WO2007013262A1

WO2007013262A1 - Terminal box for solar cell module

Info

Publication number: WO2007013262A1
Application number: PCT/JP2006/313219
Authority: WO
Inventors: Makoto Higashikozono; Hiroyuki Yoshikawa; Kazuki Naito
Original assignee: Sumitomo Wiring Systems, Ltd.
Priority date: 2005-07-28
Filing date: 2006-07-03
Publication date: 2007-02-01
Also published as: JP2007036036A

Abstract

A terminal box is provided on a substrate (11) with a plurality of terminal boards (30) for electrically interconnecting the plus or minus electrode of a solar cell module and a cable (18) for external connection corresponding to the both electrodes. A bypass diode (50) having a flat shape as a whole has the opposite end faces in the thickness direction exposed as electrode faces (51), and a resin molded side face (52). The bypass diode (50) is inserted between the opposing surfaces (41) of a diode terminal board portion (40) provided on two adjacent interconnection terminal boards (30) thus connecting the opposing surfaces (41) electrically with the electrode faces (51).

Description

Specification

Terminal box for solar cell module

Technical field

[0001] The present invention relates to a terminal box for a solar cell module.

Background art

[0002] As a conventional terminal box, two terminal plates are juxtaposed on a substrate, one of the terminal plates is connected to the positive electrode drawn from the back surface of the solar cell module, and the other is connected to the negative electrode. Things are known. An output cable for external connection is connected to these terminal plates, and a bypass diode as a rectifying element is connected between the two terminal plates (see, for example, Patent Document 1 below).

[0003] The bypass diode is for short-circuiting a reverse current during reverse load to one force and the other. The bypass diode described in Patent Document 1 also acts as a chip-like diode function part and a pair of conductor plates that are connected by soldering with the diode function part interposed therebetween. The pair of conductor plates extend in opposite directions to each other and are connected to corresponding terminal plates by soldering on the extended end side.

Patent Document 1: Japanese Patent No. 3498945

Disclosure of the invention

Problems to be solved by the invention

[0004] By the way, when connecting the pair of conductor plates and the terminal plate, it is necessary to perform soldering in a state where both the conductor plates are positioned and supported so as not to be powered. There is a situation that it is defeated.

[0005] The present invention has been completed based on the above situation, and an object of the present invention is to provide a terminal box for a solar cell module that is excellent in workability when connecting rectifying elements.

Means for solving the problem

[0006] The present invention relates to a box main body, a substrate provided in the box main body, a positive electrode or a negative electrode of a solar cell module arranged in parallel on the substrate, and both electrodes. A plurality of relay terminal plates that are connected to an external connection cable and electrically relay between the electrode and the cable, respectively, and two adjacent relay terminal plates among the plurality of relay terminal plates, respectively. A diode terminal plate portion having opposing surfaces provided opposite to each other, a flat shape as a whole, both end surfaces in the thickness direction being exposed as electrode surfaces, and side surfaces being mold-coated with grease; It is a terminal box for a solar cell module having a reverse load bypass rectifying element in which the opposing surface and the electrode surface are electrically connected by being inserted between the opposing surfaces of the plate portion.

[0007] The following configuration is preferable as an embodiment of the present invention.

(1) The diode terminal plate portion is formed by bending extended tongue pieces formed on adjacent portions of each relay terminal plate so as to rise with respect to the plate surface of the relay terminal plate. In this way, even if other components are arranged in the vicinity of the diode terminal plate portion on the substrate, the rectifying element can be connected without interfering with them.

(2) It is assumed that the rectifying element is inserted to a position in contact with the substrate surface. In this case, since the rectifying element is supported by both the opposing surfaces of the diode terminal plate and the substrate surface, the stability is good.

[0009] (3) The board is provided with a locking piece that protrudes from the surface of the relay terminal plate opposite to the board. In this way, the relay terminal plate is elastically locked by the locking piece, and the floating can be prevented.

(4) It is assumed that a positioning hole is formed in the relay terminal plate, and a positioning protrusion that can be engaged with the positioning hole of the relay terminal plate is formed in the substrate. In this way, when the relay terminal board is mounted on the board, the positioning protrusions provided on the board are fitted into the positioning holes provided in the relay terminal board, so that they can be easily positioned.

[0011] (5) The positioning hole and the positioning protrusion are formed in a rectangular shape that fits closely to each other. In this way, since the displacement hardly occurs when the positioning protrusion is fitted, the relay terminal plate can be positioned with certainty.

(6) The diode terminal plate is formed by fixing a thin plate separate from the relay terminal plate to the relay terminal plate by welding or brazing. This way, the relay terminal board Since the diode terminal plate part is formed by processing a thin plate, the stagnation deformation operation of the diode terminal plate part is smooth, and the rectifying element can be inserted smoothly. .

(7) The diode terminal plate portion is arranged so as to overlap in the thickness direction of the relay terminal plate, and the rectifying element is in a horizontal posture between the opposing surfaces of the diode terminal plate portion. In this way, the space in the thickness direction of the relay terminal plate, which is not bulky in the thickness direction of the relay terminal plate, can be effectively used.

(8) A step is formed in the thickness direction of the relay terminal plate on the substrate, the relay terminal plates are arranged adjacent to each other with a difference in height on both sides of the step, and one diode terminal plate portion is high. The relay terminal plate located at the position is low and overlapped with the relay terminal plate located at the upper position. This is preferable because it is not bulky in the thickness direction of the relay terminal board.

The invention's effect

[0015] According to the present invention, between the opposing surfaces of the diode terminal plate portions provided on the two adjacent relay terminal plates, a flat shape is formed as a whole, and both end surfaces in the thickness direction are exposed as electrode surfaces. By inserting a rectifying element whose side is mold-coated with resin, the opposing surface and the electrode surface are electrically connected, so it is possible to attach the rectifying element with one touch, and it has excellent workability. .

Brief Description of Drawings

FIG. 1 is a plan view of a box body according to a first embodiment.

[Figure 2] Cross section of the main part

[Figure 3] Cross section of bypass diode

FIG. 4 is a plan view of the box body of embodiment 2.

[Figure 5] Cross section of the main part

[Fig. 6] Plan view of box body of embodiment 3

[Fig.7] Cross section of the main part

Explanation of symbols

[0017] 10 ... Box body 11 ... Board

30 ... Terminal board

33 ... Attached part

35 ... Thin plate

40 ... Diode terminal plate

40Α ··· Ν side terminal plate

40Β ··· Ρ side terminal plate

41 ... Opposite surface

50 ·· 'Bypass diode (rectifier element)

51 ... Electrode surface

53..Diode part

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 of the present invention will be described with reference to FIGS.

The terminal box for a solar cell module that is useful in the present embodiment is attached to the back side of a solar cell module (not shown) in which a large number of solar cells connected in series are arranged. In addition, a plurality of relay terminal plates 30 (hereinafter also referred to as terminal plates 30) arranged in parallel in the box body 10 and a plurality of bin diodes 50 connected between adjacent relay terminal plates 30 (of the present invention). Equivalent to a “rectifying element”).

[0019] The box main body 10 is formed into a box shape with an open top surface by a synthetic resin material, filled with an insulating resin, and covered with an upper force cover (not shown). . Specifically, as shown in FIG. 1, the box body 10 includes a substantially rectangular substrate 11 on which a plurality of relay terminal plates 30 are placed side by side, and a side plate that is raised from the peripheral edge of the substrate 11 and surrounds the periphery. 12 and a partition wall 13 that rises from a predetermined position of the substrate 11 and partitions the relay terminal plate 30.

