JPS61153350U - - Google Patents
Info
- Publication number
- JPS61153350U JPS61153350U JP3659785U JP3659785U JPS61153350U JP S61153350 U JPS61153350 U JP S61153350U JP 3659785 U JP3659785 U JP 3659785U JP 3659785 U JP3659785 U JP 3659785U JP S61153350 U JPS61153350 U JP S61153350U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- dumets
- square
- chip
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案の実施例に係るチツプ型ダイオ
ードの全体外観図、第2図はその断面図、第3図
はモールド部を除いた斜視図、第4図および第5
図は従来のチツプ型ダイオードの全体外観図であ
る。
図中、符号1は電極デユメツト、3は樹脂材。
Fig. 1 is an overall external view of a chip diode according to an embodiment of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 is a perspective view excluding the molded part, Figs.
The figure is an overall external view of a conventional chip diode. In the figure, numeral 1 is an electrode dumet, and 3 is a resin material.
Claims (1)
,1間に素子2を挾み持ち、電極デユメツト1,
1の両外端角形部1a,1a間を樹脂材3でモー
ルドし、全体として角形に形成してあるチツプ型
ダイオード。 A pair of electrode dumets 1 with square outer ends
, 1, with the element 2 sandwiched between the electrode dumets 1,
A chip type diode is formed by molding a resin material 3 between both outer end square parts 1a and 1a of the chip 1 to form a square shape as a whole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3659785U JPS61153350U (en) | 1985-03-13 | 1985-03-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3659785U JPS61153350U (en) | 1985-03-13 | 1985-03-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61153350U true JPS61153350U (en) | 1986-09-22 |
Family
ID=30541929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3659785U Pending JPS61153350U (en) | 1985-03-13 | 1985-03-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61153350U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007013262A1 (en) * | 2005-07-28 | 2007-02-01 | Sumitomo Wiring Systems, Ltd. | Terminal box for solar cell module |
JP2010056517A (en) * | 2008-07-28 | 2010-03-11 | Toshiba Corp | Semiconductor apparatus and method for manufacturing the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58210641A (en) * | 1982-05-31 | 1983-12-07 | Rohm Co Ltd | Preparation of small-sized electronic components |
JPS596843B2 (en) * | 1972-06-05 | 1984-02-15 | アルザ コ−ポレ−シヨン | Manufacturing method of drug supply body |
-
1985
- 1985-03-13 JP JP3659785U patent/JPS61153350U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS596843B2 (en) * | 1972-06-05 | 1984-02-15 | アルザ コ−ポレ−シヨン | Manufacturing method of drug supply body |
JPS58210641A (en) * | 1982-05-31 | 1983-12-07 | Rohm Co Ltd | Preparation of small-sized electronic components |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007013262A1 (en) * | 2005-07-28 | 2007-02-01 | Sumitomo Wiring Systems, Ltd. | Terminal box for solar cell module |
JP2010056517A (en) * | 2008-07-28 | 2010-03-11 | Toshiba Corp | Semiconductor apparatus and method for manufacturing the same |
US8334173B2 (en) | 2008-07-28 | 2012-12-18 | Kabushiki Kaisha Toshiba | Method for manufacturing semiconductor apparatus |