CN222996743U - High-efficiency heat-dissipation circuit board with multiple electric elements - Google Patents
High-efficiency heat-dissipation circuit board with multiple electric elements Download PDFInfo
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- CN222996743U CN222996743U CN202421962384.0U CN202421962384U CN222996743U CN 222996743 U CN222996743 U CN 222996743U CN 202421962384 U CN202421962384 U CN 202421962384U CN 222996743 U CN222996743 U CN 222996743U
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Abstract
The utility model discloses a circuit board with multiple electric elements and high-efficiency heat dissipation, which comprises a circuit board body and electric elements arranged on the circuit board body, wherein the circuit board body is divided into a middle area and an annular peripheral area, the electric elements with large heat productivity are arranged in the middle area, the electric elements with small heat productivity are arranged in the peripheral area, a heat dissipation plate is arranged in the middle area, at least two mounting holes are arranged in the peripheral area, mounting column heads are arranged at the mounting holes, one end of each mounting column head is detachably provided with a limiting compression column with a top cap, the limiting compression column penetrates through the heat dissipation plate and is sleeved with an elastic spring, one end of the elastic spring is propped against the top cap, and the other end of the elastic spring is propped against the top of the heat dissipation plate to apply elastic force close to the circuit board body to the heat dissipation plate. According to the utility model, the circuit board body is partitioned, the electric elements with large heating value are arranged in the middle area of the circuit board body, the heat dissipation plate attached to the electric elements is arranged in the middle area, the heat dissipation plate is always attached to the electric elements through the limiting compression column and the elastic spring, automatic compensation is performed in the use process, and higher heat dissipation efficiency is ensured.
Description
Technical Field
The present utility model relates to circuit boards, and more particularly, to a circuit board with efficient heat dissipation for multiple electrical components.
Background
The circuit board is mainly used for providing connection and support for electric elements and realizing the function of a circuit. Circuit boards are widely used in a variety of electronic devices, including computers, communication devices, consumer electronics, industrial control systems, medical devices, and the like. Different types of circuit boards are suitable for different application scenes and need to be selected according to specific requirements.
The patent with the application number of CN201410240572.7 discloses a high-heat-dissipation circuit board group which is provided with a circuit board and a heat dissipation device, wherein the circuit board is provided with a plurality of electronic elements, at least one heat dissipation hole and at least one heat conduction material, the electronic elements are arranged on the top surface of the circuit board, each heat dissipation hole penetrates through the top surface and the bottom surface of the circuit board and is opposite to one electronic element, each heat conduction material is contained in the corresponding heat dissipation hole and is in contact with the electronic element opposite to the heat dissipation hole, the heat dissipation device is flatly attached to the bottom surface of the circuit board and is in contact with each heat conduction material, and waste heat generated when the electronic elements operate on the circuit board can be quickly conducted to the heat dissipation device through the heat conduction material with high heat conduction coefficient for heat dissipation.
The heat dissipation device is flatly attached to the bottom surface of the circuit board and is in contact with each heat conduction material, two problems exist in the heat dissipation device, one problem is that the heat dissipation device is required to be welded in a close fit mode, the welding process is complex, the welding position is corroded after a period of use or is loosened under the action of expansion caused by heat and contraction caused by cold, gaps are formed in the welding position, and therefore heat dissipation efficiency is weakened.
Disclosure of utility model
Based on the structure of flatly attaching a heat conduction structure in the prior art, the defect that the heat dissipation efficiency is weakened due to the fact that a gap appears when the heat conduction structure is loosened after the heat conduction structure is used for a period of time can be overcome.
The technical scheme adopted for solving the technical problems is as follows:
The circuit board comprises a circuit board body and electrical components mounted on the circuit board body, wherein the circuit board body is divided into a middle area and an annular peripheral area, the electrical components with large heating value are mounted in the middle area, the electrical components with small heating value are mounted in the peripheral area, a heat dissipation plate is arranged in the middle area, at least two mounting holes are formed in the peripheral area, mounting column heads are arranged at the mounting holes, one end of each mounting column head is detachably provided with a limiting compression column with a top cap, the limiting compression column penetrates through the heat dissipation plate and is sleeved with an elastic spring, one end of the elastic spring abuts against the top cap, and the other end of the elastic spring abuts against the top of the heat dissipation plate to apply elastic force close to the circuit board body to the heat dissipation plate.
Preferably, the heat dissipation plate comprises a bottom plate parallel to the circuit board body and a plurality of heat dissipation fins arranged on the bottom plate and perpendicular to the bottom plate.
Preferably, each radiating fin is arranged in parallel, the radiating fin comprises a plurality of subareas, the intervals of the radiating fins in the subareas are the same, and the interval between two nearest radiating fins in adjacent subareas is larger than the interval between adjacent radiating fins in the subareas.
Preferably, the electric elements on the front surface of the middle area are a plurality of electric elements attached to the circuit board body.
Preferably, the back of the middle area is provided with a mounting component, a gap is reserved between the mounting component and the back of the circuit board body, and the mounting main component is used for mounting the control chip.
