CN2621342Y - Integrated Cooling Module - Google Patents

Abstract

An integrated heat dissipation module, which is installed on a main heat source of a computer motherboard and a secondary heat source around the main heat source, comprises: a heat sink having a heat-dissipating substrate substantially contacting the main heat source and a plurality of heat-dissipating fins disposed on the upper surface of the heat-dissipating substrate at intervals; the fan cover is made of high-thermal-conductivity materials and provided with a top plate, two side plates, abutting plates extending out of the lower ends of the side plates and a plurality of external radiating fins extending out of the outer surfaces of the side plates, the side plates are enclosed on two sides of the primary heating source, the abutting plates are substantially contacted with the secondary heating source, and a first air port and a second air port are respectively arranged at the front end and the rear end of the fan cover; a heat dissipation fan is arranged at the first air inlet. The utility model discloses can effectively generate heat the produced heat energy discharge in the source and the secondary source that generates heat around and in the computer host computer to improve the radiating effect.

Description

Integrated Cooling Module

【Technical field】

The utility model relates to an integrated heat dissipation module, in particular to a heat dissipation module capable of simultaneously discharging the heat generated by the operation of the main heat source on the main board of the computer and the secondary heat source located around the main heat source, so as to effectively reduce the internal temperature of the computer host. integrated cooling module.

【Background technique】

Generally, high-end computers, such as rack-mounted network servers or various types of dedicated servers, require high integration and high processing speed, so there are many components in the body, and various heating components generate a lot of heat when they are in operation. The temperature of each component inside the host can be maintained within a temperature range that can operate normally, which is also very important for the cooling performance of the host. However, in the high-density component architecture of high-end computers, it is not enough to rely on the cooling fans used in general computers to dissipate heat from the host computer to the outside, which may easily lead to component failures or system crashes. Situation, therefore, at present most of the servers all adopt the cooling device 1 as shown in Fig. The heat dissipation fan 12 on one side is formed, and the inverted U-shaped cover body 11 is positioned on the motherboard 2 to cover the outside of the main heat source 3 that will generate a large amount of heat energy during operation such as the central processing unit or chipset, and the heat dissipation fan 12 is located at the opening (not shown) at the rear end of the inverted U-shaped cover 11, so that cold air is introduced into the inside of the inverted U-shaped cover 11 by the operation of the cooling fan 12, and generates heat energy with the main heat source 3 After the exchange, the air inside the inverted U-shaped cover 11 is cooled and the temperature of the main heat source 3 itself is lowered. Finally, the hot air formed is discharged out of the casing of the server through the opening 111 at the front end of the inverted U-shaped cover 11. The inverted U-shaped cover 11 concentrates the airflow formed by the cooling fan 12 near the main heat source 3 to effectively dissipate the heat energy generated by the main heat source 3 to improve the heat dissipation efficiency of the main heat source 3 . However, this heat dissipation method is only for the main heat source 3 in the host to dissipate heat. However, in addition to the above-mentioned main heat source in the computer, there will be heat generated during operation, and other such as MOSFET voltage regulators, expansion cards inserted in expansion slots, etc. Components also generate heat during operation, and as a secondary heat source, although the heat generated is not as much as the main heat source, if heat dissipation is not performed, the heat will accumulate in the host, which will still cause system failure and cannot be ignored , the heat dissipation efficiency of the above heat dissipation device 1 is limited to some main heat sources, but has no effect on heat dissipation for the surrounding secondary heat sources. It is necessary to assemble other heat dissipation devices, such as fans or cooling fins, etc. The source is used to dissipate heat. In this way, there will be problems such as increased manufacturing cost and large occupied volume.

Nowadays, electronic products are developing toward high integration, high performance, and high power. Therefore, the above-mentioned heat sinks that cannot take into account the heat dissipation of the main heat source and the secondary heat source cannot meet the needs of the current development trend. In order to meet the needs of the development of electronic products, the heat sink should be developed towards a module that can integrate the heat dissipation of the main heat source and the secondary heat source, so that the heat dissipation of the main heat source and the secondary heat source can be performed simultaneously, and the problem of cost and volume occupation can be solved.

【Content of utility model】

Because the computer motherboard not only has the main heat source that generates a large amount of heat energy during operation, but also has other secondary heat sources that generate heat energy during operation but produce less heat energy than the main heat source, so the utility model is aimed at these two types of computers The heat source generated by the heat energy in the main unit is processed at the same time to improve the efficiency of heat dissipation.

The purpose of this utility model is to provide an integrated heat dissipation module that can effectively discharge the heat energy generated by the main heat source in the computer mainframe and its surrounding secondary heat sources, so as to improve the heat dissipation effect and reduce the cost and occupied volume.

In order to achieve the above purpose, the utility model provides an integrated heat dissipation module, which is installed on the main heat source of the computer motherboard and the secondary heat source located around the main heat source, and is characterized in that it includes:

A heat dissipation device, the heat dissipation device has a heat dissipation substrate substantially in contact with the main heat source, and a plurality of heat dissipation fins arranged at intervals on the upper surface of the heat dissipation substrate;

A windshield made of high thermal conductivity material, the windshield has a top plate sealed above the main heat source, two side plates extending downward from opposite sides of the top plate, and from the lower ends of the side plates The abutment plates extending respectively, and a plurality of external heat dissipation fins extending outward from the outer surfaces of the side plates, the side plates surround the two sides of the main heat source, and the abutment plates and The heat source is substantially in contact, and the front and rear ends of the windshield are respectively provided with a first air port and a second air port;

A cooling fan, the cooling fan is arranged at the first air outlet.

The integrated heat dissipation module is characterized in that: the wind shield also has a plurality of internal heat dissipation fins extending from the inner surface of the top plate to the inside of the wind shield at intervals, and the internal heat dissipation fins and the heat dissipation device The cooling fins are in a staggered state.

The integrated heat dissipation module is characterized in that: the top plate of the windshield is attached to the casing.

The integrated heat dissipation module is characterized in that: the windshield can be made of copper or aluminum.

The integrated cooling module is characterized in that the cooling fan can be an axial flow fan.

The integrated heat dissipation module of the utility model comprises a heat dissipation device substantially in contact with the main heat source on the computer motherboard, a wind cover made of high thermal conductivity material and having two air ports, and a wind port arranged on the wind cover A cooling fan that forms airflow inside the windshield.

The heat energy generated by the operation of the main heat source is absorbed and conducted by the cooling device, and then dissipated into the air in the wind hood, and the heat energy is exchanged with the airflow formed by the heat dissipation fan in the wind hood, and then discharged from the other air port of the wind hood to dissipate the main heat. The heat energy generated by the heat source is dissipated to the outside of the computer host. More importantly, the above-mentioned wind cover has two abutment plates that are in substantial contact with the secondary heat sources around the main heat source, and extend outward from the outer surface of the wind cover. Multiple external heat dissipation fins to increase the heat dissipation area of the windshield. The heat energy generated by the operation of the secondary heat source is absorbed by the abutting fins and then transferred to the external heat dissipation fins, so that the heat energy generated by the secondary heat source can be dissipated. Reduce the temperature of the secondary heat source, so the heat dissipation module of the utility model can not only discharge the heat energy of the main heat source, but also dissipate the heat energy of the secondary heat source, effectively reducing the temperature in the computer mainframe, so as to balance cost and heat dissipation Under the volume occupied by the module, a good heat dissipation effect is achieved.

【Description of drawings】

The integrated heat dissipation module of the present utility model will be described in detail below through the best embodiment and accompanying drawings. In the accompanying drawings:

FIG. 1 is a perspective view of a general cooling device, and shows how the cooling device is installed in a host of a server.

FIG. 2 is a perspective view of a preferred embodiment of the integrated cooling module of the present invention, showing the state of being installed inside a computer host.

【Detailed ways】

The computer mentioned in the preferred embodiments below refers to devices with computing and processing functions such as servers and personal computers. The main heat source with a large amount of heat energy is surrounded by other components, such as MOSFET voltage regulators, expansion cards inserted in expansion slots, etc., which will generate less heat during operation , in the following preferred embodiments, these components are represented by secondary heat sources, and the structure of the integrated heat dissipation module of the present invention, the position installed in the host computer, and how to control the above-mentioned primary and secondary heat sources The generated heat energy is dissipated, which will be described in detail below.

As shown in Figure 2, the integrated heat dissipation module 5 of the present invention includes a heat dissipation device 51 attached to the main heat source 4, a heat dissipation device 51 that is in substantial contact with the secondary heat source 6 and is surrounded by the heat dissipation device 51 and the main heat source 4. Windshield 52, and a cooling fan 53 engaged with windshield 52.