[0020] An opening 14 is formed in the substrate 11 over substantially the entire width, and the leading end of each relay terminal plate 30 faces the opening 14. Then, the lead 20 corresponding to each solar cell group is passed through the opening 14 of the substrate 11, and each lead 20 passed through the corresponding terminal plate 30 する, 30C. It is connected to the tip part of the solder by soldering or the like.

On the upper surface of the substrate 11, a positioning projection 15 that can be engaged with the positioning hole 31 of the relay terminal plate 30 is provided so as to correspond to each relay terminal plate 30. The positioning projection 15 has a truncated pyramid shape, more specifically, a shape obtained by cutting the apex side of a pyramid having a rectangular bottom surface by a plane substantially parallel to the bottom surface. The positioning hole 30 has a rectangular shape that allows the positioning projection 15 to be tightly fitted, and the relay terminal plate 30 is difficult to be displaced after the positioning projection 15 is fitted.

[0022] On the upper surface of the substrate 11, a pair of latching pieces 16 that can be squeezed are provided protruding outward from both ends of the positioning projection 15. This locking piece 16 engages the surface of each relay terminal plate 30 on the side opposite to the substrate 11 to restrict the lifting of the relay terminal plate. Specifically, the locking piece 16 engages with both side edges of the relay terminal plate 30 during the mounting process of the relay terminal plate 30 and deforms to open, and the engagement piece 16 is engaged as the relay terminal plate 30 is properly assembled. The stopper 16 is restored and the upper side edges of the relay terminal board 30 are pressed against each other with an upward force so as to restrict the floating of the relay terminal board 30.

A positioning wall 21 for positioning the relay terminal plate 30 is provided on the upper surface of the substrate 11. The positioning wall 21 is formed so as to extend along the width direction of the corresponding relay terminal plate 30, and a receiving groove (not shown) into which the rear end portion of the relay terminal plate 30 can be fitted is provided at the base. Yes. The relay terminal plate 30 takes an oblique posture when mounted on the board 11 and receives the rear end of the relay terminal plate 30 against the inner surface of the groove, and the state force applied is tilted so that the front end is tilted. The positioning protrusions 15 that are not present are configured to fit into the positioning holes 31.

[0024] The side plate 12 is provided with a pair of left and right cutouts 17, to which an output cable 18 for external connection is fitted, and a cable pressing member 19 is further fitted to fix the output cable 18. In addition, the cable pressing member 19 and the side plate 12 are integrally connected. The partition wall 13 is partitioned in a manner along the outer edge of the relay terminal plate 30, and is assembled with the relay terminal plate 30 positioned by the guide of the partition wall 13. Further, the insulating resin is filled on the relay terminal plate 30 in the inner space partitioned by the partition wall 13 so that the amount of the insulating resin used can be reduced. The relay terminal plate 30 is formed in a strip shape by cutting a conductive metal plate material or the like, and six relay terminal plates 30 are provided side by side on the substrate 11. On both sides of the substrate 11 in the width direction, cable terminal plates 30A to which corresponding external connection cables 18 are connected are arranged. The cable terminal plate 30A is formed shorter in the length direction than the other terminal plates 30B and 30C. The end of the cable 18 is placed on the rear end of the cable terminal board 30A with the conductor exposed, and is screwed with a screw 25. The tip of the screw 25 is screwed into a screw hole (not shown) provided in the board 11, so that the cable terminal plate 30A is connected to the cable 18 and fixed to the board 11. Talk!

[0026] Four terminal plates 30B and 30C that are not connected to the cable 18 are arranged at a substantially central portion in the width direction of the substrate 11. These terminal boards 30B and 30C have two types of terminal boards 30B and 30C with different lengths. Among them, two terminal boards 30B formed short (hereinafter referred to as short terminal board 30B) Is provided adjacent to the cable terminal plate 30A, and the remaining two terminal plates 3 OC (hereinafter referred to as a long terminal plate 30C) are provided in the substantially central portion of the substrate 11. The short terminal board 30B does not have a contact point with the solar cell module side, and the partition wall 13 surrounds the tip of the short terminal board 30B. The short terminal board 30B and the long terminal board 30C adjacent to each other are bridged so as to be conductive by jumper pins 32 at the respective rear ends.

[0027] Further, on both side edges of each relay terminal plate 30 in the width direction, attachment portions 33 are provided to project sideways. The extension tongue piece 33A extended from the adjacent attachment portion 33 is opposed to the relay terminal plate 30 in the plate thickness direction, and a diode terminal plate portion 40 into which a bypass diode 50 can be inserted is provided therebetween. Is formed. Specifically, the diode terminal plate 40 is connected between the cable terminal plate 30A on the left end and one short terminal plate 30B, between the two long terminal plates 30C, and on the cable terminal plate 30A on the right end. Each is arranged between one short terminal board 30B. In addition, the diode terminal plate portion 40 is bent substantially so that the extension tongue 33A of the attachment portion 33 rises with respect to the plate surface of the relay terminal plate 30 to be in an upright state, thereby being substantially perpendicular to the surface of the substrate 11. And they are arranged almost parallel to each other. Further, the distance between the diode terminal plate portions 40 is set to be smaller than the thickness of the bypass diode 50 in a natural state. [0028] The non-pass diode 50 has a flat shape as a whole, specifically a disc shape, and both end surfaces (upper and lower surfaces shown in FIG. 3) in the thickness direction are exposed as electrode surfaces 51. The removed part (side 52) is mold-coated with a resin such as silicon. Specifically, the bypass diode 50 includes a P-side electrode 51B located on the upper side, an N-side electrode 51A located on the lower side, and a chip-like chip that is sandwiched between the electrodes 51A and 51B and sealed internally. It consists of a diode part 53 and a resin part 54 covering the side surface 52, and the contact area with the diode part 53 is larger for the N-side electrode 51A than for the P-side electrode 51B. In the explanation of the structure of the bypass diode 50, the vertical direction is based on FIG.

[0029] The power bypass diode 50 includes a grease portion 54! /, And differs from a bare chip diode in that it is also different from a package diode in that both ends are exposed as electrode surfaces 51. . As the bypass diode 50, a commercially available product can be used.

[0030] N-side electrode 51A (force sword side) of both electrodes 51A, 51B of bypass diode 50 can be brought into contact with diode terminal plate portion 40 located on the right side shown in FIG. 1 and FIG. The P-side electrode 51B (anode side) can contact the diode terminal plate 40 located on the left side. Here, the diode terminal plate 40 that contacts the N-side electrode 51A of the bypass diode 50 is the N-side terminal plate 40A, and the diode terminal plate 40 that contacts the P-side electrode 51B of the bypass diode 50 is the P-side terminal plate. In the case of this embodiment, the N-side terminal plate portion 40A is formed wider than the P-side terminal plate portion 40B, so that when the no-pass diode 50 generates heat, Good heat dissipation of 40A side terminal board is guaranteed.

Next, the manufacturing method and operation of this embodiment will be described. First, the extended tongue piece 33A extended from the attachment portion 33 is bent to form the diode terminal plate portion 40. Next, each relay terminal plate 30 is placed on the substrate 11, and the corresponding diode terminal plate portion 40 is positioned oppositely. At this time, by inserting the positioning projection 15 projecting on the board 11 into the positioning hole 31 of the relay terminal plate 30, the relay terminal plate 30 is positioned, and further, the locking piece 16 is elastic. The lifting of the relay terminal board 30 is restricted by the locking.

[0032] Then, the screw 25 is screwed onto the cable terminal plate 30A to perform screwing. Continue Attach the cable holding member 19 to the cable terminal board 30A and fix the cable 18 on the board 11. In this case, with respect to the short terminal board 30B and the long terminal board 30C that are not connected to the cable 18, the rear ends thereof are fitted into the receiving grooves (not shown) of the positioning wall 21, and further predetermined. Jumper pin 32 is bridged between terminal boards 30B and 30C and soldered.

Next, the electrode surface 51 of the bypass diode 50 is oriented in a direction perpendicular to the surface of the substrate 11, and the N-side electrode 51A is brought into contact with the N-side terminal plate portion 40A of the diode terminal plate portion 40, and Bypass the P-side electrode 51B against the P-side terminal plate 40B of the diode terminal plate 40 and slide the bypass diode 50 between the opposing surfaces 41 of both diode terminal plates 40. As the no-pass diode 50 is inserted, the diode terminal plate part 40 is expanded and deformed, and the elastic restoring force of the diode terminal plate part 40 causes the nos diode 50 to elastically move between the opposing surfaces 41. It is pinched. When the bypass diode 50 is inserted to the surface of the substrate 11, it is supported by the opposing surfaces 41 and the surface of the substrate 11 and becomes a stable posture.

[0034] Thereafter, the box body 10 is fixed to the back surface side of the solar cell module with an adhesive, a double-sided tape, or a bolt. In the process of attachment, the lead 20 connected to the electrode of the solar cell module is drawn into the box body 10 through the opening 14 of the substrate 11, and the lead 20 is soldered to the tip of the terminal plates 30A and 30C. Then, an insulating resin such as silicon resin is filled in the inner space of the partition wall 13 in the box body 10, and further covered with a cover to tighten the lid. The inside of the box body 10 is hermetically sealed by the insulating grease.

According to the present embodiment, by inserting the bypass diode 50 between the opposing surfaces 41 of the diode terminal plate portion 40, the bypass diode 50 can be easily attached with one touch. Therefore, the workability when connecting the no-pass diode 50 to the relay terminal plate 30 is excellent!

In addition, the bypass diode 50 is disposed between the opposing surfaces 41 of the diode terminal plate portion 40 formed by bending the electrode surface 51 of the bypass diode 50 so as to rise with respect to the plate surface of the relay terminal plate 30. Therefore, even if parts are arranged around the diode terminal plate 40, the bypass diode 50 can be easily connected without interfering with these parts. Furthermore, the bypass diode 50 according to the present embodiment has a side surface 52 of the diode portion 53 covered with grease. Therefore, unlike the conventional bare chip-shaped diode, the bypass diode 50 can avoid an external impact. There is no need to provide protective means (for example, reference numeral 56B in FIG. 1 of Japanese Patent No. 3498945). In fact, the bypass diode 50 in this embodiment may take a large space like a knock diode! /.

Next, Embodiment 2 of the present invention will be described with reference to FIG. 4 and FIG. In the second embodiment, a thin plate 35 that is separate from the relay terminal plate 30 is provided as the diode terminal plate portion 40, and the first diode 50 is indirectly connected via the thin plate 35 in the first embodiment. Is different.

In the second embodiment, unlike the first embodiment, the cable terminal plate 30A is not provided with a screw insertion hole, and the board 11 is not provided with a screw hole. The cable terminal plate 30A is formed longer in the front-rear direction than that of the first embodiment, and the barrel portion 24 provided at the rear end thereof is caulked to the terminal conductor of the cable 18. Furthermore, as shown in FIG. 4, the terminal plates 30B and 30C not connected to the cable 18 have a short terminal plate 30B and a long terminal plate 30C adjacent to each other. It is connected together via the connecting part 34, and the jumper pin 32 is provided!

[0040] The thin plate 35 separate from the relay terminal plate 30 is made of metal that is thinner than the relay terminal plate 30. Specifically, the thin plate 35 includes a connecting portion 36 that is placed on the upper surface of the relay terminal plate 30 across the attachment portion 33 of the relay terminal plate 30 having a flat shape, and a diode terminal plate that stands up substantially at right angles from one end thereof. The bypass diode 50 having the same configuration as that of the first embodiment can be inserted between the opposing surfaces 41 of the two diode terminal plate portions 40. In the present embodiment, as in the first embodiment, the diode terminal plate portion 40 located on the right side in FIG. 4 is the N-side terminal plate portion 40A, and the left-hand side is the P-side terminal. The N-side terminal plate portion 40A is formed larger than the P-side terminal plate portion 40B.

[0041] A connection protrusion 37 is formed by cutting and raising substantially at the center of the attachment portion 33 of each relay terminal plate 30 to which the thin plate 35 is connected. The connection protrusion 37 is formed on the connection portion 36 of the thin plate 35. The thin plate 35 can be fixed to the upper surface of the relay terminal plate 30 by being penetrated through the connection hole 36A and soldered at the base portion. Further, the relay terminal plate 30 is formed with an opening 38 as the connection protrusion 37 is cut and raised, so that the solder heat prevents the heat from spreading to the surroundings. Become.

According to the present embodiment, since the diode terminal plate portion 40 is provided by bending the thin plate 35 that is thinner than the relay terminal plate 30, the stagnation deformation operation of the diode terminal plate portion 40 is smooth. Thus, the insertion operation of the no-pass diode 50 can be performed more smoothly. In addition, since the diode terminal plate 40 is formed separately from the relay terminal plate 30, the degree of freedom of setting when installing the diode terminal plate 40 can be increased.

6 and 7 show Embodiment 3 of the present invention. In this embodiment, the difference between the first and second embodiments is that the step 26 is provided on the upper surface of the substrate 11 and the insertion direction of the binos diode 50 is set in the horizontal direction. ing.

[0044] A step 26 is formed in the substrate 11 in the thickness direction of the relay terminal plate 30. By way of the step 26, the top surface of the substrate 11 is lowered by one step toward the right side of the left side force shown in FIG. ing. On both sides of the step 26, relay terminal plates 30 are arranged adjacent to each other with a difference in height, so that the end surface of the relay terminal plate 30 placed on the one-stepped surface is abutted against the step 26. .

A thin plate 35 A that is thinner than the relay terminal plate 30 is bridged between the adjacent relay terminal plates 30. In the illustrated case, three thin plates 35A are arranged in series across each terminal plate 30.

[0046] As shown in FIG. 7, the thin plate 35A is configured to extend linearly as a whole, and has one end connected to the relay terminal plate 30 arranged at a high position and the other end at a low position. The relay terminal board 30 is arranged so as to overlap the relay terminal board 30. Further, another thin plate 35B is placed on the upper surface of the relay terminal plate 30 disposed at a lower position, and the other end portion of the thin plate 35A is disposed so as to cover the other thin plate 35B. The bypass diode 50 having the same form as that of the first embodiment can be elastically inserted between the opposing surfaces of the thin plates 35A and 35B in a lateral orientation. In this case, the other end of the thin plate 35A is connected to the bypass diode 50. A circular arc is formed along the outer edge.

Here, the other end portion of the thin plate 35A connected to the relay terminal plate at the high position and the one end portion of the thin plate 35B arranged at the relay terminal plate 30 at the low position are used for the diode terminal plate of the present invention. Part 40 is constructed. Furthermore, the diode terminal plate portion 40 of the thin plate 35A that contacts the P-side electrode 51B of the bypass diode 50 is defined as the P-side terminal plate portion 40B, and the diode terminal plate portion of the thin plate 35B that contacts the N-side electrode 51A of the bypass diode 50. 40 is the N-side terminal plate 40A. When the entire N-side terminal plate portion 40A is mounted and connected to the relay terminal plate 30, heat can be efficiently radiated from the N-side terminal plate portion 40A.

[0048] According to the present embodiment, the bypass diode 50 is positioned between the opposing surfaces 41 of the diode terminal plate portion 40 in both the thin plates 35A and 35B in a lateral orientation in which the electrode surface 51 faces in the direction orthogonal to the substrate 11. Therefore, it is possible to effectively use the space in the height direction (vertical direction) that is not bulky in the direction perpendicular to the substrate 11, that is, in the height direction (vertical direction).

[0049] <Other embodiments>

The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

(1) In the present embodiment, the diode terminal plate portion is provided with a flat plate shape, but at least one of the opposing surfaces is bent inwardly to apply a bending force to the protruding switch shape. It is also possible to have a contact portion formed.

(2) Although the step is provided on the substrate in the third embodiment, a plurality of relay terminal plates may be placed at the same height without providing a step on the substrate.

(3) In Embodiment 1 and Embodiment 2 described above, a diode terminal plate portion that is perpendicular to the surface of the substrate is provided, but the diode terminal plate portion has a facing surface into which the bypass diode can be inserted in a vertical force. If it is present, it does not have to be arranged exactly perpendicular to the surface of the substrate.

(4) In Embodiment 3 described above, the thin plate connected to the right terminal plate and the thin plate connected to the left terminal plate are provided as the diode terminal plate portion. Further, it is not necessary to provide a thin plate. (5) In the present invention, the short terminal board and the long terminal board are bridged by jumper pins, connected to each other by a connecting portion, and used by changing each other. Well, you can have a relay terminal board of uniform length.

(6) A guide portion having a trumpet shape for guiding may be provided at the tip of the diode terminal plate portion.

(7) In the present invention, soldering may be performed between the diode terminal plate portion 40 and the bypass diode 50 as necessary.

Claims

The scope of the claims

[1] With the box body

A substrate provided in the box body;

It is juxtaposed on the substrate and connected to the positive electrode or negative electrode of the solar cell module and an external connection cable corresponding to both electrodes, and is electrically relayed between the electrode and the cable, respectively. A plurality of relay terminal boards,

A diode terminal plate portion provided on each of two adjacent relay terminal plates among the plurality of relay terminal plates and having opposing surfaces facing each other;

It has a flat shape as a whole, both end surfaces in the thickness direction are exposed as electrode surfaces, and side surfaces are mold-coated with resin, and inserted between the opposing surfaces of the diode terminal plate portion to A terminal box for a solar cell module, comprising a rectifying element for bypass during reverse load to which the electrode surface is electrically connected.

[2] The diode terminal plate portion is formed by bending extended tongue pieces formed on adjacent portions of the relay terminal plates so as to rise with respect to the plate surface of the relay terminal plate. A terminal box for a solar cell module as set forth in paragraph 1 of the above.

[3] The terminal box for a solar cell module according to claim 1 or 2, wherein the rectifying element is inserted to a position in contact with the substrate surface.

[4] The method according to any one of claims 1 to 3, wherein the board is provided with a locking piece projectingly engaged with a surface of the relay terminal plate opposite to the board. Terminal box for solar cell modules.

[5] A positioning hole is formed in the relay terminal plate,

The solar cell module according to any one of claims 1 and 4, wherein a positioning protrusion that can be engaged with the positioning hole of the relay terminal plate is formed on the substrate. Terminal box.

6. The solar cell module terminal box according to claim 5, wherein the positioning hole and the positioning projection are formed in a rectangular shape that fits closely to each other.

[7] The diode terminal plate portion according to any one of claims 1 to 6, wherein the diode terminal plate portion is formed by fixing a thin plate separate from the relay terminal plate to the relay terminal plate by welding or brazing. The terminal box for solar cell modules in any one.

[8] The diode terminal plate portion is arranged so as to overlap in the thickness direction of the relay terminal plate, and the rectifying element is in a lateral posture between the opposing surfaces of the diode terminal plate portion. A terminal box for a solar cell module according to any one of items 1 and 4 to 7.

[9] A step is formed in the thickness direction of the relay terminal plate on the substrate, the relay terminal plate is arranged adjacent to each other with a difference in height on both sides of the step, and one of the diode terminal plate portions is The relay terminal plate force at a high position is arranged so as to overlap above the relay terminal plate at a low position, or any one of claims 1, 4, and 8 Terminal box for solar cell modules.