Preferably, the mounting assembly comprises two mounting plates arranged on the circuit board body at intervals and a mounting seat arranged on the mounting plates, the control chip is arranged on the mounting seat, and the mounting plates and the mounting seat are provided with connecting circuits for communicating the circuit board body circuit with the control chip circuit.
Preferably, the mounting column comprises a circular table at the bottom and a cylinder at the top, wherein the maximum diameter of the circular table is larger than the aperture of the mounting hole, the diameter of the cylinder is smaller than the aperture of the mounting hole, the cylinder extends into the mounting hole from the bottom of the mounting hole, and the limiting pressing column is detachably fixed on the cylinder.
Preferably, the cylinder is provided with external threads, and the limiting pressing column is provided with internal threads and is connected with the cylinder threads.
Preferably, the peripheral area is further provided with a power interface and a data interface.
Preferably, the peripheral region further comprises a fan plug connector, the fan plug connector being located at an end of the heat sink.
Compared with the prior art, the circuit board has the advantages that the circuit board body is partitioned, the electric elements with large heat productivity are arranged in the middle area of the circuit board body, the heat dissipation plate attached to the electric elements is arranged in the middle area and is always attached to the electric elements through the limiting pressing columns and the elastic springs, the heat dissipation plate is automatically compensated in the use process, the higher heat dissipation efficiency is ensured, and in addition, the electric elements with small heat productivity are arranged in the peripheral area, and the heat dissipation efficiency of the whole circuit board is improved through the partition and auxiliary heat dissipation modes.
Drawings
The utility model will be described in further detail below in connection with the drawings and the preferred embodiments, but it will be appreciated by those skilled in the art that these drawings are drawn for the purpose of illustrating the preferred embodiments only and thus should not be taken as limiting the scope of the utility model. Moreover, unless specifically indicated otherwise, the drawings are merely schematic representations, not necessarily to scale, of the compositions or constructions of the described objects and may include exaggerated representations.
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a top view of the present utility model;
Fig. 3 is a perspective view (with the radiator plate removed) of the present utility model;
FIG. 4 is a perspective view of the present utility model;
fig. 5 is a perspective view (bottom) of the present utility model;
In the figure, 10 parts of a circuit board body, 20 parts of an electric element, 30 parts of a heat radiation plate, 301 parts of a bottom plate, 302 parts of a heat radiation plate, 401 parts of a mounting column head, 402 parts of a limiting pressing column, 403 parts of an elastic spring, 501 parts of a mounting plate, 502 parts of a mounting seat, 503 parts of a control chip and the like.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the drawings, and those skilled in the art will appreciate that the descriptions are merely illustrative, exemplary, and should not be construed as limiting the scope of the present utility model.
It should be noted that like reference numerals refer to like items in the following figures, and thus once an item is defined in one figure, it may not be further defined and explained in subsequent figures.
Examples
The title of the circuit board with multiple electrical components and high-efficiency heat dissipation is mainly described in this embodiment, and the title is specifically as follows:
the main scheme is as follows:
1-5, the circuit board with high-efficient heat dissipation of many electrical components, as shown in FIG. 1-5, including circuit board body 10 and electrical components 20 installed on circuit board body 10, circuit board body 10 divide into middle part region and annular peripheral region, electrical components 20 that calorific value is big install in middle part region, electrical components 20 that calorific value is little install in peripheral region, the middle part region is equipped with heating panel 30, peripheral region is equipped with two at least mounting holes, the mounting hole department is equipped with installation column cap 401, the spacing compression column 402 of taking the top cap can be dismantled to the one end of installation column cap 401, spacing compression column 402 runs through heating panel 30 and overlaps on it and is equipped with spring 403, spring's one end is supported on the top cap and the other end is supported and is exerted the elasticity that is close to circuit board body 10 to heating panel 30 in the heating panel 30 top surface.
Heat dissipation plate part:
As shown in fig. 1-2, the heat dissipating plate 30 includes a bottom plate 301 parallel to the circuit board body 10 and a plurality of heat dissipating fins 302 disposed on the bottom plate 301 and perpendicular to the bottom plate 301.
Preferably, each fin 302 is disposed in parallel, and the fin 302 includes a plurality of sections, wherein the fins 302 in each section have the same spacing, and the spacing between two nearest fins 302 in each adjacent section is greater than the spacing between adjacent fins 302 in each section. Wherein the heat sink 302 gradually increases from the middle to both sides.
Distribution of electrical components:
as shown in fig. 1 to 5, the electrical components 20 on the front surface of the middle area are a plurality of electrical components 20 attached to the circuit board body 10.
Preferably, the back surface of the middle area is provided with a mounting component, a gap is formed between the mounting component and the back surface of the circuit board body 10, and the mounting main component is used for mounting the control chip 503. The control chip 503 is mounted on the back surface to disperse other electrical components 20, thereby avoiding local heat accumulation.
