CN219181962U

CN219181962U - Circuit device for improving heating

Info

Publication number: CN219181962U
Application number: CN202320084931.9U
Authority: CN
Inventors: 徐凯; 诸旭日
Original assignee: Ningbo Luanshi Electronics Co ltd
Current assignee: Ningbo Luanshi Electronics Co ltd
Priority date: 2023-01-29
Filing date: 2023-01-29
Publication date: 2023-06-13
Anticipated expiration: 2033-01-29

Abstract

The utility model discloses a circuit device for improving heating, which comprises a heat dissipation component and a circuit board component, wherein the heat dissipation component is arranged on the circuit board component, the heat dissipation component comprises a heat transfer plate, the circuit board component comprises fourteen heating chips, the inner sides of the front ends of the heat transfer plate are attached to the heating chips, silica gel heat conduction paste is smeared on the parts of the heat transfer plate attached to the heating chips, and the outer sides of the heat transfer plate are wrapped with heat dissipation plates; according to the utility model, through adding the design of heat dissipation, the heat transfer plate is connected to the heating chip through the heat-conducting silica gel, so that the heat generated by the heating chip is transferred to the heat dissipation plate by the heat transfer plate, and then the heat is dissipated by the heat dissipation groove of the heat dissipation plate.

Description

Circuit device for improving heating

Technical Field

The utility model relates to the technical field of electronic equipment, in particular to a circuit device for improving heating.

Background

As various chips in the power circuit are designed to be thinner and thinner, the reduction in the width and volume of the wire increases the amount of heat generated per unit volume or unit area, so the various chips on the power circuit require the addition of a heat sink.

Through searching, the utility model provides an electronic control device capable of improving cooling performance realized by air cooling, and the application number of the Chinese patent document is CN 202180029225.8. The electronic control device includes a circuit board 6 (circuit board); a heat generating component 7 (heat generating body) mounted on the circuit board 6; a heat radiation member 12 (heat conduction member) in contact with the heat generation member 7 and capable of conducting heat of the heat generation member 7; a fin integrated housing 3 (housing) that covers the circuit board 6 in contact with the heat radiating member 12; and a cover 1 covering the fin integrated housing 3. The cover 1 has a hole (2) 8 and a hole (3) 9 as suction holes and a hole (1) 2 as exhaust holes. The hole (1) 2 is formed at a position close to the heat generating component 7, compared with the holes (2) 8 and (3) 9. The hole (2) 8 and the hole (3) 9 are formed at positions distant from the heat generating component 7, compared with the hole (1) 2.

However, the utility model has the following defects:

the heat dissipation assembly designed by the device can leave enough space for the fins to dissipate heat, so that the thickness of the device is thicker, the circuit boards with the required thickness cannot be installed due to the thinner and thinner power supply circuit design, but the device cannot be designed to be too thin to influence the heat dissipation effect of the device due to the fact that the fins are required to dissipate heat mainly, and therefore, a circuit device for improving heat generation is required to solve the problems.

Disclosure of Invention

The utility model aims to provide a circuit device for improving heating, which is characterized in that a heat radiating component is added, a heat transfer plate is connected to a heating chip through heat conducting silica gel, the heat transfer plate is used for conducting heat generated by the heating chip to the heat radiating plate, and the heat radiating plate is used for radiating the heat.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an improve circuit arrangement that generates heat, includes heat radiation assembly and circuit board subassembly, heat radiation assembly installs on the circuit board subassembly, heat radiation assembly includes the heat transfer board, the circuit board subassembly includes fourteen chips that generate heat, the inboard laminating of front end of heat transfer board is on the chip that generates heat, the heat transfer board laminating is gone up to smear on the position that generates heat the chip has silica gel heat conduction cream, the heat transfer board outside is wrapped up there is the heating panel.

Preferably, a notch is formed in the heat dissipation plate and is located above the heating chip.

Preferably, the circuit board assembly further comprises a PCB board, the heating chip is embedded on the PCB board, and the front surface of the heating chip extends out of the PCB board.

Preferably, the bottom of PCB board is connected with the connecting plate, the connecting plate is the golden finger connecting plate, two sets of first round holes and two sets of second round holes have been seted up on the PCB board, every group first round hole is installed a set of insulating abrasionproof ring respectively.

