JP2002134945A - Method for manufacturing shelled electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for easily and efficiently manufacturing a shelled electronic component. SOLUTION: With respect to the method for forming the shell of an electronic component by placing face-to-face and bonding upper and lower shell elements 10 and 20, a gap 80 to be filled with fused resin is formed on the facing surfaces 12 and 22 of the upper and lower shell elements 10 and 20 when they are placed face-to-face. Cavities 61 and 71 are formed in shell sealing metal molds 60 and 70 for housing the shell elements 10 and 20 and when the upper and lower shell elements 10 and 20 are housed in the cavities 61 and 71, the molds are closed. After that, the gap 80 is filled with fused binder resin 41, and the resin 41 is cooled and solidified for coupling and adhering the facing surfaces 12 and 22 of the upper and lower shell elements 10 and 20. In this way, the electronic component is sealed with the shell and the water tightness and the dust tightness is ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an electric or electronic component sealed in a shell (hereinafter referred to as "electronic component").

[0002]

2. Description of the Related Art Waterproofing and dustproofing are required for electronic components used outdoors or in water places. In the case of these electronic components, RTV silicone resin is used around the electronic substrate.
When sealing with epoxy resin, etc. (resin sealing method), or when incorporating and sealing electric components inside the case, fix them with bolts or snap fit with the packing sandwiched between the cases. A sealing method (packing method) is adopted.

[0003]

However, the resin encapsulation method is not suitable for encapsulating a large component, and the resin is in direct contact with the periphery of the electronic component. Can not adapt. Furthermore, there is a problem that durability is inferior due to a difference in thermal expansion coefficient between the electronic component and the encapsulating resin in a place where the temperature changes drastically. Further, in the case of the packing method, there are many management items during the manufacturing process, such as positioning of the packing and tightening torque of the case, and thus there is a problem that not only does the stability of quality increase, but also man-hours are required. Also, as a method of sealing the lead wire part from the electronic component, pass the lead wire through a separately molded bush,
The assembling method is generally used, but there is a problem that the adhesion between the bush and the case is not good.

An object of the present invention is to provide a method for producing an electronic component having a shell excellent in durability and quality, easy to manufacture, and excellent in hermeticity.

[0005]

In order to achieve the above object, according to the first aspect of the present invention, in a method of manufacturing a shelled electronic component, two molded shell elements are placed in a cavity of a shell sealing mold. After the electronic component is accommodated in one or both of the shell elements, the mold is closed, a molten resin is filled between the joining surfaces of the two shell elements, and cooling of the resin is performed. After solidification, the shell elements are brought into close contact with each other to seal the electronic component in the shell.

Further, in the invention according to claim 2,
The invention according to claim 1 is characterized in that the shell element is formed of a thermoplastic resin.

Further, in the invention according to claim 3,
The invention according to claim 1 is characterized in that the shell element is formed of metal and has been subjected to a surface treatment so that the molten thermoplastic resin can be easily bonded to the joining surface. .

Further, in the invention according to claim 4,
In the invention according to claim 1, the electronic component is housed in one or both of the two shell elements in advance, and after housing the shell element in the cavity, the shell element is brought into close contact with the molten resin. It is a feature.

Further, in the invention described in claim 5,
In a method of manufacturing a shelled electronic component, in a method of manufacturing a shelled electronic component in which two divided shell elements are combined and an electronic component is sealed therein, when the butting surfaces of the shell elements abut each other, Having formed a gap for filling the molten resin between the abutting surfaces, a cavity for accommodating the shell element in the shell sealing mold, and housing the shell element in the cavity, when the mold is assembled, After forming the molten resin filling cavity surrounding the molten resin filling space from the outside to seal the molten resin filling space, incorporating the electronic component, closing the shell sealing mold containing the shell element, and then melting. The resin-filled cavity is filled with molten resin, and the resin is cooled and solidified, so that the butted surfaces of the shell elements are connected and adhered to the solidified resin. It is intended.

