CN214545322U

CN214545322U - Heat radiation structure of high-power supply

Info

Publication number: CN214545322U
Application number: CN202120980886.6U
Authority: CN
Inventors: 陈滨; 吴文江; 吴一祥
Original assignee: Shenzhen Landworld Technology Co ltd
Current assignee: Shenzhen Landworld Technology Co ltd
Priority date: 2021-05-08
Filing date: 2021-05-08
Publication date: 2021-10-29
Anticipated expiration: 2031-05-08

Abstract

The utility model relates to a radiating technical field of device especially relates to a heat radiation structure of high-power, including heat dissipation shell and with circuit board, the electricity is connected with power device on the circuit board, the heat dissipation shell includes radiating bottom plate and sets up in the heat dissipation enclosure on radiating bottom plate week edge, a side that the heat dissipation enclosure deviates from radiating bottom plate is provided with the heat dissipation base plate, power device is the dress formula power device that pastes, the dress formula power device is installed on the heat dissipation base plate. This application power device dress does not need cooling pad or insulating film on pasting the radiating basal plate, has that the thermal resistance is little, the radiating effect is good, the characteristics that the resistance to pressure is good, only need during the installation with aluminium base plate crimping to heat dissipation plane lateral wall, screw quantity reduces, has also reduced workman's the operation degree of difficulty.

Description

Heat radiation structure of high-power supply

Technical Field

The application relates to the technical field of heat dissipation of devices, in particular to a heat dissipation structure of a high-power supply.

Background

On high-power supplies with higher shockproof levels, such as a vehicle-mounted charger, a vehicle-mounted DC/DC or a motor driver, the high-power supplies with electric power of more than 180w can generate more heat in the process of electrifying operation.

In a high-power supply, a power device is mainly used for high-power electric energy conversion of power equipment and control of a high-power circuit. The current of the power device is usually tens to thousands of amperes, and the voltage is more than hundreds of volts, so the calorific value is also large, and the power device needs to be radiated in time. The common way of radiating the heat of the power device is to radiate the heat through a radiator, and the common way of radiating the heat on the vehicle-mounted power supply is to fix the power device on a radiating shell, so that a separate radiator is not needed any more. The power device and the heat dissipation shell are fixed in various ways, the most common way is that the power device is installed on a circuit main board, the power device faces the outer side of the heat dissipation shell and is pressed on the side wall of the heat dissipation shell through screws, and a heat dissipation pad and an insulation film are required to be clamped between the power device and the heat dissipation shell, so that the heat of the power device is conducted away through the heat dissipation shell, and the heat dissipation function is realized.

The heat dissipation pad or the insulating film is easy to be damaged, so the scheme has the defects of poor stability and poor heat dissipation effect of the heat dissipation structure of the power device.

SUMMERY OF THE UTILITY MODEL

In order to promote heat radiation structure's stability, this application provides a heat radiation structure of high-power.

In a first aspect, the present application provides a heat dissipation structure for a high power supply, which adopts the following technical scheme:

the utility model provides a heat radiation structure of high-power supply, includes heat dissipation shell and circuit board, is connected with power device on the circuit board, and the heat dissipation shell includes the heat dissipation bottom plate and sets up in the heat dissipation enclosure on heat dissipation bottom plate periphery, and a side that the heat dissipation enclosure deviates from the heat dissipation bottom plate is provided with the heat dissipation base plate, and power device is the dress formula power device that pastes, and the dress formula power device is installed on the heat dissipation base plate.

By the technical scheme, the mounting-type power device is attached to the radiating substrate, so that the contact area between the power device and the radiating substrate is increased, the mounting-type power device can conveniently and timely transfer heat to the radiating substrate, and the effect of timely radiating the power device is realized; the heat dissipation substrate is separated from the circuit main board, so that the interval between the power device and the electronic component on the circuit main board can be increased, the power device can dissipate heat in time conveniently, and the heat dissipation structure has the advantages of good stability and good heat dissipation effect.

Optionally, the circuit main board is electrically connected with a driving chip for driving the mounted power device to work, and the mounted power device is arranged on one side of the heat dissipation substrate away from the heat dissipation enclosure wall; one side of the heat dissipation substrate, which is far away from the heat dissipation enclosing wall, is also provided with a driving circuit board, and the driving chip is arranged on one side of the driving circuit board, which faces the mounting and sticking type power device.

Through the technical scheme, the driving chip is separated from the circuit main board and is arranged on the driving circuit board independent of the heat dissipation substrate and the circuit main board, so that the interval of electronic components on the circuit main board is further increased, and the heat dissipation effect of the high-power supply is improved.

Optionally, the driving circuit board is electrically connected with the circuit main board through a gold finger.

Through the technical scheme, because the area of contact of the golden finger is large, the connection stability between the drive circuit board and the circuit main board can be ensured, and meanwhile, the connection between the drive chip and the circuit main board is more convenient.

Optionally, a conductive column capable of electrically communicating with the mounting-type power device is disposed on one side of the heat dissipation substrate facing the driving circuit board, and an axis of the conductive column is perpendicular to the surface of the heat dissipation substrate; the drive circuit board is provided with a conductive contact which can be electrically communicated with the drive chip, and one end of the conductive column far away from the heat dissipation substrate is electrically connected with the conductive contact.

Through above-mentioned technical scheme, the circular telegram back, driver chip's the signal of telecommunication can be through leading electrical pillar transmission to conductive contact on, transmit to dress formula power device again to realize driver chip control dress formula power device work, lead the direct drive circuit board that is connected to from radiating substrate of electrical pillar, promoted the transmission efficiency of the signal of telecommunication, reduced circuit layout complexity, still strengthened radiating substrate and drive circuit board structural connection's stability.

Optionally, a hollow sleeve is arranged on one side of the heat dissipation substrate facing the driving circuit board, a connection bump is arranged on one side of the driving circuit board facing the heat dissipation substrate, an axis of the hollow sleeve is perpendicular to the surface of the heat dissipation substrate, and one end of the hollow sleeve, which is far away from the heat dissipation substrate, is fixed with the connection bump.

Through above-mentioned technical scheme, hollow sleeve has further strengthened the stability of heat dissipation base plate and drive circuit board structural connection.

Optionally, a through hole penetrates through the heat dissipation enclosure, the hollow sleeve penetrates through the heat dissipation substrate, and a connecting piece for fixing the heat dissipation enclosure and the heat dissipation substrate penetrates through the through hole and the hollow sleeve.

Through the technical scheme, the connecting piece fixes the heat dissipation enclosing wall and the heat dissipation substrate, so that the heat dissipation enclosing wall is fixed with the driving circuit board, on one hand, the heat dissipation effect between the heat dissipation substrate and the heat dissipation enclosing wall can be improved, and on the other hand, the anti-vibration effect of the mounting type power device in the heat dissipation structure of the high-power supply can be improved.

Optionally, the mounted power device is mounted on the heat dissipation substrate by reflow soldering.

Through the technical scheme, the reflow soldering process has the characteristics of reflow, self-positioning effect and the like, so that high automation and high speed of soldering between the mounting power device and the radiating substrate are easily realized, mechanical operation is facilitated, and the mounting speed between the mounting power device and the radiating substrate is increased.

Optionally, the heat dissipation substrate is an aluminum substrate.

Through the technical scheme, the heat dissipation substrate made of the aluminum material has the characteristics of higher heat conductivity, lighter weight, lower cost and the like, can play a role in reducing the cost of the high-power supply heat dissipation structure, and obtains a better heat dissipation effect.

Optionally, the heat dissipation enclosure and the heat dissipation bottom plate enclose to form a mounting cavity, the circuit board is arranged towards the mounting cavity, and the circuit board is fixed to the edge of the mounting cavity.

Through the technical scheme, because the volume of high-power supply is great, it is higher to its stability and anti vibration performance, consequently the heat dissipation shell can play the effect that supports to circuit mainboard for placing of electronic components on circuit mainboard and the circuit mainboard is more stable, and electronic components's on the circuit mainboard heat also can dispel the heat through the heat dissipation shell simultaneously, thereby has further promoted electronic components's radiating effect.

In summary, the present application includes at least one of the following beneficial technical effects:

1. because the power device is arranged on the radiating substrate, the contact area between the power device and the radiating substrate is increased, and the radiating performance of the power device is improved;

2. the traditional power device is replaced by the selected mounting type power device, and the stability of the heat dissipation structure is improved.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation structure of a high power supply according to an embodiment of the present application.

Fig. 2 is a schematic overall structure diagram of a heat dissipation housing according to an embodiment of the present application.

Fig. 3 is a sectional view taken along line a-a of fig. 4.

Fig. 4 is a side view of a heat dissipation structure of a high power supply according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a connection between a driving circuit board and a heat dissipation substrate according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a mounted power device mounted on a heat dissipation substrate according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a driving chip mounted on a driving circuit board according to an embodiment of the present application.

Description of reference numerals:

1. a heat dissipation housing; 11. a heat dissipation base plate; 12. a heat dissipation enclosure wall; 121. a through hole; 122. a threaded sleeve; 101. a mounting cavity;

2. a circuit main board; 201. mounting holes; 21. an electronic component;

3. a heat-dissipating substrate; 301. perforating; 31. a hollow sleeve; 32. a support pillar; 33. a mounted power device; 34. a conductive post;

4. a drive circuit board; 41. a driving chip; 42. a golden finger; 43. a connection bump; 44. supporting a welding spot; 45. and a conductive contact.

Detailed Description

The present application is described in further detail below with reference to figures 1-7.

The embodiment of the application discloses a heat dissipation structure of a high-power supply.

Referring to fig. 1, a heat dissipation structure of a high power supply includes a heat dissipation case 1 and a circuit board 2 covering an opening of the heat dissipation case 1. Referring to fig. 2, the heat dissipation housing 1 includes a heat dissipation bottom plate 11 and a heat dissipation enclosure 12, the heat dissipation enclosure 12 encloses and closes at the heat dissipation bottom plate 11 to form an installation cavity 101, the circuit board 2 is disposed toward the installation cavity 101, and the circuit board 2 is fixed to the edge of the installation cavity 101.

Referring to fig. 2, further, the heat dissipation bottom plate 11 and the heat dissipation enclosure wall 12 may be integrally formed by injection molding, and the heat dissipation bottom plate 11 and the heat dissipation enclosure wall 12 may also be fixed to each other by welding, bonding, or bolting. The material of the heat dissipation case 1 may be aluminum alloy, aluminum, or a material with high thermal conductivity.

Referring to fig. 3, circuit board 2 is last to be installed electronic components 21, and circuit board 2 is fixed in heat dissipation enclosure 12 and keeps away from a side of heat dissipation bottom plate 11 to electronic components 21 is towards installation cavity 101, so sets up, and electronic components 21 separates with the outside of heat dissipation shell 1 mutually for electronic components 21 is protected by heat dissipation shell 1, is difficult for receiving the effect of external force and wearing and tearing, deformation, aversion or drop.

Referring to fig. 1 and 3, a heat dissipation substrate 3 is disposed on a side of the heat dissipation enclosure wall 12 away from the heat dissipation bottom plate 11, and the heat dissipation substrate 3 has good thermal conductivity, can conduct heat in time, and reduces heat accumulation; the power device is a mounted power device 33, and the mounted power device 33 is mounted on the heat dissipation substrate 3. The mounting power device 33 is electrically connected with the circuit board 2, so that the contact area between the mounting power device 33 and the heat dissipation substrate 3 is increased, heat generated by the mounting power device 33 can be timely transmitted to the heat dissipation substrate 3, and the heat dissipation effect of the mounting power device 33 is improved.

The heat dissipation substrate 3 can abut against a side of the heat dissipation enclosing wall 12 away from the heat dissipation bottom plate 11, and the mounting type power device 33 is arranged on a side of the heat dissipation substrate 3 away from the heat dissipation enclosing wall 12. The mounting power device 33 is disposed outward so that the heat dissipation substrate 3 faces the heat dissipation enclosure 12, and when the mounting power device 33 generates heat, the heat can be transferred to the heat dissipation enclosure 12 through the heat dissipation substrate 3, so that the heat dissipation enclosure 12 can conduct away the heat of the mounting power device 33 in time, thereby promoting the heat dissipation of the mounting power device 33.

Referring to fig. 4 and 5, in an embodiment, a driving circuit board 4 is further disposed on a side of the heat dissipation substrate 3 away from the heat dissipation enclosure 12, a driving chip 41 is electrically connected to the driving circuit board 4, and the driving chip 41 is electrically connected to the circuit board 2, so as to drive the mounted power device 33 to operate. The driver chip 41 is disposed on the side of the driver circuit board 4 facing the mounted power device 33. With the arrangement, the driving chip is separated from the circuit main board 2, so that the gap between electronic components in the circuit main board 2 is further increased, and the heat dissipation of the circuit main board is facilitated; the driving chip 41 is independently mounted on the driving circuit board 4, and thus the heat dissipation effect of the driving chip 41 is also improved. The driving circuit 4 and the heat dissipation substrate 3 are arranged in parallel or approximately in parallel; the driving circuit and the heat dissipating substrate 3 are fixed to each other.

Referring to fig. 6 and 7, in an embodiment, the heat dissipation substrate 3 may be provided with a conductive pillar 34 at a side where the mounted power device 33 is provided, and the conductive pillar 34 may be electrically connected with the mounted power device 33 by etching a conductive material or by a welding process, and an axis of the conductive pillar 34 is perpendicular to a surface of the heat dissipation substrate 3. The driving circuit board 4 is provided with a conductive contact 45 at a side where the driving chip 41 is provided, and the conductive contact 45 may be in electrical communication with the driving chip 41. Referring to fig. 3, the positions and the number of the conductive posts 34 correspond to those of the conductive contacts 45, and one end of the conductive post 34 away from the heat dissipation substrate 3 and the conductive contact 45 can be electrically connected by welding, abutting, clamping, or the like. The conductive posts 34 are fixed to the conductive contacts 45, so that on one hand, the relative position between the heat dissipation substrate 3 and the driving circuit board 4 is limited, and on the other hand, the conductive posts 34 can transmit electric signals, so that the driving chip 41 can drive the packaged power device 33 to work through the electric signals.

Referring to fig. 6 and 7, in another embodiment, the side of the heat dissipation substrate 3 where the mounted power device 33 is disposed may be further provided with a hollow sleeve 31, the driving circuit board 4 is provided with a connecting bump 43 at the side where the driving chip 41 is disposed, and the axis of the hollow sleeve 31 is perpendicular to the surface of the heat dissipation substrate 3. Referring to fig. 5, the positions and the numbers of the hollow sleeves 31 correspond to those of the connecting bumps 43, and one end of the hollow sleeve 31 away from the heat-dissipating substrate 3 is fixed to the connecting bumps 43 by welding or clamping.

Referring to fig. 3 and 5, the fastening member may be a fastening screw, in the embodiment, a through hole 301 is formed on the heat dissipation substrate 3, the hollow sleeve 31 and the through hole 301 are coaxially disposed, and a through hole 121 is formed on the heat dissipation enclosure wall 12. The through hole 121 is coaxially provided with the hollow sleeve 31, the middle through hole 301 may be provided with an internal thread, and an internal thread may be provided in the hollow sleeve 31, and a fastening screw passes through the through hole 121 and is threadedly coupled with the through hole 301 or the hollow sleeve 31. With this arrangement, the stability of connection between the heat dissipation substrate 3 and the heat dissipation enclosure wall 12 can be enhanced.

Referring to fig. 5 and 6, further, a support pillar 32 is welded or bonded to one side of the heat dissipation substrate 3 where the mounted power devices 33 are disposed, and the support pillar 32 may be disposed in a central position, an edge position or between the mounted power devices 33 of the heat dissipation substrate 3 according to actual needs; the end of the supporting column 32 far from the heat dissipation substrate 3 abuts against the heat dissipation enclosing wall 12, so that the heat dissipation substrate 3 is not easily bent and deformed, and the heat dissipation substrate 3 has better vibration resistance. Further, the driving circuit board 4 may be provided with supporting pads 44 on a side where the driving chip 41 is provided, the positions and the number of the supporting pads 44 correspond to those of the supporting pillars 32, and the supporting pillars 32 and the supporting pads 44 may be in contact by welding, bonding, or abutting.

Referring to fig. 1, further, the circuit board 2 is disposed toward the mounting cavity 101, and the circuit board 2 is fixed to the edge of the mounting cavity 101, where the specific fixing manner may be a snap fixing, a bolt fixing, or an adhesive fixing. In this embodiment, a mounting hole 201 is formed in the circuit board 2, a threaded sleeve 122 is integrally disposed on a side of the heat dissipation enclosure 12 away from the heat dissipation bottom plate 11, and the mounting hole 201 and the threaded sleeve 122 are coaxially disposed, so that a screw passes through the mounting hole 201 and is in threaded fit with the threaded sleeve 122.

Furthermore, the mounted power device 33 is mounted on the heat dissipation substrate 3 by soldering, specifically, reflow soldering, wave soldering, or laser reflow soldering. The reflow soldering process has the advantages of simplicity and rapidness, high automation and high efficiency of soldering between the mounting power device 33 and the radiating substrate 3 are easily achieved, and the production efficiency of soldering the mounting power device 33 and the radiating substrate 3 is improved.

Further, the heat dissipation substrate 3 is an aluminum alloy, a pure aluminum plate, or an aluminum substrate with good thermal conductivity, and the like, and since the heat dissipation substrate 3 is mainly mounted with the mounted power device 33, the redundant electronic components 21 are eliminated, so that the area of the heat dissipation substrate 3 is small, and compared with an aluminum substrate with a large area, the aluminum substrate in the embodiment has a smaller deformation amount and better consistency.

Referring to fig. 1 and 5, the driving circuit board 4 and the circuit board 2 are electrically connected by gold fingers 42. The conductive contact area of the golden finger 42 is large, so that the electric connection between the driving circuit board 4 and the circuit main board 2 is stable, the resistance is small, the heat generation is small, and the stability of the connection between the driving circuit board 4 and the circuit main board 2 is improved. Furthermore, one end of the gold finger 42 may be welded and fixed on the driving circuit board 4, and the other end is in insertion fit with the circuit main board 2, so that the driving circuit board 4 and the circuit main board 2 are more flexible and convenient to mount and dismount; or the two ends of the golden finger 42 may be welded and fixed to the driving circuit board 4 and the circuit board 2, so that the driving circuit board 4 and the circuit board 2 are installed more firmly.

Further, the heat dissipation substrate 3 is in signal connection with the circuit main board 2, and the signal connection can be through electrical signal connection or through other signal connections, so that the signal instant transmission between the heat dissipation substrate 3 and the circuit main board 2 is realized, and better signal transmission can be kept between the electronic component 21 on the heat dissipation substrate 3 and the circuit main board 2.

The implementation principle of the heat dissipation structure of the high-power supply in the embodiment of the application is as follows: the surface mounting technology is adopted to mount the mounting type power device 33 on the radiating substrate 3 by adopting the mounting type power device 33, so that the contact area between the power device and the radiating substrate 3 is increased, and the radiating effect of the power device is improved; with the distance increase of other electronic components 21 on power device and the circuit board 2, reduced the thermal accumulation of power device to make power device's heat in time spread to the air or heat dissipation base plate 3, install heat dissipation base plate 3 at the lateral wall of heat dissipation enclosure 12 through the fastener, its connection structure is more firm, and the uniformity is better.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a heat radiation structure of high-power supply, including heat dissipation shell (1) and with circuit board (2), circuit board (2) electricity is connected with power device, its characterized in that: the heat dissipation shell (1) comprises a heat dissipation bottom plate (11) and a heat dissipation enclosing wall (12) arranged on the periphery of the heat dissipation bottom plate (11), a heat dissipation base plate (3) is arranged on one side face, deviating from the heat dissipation bottom plate (11), of the heat dissipation enclosing wall (12), the power device is a mounting type power device (33), and the mounting type power device (33) is installed on the heat dissipation base plate (3).

2. The heat dissipating structure of a high power supply as set forth in claim 1, wherein: the circuit main board (2) is electrically connected with a driving chip (41) for driving the mounting type power device (33) to work, and the mounting type power device (33) is arranged on one side of the heat dissipation substrate (3) departing from the heat dissipation enclosing wall (12); one side of the heat dissipation substrate (3) departing from the heat dissipation enclosing wall (12) is further provided with a driving circuit board (4), and the driving chip (41) is arranged on one side of the driving circuit board (4) facing the mounting type power device (33).

3. The heat dissipation structure of a high power supply as set forth in claim 2, wherein: the driving circuit board (4) is electrically connected with the circuit main board (2) through a golden finger (42).

4. The heat dissipation structure of a high power supply as claimed in any one of claims 1 to 3, wherein: one side of the heat dissipation substrate (3) facing the driving circuit board (4) is provided with a conductive column (34) which can be electrically communicated with the mounting type power device (33), and the axis of the conductive column (34) is vertical to the surface of the heat dissipation substrate (3); the driving circuit board (4) is provided with a conductive contact (45) capable of being electrically communicated with the driving chip (41), and one end, far away from the heat dissipation substrate (3), of the conductive column (34) is electrically connected with the conductive contact (45).

5. The heat dissipation structure of a high power supply as set forth in claim 4, wherein: one side of the heat dissipation substrate (3) facing the driving circuit board (4) is provided with a hollow sleeve (31), one side of the driving circuit board (4) facing the heat dissipation substrate (3) is provided with a connecting lug (43), the axis of the hollow sleeve (31) is perpendicular to the surface of the heat dissipation substrate (3), and one end, away from the heat dissipation substrate (3), of the hollow sleeve (31) is fixed with the connecting lug (43).

6. The heat dissipating structure of a high power supply as set forth in claim 5, wherein: a through hole (121) penetrates through the heat dissipation enclosing wall (12), the hollow sleeve (31) penetrates through the heat dissipation substrate (3), and a connecting piece for fixing the heat dissipation enclosing wall (12) and the heat dissipation substrate (3) penetrates through the through hole (121) and the hollow sleeve (31).

7. The heat dissipation structure of a high power supply as set forth in claim 4, wherein: the mounting type power device (33) is mounted on the heat dissipation substrate (3) through reflow soldering.

8. The heat dissipation structure of a high power supply as set forth in claim 4, wherein: the heat dissipation substrate (3) is an aluminum substrate.

9. The heat dissipation structure of a high power supply as set forth in claim 4, wherein: heat dissipation enclosure (12) enclose with heat dissipation bottom plate (11) and close formation installation cavity (101), circuit mainboard (2) set up towards installation cavity (101) and circuit mainboard (2) are fixed mutually with the border of installation cavity (101).