Preferably, each group of insulating anti-wear rings are internally provided with a main board screw, and one end of the main board screw penetrates through the insulating anti-wear rings and is fixed on the bottom board screw sleeve through threads.

Preferably, the second round hole is located below the heating chip, a third round hole is formed in the heat transfer plate and the heat dissipation plate at a position corresponding to the second round hole, a screw is installed in the third round hole, and a nut is fixed at one end of the screw.

Preferably, four groups of rubber supporting rings are arranged on the inner side of the heat transfer plate, and the other end of the screw rod penetrates through the third round hole, the rubber supporting ring, the second round hole and the rubber supporting ring respectively and is finally connected with the inner side of the rear end of the heat transfer plate in a threaded mode.

Preferably, the front side and the rear side on the heat dissipation plate are respectively provided with a heat dissipation groove, the notch of the heat dissipation groove is a triangular notch, and the heat dissipation groove covers the heating chips.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, through adding the design of heat dissipation, the heat transfer plate is connected to the heating chip through the heat-conducting silica gel, so that the heat generated by the heating chip is transferred to the heat dissipation plate by the heat transfer plate, and then the heat is dissipated by the heat dissipation groove of the heat dissipation plate.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic diagram of a front view of a heat dissipating assembly according to the present utility model;

FIG. 3 is a schematic side view of a heat dissipating assembly according to the present utility model;

FIG. 4 is a schematic diagram of a front view of a circuit board assembly according to the present utility model;

fig. 5 is a schematic side view of a circuit board assembly according to the present utility model.

In the figure: 1. a heat dissipation assembly; 2. a circuit board assembly; 101. a heat transfer plate; 102. a heat dissipation plate; 103. a heat sink; 104. a third round hole; 105. a screw; 106. a screw cap; 107. a rubber support ring; 108. a notch; 201. a PCB board; 202. a connecting plate; 203. a heat generating chip; 204. a main board screw; 205. a first round hole; 206. a second round hole; 207. an insulating wear ring; 209. a bottom plate screw sleeve.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution: the circuit device for improving heating comprises a heat dissipation component 1 and a circuit board component 2, wherein the heat dissipation component 1 is arranged on the circuit board component 2, the heat dissipation component 1 comprises a heat transfer plate 101, the circuit board component 2 comprises fourteen heating chips 203, the inner sides of the front ends of the heat transfer plate 101 are attached to the heating chips 203, silica gel heat conduction paste is smeared on the parts of the heat transfer plate 101 attached to the heating chips 203, and the outer sides of the heat transfer plate 101 are wrapped by a heat dissipation plate 102;

the heat transfer plate 101 is connected to the heating chip 203 through the heat conducting silica gel, so that the heat generated by the heating chip 203 is conducted to the heat dissipation plate 102 by the heat transfer plate 101, and then the heat is dissipated by the heat dissipation groove 103 of the heat dissipation plate 102.

The heat dissipation plate 102 is provided with a notch 108, and the notch 108 is located above the heat generation chip 203, so that a window capable of ventilating is conveniently increased, and the heat dissipation effect is better.

The circuit board assembly 2 further comprises a PCB 201, the heating chip 203 is embedded on the PCB 201, and the front surface of the heating chip 203 extends out of the PCB 201, so that the front surface of the heating chip 203 can better contact the heat transfer plate 101.

The bottom of PCB 201 is connected with connecting plate 202, and connecting plate 202 is golden finger connecting plate 202, and the convenience is connected with the bottom plate contact, and conduction data has offered two sets of first round holes 205 and two sets of second round holes 206 on the PCB 201, installs a set of insulating wear-resisting ring 207 respectively in every first round hole 205 of group, thereby prevents to damage PCB 201 and cause the short circuit when fixing PCB 201 with mainboard screw 204.

Be provided with mainboard screw 204 in every group insulating abrasionproof ring 207, the one end of mainboard screw 204 passes insulating abrasionproof ring 207 thread tightening on bottom plate swivel nut 209, is convenient for fix the PCB board, prevents that the PCB board from taking place the vibration when using, leads to heat transfer plate 101 and the chip that generates heat to contact poorly, thereby make the radiating effect poor.

The second round hole 206 is located the chip 203 below that generates heat, and the third round hole 104 has been seted up to the position that corresponds second round hole 206 on heat transfer plate 101 and the heating panel 102, installs screw rod 105 in the third round hole 104, and screw rod 105's one end is fixed with nut 106, and the radiator unit 1 is installed on circuit board assembly 2 with screw rod 105 and nut 106 of being convenient for.

Four sets of rubber support rings 107 are mounted on the inner side of the heat transfer plate 101, and the other ends of the screws 105 respectively penetrate through the third round hole 104, the rubber support rings 107, the second round hole 206 and the rubber support rings 107 and are finally connected with the inner side of the rear end of the heat transfer plate 101 in a threaded manner, and when the rubber support rings 107 are added to prevent the heat dissipation assembly 1 from being mounted on the circuit board assembly 2, the screws 105 are twisted too much, so that the heat transfer plate 101 excessively extrudes the heat generation chip 203, and the heat generation chip 203 is damaged.

The front side and the rear side on the heat dissipation plate 102 are respectively provided with a heat dissipation groove 103, the notch of the heat dissipation groove 103 is a triangular notch, the heat dissipation groove 103 covers 14 heating chips, the heat dissipation area of the heat dissipation plate 102 is conveniently increased by increasing the heat dissipation groove 103, and the heat dissipation effect is improved.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A circuit arrangement for improving heat generation, characterized in that: including radiator unit (1) and circuit board subassembly (2), radiator unit (1) is installed on circuit board subassembly (2), radiator unit (1) includes heat transfer plate (101), circuit board subassembly (2) include fourteen chips (203) that generate heat, the inboard laminating of front end of heat transfer plate (101) is on chip (203) that generates heat, it has silica gel heat conduction cream to scribble on the position of chip (203) that generates heat to laminate heat transfer plate (101), the heat transfer plate (101) outside is wrapped up there is heating panel (102).

2. A circuit arrangement for improving heating as defined in claim 1, wherein: a notch (108) is formed in the heat radiating plate (102), and the notch (108) is located above the heating chip (203).

3. A circuit arrangement for improving heating as defined in claim 1, wherein: the circuit board assembly (2) further comprises a PCB (201), the heating chip (203) is embedded on the PCB (201), and the front surface of the heating chip (203) extends out of the PCB (201).

4. A circuit arrangement for improving heating as defined in claim 3, wherein: the bottom of PCB board (201) is connected with connecting plate (202), connecting plate (202) are golden finger connecting plate (202), two sets of first round holes (205) and two sets of second round holes (206) have been seted up on PCB board (201), every group first round hole (205) are installed respectively a set of insulating abrasionproof ring (207).

5. A circuit arrangement for improving heating as defined in claim 4, wherein: and each group of insulating anti-wear rings (207) is internally provided with a main board screw (204), and one end of each main board screw (204) penetrates through the insulating anti-wear rings (207) and is fixed on a bottom board screw sleeve (209) in a threaded manner.

6. A circuit arrangement for improving heating as defined in claim 4, wherein: the second round hole (206) is located below the heating chip (203), a third round hole (104) is formed in the positions, corresponding to the second round hole (206), of the heat transfer plate (101) and the heat dissipation plate (102), a screw rod (105) is installed in the third round hole (104), and a screw cap (106) is fixed at one end of the screw rod (105).

7. A circuit arrangement for improving heating as defined in claim 6, wherein: four groups of rubber support rings (107) are arranged on the inner side of the heat transfer plate (101), and the other ends of the screws (105) respectively penetrate through the third round hole (104), the rubber support rings (107), the second round hole (206) and the rubber support rings (107) and are finally connected with the inner side of the rear end of the heat transfer plate (101) in a threaded mode.

8. A circuit arrangement for improving heating as defined in claim 7, wherein: the front side and the rear side on the heat dissipation plate (102) are respectively provided with a heat dissipation groove (103), the gaps of the heat dissipation grooves (103) are triangular gaps, and the heat dissipation grooves (103) cover 14 heating chips.