JPH0286150A - Molded diode and its manufacture - Google Patents

Molded diode and its manufacture

Info

Publication number
JPH0286150A
JPH0286150A JP63237790A JP23779088A JPH0286150A JP H0286150 A JPH0286150 A JP H0286150A JP 63237790 A JP63237790 A JP 63237790A JP 23779088 A JP23779088 A JP 23779088A JP H0286150 A JPH0286150 A JP H0286150A
Authority
JP
Japan
Prior art keywords
electrodes
pellet
wafer
resin
mold resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63237790A
Other versions
JP2558840B2 (en
Inventor
Mutsuo Kurokawa
Original Assignee
Nec Kansai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Kansai Ltd filed Critical Nec Kansai Ltd
Priority to JP63237790A priority Critical patent/JP2558840B2/en
Publication of JPH0286150A publication Critical patent/JPH0286150A/en
Application granted granted Critical
Publication of JP2558840B2 publication Critical patent/JP2558840B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE: To make external size small, eliminate useless mold resin, and prevent the generation of cut waste of a lead frame by covering a pellet provided with electrodes on the front and the rear, and electrically connecting pellet electrodes protruding outward from the resin, with external electrodes.
CONSTITUTION: Pellet electrodes 6, 6 are fixed on the front and the rear of a wafer 5 so as to correspond with each diode element; after the wafer 5 is stuck on an adhesive tape 7, the wafer is divided into individual diode pellets 8, which are arranged at equal intervals by stretching the adhesive tape 7; mold resin 9 is poured into the gaps between the pellets 8 and hardened; superfluous resin attaching on the upper surface of the pellet electrodes 6, 6 is polished, and the pellet electrodes 6, 6 are exposed outside the mold resin 9; characteristics are measured by bringing probe pins 10a, 10b into contact with the pellet electrodes 6, 6; each molded element 11 is separated, and external electrodes 12 are fixed on each of the elements.
COPYRIGHT: (C)1990,JPO&Japio
JP63237790A 1988-09-22 1988-09-22 Mold diode and its manufacturing method Expired - Fee Related JP2558840B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63237790A JP2558840B2 (en) 1988-09-22 1988-09-22 Mold diode and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63237790A JP2558840B2 (en) 1988-09-22 1988-09-22 Mold diode and its manufacturing method

Publications (2)

Publication Number Publication Date
JPH0286150A true JPH0286150A (en) 1990-03-27
JP2558840B2 JP2558840B2 (en) 1996-11-27

Family

ID=17020470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63237790A Expired - Fee Related JP2558840B2 (en) 1988-09-22 1988-09-22 Mold diode and its manufacturing method

Country Status (1)

Country Link
JP (1) JP2558840B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345560A (en) * 2000-02-09 2001-12-14 Ngk Spark Plug Co Ltd Wiring board, and its manufacturing method, and electronic component
WO2007013262A1 (en) * 2005-07-28 2007-02-01 Sumitomo Wiring Systems, Ltd. Terminal box for solar cell module
JP2007506279A (en) * 2003-09-18 2007-03-15 クリー インコーポレイテッドCree Inc. Method and apparatus for producing molded chips
JP2010062316A (en) * 2008-09-03 2010-03-18 Toshiba Corp Semiconductor device and method for manufacturing the semiconductor device
JP2010087490A (en) * 2008-09-03 2010-04-15 Toshiba Corp Semiconductor device and semiconductor device manufacturing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4685251B2 (en) * 2000-02-09 2011-05-18 日本特殊陶業株式会社 Wiring board manufacturing method
JP2001345560A (en) * 2000-02-09 2001-12-14 Ngk Spark Plug Co Ltd Wiring board, and its manufacturing method, and electronic component
US9105817B2 (en) 2003-09-18 2015-08-11 Cree, Inc. Molded chip fabrication method and apparatus
JP2007506279A (en) * 2003-09-18 2007-03-15 クリー インコーポレイテッドCree Inc. Method and apparatus for producing molded chips
US9093616B2 (en) 2003-09-18 2015-07-28 Cree, Inc. Molded chip fabrication method and apparatus
US10164158B2 (en) 2003-09-18 2018-12-25 Cree, Inc. Molded chip fabrication method and apparatus
WO2007013262A1 (en) * 2005-07-28 2007-02-01 Sumitomo Wiring Systems, Ltd. Terminal box for solar cell module
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8378479B2 (en) 2008-09-03 2013-02-19 Kabushiki Kaisha Toshiba Semiconductor device and method for fabricating semiconductor device
JP2010062316A (en) * 2008-09-03 2010-03-18 Toshiba Corp Semiconductor device and method for manufacturing the semiconductor device
JP2010087490A (en) * 2008-09-03 2010-04-15 Toshiba Corp Semiconductor device and semiconductor device manufacturing method
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same

Also Published As

Publication number Publication date
JP2558840B2 (en) 1996-11-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees