WO2006067907A1

WO2006067907A1 - Terminal box for solar cell module

Info

Publication number: WO2006067907A1
Application number: PCT/JP2005/019328
Authority: WO
Inventors: Hiroyuki Yoshikawa; Makoto Higashikozono
Original assignee: Sumitomo Wiring Systems, Ltd.
Priority date: 2004-12-22
Filing date: 2005-10-20
Publication date: 2006-06-29
Also published as: JP2006179685A

Abstract

Four terminal plates (30) are received in a box body (10). Two terminal plates (30) out of the four are cable connection terminals (30A) to which output cables (90) are connected by pressure, and the remaining terminal plates (30) are chip connection terminals (30B) on which bare chip diodes (70) are placed and connected. Conductive bodies (50) are installed between the terminal plates (30), and the conductive bodies (50) hold the bare chip diodes (70) between themselves and the chip connection terminals (30B) on which the bare chip diodes (70) are placed. One of the chip connection terminals (30B) has two placement surfaces for bare chip diodes (70). To one of the two placement surfaces is connected an N side region (71)(cathode side) of a bare chip diode (70), and to the other placement surface is connected a P side region (72)(anode side) of a bare chip diode (70).

Description

Specification

Terminal box for solar cell module

Technical field

[0001] The present invention relates to a terminal box for a solar cell module.

Background art

[0002] A solar power generation system supplies a direct current from a solar cell panel laid on a roof of a house to each electrical appliance via an inverter or the like. The solar cell panel has a plurality of solar cell module forces, and has a structure in which the electrodes of each solar cell module are connected in series or in parallel via a terminal box.

[0003] As a terminal box, one described in Patent Document 1 below is known. In this case, four terminals are housed in parallel in the box body, and an output cable for taking out an electromotive force of the solar cell group force is connected to two terminals located at both ends, and adjacent terminals. Between them, a no-pass diode connected in parallel with the output polarity of the solar cell group is connected. When the reverse load is strong, the solar cell current is bypassed to the bypass diode!

Here, the bypass diode includes a chip-shaped rectifier element body, an upper conductor piece soldered to the P side (anode side) on the upper surface side of the rectifier element body, and the N side on the lower surface side of the rectifier element body. It consists of a lower conductor piece soldered to the (force sword side), and both ends of the upper conductor piece and the lower conductor piece are soldered to the corresponding terminals.

Patent Document 1: Japanese Patent Laid-Open No. 2002-252356

Disclosure of the invention

Problems to be solved by the invention

[0004] The above bypass diode has a structure in which heat generated by the rectifier element body is radiated to the corresponding terminal through the upper conductor piece and the lower conductor piece. However, in order to ensure quick thermal conductivity to the terminal. It can be said that it is preferable to change to a structure in which the lower conductor piece is removed and the rectifying element main body is directly mounted on the corresponding terminal and soldered. But take When changing to a structure, there is a problem that if the rectifier element body is manually soldered to the corresponding terminal, it is difficult to work because the rectifier element body is small and stable quality is difficult to obtain.

[0005] Thus, a method of connecting the rectifying device body to the corresponding terminal by reflow soldering is considered, but in the case of reflow soldering, the terminal to which the output cable is connected cannot be passed through the reflow furnace. There's a problem. As a countermeasure for this, there is a method of connecting the terminal to the output cable after reflow soldering. However, in this case, it is difficult to force the terminal to the output cable due to interference with the force-fixing jig and other terminals, so the terminal must be screwed to the output cable.

[0006] The present invention has been completed based on the above-described circumstances. The purpose of the present invention is to reflow solder the rectifying element body to the corresponding terminal and then connect the terminal to the output cable. The purpose is to connect by caulking.

Means for solving the problem

[0007] As means for achieving the above object, the invention according to claim 1 includes a box main body in which a plurality of terminals are accommodated in parallel, and two of the plurality of terminals. A cable connection terminal to which an output cable for extracting an electromotive force having a power of a solar cell module is crimped, and a remaining terminal excluding the cable connection terminal among the plurality of terminals, A chip-shaped rectifying device body having a rectifying function is placed and connected to a chip connecting terminal and the corresponding two terminals are bridged, and the rectifying device main body is sandwiched between the chip connecting terminal on which it is placed. A conductor portion that short-circuits the corresponding two terminals when a reverse load is applied, and one of the chip connection terminals, and has two mounting surfaces for the rectifying device body. The N side (force sword side) of the rectifying device body is connected to one mounting surface, and the P side (anode side) of the rectifying device body is connected to the remaining mounting surface. It has a feature in that it is configured to have a chip connection terminal for PN junction pattern conversion.

[0008] The invention of claim 2 is the one described in claim 1, wherein the conductor portion is formed by reflow soldering to the chip connection terminal with the rectifier element body interposed therebetween. In addition, the conductor portion includes one having a free end portion protruding toward the cable connection terminal corresponding to the chip connection terminal cover, and the pair of free end portions includes It is characterized in that the chip connection terminal and the both cable connection terminals are connected by manual soldering or ultrasonic welding.

[0009] The invention of claim 3 is the invention of claim 1 or claim 2, wherein at least two of the chip connection terminals are provided, and two corresponding chip connections are provided. The conductor part bridged between the terminals is connected to the corresponding chip connection terminal by reflow soldering at the end opposite to the side connected to the rectifying element body by reflow soldering. Has characteristics.

[0010] The invention of claim 4 is the invention of claim 1 or claim 2, wherein the PN junction pattern conversion chip connection terminal extends in a U-shape. It has a feature in that it has a mounting surface for the rectifying device main body on both legs of the U-shape.

The invention's effect

[0011] <Claim 1>

The rectifying device body is sandwiched between one end of the conductor and the chip connection terminal, and the other end of the conductor is connected to a terminal (chip connection terminal or cable connection terminal) corresponding to the chip connection terminal. In this case, if the mounting surface for the rectifying device body is set at one location of the chip connection terminal and the N side (force sword side) of the rectifying device body is connected to this mounting surface, the PN connection of the rectifying device body Therefore, the mounting surface for the rectifier element body must be set in one of the two cable connection terminals. Then, when reflow soldering the rectifying device body, it is necessary to attach the output cable to the cable connection terminal, and the force is applied and the jig interferes with the chip connection terminal. Need to be screwed. As a countermeasure, another terminal or conductor is interposed between the cable connection terminal and the corresponding chip connection terminal, and the other terminal and the cable connection terminal are connected via the conductor. However, if you do so, the number of parts will increase by providing another terminal.

In this regard, according to the present invention, one of the chip connection terminals is connected to the rectifier element body. There are two mounting surfaces, one of which is connected to the N side (cathode side) of the rectifying device body, and the other mounting surface is connected to the rectifying device body. Since it is configured as a chip connection terminal for PN junction pattern conversion to which the P side (anode side) is connected, there is no need to set a separate mounting surface for the rectifying device body on the cable connection terminal. Therefore, it is possible to connect the chip connection terminal subjected to reflow soldering to the cable connection terminal with the output cable via the conductor part while the cable connection terminal is connected to the output cable by force. This makes it possible to improve work efficiency.

After reflow soldering the conductor part to the chip connection terminal with the rectifying element body in between, the free end part of the conductor part protruding toward the corresponding cable connection terminal from the chip connection terminal cable is output. Since it can be connected to the cable connection terminal clamped on the cable by hand soldering or ultrasonic welding, the chip connection terminal and the cable connection terminal can be securely connected.

[0014] <Invention of Claim 3>

The conductor part bridged between the two corresponding chip connection terminals is also reflow soldered to the corresponding chip connection terminal at the end opposite to the side connected to the rectifying element body by reflow soldering. Therefore, a chain structure part in which two chip connection terminals are connected by a conductor part can be easily formed simply by passing through one reflow furnace.

[0015] <Invention of Claim 4>

Since the chip connection terminal for PN junction pattern conversion is formed extending in a U shape, the heat dissipation area for dissipating the heat generated by the rectifier element body is increased, and heat dissipation is improved. In addition, the chip connection terminal for PN junction pattern conversion has a mounting surface for the rectifying device body at both legs of the U-shape, so it is easy to handle.

[0016] FIG. 1 is a plan view showing the internal structure of a box main body according to an embodiment of the present invention.

[Fig. 2] Plan view of a chain structure where two chip connection terminals are connected via a conductor [Fig. 3] Schematic cross-sectional view showing the connection state between the bare chip diode and the chip connection terminal. [Fig. 4] Plan view showing the state where the cable connection terminal is connected to both sides of the chain structure by manual soldering.

[FIG. 5] FIG. 3 equivalent diagram in another embodiment.

FIG. 6 is a plan view showing a state before connecting adjacent chip connection terminals after reflow soldering in another embodiment

Explanation of symbols

[0017] 10 ... Box body

11 ... Board

30 ... Terminal board

30A ... Cable connection terminal

30B… Chip connection terminal

32 ... Nornole

34 ... Attached part

50: Conductor section

90 ··· Output cable

91 ... Core

BEST MODE FOR CARRYING OUT THE INVENTION

An embodiment of the present invention will be described with reference to FIGS. A terminal box for a solar cell module that is effective in this embodiment is attached to the back side of a solar cell module (not shown) in which a large number of solar cells connected in series are arranged. A large number of terminal plates 30 (corresponding to the terminals of the present invention) arranged in parallel in the box body 10, a conductor portion 50 spanned between the adjacent terminal plates 30, and the conductor portion 50 and the terminal plate 30. A bare chip diode 70 (corresponding to the rectifying device main body of the present invention) sandwiched therebetween is provided.

[0019] The box main body 10 is formed into a box shape with an open top surface by a synthetic resin material, filled with an insulating resin, and covered with an upper force cover (not shown). . Specifically, the box body 10 has a plurality of terminal boards 30 arranged side by side as shown in FIG. The board 11 is placed in a substantially rectangular shape, the side plate 12 that is raised from the outer edge of the board 11 to surround the periphery, and the terminal board 30 that is raised from a predetermined position of the board 11 is partitioned. Partition wall 13. A plurality of substantially rectangular openings 14 are formed in the substrate 11, and the end portions of the terminal plates 30 corresponding to the openings 14 face each other. A lead (not shown) corresponding to each solar cell group is passed through each opening 14 of the substrate 11, and each passed lead is connected to the tip of the terminal plate 30 by soldering or the like. Yes.

A pair of locking pieces 16 that can be elastically locked to both side edges of the terminal board 30 are provided on the upper surface of the substrate 11 so as to protrude upward. In the process of installing the terminal plate 30, each locking piece 16 engages with both side edges of the terminal plate 30 and deforms to open, and as the terminal plate 30 is properly assembled, the locking piece 16 is restored. The both side edges of the terminal board 30 are elastically pressed from above to regulate the lifting of the terminal board 30! /.

[0021] Notches 17 are provided at both ends of the upper end of the side plate 12, and an output cable 90 for external connection is fitted therein, and a cable pressing member 20 is further fitted therein to fix the output cable 90. In addition, the cable pressing member 20 and the side plate 12 are integrally connected. The partition wall 13 is partitioned and formed along the outer edge of the terminal plate 30, and is assembled with the terminal plate 30 positioned by the guide of the partition wall 13. In addition, the insulating resin is filled on the terminal board 30 in the inner space partitioned by the partition wall 13.

The terminal plate 30 is formed in a substantially band shape by cutting a conductive metal plate material or the like, and is arranged on the substrate 11 side by side. Out of these, the output cables 90 for taking out the electromotive force of each solar cell group are pressure-bonded to the two terminal plates 30 arranged at both ends in the arrangement direction. The core 91 is exposed at the end of the output cable 90 by peeling off the covering 92, and the barrel 32 formed at the end of the terminal plate 30 is caulked against the core 91. In the present invention, the terminal plate 30 fastened to the output cable 90 is referred to as a cable connection terminal 30A.