Further, in the invention according to claim 6,
In the invention according to claim 5, a lead wire accommodating cavity drawn out of the shell from an electronic component housed in the shell is formed continuously in a part of the molten resin filling cavity, When the resin is filled in the resin filling cavity, the resin is also filled in the lead wire accommodating cavity, so that the bush in which the lead wire is in-molded with the sealing resin is used as the resin for sealing the shell element. Subsequently, they are integrally molded to ensure the sealing performance at the lead wire lead-out portion.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view showing a state in which an electronic component sealed in a shell and a shell element formed of a thermoplastic resin are disassembled by the method of the present invention. FIG. It shows the appearance of a state in which the shell is sealed. 1 and 2, a projection 11 existing in a lower shell element (shell body) 10
The electronic component 30 is fixed by the projection 21 existing in the upper shell element (shell lid) 20. The lower shell element 10 and the upper shell element 20, as shown in FIG.
The two shell elements 10 and 20 are combined so that the solidified binder resin is filled on the outer periphery of the divided surfaces 12 and 22 to make the lower shell element 10 and the upper shell element 20 adhere to each other. 40 is the molten resin-filled void surface 1
5 and the interface between the lower shell element 10 and the solidified binder resin 40 and the interface between the upper shell element 20 and the solidified binder resin 40 that are present in the gap surrounded by the molten resin-filled gap surface 16, respectively. The lower shell element 10 and the upper shell element 20 are connected to each other, and the electronic component 30 in the shell is hermetically sealed.

As shown in FIG. 4, the lower shell element 10 and the upper shell element 20 have a lead wire outlet 13, a lead wire 31 extending from the electronic component 30 to the outside of the shell.
23, and the lead wire outlet 1
3 and 23 are partially narrower lead wire holding grooves 1
4 and 24 are formed. This lead wire holding groove 14,
The diameter of the insertion hole formed by the lead wire 24 is set smaller than the diameter of the lead wire 31.
The lead wire 31 is fixed by being sandwiched between 4 and 24. On the outside, there is a solidified binder resin 40 forming a bush 50 in-molding the lead wire 31, and the solidified binder resin 40 shrinks and the lead wire 31 is tightened from the periphery to be pulled out of the shell. The adhesion of the lead wire 31 is ensured.

Next, a method for sealing the shell for sealing the electronic component 30 will be described with reference to FIGS. First, referring to FIGS. 5 and 6, shell housing cavities 61 and 71 are formed in the shell sealing dies 60 and 70, and the shell sealing cavities 61 and 70 are formed on the mating surfaces of the shell sealing dies 60 and 70. Are formed with cavity surfaces 62 and 72 filled with molten resin. In a part of the shell sealing molds 60 and 70, bush forming cavity surfaces 63 and 73 are formed following the molten resin filled cavity surfaces 62 and 72. This shell sealing mold 60,
When the shell is sealed with the shell 70, first, as shown in FIG. 5, the lower shell element 10 and the upper shell element 20 which have been molded using a polypropylene resin (J105W, Grand Polymer Co., Ltd.) Sealing mold 60, 70
Of each other in the shell receiving cavities 61, 71 of the
22 are installed so as to face each other.

Next, the projection 11 existing on the lower shell element 10
Then, the electronic component 30 is fixed to the lower shell element 10 so as to enter the hole 32 (shown in FIG. 6) existing in the electronic component 30 (see FIG. 6). At this time, the lead wire 31 connected to the electronic component 30 is sandwiched in the lead wire holding groove 14 present in the lower shell element 10. Then, as shown in FIG.
By closing 0 and 70, the upper shell element 20 and the lower shell element 10 are butted. At this time, one of the divided surfaces of the lower shell element 10 and the upper shell element 20 has a molten resin filling gap surface 15 on the lower shell element 10 side and a molten resin filling gap surface 25 on the upper shell element 20 side, and further has a shell sealing The molten resin-filled void surface 80 surrounded by a part of the molds 60 and 70 is formed. Further, a bush forming cavity 81, which is a space formed by the bush forming cavity surfaces 63 and 73, is formed on the division surface between the other lower shell element 10 and the upper shell element 20 as a space following the molten resin filling space surface 80. Further, a lead wire holding hole 82 for holding the lead wire 31 is formed.

Therefore, as for the contact portion between the lead wire 31 and the upper and lower shell elements 10 and 20, as shown in FIG. 4, the lead wire holding groove 14 existing in the lower shell element 10 and the lead wire existing in the upper shell element 20. The lead wire 31 is formed by the holding groove 24.
Is inserted, and the diameter of the insertion hole formed by the lead wire holding groove 14 and the lead wire holding groove 24 is set smaller than the outer diameter of the lead wire 31.
Is fixed between the lead wire holding grooves 14 and 24 in a compressed state. The electronic component 30 is fixed by the protrusions 11 present on the lower shell element 10 and the protrusions 21 present on the upper shell element 20, as shown in FIG.

Thereafter, the binder resin (styrene-based elastomer, SB261
0, Sumitomo Chemical Co., Ltd.) 41 (FIG. 8). The filled molten binder resin 41 fuses the lower shell element 10 and the upper shell element 20 with each other by melting a surface that controls a part of the molten resin filling gap 80.
At the same time, the molten binder resin 41 is filled with the bush forming cavity 8 of the lead wire 31 constituted by the continuous gap.
1 to form a bush 50 in a form in which the lead wire 31 is in-molded.

Thereafter, the molten binder resin 41 is cooled and solidified, whereby the lower shell element 10, the upper shell element 20,
The electronic component 30 and the lead wire 31 are integrated, and the electronic component 3
0 is sealed in the shell. In the bush molding cavity 81, as shown in FIG. 4, the lead wire 31 is in-molded at the time of molding the bush 50, so that the molding shrinkage ensures the close contact between the bush 50 and the lead wire 31, and furthermore, Since the wire 31 is clamped and deformed by the lead wire holding grooves 14 and 24 formed in the lower shell element 10 and the upper shell element 20, the wire 31 does not come off even if the lead wire 31 is pulled. Furthermore, by using a resin having elasticity typified by an elastomer for the molten binder resin 41, the resin flows into the bush forming cavity 81,
The solidified binder resin 40 follows the bending operation of the lead wire 31 and can play a role of preventing breakage. In addition, it has a feature that it can be used in places where the temperature changes drastically.

The resin used for the binder is the same resin as the upper and lower shell elements 10 and 20, that is, ABS resin, AS resin, and P which are generally used for electronic parts.
S resin, PBT resin, PC resin, AN resin, PMMA resin, etc., as well as thermoplastic resin such as POM resin, PPO resin, PPS resin which are engineer plastics, more preferably thermoplastic resin An elastomer is used. As the thermoplastic elastomer, elastomers such as olefin-based, styrene-based, polyester-based, vinyl-based, urethane-based, and polyamide-based are convenient.

In the above example, the lower shell element 11 and the upper shell element 1 which have been formed in advance are formed of a thermoplastic resin in view of the fact that they are fused by the binder resin 40 melted in a later step. It is desirable to use a metal whose adhesion to resin is improved by subjecting the joint butting surface to a surface treatment. By using the metal shell element, the electromagnetic wave shielding property of the electronic component 30 can be secured.

As a method of installing the lower shell element 10 and the upper shell element 20 in the cavity of the injection mold so that the divided surfaces 12 and 22 of the upper shell element 20 face each other, molding is performed in a separate step. Although there is a method of moving the shell elements 10 and 20 thus formed to the corresponding sealing cavity and installing them, the shell elements 10 and 2 previously formed by injection molding are used.
By moving a part of the mold as it is without taking out the 0 from the mold, it is also possible by a method of moving to a position where the divided surfaces 12, 22 face each other.

In the method of fixing the electronic component 30 inside the shell element 10, a hole 32 is provided in the electronic component 30, and when the electronic component 30 is fixed by being sandwiched between the projections 11 and 21 existing on the two shell elements 10 and 20, The hole 32 is large and the electronic component 3
By providing looseness in the fixing of zero, even when the thermal expansion differs between the upper and lower shell elements 10, 20 and the electronic component 30 in use in a place where the temperature changes drastically, the electronic component 30 is not strained. Can be.

[0022]

According to the present invention, an electronic component having a lead wire is placed in one shell element, butted against the joining surface of the other shell element, and the butted surfaces of each other are fused with a molten binder resin. By attaching the electronic component, the electronic component can be easily and reliably sealed in the shell. Further, in the above method, by using a material having an electromagnetic wave shielding property for the upper and lower shell elements, an electronic component covered with a shell having the electromagnetic wave shielding property can be obtained. Also, by using an insulating material for the upper and lower shell elements, the electronic component can be protected from arcs. In addition, since electronic components are installed in the space inside the upper and lower shell elements, it is suitable for sealing electronic parts with movable parts.Furthermore, because there are few contact parts between upper and lower shell elements and electronic parts, it is suitable for use in places where temperature changes are severe. It is also possible to obtain an electronic component with a shell that has unique characteristics.

[Brief description of the drawings]

FIG. 1 is an exploded view of an electronic component and a shell element.

FIG. 2 is an explanatory view of a state in which an electronic component is sealed in a shell.

FIG. 3 is an explanatory view of a state in which a shell element is butted and a state in which a shell is sealed by filling a melted resin into a molten resin filling space formed by the butting;

FIG. 4 is an explanatory view of a bush portion in which a lead wire is drawn out of a shell.

FIG. 5 is an explanatory view just before setting upper and lower shell elements in a mold;

FIG. 6 is an explanatory view of a state in which upper and lower shell elements are set in a mold.

FIG. 7 is a front view of a state in which the upper and lower shell elements are set in the mold and the mold is closed.

FIG. 8 is an explanatory view of a state in which a mold is filled with a molten binder resin, upper and lower shell elements are adhered to each other, and an electronic component is sealed.

[Explanation of symbols]

 10, 20 Upper and lower shell elements 15, 25 Gap surface filled with molten resin 30 Electronic component 31 Lead wire 40 Solidified binder resin 41 Melted binder resin 50 Bush 60, 70 Mold for sealing shell 80 Melted resin filled gap 81 Bush molding cavity

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 7/00 H05K 7/00 M // B29L 31:34 B29L 31:34 F term (Reference) 4E352 AA05 BB04 CC33 CC36 CC52 CC56 DD06 DR02 DR37 EE03 FF04 FF07 GG04 GG08 GG11 GG20 4E360 CA02 CA05 CA08 EA24 EC05 ED03 ED22 ED28 GA12 GA21 GA22 GA23 GA29 GA33 GA34 GB97 GC02 GC08 GC14 4F206 AA13 AA45 AD03 AD05 AD19 J12A

Claims (6)

[Claims] 1. A two-shell element thus formed is received in a cavity of a shell-sealing mold so as to face each other, and an electronic component is housed in one or both of the shell elements. A method of manufacturing an electronic component with a shell, in which a molten resin is filled between the joining surfaces of two shell elements, and the shell elements are integrally adhered to each other after cooling and solidification of the resin to seal the electronic component in the shell. 2. A method for manufacturing a shell-equipped electronic component, wherein the shell element according to claim 1 is formed of a thermoplastic resin. 3. The shell element according to claim 1, wherein the shell element is formed of metal, and is subjected to a surface treatment so that a molten thermoplastic resin is easily bonded to a joint surface. Manufacturing method of electronic parts with 4. The electronic component according to claim 1, which is housed in one or both of two shell elements in advance, and after housing the shell element in a cavity, the shell elements are brought into close contact with a molten resin. Manufacturing method of electronic parts with shell. 5. A method of manufacturing a shelled electronic component in which two divided shell elements are joined together to seal an electronic component inside the shell element, wherein abutting surfaces of the shell elements are formed when they are abutted against each other. Forming a gap for filling the molten resin in between, a shell sealing mold, a cavity for housing the shell element, and housing the shell element in the cavity,
When the molds are fitted, a molten resin filling cavity is formed to surround the molten resin filling cavity from the outside and seal the molten resin filling cavity, incorporating an electronic component, and sealing the shell containing the shell element. After the mold is closed, the molten resin is filled into the molten resin filling cavity, and the resin is cooled and solidified, so that the mating surfaces of the shell elements are connected and adhered to the solidified resin. The manufacturing method of electronic parts with shells. 6. A part of the molten resin-filled cavity according to claim 5, wherein a lead wire accommodating cavity drawn out of the shell from an electronic component housed in the shell is formed continuously. When the resin is filled in the resin filling cavity, the resin is also filled in the lead wire accommodating cavity, so that the bush in which the lead wire is in-molded with the sealing resin is used as the resin for sealing the shell element. A method of manufacturing electronic components with shells, which is then integrally molded to ensure the sealing performance at the lead wire lead-out part.