CN112509994A - Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device - Google Patents
Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device Download PDFInfo
- Publication number
- CN112509994A CN112509994A CN202011401731.9A CN202011401731A CN112509994A CN 112509994 A CN112509994 A CN 112509994A CN 202011401731 A CN202011401731 A CN 202011401731A CN 112509994 A CN112509994 A CN 112509994A
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- insulating pressing
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 138
- 238000000034 method Methods 0.000 title claims abstract description 10
- 230000005855 radiation Effects 0.000 title description 2
- 238000003825 pressing Methods 0.000 claims abstract description 65
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the field of semiconductors, and discloses a semiconductor device fixing device, a heat dissipation assembly and a semiconductor device mounting method, which comprise the following steps: the insulating pressing plate is pressed on the at least two semiconductor devices, a plurality of pin holes are formed in the insulating pressing plate, the pin holes are used for being penetrated by the corresponding pins, at least one fixing hole is formed in the insulating pressing plate, and the fixing holes are arranged to avoid the semiconductor devices; the insulating heat conducting pad is arranged between each semiconductor device and the heat dissipation device, and at least one connecting hole is formed in the insulating heat conducting pad; and each fastener is used for sequentially penetrating through the corresponding fixing hole and the corresponding connecting hole to be fixedly connected with the heat dissipation device, and sequentially pressing the insulating pressing plate, the semiconductor device and the insulating heat conduction pad on the heat dissipation device. The fastener can not be close to semiconductor device, and the creepage distance between fastener and the semiconductor device is enough, can not produce the fastener and lead to the phenomenon of semiconductor device short circuit.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a semiconductor device fixing device, a heat dissipation assembly and a semiconductor device mounting method.
Background
Power semiconductor devices, also known as power electronic devices, are the basis of power electronics technology and are also core devices constituting power electronic conversion devices. In practical situations, generally, a fastener penetrates through an insulating particle and then penetrates through a mounting hole in the semiconductor device, and the insulating particle is sleeved in the semiconductor device, so that the semiconductor device is fixed. Since the fastener penetrates into the semiconductor device, when the insulating particles are broken, a creepage distance or an electrical gap between the fastener and the semiconductor device may be insufficient, and the fastener may cause the semiconductor device to be short-circuited.
Disclosure of Invention
The invention aims to provide a semiconductor device fixing device, a heat dissipation assembly and a semiconductor device mounting method, so that semiconductor devices cannot be short-circuited.
In order to solve the above technical problem, an embodiment of the present invention provides a semiconductor device mounting apparatus, including:
the insulating pressing plate is pressed on at least two semiconductor devices, a plurality of pin holes are formed in the insulating pressing plate, the number of the pin holes is equal to that of pins on the semiconductor devices, the pin holes correspond to the pin holes one by one, the pin holes are used for being penetrated by the corresponding pins, at least one fixing hole is formed in the insulating pressing plate, and the fixing hole is arranged to avoid the semiconductor devices;
the insulating heat conducting pad is arranged on one side, away from the insulating pressing plate, of the semiconductor device, is arranged between each semiconductor device and the heat dissipation device, and is provided with at least one connecting hole, the number of the connecting holes is equal to that of the fixing holes, and the connecting holes are coaxially arranged in a one-to-one correspondence manner;
the number of the fasteners is equal to that of the fixing holes and the number of the connecting holes, the fasteners are uniformly and correspondingly arranged, each fastener is used for sequentially penetrating through the corresponding fixing hole and the corresponding connecting hole and is fixedly connected with the heat dissipation device, and the insulating pressing plate, the semiconductor device and the insulating heat conduction pad are sequentially pressed on the heat dissipation device.
Compared with the prior art, the semiconductor device fixing device is fixed by the fastening piece in a mode that the insulating pressing plate presses at least two semiconductor devices, and then the fixing holes are formed in the insulating pressing plate, the fastening piece is arranged to be away from the semiconductor devices, so that the fastening piece is not close to the semiconductor devices and is far away from the semiconductor devices, the creepage distance or the electric clearance between the fastening piece and the semiconductor devices is enough, and the phenomenon that the fastening piece causes short circuit of the semiconductor devices is avoided.
In addition, one fixing hole is formed between every two adjacent semiconductor devices.
In addition, the fixing holes between two adjacent semiconductor devices are spaced from the two semiconductor devices by the same distance.
Additionally, the fastener is a screw.
In addition, a hollow part is arranged on the insulating pressing plate.
In addition, the hollow portion is formed to avoid the semiconductor device.
In addition, the side, facing the semiconductor device, of the insulating heat conducting pad is provided with heat conducting silicone grease.
