機能部のバイパス機能が不具合を起こす懸念もあった。   By the way, in the above case, it is necessary to dissipate the heat generated in the diode function part to the terminal plate side through each conductor piece, so that it is difficult to ensure quick thermal conductivity. For this reason, there is a concern that heat accumulates on the diode function part side and the bypass function of the diode function part causes a problem.
本発明は上記のような事情に基づいて完成されたものであって、その目的は、端子ボックスの放熱特性を良好にし、それを実現するに当たり、ベアチップダイオードと導体片とを半田溶接で対応する端子板に接合可能とし、かつリフロー装置を利用することによって同端子ボックスの生産性を高めるところにある。 The present invention has been completed based on the above circumstances, and its purpose is to improve the heat dissipation characteristics of the terminal box , and to realize it, the bare chip diode and the conductor piece are supported by solder welding. The terminal box can be joined to the terminal board and the reflow device is used to increase the productivity of the terminal box.
上記の目的を達成するための手段として、請求項1の発明は、ボックス本体内に複数並設されて太陽電池モジュールのプラス電極及びマイナス電極が接続され得る端子板と、この端子板に接続され得る外部接続用のケーブルと、対応する二つの端子板のうちの一方の端子板に接続されるとともにこの一方の端子板から他方の端子板へ架け渡される導体片と、この導体片と前記他方の端子板との間に挟み込まれて双方と直接的に接続する逆負荷時バイパス用のチップ状の整流素子本体とを備え、かつこの整流素子本体がメサ型のベアチップダイオードからなり、同ベアチップダイオードのP形領域が前記導体片と、N形領域が前記他方の端子板とそれぞれ接続されてなる太陽電池モジュール用端子ボックスの製造方法であって、前記対応する二つの端子板同士を橋渡し部により一体に連結した状態となし、この連鎖状の端子板をカーボン治具に位置決め状態でセットするとともに前記端子板上にペースト半田を塗布し、その後、前記整流素子本体及び前記導体片を夫々対応する端子板のペースト半田上に載せ、続いて、リフロー装置によりペースト半田を加熱処理して溶融固化することにより、前記整流素子本体及び前記導体片を対応する端子板に半田溶接し、次いで、前記端子板を前記ボックス本体に組み付けたあと前記橋渡し部を切除するところに特徴を有する。 As means for achieving the above-mentioned object, the invention of claim 1 includes a terminal plate arranged in parallel in the box body to which the positive electrode and the negative electrode of the solar cell module can be connected, and connected to the terminal plate. A cable for external connection to be obtained, a conductor piece connected to one of the corresponding two terminal boards and spanned from the one terminal board to the other terminal board, the conductor piece and the other A chip-shaped rectifying device body for reverse load that is sandwiched between and directly connected to both terminals , and the rectifying device body is composed of a mesa-type bare chip diode. and P-type region the conductor piece, a manufacturing method of a solar cell module terminal box N-type region is respectively connected with the other terminal plates, the corresponding secondary The terminal plates are integrally connected by a bridging portion, the chained terminal plates are set in a positioning state on a carbon jig, and paste solder is applied on the terminal plates, and then the rectifying element body And placing the conductor pieces on the corresponding terminal board paste solder, and then heat-treating the paste solder by a reflow device to melt and solidify the rectifier element body and the conductor pieces on the corresponding terminal board. It is characterized in that the bridge portion is cut out after solder welding and then assembling the terminal board to the box body.
<請求項1の発明>
チップ状の整流素子本体を導体片と端子板との間に直接的に挟み込む構造となっているから、整流素子本体で発生した熱を端子板側へダイレクトに速やかに放熱することが可能となり、導体片を介在させる場合に比べて、放熱特性が良好となる。また、整流素子本体と導体片とをリフロー半田によって対応する端子板に接合することができ、かつ、リフロー装置の利用によって生産性が高められる。
<Invention of Claim 1>
Since the chip-shaped rectifying device body is directly sandwiched between the conductor piece and the terminal plate, the heat generated in the rectifying device body can be directly and quickly radiated to the terminal plate side, Compared with the case where a conductor piece is interposed, the heat dissipation characteristics are improved. Further, the rectifying element main body and the conductor piece can be joined to the corresponding terminal plate by reflow soldering, and the productivity is increased by using the reflow device.
また、導体片がベアチップダイオードのP形領域(アノード側)と接続され、端子板がベアチップダイオードのN形領域(カソード側)と接続されるから、端子板とベアチップダイオードとの間の接合面積を大きく確保することができ、ベアチップダイオードで発生した熱をN形領域から端子板へ効率良く放熱させることができる。 Also, since the conductor piece is connected to the P-type region (anode side) of the bare chip diode and the terminal plate is connected to the N-type region (cathode side) of the bare chip diode, the junction area between the terminal plate and the bare chip diode is increased. A large amount can be secured, and the heat generated in the bare chip diode can be efficiently radiated from the N-type region to the terminal board.
本発明の実施形態を図1ないし図4によって説明する。本実施形態にかかる太陽電池モジュール用端子ボックスBは、表面に直列接続された多数の太陽電池セルを配した太陽電池モジュール(図示せず)の裏面側に取り付けられるものであって、ボックス本体10と、ボックス本体10内に並設された多数の端子板30と、隣接する端子板30間に架け渡された導体片50と、導体片50と端子板30との間に挟み込まれたベアチップダイオード70とを備えて構成される。   An embodiment of the present invention will be described with reference to FIGS. The solar cell module terminal box B according to the present embodiment is attached to the back side of a solar cell module (not shown) in which a large number of solar cells connected in series on the surface are arranged. A large number of terminal plates 30 arranged in parallel in the box body 10, a conductor piece 50 spanned between adjacent terminal plates 30, and a bare chip diode sandwiched between the conductor piece 50 and the terminal plate 30 70.
ボックス本体10は、合成樹脂材によって上面開放の箱型に形成されており、その内部に絶縁樹脂が充填され、かつ、上方からカバー(図示せず)が被せられるようになっている。詳しくはボックス本体10は、端子板30が横並びで載置された略矩形状の基板11と、この基板11の外縁部から立ち上げられて周囲を取り囲む側板12と、基板11の所定位置から立ち上げられて端子板30間を区画する仕切り壁13とを備える。基板11には略方形状の開口14が四つあいており、各開口14に対応する端子板30の先端部が臨んでいる。基板11の各開口14には太陽電池モジュールのプラス電極及びマイナス電極に接続されたリード(図示せず)が通され、通された各リードが端子板30の先端部に半田付け等により接続されるようになっている。   The box body 10 is formed of a synthetic resin material in a box shape having an open top surface, filled with an insulating resin, and covered with a cover (not shown) from above. Specifically, the box body 10 is formed from a substantially rectangular substrate 11 on which terminal plates 30 are placed side by side, a side plate 12 that is raised from an outer edge of the substrate 11 and surrounds the periphery, and a predetermined position on the substrate 11. And a partition wall 13 which is raised and partitions the terminal plates 30. The substrate 11 has four substantially square openings 14, and the front ends of the terminal plates 30 corresponding to the openings 14 face each other. Leads (not shown) connected to the positive electrode and the negative electrode of the solar cell module are passed through the openings 14 of the substrate 11, and the passed leads are connected to the tip of the terminal plate 30 by soldering or the like. It has become so.
基板11の上面には各端子板30毎に対応して端子板30の位置決め孔31と係合可能な位置決め突部15が突設されている。位置決め突部15の両端外方には撓み可能な一対の係止片16が突出して設けられており、端子板30の装着過程では各係止片16が端子板30の両側縁部と係合して開き変形し、端子板30が正規に組み付けられるに伴ない係止片16が復元して端子板30の両側縁部を上方から押し付け、端子板30の浮き上がりを規制するようになっている。   Positioning protrusions 15 that can be engaged with the positioning holes 31 of the terminal board 30 are provided on the upper surface of the substrate 11 so as to correspond to the terminal boards 30. A pair of flexible locking pieces 16 project from both ends of the positioning protrusion 15 so that each locking piece 16 engages with both side edges of the terminal plate 30 in the process of mounting the terminal plate 30. Then, as the terminal plate 30 is properly assembled, the locking pieces 16 are restored, and both side edges of the terminal plate 30 are pressed from above to restrict the floating of the terminal plate 30. .
