CN211630488U - Electronic module - Google Patents
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- CN211630488U CN211630488U CN202020090710.9U CN202020090710U CN211630488U CN 211630488 U CN211630488 U CN 211630488U CN 202020090710 U CN202020090710 U CN 202020090710U CN 211630488 U CN211630488 U CN 211630488U
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- power device
- circuit board
- printed circuit
- heat dissipation
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Abstract
The utility model provides an electronic module, including radiator unit, printed circuit board, elastic connection spare and at least one power device, wherein: the printed circuit board and the power device are respectively fixed on the heat dissipation assembly; the power device comprises a plurality of pins, and the printed circuit board is provided with a plurality of welding holes; the elastic connecting piece is arranged between the printed circuit board and the power device, and the elastic connecting piece fixes the printed circuit board and the power device when the pins of the power device are respectively inserted into the welding holes of the printed circuit board until the printed circuit board and the power device are respectively fixed on the heat dissipation assembly. The embodiment of the utility model provides a through setting up elastic connection spare, can make the assembly oversimplify, improve maneuverability, solve the problem of assembly difficulty or unable assembly between a plurality of welding holes of a plurality of pins of power device and printed circuit board, effectively reduced the assembly degree of difficulty.
Description
Technical Field
The embodiment of the utility model provides a relate to power electronic equipment field, more specifically say, relate to an electronic module.
Background
Modern power electronic devices have the advantages of high power, simple driving and high switching frequency, and electronic components with high output power are called power devices and comprise: high power transistors, thyristors, triacs, etc. In addition, the power device has the characteristics of small volume, reliable work, long service life and the like, so the power device is widely applied to various industries.
Currently, the power device is generally electrically connected to the printed circuit board by soldering a plurality of pins to the printed circuit board. In the equipment of electronic module, if weld power device's a plurality of pins to printed circuit board earlier, then fix power device and printed circuit board respectively to electronic module's fixing base on, so because the existence of assembly error, can make power device's pin continue tensile stress after the equipment is accomplished to the ageing of accelerating power device, reduce power device's life, direct extrusion or the pin of dragging power device cause the damage during even the equipment, influence the reliability that power device used for a long time. Therefore, in order to ensure reliable soldering between the pins and the printed circuit board, and because the soldering positions between the pins and the printed circuit board can be adjusted within a certain range, the conventional electronic module is usually manufactured by firstly mounting and fixing the power device and the printed circuit board on the fixing base, and then inserting the pins of the power device into the soldering holes of the printed circuit board for soldering, so as to realize electrical connection.
However, since the power device and the printed circuit board are assembled on the fixing base respectively, and position tolerance exists, it is difficult to insert a plurality of pins of the power device into the soldering holes of the printed circuit board during assembly, so that the assembly operation is complicated, the operable space of the assembly pins is limited, the assembly difficulty is increased undoubtedly, and particularly when a plurality of power devices need to be assembled, the assembly efficiency is lower.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a to the problem that the assembly operation of above-mentioned current electronic module is complicated, the assembly degree of difficulty is big and assembly efficiency is low, provide an electronic module.
The embodiment of the utility model provides a solve above-mentioned technical problem's technical scheme is, provide an electronic module, including radiator unit, printed circuit board, elastic connection spare and at least one power device, wherein: the printed circuit board and the power device are respectively fixed on the heat dissipation assembly; the power device comprises a plurality of pins, and the printed circuit board is provided with a plurality of welding holes; the elastic connecting piece is arranged between the printed circuit board and the power device, and the elastic connecting piece fixes the printed circuit board and the power device when the pins of the power device are respectively inserted into the welding holes of the printed circuit board until the printed circuit board and the power device are respectively fixed on the heat dissipation assembly.
Preferably, the elastic connecting piece comprises two fixing surfaces which are parallel to each other, and the relative position of the two fixing surfaces is adjusted through elastic deformation of the elastic connecting piece; the printed circuit board and the power device are respectively connected and fixed with the two fixing surfaces.
Preferably, the two fixing surfaces are respectively provided with an adhesive layer; the printed circuit board and the power device are respectively bonded and fixed through the adhesive layer and the two fixing surfaces of the elastic connecting piece, and in a free state, the distance between the two fixing surfaces of the elastic connecting piece is smaller than the length of the pin of the power device.
Preferably, the elastic connecting piece is made of foam materials with elasticity.
Preferably, the heat dissipation assembly includes a heat sink, the power device includes a heat dissipation surface facing away from the extending direction of the pins, and the printed circuit board and the power device are respectively fixed on the heat sink by screws; and the heat dissipation surface of the power device is connected with the surface of the heat sink when the power device is assembled to the heat sink.
Preferably, the heat dissipation assembly further comprises an elastic gasket made of a heat conducting material, the elastic gasket is located between the power device and the heat sink and is tightly fixed on the heat sink through the power device.
Preferably, the power device and the printed circuit board are respectively parallel to the surface of the heat sink, and the power device is positioned between the printed circuit board and the heat sink; the elastic connecting piece is positioned in the center of an overlapping area of vertical projection of the power device and the printed circuit board.
Preferably, the printed circuit board has an integrated circuit for electrically connecting the power device with an external device, and the plurality of solder holes of the printed circuit board are electrically connected with the integrated circuit respectively.
Preferably, the heat dissipation assembly includes a chassis, the power device includes a heat dissipation surface facing away from the extending direction of the pins, and the printed circuit board and the power device are respectively fixed on the chassis by screws; and the heat dissipation surface of the power device is connected with the surface of the case when the power device is assembled to the case.
The utility model discloses electronic module has following beneficial effect: through the arrangement of the elastic connecting piece, a plurality of pins of the power device can be inserted into a plurality of welding holes of the printed circuit board before the power device and the printed circuit board are respectively assembled on the radiating assembly, and meanwhile, the relative position between the power device and the printed circuit board is fixed by the elastic connecting piece, so that the pins can be ensured to be continuously inserted into the corresponding welding holes; and, because elastic connection spare possesses elasticity, consequently when the equipment, power device and printed circuit board accessible make elastic connection spare take place the mode of elastic deformation and fix respectively to radiator unit, equipment convenient operation is swift, and can guarantee that the pin continuously inserts and establish in the welding hole, be favorable to adjusting the relative position between pin and the welding hole to there is tensile stress to cause the damage and influence the reliability that power device used for a long time in the pin when avoiding welding.
Drawings
Fig. 1 is a perspective structural schematic diagram of an electronic module according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, the embodiment of the present invention provides a perspective structure diagram of an electronic module, which can be applied to the field of power electronic devices, especially in an automotive electronic module with more power devices. The electronic module in the embodiment comprises a heat dissipation assembly 1, a printed circuit board 2, an elastic connecting piece 3 and at least one power device 4, wherein the printed circuit board 2 and the power device 4 are respectively fixed on the heat dissipation assembly 1, so that heat on the printed circuit board 2 and the power device 4 can be transferred through the heat dissipation assembly 1, and heat dissipation and cooling of the printed circuit board 2 and the power device 4 are realized. The number of the power devices 4 can be specifically set according to actual requirements.
Since the power device 4 includes the plurality of pins 41 and the printed circuit board 2 is provided with the plurality of solder holes adapted to the plurality of pins 41, the power device 4 can be electrically connected to the printed circuit board 2 by soldering the plurality of pins 41 to the plurality of solder holes.
Preferably, the elastic connector 3 is disposed between the printed circuit board 2 and the power device 4, and the elastic connector 3 fixes the printed circuit board 2 and the power device 4 during a period from the time when the plurality of pins 41 of the power device 4 are respectively inserted into the plurality of solder holes of the printed circuit board 2 to the time when the printed circuit board 2 and the power device 4 are respectively fixed to the heat dissipation assembly 1.
Specifically, during assembly, the elastic connector 3 may be first installed on a side surface of the power device 4 having the plurality of pins 41, and then the plurality of pins 41 of the power device 4 are inserted into the plurality of solder holes of the printed circuit board 2, at this time, the elastic connector 3 is located between the power device 4 and the printed circuit board 2, and the power device 4 and the printed circuit board 2 are relatively fixed (integrally assembled), so that the plurality of pins 41 of the power device 4 can be stably inserted into the plurality of solder holes of the printed circuit board 2. Then, the power device 4 and the printed circuit board 2 are integrally mounted on the heat sink 1 and then are respectively and fixedly connected with the heat sink 1, so that in the fixing process, under the elastic action of the elastic connector 3, the plurality of pins 41 of the power device 4 can be always positioned in the corresponding soldering holes of the printed circuit board 2. After the power device 4 and the printed circuit board 2 are respectively fixed on the heat dissipation assembly 1, the plurality of pins 41 of the power device 4 are respectively fixed with the corresponding soldering holes on the printed circuit board 2 by welding, and the assembling operation of the electronic module is completed.
Above-mentioned electronic module is through setting up elastic connection piece 3 between power device 4 and printed circuit board 2, and power device 4 and printed circuit board 2 accessible make elastic connection piece 3 take place the mode of elastic deformation respectively and fix to radiator unit 1 from this, and equipment convenient operation is swift, and can guarantee that pin 41 continuously inserts and establish in printed circuit board 2's the corresponding welding hole. Moreover, the elastic connector 3 has elasticity, so that when the pins 41 of the power device 4 are continuously positioned in the corresponding soldering holes of the printed circuit board 2, the relative positions of the pins 41 and the soldering holes can be adjusted, and when a plurality of pins 41 are soldered to the corresponding soldering holes, the pins 41 cannot generate tensile stress due to assembly, so that the damage to the pins 41 is effectively avoided, and the reliability of the long-term use of the power device 4 is higher.
Because the elastic connecting piece 3 is arranged, the power device 4 and the printed circuit board 2 can be assembled firstly, so that the plurality of pins 41 of the power device 4 can be simply and conveniently assembled in the printed circuit board 2, the assembled operation space is large, the space limitation is avoided, the operability is high, the assembly procedure can be simplified, the assembly difficulty is reduced, and the assembly efficiency is greatly improved.
Further, the elastic connector 3 includes two fixing surfaces parallel to each other, and the printed circuit board 2 and the power device 4 are respectively connected and fixed to the two fixing surfaces of the elastic connector 3. Because the relative position between two mutually parallel fixed surfaces can be adjusted through elastic deformation by the elastic connecting piece 3, the power device 4 and the printed circuit board 2 can be adjusted through elastic deformation of the elastic connecting piece 3.
The utility model discloses an embodiment, two stationary planes of elastic connection piece 3 have the viscose layer respectively, and printed circuit board 2 and power device 4 will bond fixedly through two stationary planes of this viscose layer and elastic connection piece 3 respectively, elastic connection piece 3 makes printed circuit board 2 and power device 4 indirect fixation with the connected mode that bonds promptly, and easy operation is convenient, and the connected mode that bonds is firm reliable, can guarantee to take place to break away from with the fixed corresponding stationary plane that bonds mutually when power device 4 and printed circuit board 2 effect elastic connection piece 3 take place elastic deformation.
In particular, in order to ensure that the pins 41 of the power device 4 can be stably inserted into the solder holes of the printed circuit board 2, the distance between the two fixing surfaces of the elastic connector 3 in the free state should be smaller than the length of the pins 41 of the power device 4, so as to avoid the pins 41 of the power device 4 from being separated from the corresponding solder holes of the printed circuit board 2 when the elastic connector 3 and the power device 4 are elastically deformed due to stretching.
In practical application, the elastic connecting piece 3 is preferably made of an elastic foam material, specifically, the elastic foam material can be elastic foam with double-sided adhesive, so that the use is convenient, and the material cost is low; in particular, the foam material is light in weight and does not increase the weight of the electronic module.
In another embodiment of the present invention, the heat dissipation assembly 1 includes a heat sink 11, the power device 4 includes a heat dissipation surface facing away from the extending direction of the pins 41 (or the extending direction after bending), and the printed circuit board 2 and the power device 4 are fixed on the heat sink 11 by screws respectively, so that the assembly and disassembly are convenient and fast, which is beneficial to maintenance. And, when the power device 4 is mounted to the heat sink 11, the heat radiation surface of the power device 4 is connected to the surface of the heat sink 11. Therefore, heat generated by the power device 4 can be transferred in time through the radiator 11, the power device 4 is efficiently cooled, and the use stability of the power device 4 is ensured.
The heat dissipation assembly 1 further includes an elastic pad 12 made of a heat conductive material (e.g., silicone), wherein the elastic pad 12 is located between the power device 4 and the heat sink 11, and is pressed and fixed on the heat sink 11 via the power device 4. Because the elastic gasket 12 has elasticity and can play a role of an elastic gasket, the elastic gasket 12 is arranged between the power device 4 and the radiator 11 in a cushioning manner, so that the installation stability of the power device 4 can be improved, and meanwhile, the relative distance between the power device 4 and the radiator 11 can be adjusted within a certain range, so that the assembly precision between the power device 4 and the radiator 11 is reduced, and the assembly difficulty is lower.
The elastic gasket 12 is made of a heat conductive material, the elastic gasket 12 is arranged between the power device 4 and the heat sink 11, and heat on the power device 4 can be transferred to the heat sink 11 through the elastic gasket 12, so that the heat dissipation effect is ensured. The elastic pad 12 may be made of a heat-conducting silicone sheet, and has low material cost and convenient manufacture, and the shape and size of the elastic pad 12 can be adjusted according to actual requirements.
The power device 4 and the printed circuit board 2 are parallel to the surface of the heat sink 11, respectively, and the power device 4 is located between the printed circuit board 2 and the heat sink 11. In practical applications, the elastic connector 2 is preferably disposed in the center of the overlapping area of the vertical projections of the power device 4 and the printed circuit board 2, so as to ensure the balance of the stress of the power device 4 and the printed circuit board 2 relative to the elastic connector 3 and avoid the stress from being unbalanced and separating from the elastic connector 3. Of course, when two elastic connectors 2 are used to fixedly connect the power device 4 and the printed circuit board 2, two elastic connectors 2 may be respectively disposed at two sides of the overlapping region of the vertical projection of the power device 4 and the printed circuit board 2.
In addition, the shape and size of the elastic connector 3 can be adjusted according to practical application to avoid affecting the reliable connection between the plurality of pins 41 of the power device 4 and the plurality of solder holes of the printed circuit board 2.
In practical applications, the power device 4 may also be connected and fixed to the printed circuit board 2 through two or three elastic connectors 3, so as to ensure stability of the relative position between the power device 4 and the printed circuit board 2. However, this would considerably increase the complexity of the structure and would be detrimental to the assembly operation.
In addition, the printed circuit board 2 has an integrated circuit for electrically connecting the power device 4 with an external device, and the plurality of solder holes of the printed circuit board 2 are electrically connected with the integrated circuit, that is, when the plurality of pins 41 of the power device 4 are soldered to the plurality of solder holes, the power device 4 is electrically connected with the integrated circuit on the printed circuit board 2, and the power device 4 can electrically connect the external device electrically connected with the integrated circuit through the integrated circuit.
In another embodiment of the present invention, the heat dissipating assembly 1 includes a housing, and the printed circuit board 2 and the power device 4 are fixed to the housing by screws, respectively. Moreover, when the power device 4 is assembled to the chassis, the surface of the power device 4 facing away from the pins 41 (i.e., the heat dissipation surface of the power device 4) is connected to the surface of the chassis, so that heat on the power device 4 and the printed circuit board 2 can be directly transferred through the chassis to dissipate heat and reduce temperature, and thus, a heat dissipation device is not required to be additionally arranged, the structure is simple, the installation space can be reduced, and the designability of the volume of application scene equipment (e.g., driving equipment) is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. An electronic module comprising a heat dissipating assembly, a printed circuit board, an elastomeric connector, and at least one power device, wherein: the printed circuit board and the power device are respectively fixed on the heat dissipation assembly; the power device comprises a plurality of pins, and the printed circuit board is provided with a plurality of welding holes; the elastic connecting piece is arranged between the printed circuit board and the power device, and the elastic connecting piece fixes the printed circuit board and the power device when the pins of the power device are respectively inserted into the welding holes of the printed circuit board until the printed circuit board and the power device are respectively fixed on the heat dissipation assembly.
2. The electronic module according to claim 1, wherein the elastic connecting member comprises two fixing surfaces parallel to each other, and the elastic connecting member adjusts the relative positions of the two fixing surfaces through elastic deformation; the printed circuit board and the power device are respectively connected and fixed with the two fixing surfaces.
3. The electronic module of claim 2, wherein both of the securing surfaces have an adhesive layer; the printed circuit board and the power device are respectively bonded and fixed through the adhesive layer and the two fixing surfaces of the elastic connecting piece, and in a free state, the distance between the two fixing surfaces of the elastic connecting piece is smaller than the length of the pin of the power device.
4. The electronic module of claim 3, wherein the resilient connector is comprised of a resilient foam material.
5. The electronic module of claim 1, wherein the heat dissipation assembly comprises a heat sink, the power device comprises a heat dissipation surface facing away from the extending direction of the pins, and the printed circuit board and the power device are respectively fixed on the heat sink by screws; and the heat dissipation surface of the power device is connected with the surface of the heat sink when the power device is assembled to the heat sink.
6. The electronic module of claim 5, wherein the heat dissipation assembly further comprises a resilient gasket constructed of a thermally conductive material, the resilient gasket being positioned between the power device and the heat sink and being compressively secured to the heat sink via the power device.
7. The electronic module of claim 5, wherein the power device and the printed circuit board are each parallel to a surface of the heat sink, and the power device is located between the printed circuit board and the heat sink; the elastic connecting piece is positioned in the center of an overlapping area of vertical projection of the power device and the printed circuit board.
8. The electronic module of claim 1, wherein the printed circuit board has an integrated circuit thereon for electrically connecting the power device with an external device, and the plurality of solder holes of the printed circuit board are electrically connected with the integrated circuit respectively.
9. The electronic module of claim 1, wherein the heat dissipation assembly comprises a housing, the power device comprises a heat dissipation surface facing away from the extending direction of the leads, and the printed circuit board and the power device are respectively fixed on the housing by screws; and the power device heat dissipation surface is connected with the surface of the machine shell when the power device is assembled to the machine shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020090710.9U CN211630488U (en) | 2020-01-15 | 2020-01-15 | Electronic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020090710.9U CN211630488U (en) | 2020-01-15 | 2020-01-15 | Electronic module |
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| Publication Number | Publication Date |
|---|---|
| CN211630488U true CN211630488U (en) | 2020-10-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020090710.9U Active CN211630488U (en) | 2020-01-15 | 2020-01-15 | Electronic module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828442A (en) * | 2022-02-15 | 2022-07-29 | 上海电气集团股份有限公司 | Method for installing IGBT module and radiator based on PCB connection |
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2020
- 2020-01-15 CN CN202020090710.9U patent/CN211630488U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828442A (en) * | 2022-02-15 | 2022-07-29 | 上海电气集团股份有限公司 | Method for installing IGBT module and radiator based on PCB connection |
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Address after: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215000 52 tianedang Road, Yuexi Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |