CN114828442A - Method for installing IGBT module and radiator based on PCB connection - Google Patents
Method for installing IGBT module and radiator based on PCB connection Download PDFInfo
- Publication number
- CN114828442A CN114828442A CN202210136426.4A CN202210136426A CN114828442A CN 114828442 A CN114828442 A CN 114828442A CN 202210136426 A CN202210136426 A CN 202210136426A CN 114828442 A CN114828442 A CN 114828442A
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- Prior art keywords
- igbt
- radiator
- pcb
- pressure
- mounting
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000009434 installation Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- 238000010923 batch production Methods 0.000 abstract description 2
- ZHBBDTRJIVXKEX-UHFFFAOYSA-N 1-chloro-2-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=CC=CC=2)Cl)=C1 ZHBBDTRJIVXKEX-UHFFFAOYSA-N 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
The invention relates to a method for installing an IGBT module and a radiator based on PCB connection, which comprises the following steps: step 1: the radiator and the IGBT are both arranged on the PCB, and before the radiator and the IGBT are arranged, a pair of supporting pieces are arranged on the PCB to support the IGBT; step 2: placing the IGBT above the support piece, and completing assembly with the PCB through pins; and step 3: welding the pins of the IGBT on the PCB; and 4, step 4: placing the radiator on the IGBT, and connecting the radiator with the PCB through bolts, so that the whole radiating surface of the IGBT is uniformly stressed, and the radiator is fully attached to the radiating surface of the IGBT; and 5: and flexible limiting devices are arranged at the bolt connection positions of the radiator and the PCB. The invention is convenient for independent installation and disassembly of the radiator, can avoid the damage of the IGBT caused by improper operation during manual assembly, improves the efficiency of batch production and reduces the cost.
Description
Technical Field
The invention relates to the technical field of structural heat dissipation of power electronic devices, in particular to a method for installing an IGBT module and a radiator based on PCB connection.
Background
The IGBT power module (IGBT for short) based on PCB connection is often needed to be used in the power electronic equipment with small capacity, and the IGBT can generate a large amount of heat in the working process, if the heat can not be transmitted out in time, the IGBT can be failed and break down due to the fact that the IGBT works under the high-temperature condition for a long time. Therefore, a heat sink is usually required to be mounted on the IGBT to ensure that the heat generated by the IGBT is dissipated in time, so that the temperature of the IGBT is stabilized within the range of the design requirement. In order to make the IGBT and the heat sink have good contact and sufficiently transfer heat, the IGBT and the heat sink are generally fixed together for use. At present, a common installation method of the IGBT and the radiator is a bolt fastening mode, generally, the IGBT and the radiator are fixed by bolts, then the radiator is installed on a PCB, and finally, the IGBT pin is welded on the PCB to complete electrical connection.
Because the clearance between PCB and the radiator is less, it is difficult to directly tear down the bolt between IGBT and the radiator. After the IGBT completes the electrical connection on the PCB, if the radiator needs to be disassembled, the pins of the IGBT need to be disassembled and welded, then the bolts between the radiator and the PCB are disassembled, and finally the bolts between the IGBT and the radiator are disassembled, so that the radiator is disassembled. Therefore, the process of separating the heat sink from the IGBT is cumbersome. In addition, in the bolt connection mode, the IGBT is only stressed at the connection point, so that the heat dissipation surface of the IGBT is not sufficiently attached to the radiator, the heat conduction effect is possibly influenced, and in the fastening process, the contact area between the bolt and the IGBT mounting surface is small, so that the IGBT is easily damaged if the moment is too large. If the environmental temperature fluctuation is too large, the bolt fastening mode is easy to loosen.
Disclosure of Invention
In order to solve the technical problem, the invention provides a method for mounting an IGBT module and a radiator based on PCB connection.
The technical scheme of the invention is as follows:
a method for installing an IGBT module and a radiator based on PCB connection comprises the following steps:
step 1: the radiator and the IGBT are both arranged on the PCB, and before the radiator and the IGBT are arranged, a pair of supporting pieces are firstly arranged on the PCB to support the IGBT;
step 2: placing the IGBT above the support piece, and completing assembly with the PCB through pins;
and step 3: welding the pins of the IGBT on the PCB;
and 4, step 4: the radiator is arranged on the IGBT and is connected with the PCB through a bolt, so that the radiator and the IGBT are mutually extruded, the whole radiating surface of the IGBT is uniformly stressed, the radiator and the radiating surface of the IGBT are fully attached, and the heat conduction effect is ensured;
and 5: in order to ensure that the IGBT is not damaged due to the fact that the pressure of the radiator on the IGBT is not too large, flexible limiting devices are arranged at the positions of bolt connection portions of the radiator and the PCB.
Further, the support piece is used for supporting the IGBT to ensure that the pressure of the radiator on the IGBT only acts on the IGBT mounting surface, and the area of the top surface of the support piece is equal to or smaller than that of the IGBT mounting surface.
Furthermore, the stress area of the IGBT mounting surface is larger than that of the IGBT mounting surface in a bolt fastening mode.
Furthermore, the flexible limiting device can be compressed when the radiator is connected with the PCB through bolts, and when the flexible limiting device is compressed to the maximum limiting displacement, the flexible limiting device cannot be compressed continuously, the pressure applied at the moment is the sum of the gravity of the radiator and the pressure which can be borne by the IGBT in an allowed installation mode, the IGBT is tightly attached to the radiator, and the IGBT cannot be damaged due to overlarge pressure.
The method for installing the IGBT module and the radiator based on the PCB connection has the advantages that: the radiator is convenient to independently mount and dismount, the IGBT can be prevented from being damaged due to improper operation during manual assembly, the efficiency of batch production is improved, and the cost is reduced; the plane of the radiator can be fully contacted with the IGBT surface, and conduction and heat dissipation are facilitated; a fastening bolt between the IGBT and the radiator is omitted, looseness of the fastening bolt caused by overlarge temperature fluctuation can be avoided, and fault points are reduced.
Drawings
FIG. 1 is a schematic view of the mounting of a heat sink, IGBT and PCB;
FIG. 2 is a schematic diagram of an IGBT based on PCB connections;
in the figure: 1 is the radiator, 2 is the IGBT, 3 is the support piece, 4 is flexible stop device, 5 is radiator and PCB construction bolt, 6 is the PCB, 7 is the installation face of IGBT, 8 is the support piece top surface, 9 is the pin, 10 is the cooling surface of IGBT.
Detailed Description
The invention is further described with reference to the following figures and examples.
As shown in fig. 1 and 2, a method for mounting an IGBT module and a heat sink based on PCB connection includes the steps of:
step 1: both the heat sink 1 and the IGBT 2 are mounted on the PCB 6, and before the heat sink 1 and the IGBT 2 are mounted, a pair of supports 3 are first mounted on the PCB 6 to support the IGBT 2.
Wherein, the support 3 is used for ensuring that the pressure of the radiator 1 on the IGBT 2 only acts on the installation surface 7 of the IGBT 2, and the area of the top surface 8 of the support can be equal to or slightly smaller than the area of the installation surface 7 of the IGBT 2. The stress area of the IGBT 2 mounting surface 7 is larger than that of the IGBT mounting surface 7 in a bolt fastening mode. Therefore, under the condition of the same pressure, the pressure intensity on the mounting surface 7 is much smaller in the scheme, the damage probability of the IGBT 2 is greatly reduced, and meanwhile, the welding layer on the pin 9 of the IGBT 2 cannot be damaged when the radiator 1 is mounted.
And 2, step: the IGBT 2 is placed over the support 3 and assembled with the PCB 6 by means of the pins 9.
And step 3: the pin 9 of the IGBT 2 is soldered to the PCB 6.
And 4, step 4: arrange radiator 1 in on IGBT 2 to pass through bolt 5 with PCB 6 and be connected, radiator 1 extrudees each other with IGBT 2 like this, makes the even atress of the whole radiating surface 10 of IGBT 2, can make radiator 1 and IGBT 2's radiating surface 10 fully laminate, guarantees heat-conducting effect.
And 5: in order to ensure that the pressure of the radiator 1 on the IGBT 2 is not too large to damage the IGBT 2, flexible limiting devices 4 are arranged at the bolt connection positions of the radiator 1 and the PCB 6.
