CN213750993U - Novel heat radiation structure of industrial computer - Google Patents
Novel heat radiation structure of industrial computer Download PDFInfo
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- CN213750993U CN213750993U CN202120047175.3U CN202120047175U CN213750993U CN 213750993 U CN213750993 U CN 213750993U CN 202120047175 U CN202120047175 U CN 202120047175U CN 213750993 U CN213750993 U CN 213750993U
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- fixing plate
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Abstract
The utility model relates to a novel heat dissipation structure of an industrial personal computer; the heating mechanism comprises a top layer fixing plate and a middle layer fixing plate, the top layer fixing plate is provided with a first main board, the middle layer fixing plate is provided with a second main board, a third main board is arranged between the middle layer fixing plate and the base, a top layer heat conduction block is arranged between the first main board and the top cover, a middle layer heat conduction block is arranged between the second main board and the first heat dissipation block, and a bottom layer heat conduction block is arranged between the third main board and the base; the beneficial effects of the utility model embody: the position through changing the heat conduction piece changes traditional plane heat dissipation into perpendicular heat dissipation to on the heat dissipation aluminium pig with heat conduction to the side, increase heat conduction area, improve heat conductivility, and the increase of the quantity of mainboard can not increase the bearing of mainboard, use standard angle aluminium spare reduction in production cost, simplified processing.
Description
Technical Field
The utility model relates to an industrial computer refers in particular to a novel heat radiation structure of the inside thermal industrial computer of can effectively dispel the heat fast.
Background
The mode that the traditional no fan industry control generally adopted heat dissipation aluminium pig and mainboard plane direct contact dispels the heat, if there is the very big CPU of consumption or during polylith mainboard stack installation, the radiating surface of unilateral often can't satisfy the radiating condition of mainboard, burns out easily when the mainboard can't carry out appropriate heat dissipation, influences the use of industrial computer, damages whole equipment even, and it is very inconvenient to use, and the practicality is relatively poor.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model aims at providing an industrial computer refers in particular to a novel heat radiation structure of the inside thermal industrial computer of can effectively dispelling the heat fast.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a novel heat radiation structure of industrial computer, include the shell with set up in mechanism that generates heat in the shell, the shell includes first radiating block, top cap, second radiating block and base, first radiating block with the second radiating block set up respectively in the both sides of mechanism that generates heat, the mechanism that generates heat includes top layer fixed plate and at least one middle level fixed plate, the top layer fixed plate is provided with first mainboard, the middle level fixed plate is provided with the second mainboard, the middle level fixed plate with be provided with the third mainboard between the base, first mainboard with be provided with the top layer heat conduction piece between the top cap, the second mainboard with be provided with the middle level heat conduction piece between the first radiating block, the third mainboard with be provided with the bottom heat conduction piece between the base.
Preferably, the first mounting panel that the inboard of first radiating block was provided with, the inboard of second radiating block is provided with the second mounting panel, the top layer fixed plate with the both sides of middle level fixed plate all through screw difference fixed mounting in first mounting panel with on the second mounting panel.
Preferably, the middle layer heat conduction block is an L-shaped heat conduction angle aluminum, one side of the middle layer heat conduction block is fixedly installed at the bottom of the middle layer fixing plate through a screw, and the other side of the middle layer heat conduction block is fixedly installed on the first installation plate through a screw.
Preferably, the first main board, the second main board and the third main board are all provided with heating chips which emit heat during work.
Preferably, one end of the top heat conduction block abuts against the inner side of the top cover, the other end of the top heat conduction block abuts against the first main board, one end of the bottom heat conduction block abuts against the inner side of the base, and the other end of the bottom heat conduction block abuts against the third main board.
Preferably, a plurality of positioning rods are arranged between the base and the third main board, one end of each positioning rod is fixedly installed on the base, and the other end of each positioning rod is fixedly installed on the third main board, so that the third main board is fixed on the base.
Preferably, the first radiating block, the top cover, the second radiating block and the outer side of the base are all integrally provided with a plurality of radiating fins for radiating heat.
Preferably, the first mounting plate is provided with a positioning groove matched with the middle layer heat-conducting block, and the middle layer heat-conducting block is clamped in the positioning groove so as to position the middle layer heat-conducting block on the first mounting plate.
The beneficial effects of the utility model embody: the utility model aims at providing a novel heat radiation structure of industrial computer, the position through changing the heat conduction piece changes traditional plane heat dissipation into perpendicular heat dissipation to on the heat dissipation aluminium pig with heat conduction to side, increase heat conduction area, improve heat conductivility, and according to the quantity increase heat conduction angle aluminium of the inside mainboard of industrial computer, can not increase the bearing of mainboard, overall structure is simple, uses standard angle aluminium spare reduction in production cost, simplifies the adaptability processing of traditional heat conduction aluminium pig.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the overall internal structure of the present invention.
Fig. 3 is an explosion diagram of the whole structure of the present invention.
Fig. 4 is a front view of the heat dissipation structure of the middle fixing plate of the present invention.
Reference is made to the accompanying drawings in which:
1-a housing; 2-a heating mechanism; 3-a first heat sink; 4-a top cover; 5-a second heat dissipation block; 6-a base; 7-top layer fixing plate; 8-middle layer fixing plate; 9-a first main board; 10-a second main board; 11-a third main board; 12-top layer heat conducting block; 13-middle layer heat-conducting block; 14-bottom layer heat conducting block; 15-a first mounting plate; 16-a second mounting plate; 17-positioning the rod; 18-a heat sink; 19-positioning groove.
Detailed Description
In the following description, any concept relating to the directions or orientations of up, down, left, right, front, and rear is given with respect to the position shown in the drawings being described, and thus should not be construed as particularly limiting the technical solution provided by the present invention.
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings:
as shown in figures 1-3, the novel heat dissipation structure of the industrial personal computer comprises a housing 1 and a heating mechanism 2 arranged in the housing 1, the shell 1 comprises a first radiating block 3, a top cover 4, a second radiating block 5 and a base 6, the first radiating block 3 and the second radiating block 5 are respectively arranged at two sides of the heating mechanism 2, the heating mechanism 2 comprises a top layer fixing plate 7 and at least one middle layer fixing plate 8, the top layer fixing plate 7 is provided with a first main plate 9, the middle fixing plate 8 is provided with a second main plate 10, a third main plate 11 is arranged between the middle fixing plate 8 and the base 6, a top heat-conducting block 12 is arranged between the first main board 9 and the top cover 4, a middle heat-conducting block 13 is arranged between the second main board 10 and the first heat-dissipating block 3, and a bottom heat-conducting block 14 is arranged between the third main board 11 and the base 6.
Preferably, the first mounting plate 15 that the inboard of first radiating block 3 was provided with, the inboard of second radiating block 5 is provided with second mounting plate 16, top layer fixed plate 7 with the both sides of middle level fixed plate 8 all through screw difference fixed mounting in first mounting plate 15 with on the second mounting plate 16.
Preferably, the middle layer heat conduction block 13 is an L-shaped heat conduction angle aluminum, one side of the middle layer heat conduction block 13 is fixedly mounted at the bottom of the middle layer fixing plate 8 through a screw, and the other side of the middle layer heat conduction block is fixedly mounted on the first mounting plate 15 through a screw.
Preferably, the first main board 9, the second main board 10 and the third main board 11 are all provided with heating chips which radiate heat during operation.
Preferably, one end of the top heat conduction block 12 abuts against the inner side of the top cover 4, the other end abuts against the first main board 9, one end of the bottom heat conduction block 14 abuts against the inner side of the base 6, and the other end abuts against the third main board 11.
Preferably, a plurality of positioning rods 17 are arranged between the base 6 and the third main board 11, one end of each of the plurality of positioning rods 17 is fixedly installed on the base 6, and the other end of each of the plurality of positioning rods 17 is fixedly installed on the third main board 11, so that the third main board 11 is fixed on the base 6.
Preferably, a plurality of radiating fins 18 for radiating heat are integrally formed on the outer sides of the first radiating block 3, the top cover 4, the second radiating block 5 and the base 6.
Preferably, the first mounting plate 15 is provided with a positioning groove 19 matched with the middle layer heat-conducting block 13, and the middle layer heat-conducting block 13 is clamped in the positioning groove 19, so as to position the middle layer heat-conducting block 13 on the first mounting plate 15.