[0023] The remaining part of the terminal plate 30 excluding the cable connection terminal 30A is formed to extend substantially in a U-shape, and is formed at one end (one leg of both U-shaped legs). Surrounded by the partition wall 13 and the other end (the other leg of the U-shaped legs) Part) faces the opening 14 and is connected to the lead, so that heat dissipation by releasing the heat generated by the gap diode 70 is enhanced by the amount of detour to the one end side. The terminal plate 30 formed in a substantially U shape is provided with a pair of left and right symmetrical, and is connected to each other by a conductor portion 50 bridged between the two. In the present invention, this terminal plate 30 is referred to as a chip connection terminal 30B.

[0024] Attached portions 34 are provided on both side edges of the terminal plate 30 so as to protrude, and end surfaces of the attached portions 34 are disposed to face each other between the adjacent terminal plates 30. The mounting surface for the bare chip diode 70 is set on the attachment portion 34 in the chip connection terminal 30B. Specifically, one chip connection terminal 30B (left side shown in FIG. 1) is connected to the bare chip diode 70 at a position where it can be connected to the conductor portion 50 bridged between the corresponding cable connection terminals 30A. One mounting surface is set. The other chip connection terminal 30B (the right side in FIG. 1) has a mounting surface for the bare chip diode 70 at a position where it can be connected to the conductor 50 bridged between the corresponding cable connection terminals 30A. One mounting surface is set for the bare chip diode 70 at a position where it can be connected to the conductor part 50 bridged between the corresponding chip connection terminals 30B. Surface is set. The other chip connection terminal 30B is configured as a chip connection terminal for PN junction pattern conversion in the present invention.

[0025] As shown in FIG. 3, the conductor portion 50 is formed in a flat plate shape that is thinner than the terminal plate 30, and is sandwiched between the bare chip diode 70 and the terminal plate 30 on which it is placed. Connected to diode 70. Further, a total of three conductor portions 50 are provided by bridging between the four terminal plates 30 so that the bare chip diodes 70 are connected in series between the terminal plates 30 via the conductor portions 50. Become.

The conductor portion 50 located on the left side shown in FIG. 1 is superposed on the bare chip diode 70 mounted on the corresponding chip connection terminal 30B at the right end portion thereof and subjected to reflow soldering (described later). At the same time, it is placed on the corresponding cable connection terminal 30A at the left end and is hand-soldered. Further, the conductor portion 50 located on the right side shown in FIG. 1 is superposed on the chip diode 70 mounted on the corresponding chip connection terminal 30B at the left end thereof, and is subjected to reflow soldering. ,That At the right end, it is placed on the corresponding cable connection terminal 30A and hand-soldered.

[0026] The conductor portion 50 located in the center is superposed on the bare chip diode 70 mounted on the corresponding chip connection terminal 30B at the right end portion thereof, and is subjected to reflow soldering. Reflow soldering is performed on the corresponding chip connection terminal 30B at the left end.

A positioning hole 51 through which a positioning projection 35 provided on each terminal plate 30 can pass is formed at the end of the conductor portion 50 opposite to the side connected to the bare chip diode 70. The positioning protrusion 35 is formed by cutting and raising a part of the terminal plate 30, and penetrates the positioning hole 51 of the conductor part 50 and is soldered between the conductor part 50. In the terminal plate 30, an extraction space 36 is formed around the root of the positioning protrusion 35 as the positioning protrusion 35 is raised, and soldering is performed in the extraction space 36 so that the soldering heat is It is set to not spread!

The bare chip diode 70 has a structure in which an N-side region 71 (force sword side) and a P-side region 72 (anode side) are laminated, and a glass film (not shown) is provided around the laminated structure. It is configured.

Here, on one chip connection terminal 30B (left side shown in FIG. 1), the N-side region 71 is directed to one mounting surface, and the conductor part 50 bridged between the adjacent cable connection terminal 30A 50 A bare chip diode 70 having a P-side region 72 facing one end is disposed. Solder is formed between the N-side region 71 of the bare chip diode 70 and the mounting surface, and between the P-side region 72 of the bare chip diode 70 and one end of the conductor portion 50, and reflow soldering is performed. Are connected to each other.

[0028] On the other chip connection terminal 30B (right side shown in FIG. 1), an N-side region 71 is provided on the mounting surface corresponding to one chip connection terminal 30B, out of the two mounting surfaces. In addition, a bare chip diode 70 having a P-side region 72 directed to one end portion of the conductor portion 50 bridged between the one chip connection terminal 30B is disposed. As described above, the other end portion of the conductor portion 50 is overlaid on the one chip connection terminal 30B. Between the N-side region 71 of the bare chip diode 70 and the mounting surface, between the P-side region 72 of the bare chip diode 70 and the conductor 5 A solder is formed between one end portion of 0 and between the bare chip diode 70 and the other end portion of the conductor portion 50, and these are connected to each other by reflow soldering.

[0029] Further, on the other chip connection terminal 30B (right side shown in FIG. 1), the P-side region 72 is directed to the placement surface corresponding to the cable connection terminal 30A, out of the two placement surfaces. The bare chip diode 70 with the N-side region 71 facing the one end portion of the conductor portion 50 bridged between the cable connection terminal 30A is disposed. Solder is formed between the P-side region 72 of the bare chip diode 70 and the mounting surface, and between the N-side region 71 of the bare chip diode 70 and one end of the conductor portion 50, and reflow soldering is performed. These are connected to each other.

[0030] After the reflow soldering is performed, as shown in FIG. 2, a chain structure portion 30E in which the chip connection terminals 30B are connected via the conductor portion 50 is obtained. The free end part of the conductor part 50 protruding to the corresponding cable connection terminal 30A side is exposed at both end parts (U-shaped leg parts) of the chain structure part 30E. Connection terminal 30A is connected by hand soldering. When a reverse load is applied, current also flows to the cathode side on the anode side force.In other words, current flows between the terminal plate 30 from the left cable connection terminal 30A to the right cable connection terminal 30A via the conductor portion 50. Will flow.

Next, the manufacturing method of the present embodiment will be described. In order to connect the bare chip diode 70 and the conductor portion 50 to the chip connection terminal 30B, solder is supplied in advance to the mounting surface of the chip connection terminal 30B, and the corresponding bare chip diode 70 and the conductor portion 50 are connected thereto. Place and heat through a reflow oven (not shown). At this time, the solder is also supplied to the base portion of the positioning protrusion 35 of one of the chip connection terminals 30B, and the other end portion of the conductor portion 50 located at the center is placed thereon and heated through the same reflow furnace. To do. As shown in FIGS. 2 and 3, the chain structure portion 30E of the chip connection terminal 30B obtained by force is provided with two mounting surfaces for the bare chip diode 70 on the other chip connection terminal 30B. One of the mounting surfaces is connected to the N side of the bare chip diode 70, and the other mounting surface is connected to the P side of the bare chip diode 70, so the cable connection terminal 30A side is connected to the bare chip diode 70. There is no need to set the mounting surface.

[0032] Before and after the above reflow soldering process, the cable connection terminal 30A is connected to the output cable 9 Clamp to 0. Then, corresponding cable connection terminals 30A are superposed on the free ends of the conductor portions 50 projecting laterally at both ends of the chain structure portion 30E, and then hand soldered thereto, as shown in FIG. Connect the cable connection terminal 30A with the output cable 90 to both sides of the chain structure 30E. Thereby, the terminal plates 30 are connected to each other through the conductor portion 50.

Next, each terminal plate 30 in this connected state is attached to the substrate 11. At this time, the floating of the terminal plate 30 is restricted by the elastic locking of the locking piece 16. In addition, by attaching the cable pressing member 20 onto the output cable 90, the output cable 90 is fixed in a state in which the movement is restricted.

Thereafter, the box body 10 is fixed to the back side of the solar cell module with an adhesive, double-sided tape, or bolts. The lead connected to the electrode of the solar cell module in the process of attachment is drawn into the box body 10 through the opening 14 of the substrate 11, and the lead is soldered to the tip of the terminal plate 30. That force Fill the inner space of the partition wall 13 in the box body 10 with an insulating resin such as silicon resin, and then cover and tighten the lid. Each connection portion such as a crimp connection portion and a solder connection portion is hermetically sealed by the insulating resin.

[0034] As described above, according to the present embodiment, by changing the PN junction laminated pattern of the bare chip diode 70, the cable connection terminal 30A is not passed through the reflow furnace. It is possible to connect the cable connection terminal 30A, which is crimped to the output cable 90, to the chip connection terminal 30B to which the diode 70 is reflow soldered. .

[0035] Further, the conductor portion 50 bridged between the adjacent chip connection terminals 30B is connected to the bare chip diode 70 mounted on the other chip connection terminal 30B at one end thereof by reflow soldering, and the like. Since one end of the chip connection terminal 30B is also connected by reflow soldering at the end, the chain structure part 30E in which the adjacent chip connection terminals 30B are connected by the conductor part 50 can be formed by simply passing through one reflow furnace. Can be formed.

Furthermore, the opposite end of the other chip connection terminal 30B is connected to the bare chip diode 70. Since the mounting surface is set, it is easy to handle.

The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and are within the scope not departing from the gist other than the following. Various modifications can be made.

(1) The present invention can also be applied to a case where the bare chip diode 70 is configured by interposing a silicon resin layer 73 between the P-side region 72 and the N-side region 71 as shown in FIG.

(2) In the present invention, as shown in FIG. 6, each chip connection terminal 30B is connected to the corresponding diode 70 and conductor 50 by reflow soldering, and then one of the other chip connection terminals 30B is connected to the other. The two chip connection terminals 30B may be connected to the free ends of the conductor portions 50 protruding from the chip connection terminals 30B by hand soldering or the like.

(3) The present invention can also be applied to the case where the chip connection terminal 30B extends straight without bending into a substantially U shape.

(4) The present invention can also be applied to a case where three or more chip connection terminals are accommodated in parallel in a state of being connected by a conductor in the box body.

(5) In the present invention, the conductor part is integrated with one of the two terminal plates adjacent to each other, and the bare chip diode located on the side protruding from the other terminal plate is connected to the other terminal plate. It may be configured to be sandwiched between them (see JP-A-2004-282107).

(6) In the present invention, the conductor portion and the cable connection terminal may be connected by ultrasonic welding or resistance welding.

(7) The present invention can also be applied to a case where the conductor portion is bridged by sandwiching one or more terminal plates between two corresponding terminal plates.

Claims

The scope of the claims

[1] A plurality of terminals are housed in parallel inside the box body,

Two of the plurality of terminals, a cable connection terminal to which an output cable for taking out an electromotive force of the solar cell module force is crimped, and

Among the plurality of terminals, the remaining terminals excluding the cable connection terminal, between the corresponding two terminals and a chip connection terminal on which a chip-shaped rectifier body having a rectifying function is placed and connected. A cross-linked conductor portion that sandwiches the rectifier element body with the chip connection terminal on which the rectifying element body is placed, and short-circuits the corresponding two terminals when a reverse load is applied;

One of the chip connection terminals, which has two mounting surfaces for the rectifying device body, and one of the mounting surfaces has an N side (cathode) on the rectifying device body. And a chip connection terminal for PN junction pattern conversion, to which the P side (anode side) of the rectifying element main body is connected to the rest of the mounting surface. Terminal box.

[2] The conductor portion is connected to the chip connection terminal by reflow soldering with the rectifier element body interposed therebetween, and

The conductor portion includes one having a free end portion projecting toward the corresponding cable connection terminal from the chip connection terminal cap, and hand-soldering or ultrasonic wave is applied to the pair of free end portions. 2. The terminal box for a solar cell module according to claim 1, wherein the chip connection terminal and the both cable connection terminals are connected by welding or the like.

[3] At least two chip connection terminals are provided, and the conductor portion bridged between the corresponding two chip connection terminals is an end portion on the opposite side to the side connected to the rectifying element main body by reflow soldering. The terminal box for a solar cell module according to claim 1, wherein the terminal box is connected to the corresponding chip connection terminal by reflow soldering.

[4] The chip connection terminal for PN junction pattern conversion is formed to extend in a U-shape, and has mounting surfaces for the rectifying device main body on both legs of the U-shape, respectively. The terminal box for a solar cell module according to claim 1 or claim 2, wherein the terminal box is a solar cell module.