The present invention also provides a heat dissipating assembly comprising:
at least two semiconductor devices;
the semiconductor device fixing apparatus described above;
the circuit board is arranged on one side of the insulating pressing plate, which is far away from the heat dissipation device, welded on each pin of each semiconductor device and electrically connected with each pin;
the heat dissipation device is used for dissipating the heat of the semiconductor device;
the circuit board is provided with a plurality of mounting holes, the number of the mounting holes is equal to that of the fasteners, the mounting holes correspond to the fasteners one by one, the mounting holes are arranged opposite to the fasteners corresponding to the mounting holes, and the fasteners are mounted on the insulating pressing plate and the heat dissipation device through the mounting holes.
Because an insulating clamp plate can press on two at least semiconductor devices simultaneously, therefore the fastener can be one, so greatly reduced the quantity of fastener, owing to need set up the mounting hole on the circuit board again to make things convenient for the installation of fastener, consequently the fastener has been lacked, and the mounting hole on the circuit board will reduce naturally, and then can improve the availability factor in space on the circuit board, reduces the area of circuit board.
In addition, the invention also provides a mounting method of the semiconductor device, which comprises the following steps:
the pins of at least two semiconductor devices are correspondingly arranged one by one and penetrate through the fixing holes on the insulating pressing plate;
arranging a circuit board opposite to the insulating pressing plate, and welding the circuit board on each pin;
arranging an insulating heat conducting pad on the heat dissipation device, and arranging the welded semiconductor device on the insulating heat conducting pad;
the heat sink is tightly connected with the insulating pressing plate, the semiconductor devices and the insulating heat conducting plate after the fasteners sequentially penetrate through the insulating pressing plate and the insulating heat conducting plate, and the insulating pressing plate, the semiconductor devices and the insulating heat conducting plate are tightly pressed on the heat sink.
Compared with the prior art, the semiconductor device fixing device is fixed by the fastening piece in a mode that the insulating pressing plate presses at least two semiconductor devices, and then the fixing holes are formed in the insulating pressing plate, the fastening piece is arranged to be away from the semiconductor devices, so that the fastening piece is not close to the semiconductor devices and is far away from the semiconductor devices, the creepage distance or the electric clearance between the fastening piece and the semiconductor devices is enough, and the phenomenon that the fastening piece causes short circuit of the semiconductor devices is avoided.
In addition, when the circuit board is welded on each pin, a welding tool is arranged between the circuit board and the insulating pressing plate to support the circuit board.
Drawings
Fig. 1 is a schematic structural view of a semiconductor device holding apparatus according to a first embodiment of the present invention;
FIG. 2 is a front view of a semiconductor fixture according to a first embodiment of the present invention;
FIG. 3 is a left side view of a semiconductor fixture according to a first embodiment of the present invention;
fig. 4 is a flowchart of a mounting method of a semiconductor device in a third embodiment of the present invention.
Description of reference numerals: 1. an insulating platen; 11. a fixing hole; 2. an insulating heat conducting pad; 21. connecting holes; 3. a fastener; 31. a cylinder; 32. a nut; 4. a semiconductor device; 41. a device body; 42. a pin; 5. a heat sink; 6. a circuit board; 61. mounting holes; 7. welding a tool; 8. an anti-loosening element; 81. a common gasket; 82. a spring washer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solutions claimed in the claims of the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
The first embodiment of the present invention relates to a semiconductor device 4 fixing apparatus. As shown in figures 1 to 3. Comprises the following steps: insulating clamp plate 1, insulating heat conduction pad 2 and at least one fastener 3, wherein, insulating clamp plate 1 presses on at least two semiconductor device 4, sets up a plurality of pins 42 holes on insulating clamp plate 1, and each pin 42 hole equals with the quantity of pin 42 on each semiconductor device 4, and the one-to-one correspondence, each pin 42 hole is used for being passed by respective corresponding pin 42, that is to say, in actual conditions, as shown in fig. 2 and 3, in this embodiment, insulating clamp plate 1 presses on two semiconductor device 4, and semiconductor device 4 includes: the device comprises a device body 41 and pins 42, wherein the insulating pressing plate 1 is pressed on the device body 41, and the pins 42 on the two semiconductor devices 4 penetrate through fixing holes 11 on the insulating pressing plate 1. In addition, the insulating pressing plate 1 is also provided with at least one fixing hole 11, and the fixing hole 11 is arranged to avoid each semiconductor device 4; the insulating heat conducting pad 2 is arranged on one side, away from the insulating pressing plate 1, of the semiconductor device 4 and is arranged between each semiconductor device 4 and the heat dissipation device 5, at least one connecting hole 21 is formed in the insulating heat conducting pad 2, the number of the connecting holes 21 is equal to that of the fixing holes 11, and the connecting holes 21 are coaxially arranged in a one-to-one correspondence mode; the number of the at least one fastener 3 is equal to that of the fixing holes 11 and the connecting holes 21, the fasteners 3 are uniformly and correspondingly arranged, each fastener 3 is used for sequentially penetrating through the corresponding fixing hole 11 and the corresponding connecting hole 21 to be fixedly connected with the heat dissipation device 5, and the insulating pressing plate 1, the semiconductor device 4 and the insulating heat conduction pad 2 are sequentially pressed on the heat dissipation device 5.