側板12の上端両端部には切り欠き17設けられ、ここに上方から外部接続用のケーブル90が嵌め込まれ、さらにケーブル押さえ部材20が嵌着されてケーブル90が固定されるとともに、ケーブル押さえ部材20と側板12とが一体に連なるようになっている。仕切り壁13は端子板30の外縁に沿うような態様で区画形成されており、この仕切り壁13の案内によって端子板30が位置決めされた状態で組み付けられる。また、仕切り壁13により区画された内側空間の端子板30上に絶縁樹脂が充填される。   Notches 17 are provided at both ends of the upper end of the side plate 12, and a cable 90 for external connection is fitted from above, and a cable holding member 20 is further fitted to fix the cable 90, and the cable holding member 20. And the side plate 12 are integrally connected. The partition wall 13 is partitioned and formed along the outer edge of the terminal plate 30, and is assembled with the terminal plate 30 positioned by the guidance of the partition wall 13. In addition, an insulating resin is filled on the terminal plate 30 in the inner space partitioned by the partition wall 13.
端子板30は、導電性金属板材を切断等して略短冊状に形成されている。基板11の両端部に配された端子板30には対応する外部接続用のケーブル90が接続されている。ケーブル90の端末は被覆の剥離によって芯線91が露出しており、この芯線91に対して端子板30の端部に形成されたバレル部32がかしめ付けられることにより、ケーブル90と端子板30とが接続されるようになっている。なお、ケーブル90の延出端にはコネクタ部(図示せず)が接続されている。   The terminal plate 30 is formed in a substantially strip shape by cutting a conductive metal plate material or the like. Corresponding external connection cables 90 are connected to the terminal plates 30 arranged at both ends of the substrate 11. The core wire 91 is exposed at the end of the cable 90 due to the peeling of the coating, and the barrel portion 32 formed at the end of the terminal plate 30 is caulked to the core wire 91, thereby the cable 90 and the terminal plate 30. Are to be connected. A connector portion (not shown) is connected to the extended end of the cable 90.
ケーブル90が接続された端子板30を除いて隣り合う端子板30同士は、その一端にて連繋部33を介して一体に連なっている。このうち一方の端子板30Aは太陽電池モジュールの電極側との接点を有しておらず、他方の端子板30Bよりも短寸に形成されてその先端周りが仕切り壁13によって取り囲まれている。つまり、この端子板30Aは相手側との接続に直接に関与することなく他方の端子板30Bから迂回して配されており、この迂回した分だけベアチップダイオード70が発生した熱を逃す沿面距離をかせいで放熱効果を高めている。
また、端子板30の両側縁には付設部34が側方へ張り出して設けられ、付設部34の先端縁が隣り合う端子板30間にて対向配置されている。そして、隣り合う端子板30間には端子板30よりも薄肉の導体片50が架け渡されている。図示する場合、三つの導体片50が各端子板30を横切って直列に配されている。
Excepting the terminal plate 30 to which the cable 90 is connected, the adjacent terminal plates 30 are connected together at one end via the connecting portion 33. Among these, one terminal board 30A does not have a contact point with the electrode side of the solar cell module, is formed to be shorter than the other terminal board 30B, and is surrounded by a partition wall 13 around the tip. That is, the terminal board 30A is arranged to bypass the other terminal board 30B without being directly involved in the connection with the other party, and the creeping distance for releasing the heat generated by the bare chip diode 70 by the amount of the bypass is provided. It increases the heat dissipation effect.
Further, the attachment portions 34 are provided so as to protrude laterally on both side edges of the terminal plate 30, and the front end edges of the attachment portions 34 are disposed opposite to each other between the adjacent terminal plates 30. And between the adjacent terminal boards 30, the conductor piece 50 thinner than the terminal board 30 is spanned. In the illustrated case, three conductor pieces 50 are arranged in series across each terminal board 30.
導体片50は、図2ないし図4に示すように、隣り合う端子板30のうちの一方の端子板30に半田溶接等によって接続される端子側接点部51と、この端子側接続部51から他方の端子側板30側へ延出して同他方の端子板30上にベアチップダイオード70を挟み込みつつ覆い被さる素子本体側接点部52と、素子本体側接点部52と端子側接点部51との間に配されて溶接等に伴なう応力を吸収するための応力緩和部53とからなる。
ベアチップダイオード70は、図3に示すように、下から上にかけてカソード電極、N形領域71と、アノード電極、P形領域72とを台形状(富士山状)に積層した構造とされ、その積層構造の周囲にガラス膜73を設けて構成されている。ここで、導体片50の素子本体側接点部52はベアチップダイオード70のP形領域72と接続可能とされ、端子板30はベアチップダイオード70のN形領域71と接続可能とされる。
As shown in FIGS. 2 to 4, the conductor piece 50 includes a terminal side contact portion 51 connected to one terminal plate 30 of the adjacent terminal plates 30 by solder welding, and the terminal side connection portion 51. An element main body side contact portion 52 that extends toward the other terminal side plate 30 and covers the bare terminal chip 70 while sandwiching the bare chip diode 70 on the other terminal plate 30, and between the element main body side contact portion 52 and the terminal side contact portion 51. And a stress relaxation portion 53 for absorbing stress accompanying welding or the like.
As shown in FIG. 3, the bare chip diode 70 has a structure in which a cathode electrode, an N-type region 71, an anode electrode, and a P-type region 72 are stacked in a trapezoidal shape (Mount Fuji) from the bottom to the top. Is provided with a glass film 73 around it. Here, the element body side contact portion 52 of the conductor piece 50 can be connected to the P-type region 72 of the bare chip diode 70, and the terminal board 30 can be connected to the N-type region 71 of the bare chip diode 70.
端子側接点部51は、一方の端子板30にその平面方向に沿って重ね合わされ、その重合部分に溶接が施されるようになっている。応力緩和部53は、長さ方向に対して斜めに交差して延びる二条の細帯片53Aによって構成され、この二条の細帯片53Aが撓み変形することで導体片50の長さ方向に沿った伸縮が可能となっている。各細帯片53Aは、互いに一定間隔をあけて全長に亘ってほぼ同幅をもって形成されている。また、素子本体側接点部52は、くびれ部54を介して応力緩和部53と連なり、略方形状をなしその下面にてベアチップダイオード70のP形領域72に半田接続されている。この素子本体側接点部52とベアチップダイオード70を挟んで対応する位置には他方の端子板30の付設部34が配され、この付設部34上にベアチップダイオード70が載せられて半田接続されるようになっている。   The terminal-side contact portion 51 is superposed on one terminal plate 30 along the plane direction, and welding is applied to the overlapped portion. The stress relieving portion 53 is constituted by two strips 53A extending obliquely crossing the length direction, and the two strips 53A are bent and deformed to be along the length direction of the conductor strip 50. It can be expanded and contracted. The narrow strips 53A are formed with substantially the same width over the entire length with a predetermined interval therebetween. The element main body side contact portion 52 is connected to the stress relaxation portion 53 via the constricted portion 54, has a substantially rectangular shape, and is solder-connected to the P-type region 72 of the bare chip diode 70 on the lower surface thereof. An attachment portion 34 of the other terminal plate 30 is disposed at a position corresponding to the element main body side contact portion 52 and the bare chip diode 70, and the bare chip diode 70 is placed on the attachment portion 34 and soldered. It has become.
次に、本実施形態の製造方法を説明する。ベアチップダイオード70及び導体片50を端子板30に半田接続するには、以下の方法が採用される。
方法は、端子板30を基板11に取り付けるに先立って、図5に示すように、隣り合う端子板30同士を橋渡し部35により一体に連結した状態となし、この連鎖状の端子板30をカーボン治具に位置決め状態でセットするとともに端子板30上の所定領域にペースト半田を塗布し、その後、ベアチップダイオード70及び導体片50を夫々対応する端子板30のペースト半田上に載せ、次いで、リフロー装置によりペースト半田を加熱処理して溶融固化することにより、ベアチップダイオード70及び導体片50を対応する端子板30に半田溶接する、方法である。この方法では端子板30を基板11に取り付けたあと橋渡し部35を切除する
Next, the manufacturing method of this embodiment is demonstrated. In order to solder-connect the bare chip diode 70 and the conductor piece 50 to the terminal plate 30, the following method is employed.
Prior to attaching the terminal board 30 to the substrate 11, the method is such that adjacent terminal boards 30 are integrally connected by the bridging portion 35 as shown in FIG. It is set on the carbon jig in a positioning state, and paste solder is applied to a predetermined area on the terminal board 30, and then the bare chip diode 70 and the conductor piece 50 are placed on the corresponding paste solder on the terminal board 30, and then reflowed This is a method in which the bare chip diode 70 and the conductor piece 50 are solder-welded to the corresponding terminal plate 30 by heat-treating and solidifying the paste solder with an apparatus. The way this ablating after bridging portion 35 fitted with the terminal plate 30 to the substrate 11.