Preferably, the mounting assembly comprises two mounting plates 501 arranged on the circuit board body 10 at intervals and a mounting seat 502 arranged on the mounting plates 501, the control chip 503 is arranged on the mounting seat 502, and the mounting plates 501 and the mounting seat 502 are provided with connecting circuits for connecting the circuit of the circuit board body 10 with the circuit of the control chip 503.
Preferably, the peripheral area is further provided with a power interface and a data interface. The power interface and the data interface are both of a structure with smaller heat generation amount, and are arranged on the periphery without being influenced.
Preferably, the peripheral region also has a fan plug connector located at the end of the heat sink 302. When the fan is used in summer, the fan can be additionally arranged on the circuit board, so that the heat dissipation effect of the fan is further improved.
Radiating plate mounting structure:
as shown in fig. 4, the mounting post includes a circular truncated cone at the bottom and a cylinder at the top, the maximum diameter of the circular truncated cone is greater than the aperture of the mounting hole, the diameter of the cylinder is smaller than the aperture of the mounting hole, the cylinder extends into the mounting hole from the bottom of the mounting hole, and the limiting press post 402 is detachably fixed on the cylinder.
Preferably, the cylinder is provided with external threads, and the spacing compression column 402 is provided with internal threads and is in threaded engagement with the cylinder.
While the foregoing has been provided to illustrate the principles and embodiments of the present utility model, and while specific embodiments have been described herein, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the principles and embodiments of the utility model, the utility model is defined in the appended claims.
Claims (10)
1. The circuit board is characterized in that the circuit board body is divided into a middle area and an annular peripheral area, the electric elements with large heating value are arranged in the middle area, the electric elements with small heating value are arranged in the peripheral area, a heat dissipation plate is arranged in the middle area, at least two mounting holes are formed in the peripheral area, mounting column heads are arranged at the mounting holes, one end of each mounting column head is detachably provided with a limiting compression column with a top cap, the limiting compression column penetrates through the heat dissipation plate and is sleeved with an elastic spring, one end of the elastic spring abuts against the top cap, and the other end of the elastic spring abuts against the top of the heat dissipation plate to apply elastic force close to the circuit board body to the heat dissipation plate.
2. The circuit board with efficient heat dissipation of multiple electrical components as recited in claim 1, wherein the heat dissipation plate comprises a bottom plate parallel to the circuit board body and a plurality of heat dissipation fins disposed on the bottom plate perpendicular to the bottom plate.
3. The circuit board with efficient heat dissipation of multiple electrical components of claim 2, wherein each heat sink is arranged in parallel and comprises a plurality of sections, the heat sinks in a section are equally spaced, and the spacing between two nearest heat sinks in adjacent sections is greater than the spacing between adjacent heat sinks in a section.
4. The circuit board with efficient heat dissipation of multiple electrical components of claim 1, wherein the electrical components on the front side of the central region are a plurality of electrical components attached to the circuit board body.
5. The circuit board with efficient heat dissipation of multiple electrical components of claim 1, wherein the back side of the central region is provided with a mounting assembly having a gap from the back side of the circuit board body, the mounting assembly being configured to mount the control chip.
6. The circuit board with efficient heat dissipation of multiple electrical components of claim 5, wherein the mounting assembly comprises two mounting plates arranged on the circuit board body at intervals and a mounting seat arranged on the mounting plates, the control chip is arranged on the mounting seat, and connection circuits for connecting the circuit board body circuit with the control chip circuit are arranged on the mounting plates and the mounting seat.
7. The circuit board with efficient heat dissipation of multiple electrical components of claim 1, wherein the mounting post comprises a circular truncated cone at the bottom and a cylinder at the top, the largest diameter of the circular truncated cone is larger than the aperture of the mounting hole, the diameter of the cylinder is smaller than the aperture of the mounting hole, the cylinder extends into the mounting hole from the bottom of the mounting hole, and the limiting press post is detachably fixed on the cylinder.
8. The circuit board with efficient heat dissipation of multiple electrical components of claim 7, wherein the cylinder is provided with external threads and the spacing compression post is provided with internal threads and is connected with the cylinder threads.
9. The circuit board with efficient heat dissipation of multiple electrical components of claim 1, wherein the peripheral region is further provided with a power interface and a data interface.
10. A circuit board with efficient heat dissipation of multiple electrical components as recited in claim 2 or 3 wherein the peripheral region further comprises a fan plug connector located at an end of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421962384.0U CN222996743U (en) | 2024-08-13 | 2024-08-13 | High-efficiency heat-dissipation circuit board with multiple electric elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421962384.0U CN222996743U (en) | 2024-08-13 | 2024-08-13 | High-efficiency heat-dissipation circuit board with multiple electric elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222996743U true CN222996743U (en) | 2025-06-17 |
Family
ID=95988242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421962384.0U Active CN222996743U (en) | 2024-08-13 | 2024-08-13 | High-efficiency heat-dissipation circuit board with multiple electric elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222996743U (en) |
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2024
- 2024-08-13 CN CN202421962384.0U patent/CN222996743U/en active Active
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