The utility model relates to a novel heat radiation structure of industrial computer, as shown in FIG. 4, be provided with the second heat conduction piece on the mainboard second mainboard 10 on the middle level fixed plate 8, this second heat conduction piece is the heat conduction angle aluminium of L type, the second mainboard 10 that the heat conduction angle aluminium passes through the fastening screw at both ends will take the wafer that generates heat is connected with the first radiating block 3 in side, one end screw locking is on middle level fixed plate 8, the other end locking is on the side heat dissipation aluminium piece, ensure that the wafer that generates heat and the mutual laminating of second radiating block 5 on second heat conduction piece and the second mainboard 10 form heat-conduction, the effect of this kind of structure lies in increaseing the area of contact of heat source and heat dissipation source, increase heat conduction area, the contact surface laminating closely and the mainboard need not the bearing.
Further, as shown in fig. 2, a first main board 9 with a heat generating chip and a third main board 11 with a heat generating chip, wherein the first main board 9 guides heat to the top cover 4 through a first heat conducting block, the top cover 4 dissipates heat, the third main board 11 guides heat to the base 6 through a third heat conducting block, and the heat is dissipated by the base 6.
The above, it is only the preferred embodiment of the present invention, not right the technical scope of the present invention makes any restriction, the technical personnel of the industry, under this technical scheme's enlightenment, can do some deformation and modification, all the basis the utility model discloses a technical essence is to any modification, the equivalent change and the modification of the above embodiment do, all still belong to the technical scheme's scope of the present invention.
Claims (8)
1. The utility model provides a novel heat radiation structure of industrial computer which characterized in that: the heating mechanism comprises a shell and a heating mechanism arranged in the shell, wherein the shell comprises a first radiating block, a top cover, a second radiating block and a base, the first radiating block and the second radiating block are respectively arranged on two sides of the heating mechanism, the heating mechanism comprises a top layer fixing plate and at least one middle layer fixing plate, the top layer fixing plate is provided with a first main board, the middle layer fixing plate is provided with a second main board, the middle layer fixing plate and a third main board are arranged between the bases, a top layer heat-conducting block is arranged between the first main board and the top cover, a middle layer heat-conducting block is arranged between the second main board and the first radiating block, and a bottom layer heat-conducting block is arranged between the third main board and the bases.
2. The novel heat dissipation structure of industrial computer of claim 1, characterized in that: the inboard first mounting panel that is provided with of first radiating block, the inboard of second radiating block is provided with the second mounting panel, the top layer fixed plate with the both sides of middle level fixed plate all through screw respectively fixed mounting in first mounting panel with on the second mounting panel.
3. The novel heat dissipation structure of industrial computer of claim 2, characterized in that: the middle-layer heat-conducting block is L-shaped heat-conducting angle aluminum, one side of the middle-layer heat-conducting block is fixedly arranged at the bottom of the middle-layer fixing plate through screws, and the other side of the middle-layer heat-conducting block is fixedly arranged on the first mounting plate through screws.
4. The novel heat dissipation structure of industrial computer of claim 1, characterized in that: the first main board, the second main board and the third main board are all provided with heating chips which emit heat in work.
5. The novel heat dissipation structure of industrial computer of claim 1, characterized in that: one end of the top heat conduction block is abutted against the inner side of the top cover, the other end of the top heat conduction block is abutted against the first main board, one end of the bottom heat conduction block is abutted against the inner side of the base, and the other end of the bottom heat conduction block is abutted against the third main board.
6. The novel heat dissipation structure of industrial computer of claim 1, characterized in that: a plurality of positioning rods are arranged between the base and the third main board, one end of each positioning rod is fixedly arranged on the base, and the other end of each positioning rod is fixedly arranged on the third main board, so that the third main board is fixed on the base.
7. The novel heat dissipation structure of industrial computer of claim 1, characterized in that: the first radiating block, the top cover, the second radiating block and the outer side of the base are all integrally provided with a plurality of radiating fins for radiating heat.
8. The novel heat dissipation structure of industrial computer of claim 2, characterized in that: the first mounting plate is provided with a positioning groove matched with the middle-layer heat-conducting block, and the middle-layer heat-conducting block is clamped in the positioning groove so as to position the middle-layer heat-conducting block on the first mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120047175.3U CN213750993U (en) | 2021-01-08 | 2021-01-08 | Novel heat radiation structure of industrial computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120047175.3U CN213750993U (en) | 2021-01-08 | 2021-01-08 | Novel heat radiation structure of industrial computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213750993U true CN213750993U (en) | 2021-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120047175.3U Active CN213750993U (en) | 2021-01-08 | 2021-01-08 | Novel heat radiation structure of industrial computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213750993U (en) |
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2021
- 2021-01-08 CN CN202120047175.3U patent/CN213750993U/en active Active
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