端子板30を基板11に取り付けるには、基板11上に突設された位置決め突部15を端子板30の位置決め孔31に挿通することで端子板30を位置決めし、さらに係止片16の弾性係止によって端子板30の浮き上がりを規制するようにする。また、あらかじめ端子板30のバレル部32をケーブル90の端末にて露出された芯線91にかしめつけて、端子板30とケーブル90とをかしめ接続しておく。ケーブル押さえ部材20をケーブル90に上から覆い被せるように取り付けることにより、ケーブル90を遊動規制した状態で固定することが可能となる。   In order to attach the terminal plate 30 to the substrate 11, the positioning projection 15 provided on the substrate 11 is inserted into the positioning hole 31 of the terminal plate 30 to position the terminal plate 30, and the elasticity of the locking piece 16 is further increased. The floating of the terminal board 30 is regulated by the locking. Further, the terminal plate 30 and the cable 90 are caulked and connected in advance by caulking the barrel portion 32 of the terminal plate 30 to the core wire 91 exposed at the end of the cable 90. By attaching the cable pressing member 20 so as to cover the cable 90 from above, it is possible to fix the cable 90 in a state where the cable 90 is loosely restricted.
その後、ボックス本体10を太陽電池モジュールの裏面側に両面テープもしくはボルトで固着する。取り付けの過程で太陽電池モジュールの電極に接続されたリードを基板11の開口14を通してボックス本体10内に引き込み、該リードを端子板30の先端部に半田接続する。それからシリコン樹脂等の絶縁樹脂をボックス本体10内における仕切り壁13の内側空間に充填し、さらにカバーを被せて蓋締めする。絶縁樹脂により、かしめ接続部分、半田接続部分等の各接続部分が気密に封止されることとなる。   Thereafter, the box body 10 is fixed to the back side of the solar cell module with a double-sided tape or a bolt. In the process of attachment, the lead connected to the electrode of the solar cell module is drawn into the box body 10 through the opening 14 of the substrate 11, and the lead is soldered to the tip of the terminal plate 30. Then, an insulating resin such as silicon resin is filled in the inner space of the partition wall 13 in the box body 10, and a cover is put on and the lid is tightened. Each connection portion such as a caulking connection portion and a solder connection portion is hermetically sealed by the insulating resin.
以上のように本実施形態によれば、ベアチップダイオード70を導体片50と端子板30との間に挟み込む構造となっているから、ベアチップダイオード70で発生した熱を端子板30側へダイレクトに速やかに放熱することが可能となり、導体片50を介在させる場合に比べて、放熱特性が良好となる。したがって、ベアチップダイオード70と導体片50とによるバイパスダイオードとしてのバイパス機能を長期にわたって発揮させることが可能となる。   As described above, according to the present embodiment, since the bare chip diode 70 is sandwiched between the conductor piece 50 and the terminal plate 30, the heat generated in the bare chip diode 70 is promptly and directly transmitted to the terminal plate 30 side. It is possible to dissipate heat, and the heat dissipating characteristics are better than when the conductor piece 50 is interposed. Therefore, a bypass function as a bypass diode by the bare chip diode 70 and the conductor piece 50 can be exhibited over a long period of time.
また、導体片50がベアチップダイオード70のP形領域72と接続可能とされ、端子板30がベアチップダイオード70のN形領域71と接続可能とされているから、端子板30とベアチップダイオード70との間の接合面積を大きく確保することができ、ベアチップダイオード70で発生した熱をN形領域71から端子板30へ効率良く放熱することができる。   Further, since the conductor piece 50 can be connected to the P-type region 72 of the bare chip diode 70 and the terminal plate 30 can be connected to the N-type region 71 of the bare chip diode 70, the terminal plate 30 and the bare chip diode 70 can be connected to each other. A large junction area can be secured, and heat generated by the bare chip diode 70 can be efficiently radiated from the N-type region 71 to the terminal board 30.
