CN216528866U - Power device assembly and power supply - Google Patents
Power device assembly and power supply Download PDFInfo
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- CN216528866U CN216528866U CN202122677084.0U CN202122677084U CN216528866U CN 216528866 U CN216528866 U CN 216528866U CN 202122677084 U CN202122677084 U CN 202122677084U CN 216528866 U CN216528866 U CN 216528866U
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- power device
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Abstract
The embodiment of the utility model relates to the technical field of power devices, and particularly discloses a power device assembly and a power supply, wherein the power device assembly comprises: a heat sink; at least one power device mounted to the heat sink; a first fixed pin; the second fixing pin and the first fixing pin are arranged on the radiating fin, a device pin of the power device, the first fixing pin and the second fixing pin all protrude out of the radiating fin, and the device pin of the power device is positioned between the first fixing pin and the second fixing pin; and along the direction from the first fixed pin to the second fixed pin, the distance from the power device closest to the first fixed pin is not equal to the distance from the power device closest to the second fixed pin. When the power device assembly is vertically rotated by 180 degrees, the positions of the first fixing pin, the second fixing pin and the power device cannot correspond to the original inserting position, so that the power device assembly is prevented from being reversely inserted.
Description
Technical Field
The embodiment of the utility model relates to the technical field of power devices, in particular to a power device assembly and a power supply.
Background
Power supplies are devices that convert other forms of energy into electrical energy, and many consumers require the use of power supplies. With the development of science and technology, the demand of power supplies is getting bigger and bigger, but the cooling and heat dissipation of power devices in the power supplies are always important problems in the design of the power supplies, and the service life and the normal operation of the power supplies are affected by the excessive heat. Therefore, in the current power supply, the power device is often disposed on the heat sink, and the pins of the power device and the fixing pins of the heat sink are plugged together on the printed circuit board of the power supply, so as to achieve connection and heat dissipation of the power device.
In the process of implementing the embodiment of the present invention, the inventors found that: in order to achieve the effects of attractiveness and convenience in use, parts on the existing heat dissipation member and a power device mounted on the heat dissipation member are often symmetrically arranged, so that when an operator vertically rotates the power device by 180 degrees, pins and fixing pins can be directly inserted into a printed circuit board. This arrangement may result in the power supply not operating properly and the difficulty of detection is very high.
SUMMERY OF THE UTILITY MODEL
The technical problem mainly solved by the embodiment of the utility model is to provide a power device assembly and a power supply, which can avoid reversely plugging a power device.
In order to solve the technical problems, the utility model adopts a technical scheme that: there is provided a power device assembly, comprising: the power device comprises a heat sink, at least one power device, a first fixing pin and a second fixing pin. The power device is mounted to the heat sink. The first fixing pin is arranged on the radiating fin. The second fixing pin and the first fixing pin are arranged on the radiating fin, a device pin of the power device, the first fixing pin and the second fixing pin all protrude out of the radiating fin, and the device pin of the power device is located between the first fixing pin and the second fixing pin. And along the direction from the first fixed pin to the second fixed pin, the first distance from the power device closest to the first fixed pin is not equal to the second distance from the power device closest to the second fixed pin.
Optionally, the first fixing pin is provided with a first rivet, the heat sink is provided with a first insertion hole, and the first rivet is inserted into and fixed to the first insertion hole.
Optionally, the second fixing pin is provided with a second rivet, the heat sink is provided with a second insertion hole, and the second rivet is inserted into and fixed to the second insertion hole.
Optionally, the power device further includes a plurality of heat dissipation teeth, and the heat dissipation teeth are disposed on the heat dissipation plate and used for accelerating heat dissipation of the power device.
Optionally, the power device assembly further comprises a heat conducting insulating film attached to a surface of the heat sink facing the power device.
Optionally, the heat sink is provided with a mounting through hole facing the power device. The power device component further comprises a first screw and a first nut, the power device is provided with a fixing through hole, one end of the first screw penetrates through the mounting through hole and the fixing through hole respectively and is in threaded connection with the first nut, and therefore the power device is fixed on the radiating fin.
Optionally, the number of the device pins of the power device is multiple, and at least one of the device pins is bent.
Optionally, the heat sink is made of an aluminum material.
According to an aspect of the embodiments of the present invention, there is provided a power supply, the power supply includes a printed circuit board and the power device assembly as described in any one of the above, the power device assembly is plugged into the printed circuit board so as to realize circuit connection.
Optionally, the printed circuit board is provided with at least one socket facing the power device, so that the device pin of the power device is plugged into the socket. The printed circuit board is provided with a first fixing hole and a second fixing hole facing the radiating fin, so that the first fixing pin and the second fixing pin are respectively inserted into the first fixing hole and the second fixing hole. And along the direction from the first fixing hole to the second fixing hole, the third distance from the socket nearest to the first fixing hole is not equal to the fourth distance from the socket nearest to the second fixing hole.
The embodiment of the utility model has the beneficial effects that: the power device assembly of an embodiment of the utility model comprises a heat sink, at least one power device, a first fixing pin and a second fixing pin. The power device is arranged on the radiating fin, so that the heat radiation of the power device is realized. The second fixing pin and the first fixing pin are arranged on the radiating fin, so that the radiating piece and the object to be connected are fixedly connected. The device pin, the first fixing pin and the second fixing pin of the power device all protrude out of the heat sink, and the device pin of the power device is located between the first fixing pin and the second fixing pin. And along the direction from the first fixed pin to the second fixed pin, the first distance from the power device closest to the first fixed pin is not equal to the second distance from the power device closest to the second fixed pin. In this way, when the power device assembly is vertically rotated by 180 degrees, the positions of the first fixed pin and the second fixed pin and the power device cannot correspond to the original positions, and the original inserting position in the object to be connected is unchanged, so that the device pins of the first fixed pin and the second fixed pin and the power device cannot be inserted into the object to be connected, and the power device assembly is prevented from being reversely inserted, and further the use of the power device assembly is influenced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a perspective view of a power device assembly according to an embodiment of the present invention;
FIG. 2 is another view from FIG. 1;
fig. 3 is yet another perspective view of fig. 1.
The reference numbers in the detailed description are as follows:
| 100 | |
20 | |
| 10 | |
21 | |
| 11 | First fixed pin | 30 | |
| 12 | Second fixed |
40 | |
| 13 | Heat dissipation tooth |
Detailed Description
In order to facilitate an understanding of the utility model, the utility model is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a power device assembly 100 according to an embodiment of the utility model includes a heat sink 10 and at least one power device 20. Wherein the power device 20 is mounted to the heat sink 10, thereby achieving heat dissipation of the power device 20.
In some embodiments, the power device assembly 100 further includes a thermally conductive insulating film (not shown) attached to a surface of the heat sink 10 facing the power device 20, so as to promote heat dissipation of the heat sink 10 to the power device 20, and the insulating effect of the thermally conductive insulating film can prevent the heat sink 10 from being electrically connected with the power device 20, thereby affecting use of the power device 20.
It is understood that the power device assembly 100 includes the heat conductive insulating film in the present embodiment, but the present invention is not limited thereto, as long as the heat conduction to the power device 20 can be achieved, for example, heat conductive silicone grease or the like is coated on the surface of the power device 20, and the heat conduction to the power device 20 can also be achieved, so as to promote the heat dissipation to the power device 20.
For the heat sink 10, the heat sink 10 is provided with a first fixed lead 11, a second fixed lead 12 and a plurality of heat dissipation teeth 13, respectively, please refer to fig. 2. The first fixing pin 11 and the second fixing pin 12 are located on the same side of the heat sink 10 and both protrude from the heat sink 10, and when the first fixing pin 11 and the second fixing pin 12 are inserted into a to-be-connected object such as a printed circuit board together, the heat sink 10 can be connected and fixed with the to-be-connected object. The heat dissipation teeth 13 are disposed on the other side of the heat sink 10 away from the first and second fixing pins 11 and 12, and the heat dissipation teeth 13 dissipate heat in a convection manner after absorbing the heat, thereby promoting heat dissipation of the power device 20.
It is understood that the heat dissipation teeth 13 are disposed on the other side of the heat sink 10 away from the first and second fixed pins 11 and 12 in this embodiment, but the position of the heat dissipation teeth 13 is not limited thereto, as long as the heat dissipation teeth are disposed on the heat sink 10 to dissipate heat of the power device 20.
In some embodiments, the heat sink 10 is made of an aluminum material through sheet metal working, and the aluminum material has good thermal conductivity and can promote the heat dissipation of the power device 20 by the heat sink 10. It is to be understood that the material of the heat sink 10 and the processing of the heat sink are not limited thereto, and for example, the heat sink is made of a silicon material, and can also promote heat dissipation of the power device 20.
In some embodiments, the first fixing pin 11 is provided with a first rivet (not shown), and the heat sink 10 is provided with a first insertion hole (not shown), and the first rivet is inserted into and fixed to the first insertion hole. The second fixing pin 12 is provided with a second rivet (not shown), and the heat sink 10 is provided with a second insertion hole (not shown), and the second rivet is inserted into and fixed to the second insertion hole. When the first rivet and the second rivet are respectively inserted into the first insertion hole and the second insertion hole, the first fixing pin 11 and the second fixing pin 12 can be fixed on the heat sink 10.
It is understood that the fixing of the first fixing pins 11 and the second fixing pins 12 to the heat sink 10 is not limited to the above-mentioned manner, and for example, the first fixing pins 11 and the second fixing pins 12 may be integrally formed with the heat sink 10, and the fixing of the first fixing pins 11 and the second fixing pins 12 may also be achieved.
In some embodiments, the heat sink teeth 13 are integrally formed with the heat sink 10. It is understood that the connection manner of the heat dissipation teeth 13 and the heat dissipation plate 10 is not limited thereto, and the connection of the heat dissipation teeth 13 and the heat dissipation plate 10 can be achieved by gluing, screwing, and the like.
For the power device 20, please refer to fig. 3, the device pin 21, the first fixing pin 11, and the second fixing pin 12 of the power device 20 are located on the same side of the heat sink 10, the device pin 21 of the power device 20 is located between the first fixing pin 11 and the second fixing pin 12, and the device pin 21, the first fixing pin 11, and the second fixing pin 12 of the power device 20 all protrude out of the heat sink 10, so that the device pin 21, the first fixing pin 11, and the second fixing pin 12 are inserted into the object to be connected together, and the connection between the power device 20 and the heat sink and the object to be connected is further achieved.
It should be noted that, along the direction from the first fixed pin 11 to the second fixed pin 12, a first distance from the power device 20 closest to the first fixed pin 11 is not equal to a second distance from the power device 20 closest to the second fixed pin 12. When the power device assembly 100 is vertically rotated by 180 degrees, the positions of the first fixing pin 11, the second fixing pin 12 and the device pin 21 of the power device 20 cannot correspond to the original positions, and the original insertion positions in the object to be connected are unchanged, so that the first fixing pin 11, the second fixing pin 12 and the device pin 21 of the power device 20 cannot be inserted into the object to be connected, and the power device assembly 100 is prevented from being reversely inserted, and further the use of the power assembly is prevented from being influenced.
In some embodiments, the power device assembly 100 further includes a first screw 30 and a first nut 40, the heat sink 10 is provided with a mounting through hole (not shown) facing the power device 20, and the power device 20 is provided with a fixing through hole (not shown), and one end of the first screw 30 passes through the mounting through hole and the fixing through hole, respectively, and then is screwed with the first nut 40, thereby fixing the power device 20 to the heat sink 10. It is understood that the mounting manner of the power device 20 is not limited thereto, and for example, the power device 20 can be mounted by gluing the power device 20 to the heat sink 10.
In some embodiments, the device pin 21 of the power device 20 is plural, and at least one of the plural device pins is bent. It is understood that the socket of the object to be connected is also arranged corresponding to the device pin 21 which is not bent. When the power device assembly 100 is vertically rotated by 180 degrees, the position of the device pin of the power device 20 cannot correspond to the original plugging position, and the original plugging position in the object to be connected is unchanged, so that the device pin 21 of the power device 20 cannot be connected with the object to be connected at the moment, and the detection difficulty of testing whether the power device 20 is plugged reversely by an operator is reduced.
An embodiment of the utility model provides a power device assembly 100 including a heat sink 10, at least one power device 20, a first fixing pin 11 and a second fixing pin 12. The power device 20 is mounted on the heat sink 10, so that the heat sink 10 dissipates heat from the power device 20. The second fixing pin 12 and the first fixing pin 11 are both arranged on the heat sink 10, so that the heat sink and an object to be connected are connected and fixed. The device pin 21, the first fixing pin 11 and the second fixing pin 12 of the power device 20 all protrude out of the heat sink 10, and the device pin 21 of the power device 20 is located between the first fixing pin 11 and the second fixing pin 12. Along the direction from the first fixed pin 11 to the second fixed pin 12, a first distance from the power device 20 closest to the first fixed pin 11 is not equal to a second distance from the power device 20 closest to the second fixed pin 12. Through the above manner, when the power device assembly 100 is vertically rotated by 180 degrees, the positions of the first fixed pin 11, the second fixed pin 12 and the power device 20 cannot correspond to the original positions, and the original insertion positions in the object to be connected are unchanged, so that the first fixed pin 11, the second fixed pin 12 and the device pin 21 of the power device 20 cannot be inserted into the object to be connected at the moment, and the power device assembly 100 is prevented from being reversely inserted, thereby affecting the use of the power device.
An embodiment of the present invention further provides a power supply, where the power supply includes a printed circuit board and the power device assembly 100, and the power device assembly 100 is plugged into the printed circuit board to implement circuit connection. For the structure of the power device assembly 100, reference may be made to the above embodiments, which are not repeated herein, and the following is a description of a printed circuit board.
In some embodiments, the printed circuit board is provided with at least one socket facing the power device 20, such that the device pins 21 of the power device 20 are plugged into the socket. The printed circuit board is provided with a first fixing hole and a second fixing hole facing the heat sink 10, so that the first fixing pin 11 and the second fixing pin 12 are respectively inserted into the first fixing hole and the second fixing hole. When the device pin 21, the first fixing pin 11 and the second fixing pin 12 of the power device 20 are respectively plugged into the socket, the first fixing hole and the second fixing hole, the power device assembly 100 is plugged into the printed circuit board.
It should be noted that, along the direction from the first fixing hole to the second fixing hole, a third distance from the socket nearest to the first fixing hole is not equal to a fourth distance from the socket nearest to the second fixing hole. When the power device assembly 100 is vertically rotated by 180 degrees, the positions of the device pin 21 of the power device 20, the first fixing pin 11 and the second fixing pin 12 cannot correspond to the positions of the socket, the first fixing hole and the second fixing hole, so that the first fixing pin 11, the second fixing pin 12 and the device pin 21 of the power device 20 cannot be inserted into the printed circuit board at the moment, the power device assembly 100 is prevented from being reversely inserted, the connection between the power device 20 and other parts in the power supply is prevented from being influenced, and the power supply cannot be used.
It should be noted that the description of the present invention and the accompanying drawings illustrate preferred embodiments of the present invention, but the present invention may be embodied in many different forms and is not limited to the embodiments described in the present specification, which are provided as additional limitations to the present invention and to provide a more thorough understanding of the present disclosure. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the utility model as defined by the appended claims.
Claims (10)
1. A power device assembly, comprising:
a heat sink;
at least one power device mounted to the heat sink;
the first fixing pin is arranged on the radiating fin;
the second fixing pin and the first fixing pin are arranged on the radiating fin, a device pin of the power device, the first fixing pin and the second fixing pin all protrude out of the radiating fin, and the device pin of the power device is located between the first fixing pin and the second fixing pin;
and along the direction from the first fixed pin to the second fixed pin, a first distance from the power device closest to the first fixed pin is not equal to a second distance from the power device closest to the second fixed pin.
2. The power device assembly as claimed in claim 1, wherein the first fixing pin is provided with a first rivet, and the heat sink is provided with a first insertion hole, and the first rivet is inserted into and fixed to the first insertion hole.
3. The power device assembly of claim 1, wherein the second fixing pin is provided with a second rivet, and the heat sink is provided with a second insertion hole, and the second rivet is inserted into and fixed to the second insertion hole.
4. The power device assembly of claim 1, wherein the power device further comprises a plurality of heat dissipation teeth, and the plurality of heat dissipation teeth are disposed on the heat dissipation plate for increasing the heat dissipation of the power device.
5. The power device assembly of claim 1, further comprising a thermally conductive insulating film attached to a surface of the heat sink facing the power device.
6. The power device assembly of claim 1,
the radiating fin is provided with a mounting through hole facing the power device;
the power device component further comprises a first screw and a first nut, the power device is provided with a fixing through hole, one end of the first screw penetrates through the mounting through hole and the fixing through hole respectively and is in threaded connection with the first nut, and therefore the power device is fixed on the radiating fin.
7. The power device assembly of claim 1, wherein the device pin of the power device is plural, and at least one of the plural device pins is bent.
8. The power device assembly of claim 1, wherein the heat sink is made of an aluminum material.
9. A power supply comprising a printed circuit board and a power device assembly as claimed in any one of claims 1 to 8, the power device assembly being plugged into the printed circuit board to effect connection of a circuit.
10. The power supply of claim 9,
the printed circuit board is provided with at least one jack facing the power device, so that a device pin of the power device is plugged into the jack;
the printed circuit board is provided with a first fixing hole and a second fixing hole facing the radiating fin, so that the first fixing pin and the second fixing pin are respectively inserted into the first fixing hole and the second fixing hole;
and along the direction from the first fixing hole to the second fixing hole, the third distance from the socket nearest to the first fixing hole is not equal to the fourth distance from the socket nearest to the second fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122677084.0U CN216528866U (en) | 2021-11-03 | 2021-11-03 | Power device assembly and power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122677084.0U CN216528866U (en) | 2021-11-03 | 2021-11-03 | Power device assembly and power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216528866U true CN216528866U (en) | 2022-05-13 |
Family
ID=81527465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122677084.0U Active CN216528866U (en) | 2021-11-03 | 2021-11-03 | Power device assembly and power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216528866U (en) |
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2021
- 2021-11-03 CN CN202122677084.0U patent/CN216528866U/en active Active
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