This flexible stop device 4 can compress when radiator 1 and PCB 6 carry out bolted connection, and when compressing to the biggest spacing displacement, flexible stop device 4 can not continue to compress, and the pressure that it received this moment is the sum of the gravity of radiator 1 and the pressure that IGBT 2 supplier allowed the installation to bear, has so both guaranteed IGBT 2 and radiator 1 and has closely laminated and also can not be pressed too big IGBT 2 impaired.
Claims (4)
1. A method for installing an IGBT module and a radiator based on PCB connection is characterized by comprising the following steps:
step 1: the radiator and the IGBT are both arranged on the PCB, and before the radiator and the IGBT are arranged, a pair of supporting pieces are firstly arranged on the PCB to support the IGBT;
and 2, step: placing the IGBT above the support piece, and completing assembly with the PCB through pins;
and step 3: welding the pins of the IGBT on the PCB;
and 4, step 4: the radiator is arranged on the IGBT and is connected with the PCB through a bolt, so that the radiator and the IGBT are mutually extruded, the whole radiating surface of the IGBT is uniformly stressed, the radiator and the radiating surface of the IGBT are fully attached, and the heat conduction effect is ensured;
and 5: in order to ensure that the pressure of the radiator on the IGBT is not too large to damage the IGBT, flexible limiting devices are arranged at the bolt connection positions of the radiator and the PCB.
2. The method for mounting an IGBT module and a heat sink based on PCB connection according to claim 1, characterized in that: the support piece is used for supporting the IGBT to ensure that the pressure of the radiator on the IGBT only acts on the IGBT mounting surface, and the area of the top surface of the support piece is equal to or smaller than that of the IGBT mounting surface.
3. The method for mounting the IGBT module and the heat sink based on the PCB connection as recited in claim 2, wherein: the stress area of the IGBT mounting surface is larger than that of the IGBT mounting surface in a bolt fastening mode.
4. The method for mounting an IGBT module and a heat sink based on PCB connection according to claim 1, characterized in that: the flexible limiting device can be compressed when the radiator is connected with the PCB through bolts, and when the radiator is compressed to the maximum limiting displacement, the flexible limiting device cannot be compressed continuously, the pressure applied to the flexible limiting device is the sum of the gravity of the radiator and the pressure which can be borne by the IGBT in an allowed installation mode, the IGBT is guaranteed to be tightly attached to the radiator, and the IGBT cannot be damaged due to overlarge pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210136426.4A CN114828442A (en) | 2022-02-15 | 2022-02-15 | Method for installing IGBT module and radiator based on PCB connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210136426.4A CN114828442A (en) | 2022-02-15 | 2022-02-15 | Method for installing IGBT module and radiator based on PCB connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114828442A true CN114828442A (en) | 2022-07-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210136426.4A Pending CN114828442A (en) | 2022-02-15 | 2022-02-15 | Method for installing IGBT module and radiator based on PCB connection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114828442A (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0886473A (en) * | 1994-09-20 | 1996-04-02 | Fujitsu General Ltd | Outdoor machine of air conditioner |
| CN200962690Y (en) * | 2006-10-18 | 2007-10-17 | 英业达股份有限公司 | Bending-resistance circuit board |
| CN103681523A (en) * | 2012-09-05 | 2014-03-26 | 深圳市艾威迅科技有限公司 | Mounting structure for power tube of sealed power supply product with integral heat radiating function |
| CN104112720A (en) * | 2013-03-05 | 2014-10-22 | 英飞凌科技股份有限公司 | Power semiconductor assembly and module |
| JP2014216595A (en) * | 2013-04-30 | 2014-11-17 | 株式会社Ｊｖｃケンウッド | Heat dissipation structure and assembly method of heat dissipation structure |
| CN104159430A (en) * | 2013-05-14 | 2014-11-19 | 鸿富锦精密工业（深圳）有限公司 | Radiator combination |
| CN104701277A (en) * | 2013-12-10 | 2015-06-10 | 江苏宏微科技股份有限公司 | Power module package structure |
| CN105280589A (en) * | 2015-09-29 | 2016-01-27 | 武汉光迅科技股份有限公司 | Chip heat radiation assembly and chip circuit board thereof |
| CN206165083U (en) * | 2016-11-10 | 2017-05-10 | 广东高标电子科技有限公司 | Controller and have electric motor car of this controller |
| CN106849697A (en) * | 2017-03-07 | 2017-06-13 | 珠海英搏尔电气股份有限公司 | AC motor control |
| CN108428681A (en) * | 2017-02-14 | 2018-08-21 | 乐金电子研发中心(上海)有限公司 | The power electronic equipment of front side conductive backside radiator |
| US20190069438A1 (en) * | 2017-08-23 | 2019-02-28 | Delta Electronics (Shanghai) Co., Ltd. | Power module assembly and assembling method thereof |
| CN210470133U (en) * | 2019-08-12 | 2020-05-05 | 西安特锐德智能充电科技有限公司 | Power tube heat radiation structure and controller |
| CN211630488U (en) * | 2020-01-15 | 2020-10-02 | 苏州汇川联合动力系统有限公司 | Electronic module |
| CN112164691A (en) * | 2020-10-19 | 2021-01-01 | 珠海格力电器股份有限公司 | IGBT mounting structure and IGBT module assembly |
| US20220044984A1 (en) * | 2020-08-06 | 2022-02-10 | Vitesco Technologies GmbH | Circuit Carrier Arrangement And Method For Producing Such A Circuit Carrier Arrangement |
-
2022
- 2022-02-15 CN CN202210136426.4A patent/CN114828442A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0886473A (en) * | 1994-09-20 | 1996-04-02 | Fujitsu General Ltd | Outdoor machine of air conditioner |
| CN200962690Y (en) * | 2006-10-18 | 2007-10-17 | 英业达股份有限公司 | Bending-resistance circuit board |
| CN103681523A (en) * | 2012-09-05 | 2014-03-26 | 深圳市艾威迅科技有限公司 | Mounting structure for power tube of sealed power supply product with integral heat radiating function |
| CN104112720A (en) * | 2013-03-05 | 2014-10-22 | 英飞凌科技股份有限公司 | Power semiconductor assembly and module |
| JP2014216595A (en) * | 2013-04-30 | 2014-11-17 | 株式会社Ｊｖｃケンウッド | Heat dissipation structure and assembly method of heat dissipation structure |
| CN104159430A (en) * | 2013-05-14 | 2014-11-19 | 鸿富锦精密工业（深圳）有限公司 | Radiator combination |
| CN104701277A (en) * | 2013-12-10 | 2015-06-10 | 江苏宏微科技股份有限公司 | Power module package structure |
| CN105280589A (en) * | 2015-09-29 | 2016-01-27 | 武汉光迅科技股份有限公司 | Chip heat radiation assembly and chip circuit board thereof |
| CN206165083U (en) * | 2016-11-10 | 2017-05-10 | 广东高标电子科技有限公司 | Controller and have electric motor car of this controller |
| CN108428681A (en) * | 2017-02-14 | 2018-08-21 | 乐金电子研发中心(上海)有限公司 | The power electronic equipment of front side conductive backside radiator |
| CN106849697A (en) * | 2017-03-07 | 2017-06-13 | 珠海英搏尔电气股份有限公司 | AC motor control |
| US20190069438A1 (en) * | 2017-08-23 | 2019-02-28 | Delta Electronics (Shanghai) Co., Ltd. | Power module assembly and assembling method thereof |
| CN210470133U (en) * | 2019-08-12 | 2020-05-05 | 西安特锐德智能充电科技有限公司 | Power tube heat radiation structure and controller |
| CN211630488U (en) * | 2020-01-15 | 2020-10-02 | 苏州汇川联合动力系统有限公司 | Electronic module |
| US20220044984A1 (en) * | 2020-08-06 | 2022-02-10 | Vitesco Technologies GmbH | Circuit Carrier Arrangement And Method For Producing Such A Circuit Carrier Arrangement |
| CN112164691A (en) * | 2020-10-19 | 2021-01-01 | 珠海格力电器股份有限公司 | IGBT mounting structure and IGBT module assembly |
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