<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれ、さらに、下記以外にも要旨を逸脱しない範囲内で種々変更して実施することができる。
(1)上記実施形態では、端子板がボックス本体内に多数並設されていたが、本発明においては、端子板が二つの並設されているだけも構わない
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) In the above embodiment, a large number of terminal boards are arranged in the box body. However, in the present invention, only two terminal boards may be arranged in parallel .
本発明の実施形態のボックス本体の平面図The top view of the box body of an embodiment of the present invention 端子板に接続されたベアチップダイオード及び導体片の模式断面図Schematic cross section of bare chip diode and conductor piece connected to terminal board ベアチップダイオードの構造を示す模式断面図Schematic sectional view showing the structure of bare chip diode 導体片の平面図Top view of conductor piece 橋渡し部を切除する前のボックス本体の平面図Top view of the box body before cutting off the bridge
符号の説明Explanation of symbols
10…ボックス本体
11…基板
30…端子板
50…導体片
70…ベアチップダイオード
71…N形領域
72…P形領域
90…ケーブル
DESCRIPTION OF SYMBOLS 10 ... Box main body 11 ... Board | substrate 30 ... Terminal board 50 ... Conductor piece 70 ... Bare chip diode 71 ... N-type area | region 72 ... P-type area | region 90 ... Cable

Claims (1)

  1. ボックス本体内に複数並設されて太陽電池モジュールのプラス電極及びマイナス電極が接続され得る端子板と、この端子板に接続され得る外部接続用のケーブルと、対応する二つの端子板のうちの一方の端子板に接続されるとともにこの一方の端子板から他方の端子板へ架け渡される導体片と、この導体片と前記他方の端子板との間に挟み込まれて双方と直接的に接続する逆負荷時バイパス用のチップ状の整流素子本体とを備え、かつこの整流素子本体がメサ型のベアチップダイオードからなり、同ベアチップダイオードのP形領域が前記導体片と、N形領域が前記他方の端子板とそれぞれ接続されてなる太陽電池モジュール用端子ボックスの製造方法であって、
    前記対応する二つの端子板同士を橋渡し部により一体に連結した状態となし、この連鎖状の端子板をカーボン治具に位置決め状態でセットするとともに前記端子板上にペースト半田を塗布し、その後、前記整流素子本体及び前記導体片を夫々対応する端子板のペースト半田上に載せ、続いて、リフロー装置によりペースト半田を加熱処理して溶融固化することにより、前記整流素子本体及び前記導体片を対応する端子板に半田溶接し、次いで、前記端子板を前記ボックス本体に組み付けたあと前記橋渡し部を切除することを特徴とする太陽電池モジュール用端子ボックスの製造方法。
    A terminal plate that is arranged in parallel in the box body and can be connected to the positive electrode and the negative electrode of the solar cell module, an external connection cable that can be connected to the terminal plate, and one of the two corresponding terminal plates A conductor piece that is connected to the other terminal board and spans from one terminal board to the other terminal board, and is sandwiched between the conductor piece and the other terminal board and directly connected to both. A chip-shaped rectifying element body for bypassing under load , and the rectifying element body is made of a mesa-type bare chip diode. The P-type region of the bare-chip diode is the conductor piece, and the N-type region is the other terminal. A method for manufacturing a terminal box for a solar cell module connected to a plate ,
    The state where the corresponding two terminal boards are integrally connected by a bridging portion, and this chain-shaped terminal board is set in a positioning state on a carbon jig and applying paste solder on the terminal board, The rectifying element body and the conductor piece are placed on the paste solder of the corresponding terminal board, respectively, and then the paste solder is heated and melted and solidified by a reflow device, thereby corresponding to the rectifying element body and the conductor piece. A method of manufacturing a terminal box for a solar cell module, comprising: solder welding to a terminal plate to be cut; and then cutting the bridging portion after the terminal plate is assembled to the box body.
JP2004128432A 2004-04-23 2004-04-23 Manufacturing method of terminal box for solar cell module Expired - Fee Related JP3904114B2 (en)

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CNA2005100676142A CN1691417A (en) 2004-04-23 2005-04-22 A terminal box for a solar battery module and a method for producing such a terminal box
EP05008907A EP1589588A3 (en) 2004-04-23 2005-04-22 A terminal box for a solar battery module and a method for producing such a terminal box
US11/114,498 US7928314B2 (en) 2004-04-23 2005-04-25 Terminal box for a solar battery module and a method for producing such a terminal box

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