JPS61153350U - - Google Patents

Info

Publication number
JPS61153350U
JPS61153350U JP3659785U JP3659785U JPS61153350U JP S61153350 U JPS61153350 U JP S61153350U JP 3659785 U JP3659785 U JP 3659785U JP 3659785 U JP3659785 U JP 3659785U JP S61153350 U JPS61153350 U JP S61153350U
Authority
JP
Japan
Prior art keywords
electrode
dumets
square
chip
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3659785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3659785U priority Critical patent/JPS61153350U/ja
Publication of JPS61153350U publication Critical patent/JPS61153350U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例に係るチツプ型ダイオ
ードの全体外観図、第2図はその断面図、第3図
はモールド部を除いた斜視図、第4図および第5
図は従来のチツプ型ダイオードの全体外観図であ
る。 図中、符号1は電極デユメツト、3は樹脂材。
Fig. 1 is an overall external view of a chip diode according to an embodiment of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 is a perspective view excluding the molded part, Figs.
The figure is an overall external view of a conventional chip diode. In the figure, numeral 1 is an electrode dumet, and 3 is a resin material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外端を角形に形成した一対の電極デユメツト1
,1間に素子2を挾み持ち、電極デユメツト1,
1の両外端角形部1a,1a間を樹脂材3でモー
ルドし、全体として角形に形成してあるチツプ型
ダイオード。
A pair of electrode dumets 1 with square outer ends
, 1, with the element 2 sandwiched between the electrode dumets 1,
A chip type diode is formed by molding a resin material 3 between both outer end square parts 1a and 1a of the chip 1 to form a square shape as a whole.
JP3659785U 1985-03-13 1985-03-13 Pending JPS61153350U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3659785U JPS61153350U (en) 1985-03-13 1985-03-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3659785U JPS61153350U (en) 1985-03-13 1985-03-13

Publications (1)

Publication Number Publication Date
JPS61153350U true JPS61153350U (en) 1986-09-22

Family

ID=30541929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3659785U Pending JPS61153350U (en) 1985-03-13 1985-03-13

Country Status (1)

Country Link
JP (1) JPS61153350U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013262A1 (en) * 2005-07-28 2007-02-01 Sumitomo Wiring Systems, Ltd. Terminal box for solar cell module
JP2010056517A (en) * 2008-07-28 2010-03-11 Toshiba Corp Semiconductor apparatus and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210641A (en) * 1982-05-31 1983-12-07 Rohm Co Ltd Preparation of small-sized electronic components
JPS596843B2 (en) * 1972-06-05 1984-02-15 アルザ コ−ポレ−シヨン Manufacturing method of drug supply body

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596843B2 (en) * 1972-06-05 1984-02-15 アルザ コ−ポレ−シヨン Manufacturing method of drug supply body
JPS58210641A (en) * 1982-05-31 1983-12-07 Rohm Co Ltd Preparation of small-sized electronic components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013262A1 (en) * 2005-07-28 2007-02-01 Sumitomo Wiring Systems, Ltd. Terminal box for solar cell module
JP2010056517A (en) * 2008-07-28 2010-03-11 Toshiba Corp Semiconductor apparatus and method for manufacturing the same
US8334173B2 (en) 2008-07-28 2012-12-18 Kabushiki Kaisha Toshiba Method for manufacturing semiconductor apparatus

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