Compared with the prior art, the semiconductor device 4 fixing device of the embodiment of the invention presses at least two semiconductor devices 4 through the insulating pressing plate 1, then the fixing device is fixed by the fastening piece 3 in a mode of forming the fixing hole 11 on the insulating pressing plate 1, and the fixing hole 11 on the insulating pressing plate 1 is arranged to avoid the semiconductor device 4, so that the fastening piece 3 is not close to the semiconductor device 4 and is far away from the semiconductor device 4, the creepage distance or the electrical clearance between the fastening piece 3 and the semiconductor device 4 is enough, and the phenomenon that the fastening piece 3 causes the short circuit of the semiconductor device 4 is avoided.
Specifically, as shown in fig. 2 and 3, since in the present embodiment, there are two semiconductor devices 4 and the fixing hole 11 is provided between two semiconductor devices 4, in practical cases, one insulating pressing plate 1 may be pressed on three or more semiconductor devices 4 at the same time, and when one insulating pressing plate 1 is pressed on three or more semiconductor devices 4, one fastening member 3 may be used for fixing, or a plurality of fastening members may be used, and when a plurality of fastening members are used, one fixing hole 11 is generally provided between every two adjacent semiconductor devices 4. Moreover, the fixing holes 11 between two adjacent semiconductor devices 4 are spaced apart from the two semiconductor devices 4 by the same distance. That is, the fixing holes 11 are equally spaced from the adjacent two semiconductor devices 4.
In addition, specifically, as shown in fig. 2, the fastener 3 is a screw including: the column 31 and the nut 32 are coaxially and fixedly connected with the column, threads are formed on the outer surface of the column, the column 31 of the screw sequentially penetrates through the fixing hole 11 and the connecting hole 21 and then is in threaded connection with the heat dissipation device 5, therefore, a threaded hole is formed in the heat dissipation device 5 in advance, the number of the threaded holes is equal to that of the connecting holes 21, the threaded holes correspond to the connecting holes one by one, the nut 32 of the screw abuts against one side, deviating from the heat dissipation device 5, of the insulating pressing plate 1, and the semiconductor device 4 and the insulating heat conduction pad 2 are pressed on the heat dissipation device 5. Of course, in practical cases, the fastener may further include a screw and a locking member 8, the locking member 8 is inserted into the cylinder 31 of the screw, the locking member 8 may be a locking washer, such as a spring washer, of course, the locking member 8 may further include a common washer 81 and a spring washer 82, both the common washer 81 and the spring washer 82 are inserted into the cylinder 31 of the screw, and specifically, in this embodiment, as shown in fig. 2, the fastener includes: the heat sink comprises a screw and a locking member 8, wherein the locking member comprises a common gasket 81 and a spring gasket 82, and the spring gasket 82 abuts against one side of the insulating pressing plate 1, which is far away from the heat sink 5.
In addition, in order to reduce the weight of the insulating pressing plate 1, in practical cases, a hollow portion is further formed on the insulating pressing plate 1, and specifically, the hollow portion is formed to avoid the semiconductor device 4.
A second embodiment of the present invention relates to a heat dissipating assembly, as shown in fig. 1 to 3, comprising: at least two semiconductor devices 4, a fixing device for the semiconductor devices 4 in the first embodiment, a circuit board 6 and a heat dissipation device 5, wherein the circuit board 6 is disposed on a side of the insulating pressing plate 1 away from the heat dissipation device 5 and is parallel to the insulating pressing plate 1, and the circuit board 6 is soldered on each of the pins 42 of each of the semiconductor devices 4 and is electrically connected to each of the pins 42; the heat dissipation device 5 is used for dissipating heat of the semiconductor device 4; specifically, the insulating thermal pad 2 is attached to the heat transmission portion of the heat dissipation device 5, and in practical cases, the type of the heat dissipation device is not limited, and may be natural cooling, air cooling, water cooling, or other manners.
In addition, in practical situations, since the circuit board 6 needs to be soldered to the pins 42, and then the insulating pressing plate 1 and the heat dissipation device 5 need to be fastened by the fasteners 3, the circuit board 6 interferes with the installation of the fasteners 3, so as shown in fig. 1, in the present embodiment, a plurality of installation holes 61 are formed in the circuit board 6, the installation holes 61 are equal in number and correspond to the fasteners 3 one by one, each installation hole 61 is arranged opposite to the corresponding fastener 3, and each fastener 3 is installed on the insulating pressing plate 1 and the heat dissipation device 5 through the installation hole 61. In the prior art, in order to install the fastening piece 3, a hole needs to be formed in the circuit board 6, and as one insulating pressing plate 1 can be pressed on at least two semiconductor devices 4 at the same time, the fastening piece 3 can be one, so that the number of the fastening pieces 3 is greatly reduced, and the mounting hole 61 needs to be formed in the circuit board 6, so that the fastening piece 3 is convenient to install, the fastening pieces 3 are fewer, the mounting holes 61 in the circuit board 6 are naturally reduced, the use efficiency of the space on the circuit board 6 can be improved, and the area of the circuit board 6 is reduced.
A third embodiment of the present invention relates to a method of mounting a semiconductor device 4, including the steps of:
the pins 42 of at least two semiconductor devices 4 are correspondingly penetrated through the fixing holes 11 on the insulating pressing plate 1;
arranging a circuit board 6 opposite to the insulating pressing plate 1, and welding the circuit board 6 on each pin 42;
arranging an insulating heat conducting pad 2 on a heat radiating device 5, and arranging a welded semiconductor device 4 on the insulating heat conducting pad 2;
the fastening piece 3 penetrates through the insulating pressing plate 1 and the insulating heat conducting plate in sequence and then is tightly connected with the heat dissipation device 5, and the insulating pressing plate 1, the semiconductor devices 4 and the insulating heat conducting plate are tightly pressed on the heat dissipation device 5.
Compared with the prior art, the semiconductor device 4 fixing device of the embodiment of the invention presses at least two semiconductor devices 4 through the insulating pressing plate 1, then the fixing device is fixed by the fastening piece 3 in a mode of forming the fixing hole 11 on the insulating pressing plate 1, and the fixing hole 11 on the insulating pressing plate 1 is arranged to avoid the semiconductor device 4, so that the fastening piece 3 is not close to the semiconductor device 4 and is far away from the semiconductor device 4, the creepage distance or the electrical clearance between the fastening piece 3 and the semiconductor device 4 is enough, and the phenomenon that the fastening piece 3 causes the short circuit of the semiconductor device 4 is avoided.
In addition, when the circuit board 6 is soldered to each of the pins 42, a soldering fixture 7 is disposed between the circuit board 6 and the insulating pressing plate 1 to support the circuit board 6. Of course, in practical cases, if there is no gap between the circuit board 6 and the insulating pressing plate 1, the soldering tool 7 may not be provided.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A semiconductor device holding apparatus, comprising:
the insulating pressing plate is pressed on at least two semiconductor devices, a plurality of pin holes are formed in the insulating pressing plate, the number of the pin holes is equal to that of pins on the semiconductor devices, the pin holes correspond to the pin holes one by one, the pin holes are used for being penetrated by the corresponding pins, at least one fixing hole is formed in the insulating pressing plate, and the fixing hole is arranged to avoid the semiconductor devices;
the insulating heat conducting pad is arranged on one side, away from the insulating pressing plate, of the semiconductor device, is arranged between each semiconductor device and the heat dissipation device, and is provided with at least one connecting hole, the number of the connecting holes is equal to that of the fixing holes, and the connecting holes are coaxially arranged in a one-to-one correspondence manner;
the number of the fasteners is equal to that of the fixing holes and the number of the connecting holes, the fasteners are uniformly and correspondingly arranged, each fastener is used for sequentially penetrating through the corresponding fixing hole and the corresponding connecting hole and is fixedly connected with the heat dissipation device, and the insulating pressing plate, the semiconductor device and the insulating heat conduction pad are sequentially pressed on the heat dissipation device.
2. The semiconductor device mounting apparatus according to claim 1, wherein one of the mounting holes is provided between each adjacent two of the semiconductor devices.
3. The semiconductor device mounting apparatus according to claim 2, wherein the mounting holes between two adjacent semiconductor devices are spaced apart from each other by an equal distance.
4. The semiconductor device fixing apparatus according to claim 1, wherein the fastener is a screw.
5. The semiconductor device fixing apparatus according to claim 1, wherein a hollow portion is further formed in the insulating pressing plate.
6. The semiconductor device fixing apparatus according to claim 5, wherein the hollowed-out portion is opened so as to avoid the semiconductor device.
7. The semiconductor device mounting apparatus of claim 1, wherein the insulating thermal pad is provided with a thermally conductive silicone grease on a side facing the semiconductor device.
8. A heat sink assembly, comprising:
at least two semiconductor devices;
the semiconductor device holding device according to any one of claims 1 to 7;
the circuit board is arranged on one side of the insulating pressing plate, which is far away from the heat dissipation device, welded on each pin of each semiconductor device and electrically connected with each pin;
the heat dissipation device is used for dissipating the heat of the semiconductor device;
the circuit board is provided with a plurality of mounting holes, the number of the mounting holes is equal to that of the fasteners, the mounting holes correspond to the fasteners one by one, the mounting holes are arranged opposite to the fasteners corresponding to the mounting holes, and the fasteners are mounted on the insulating pressing plate and the heat dissipation device through the mounting holes.
9. A method of mounting a semiconductor device, comprising the steps of:
the pins of at least two semiconductor devices are correspondingly arranged one by one and penetrate through the fixing holes on the insulating pressing plate;
arranging a circuit board opposite to the insulating pressing plate, and welding the circuit board on each pin;
arranging an insulating heat conducting pad on the heat dissipation device, and arranging the welded semiconductor device on the insulating heat conducting pad;
the heat sink is tightly connected with the insulating pressing plate, the semiconductor devices and the insulating heat conducting plate after the fasteners sequentially penetrate through the insulating pressing plate and the insulating heat conducting plate, and the insulating pressing plate, the semiconductor devices and the insulating heat conducting plate are tightly pressed on the heat sink.
10. The method of mounting a semiconductor device according to claim 9, wherein a soldering jig is provided between the circuit board and the insulating pressing plate to support the circuit board when the circuit board is soldered to each of the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011401731.9A CN112509994A (en) | 2020-12-02 | 2020-12-02 | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011401731.9A CN112509994A (en) | 2020-12-02 | 2020-12-02 | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112509994A true CN112509994A (en) | 2021-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011401731.9A Pending CN112509994A (en) | 2020-12-02 | 2020-12-02 | Semiconductor device fixing device, heat radiation assembly and mounting method of semiconductor device |
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| Country | Link |
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| CN (1) | CN112509994A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798617A (en) * | 2021-09-08 | 2021-12-17 | 苏州华太电子技术有限公司 | Welding method, electronic component and clamp |
| CN115055952A (en) * | 2022-07-06 | 2022-09-16 | 珠海格力电器股份有限公司 | Automatic screw screwing device and method for power device assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201894041U (en) * | 2010-12-02 | 2011-07-06 | 保定市金源科技有限公司 | Heat dissipation structure for multi-power device |
| CN203722987U (en) * | 2014-01-06 | 2014-07-16 | 保定市金源科技有限公司 | Simple heat radiation structure of multiple power devices |
| CN109195307A (en) * | 2018-08-30 | 2019-01-11 | 苏州汇川技术有限公司 | Semiconductor element assembly technology, power module and power electronic equipment |
| CN213782008U (en) * | 2020-12-02 | 2021-07-23 | 上海新时达电气股份有限公司 | Semiconductor device fixing device and heat dissipation assembly |
-
2020
- 2020-12-02 CN CN202011401731.9A patent/CN112509994A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201894041U (en) * | 2010-12-02 | 2011-07-06 | 保定市金源科技有限公司 | Heat dissipation structure for multi-power device |
| CN203722987U (en) * | 2014-01-06 | 2014-07-16 | 保定市金源科技有限公司 | Simple heat radiation structure of multiple power devices |
| CN109195307A (en) * | 2018-08-30 | 2019-01-11 | 苏州汇川技术有限公司 | Semiconductor element assembly technology, power module and power electronic equipment |
| CN213782008U (en) * | 2020-12-02 | 2021-07-23 | 上海新时达电气股份有限公司 | Semiconductor device fixing device and heat dissipation assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798617A (en) * | 2021-09-08 | 2021-12-17 | 苏州华太电子技术有限公司 | Welding method, electronic component and clamp |
| CN115055952A (en) * | 2022-07-06 | 2022-09-16 | 珠海格力电器股份有限公司 | Automatic screw screwing device and method for power device assembly |
| CN115055952B (en) * | 2022-07-06 | 2024-03-08 | 珠海格力电器股份有限公司 | Automatic screw screwing device and screwing method for power device assembly |
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