First, the material and structure of the windshield 52 are introduced. The windshield 52 is made of high thermal conductivity materials such as aluminum or copper as a whole, so it has high thermal conductivity. The wind cover 52 has a top plate 521 that is blocked above the main heat source 4 and attached to the lower surface of the computer case 7, and two sides that extend downwards from the opposite sides of the top plate 521 and surround the two sides of the main heat source 4. Side plates 522, a plurality of external cooling fins 523 extending outward from the outer surface of each side plate 522, two abutment plates extending outward from the lower end of each side plate 522 to the secondary heat source 6 on both sides of the main heat source 4 524, the computer casing 7 is made of metal material, and the upper surface of the top plate 521 of the above-mentioned air cover 52 and the lower surface of the abutting plate 524 are thermally conductive patches made of a thermally conductive material (Thermal Interface Material; TIM) ( Not shown in the figure), are respectively bonded with the computer case 7 and the secondary heat source 6. Since the heat conduction patch is quite thin, between the top plate 521 of the wind cover 52 and the computer case 7 and between the abutment plate 524 and the secondary heat source 6 They are all considered to be in substantial contact, almost in direct contact, and these heat-conducting patches are good heat conductors, and the wind cover 52 can quickly conduct heat to the computer casing 7, and the heat generated by the operation of the secondary heat source 6 The heat can also be quickly transferred to the abutment plate 524. Therefore, when the secondary heat source 6 operates to generate heat energy, the abutment plate 524 conducts the heat energy from the secondary heat source 6 quickly, and part of the heat energy generated by the secondary heat source 6 is quickly dissipated by the external heat dissipation fins 523 on the wind cover 52. The space outside the air cover 52 is naturally dissipated by the system, and at the same time through the conduction of the side plate 522 and the top plate 521 of the air cover 52, the heat energy generated by the secondary heat source 6 can be dissipated to the outside of the computer case 7 by the conduction of the computer case 7 , reduce the temperature of the secondary heat source 6 .

Furthermore, the windshield 52 further has a plurality of internal cooling fins 525 extending from the inner surface of the top plate 521 to the inner space of the windshield 52 at intervals, and their functions will be described in detail later. The front and rear ends of the air cover 52 respectively define a second air port 526 and a first air port 527 to connect the inner and outer spaces of the air cover 52 . The heat dissipation fan 53 is locked on the top plate 521 and the two side plates 522 of the windshield 52 by screws (not shown), and is blocked at the first air port 527, and the heat dissipation fan 53 is an axial flow fan. At the same time, the first tuyere 527 is blown to the second tuyere 526, so that the cold air outside the windshield 52 is introduced into the inside of the windshield 52, and then blown out by the second tuyere 526. Due to the shielding of the windshield 52, the cooling fan can A large amount of air-flows formed by 53 operations are concentrated in the air cover 52, and its effect will be described later.

Of course, the above-mentioned way of fixing the heat dissipation fan 53 on the windshield 52 is not limited to the way of locking, and other ways such as riveting and bonding can also be used.

The heat dissipation device 51 is arranged in the internal space 528 defined by the top plate 521 and the two side plates 522 of the windshield 52. The heat dissipation device 51 has a heat dissipation substrate 511 and a plurality of heat dissipation fins arranged at intervals on the upper surface of the heat dissipation substrate 511. 512 , and each internal heat dissipation fin 525 of the windshield 52 is alternately located between two adjacent heat dissipation fins 512 of the heat dissipation device 51 . The lower surface of the heat dissipation substrate 511 is also bonded to the main heat source 4 by the above-mentioned heat conduction patch, so that the heat dissipation substrate 511 is almost in direct contact with the main heat source 4, and the heat generated by the main heat source 4 can be quickly The ground is transmitted to the heat dissipation substrate 511 and then to the heat dissipation fins 512 . In addition, part of the heat energy generated by the secondary heat source 6 can also be transferred to each internal heat dissipation fin 525 through the conduction of the side plate 522 and the top plate 521 of the windshield 52. Therefore, the main heat source 4 is transmitted to the heat dissipation fin 512 The heat energy on the upper surface and the heat energy transmitted from the secondary heat source 6 to the internal heat dissipation fins 525 are all exchanged with the air in the wind cover 52, and at the same time, the heat dissipation is forced by the heat dissipation fan 53. By the operation of the heat dissipation fan 53, a large amount of airflow blows In the air inlet hood 52, all cooling fins 512, 525 in the air hood 52 are accelerated to carry out heat exchange with the air in the air hood 52, so that the heat energy of the main heat source 4 and the secondary heat source 6 is dissipated in the wind hood 52 In the air, the air in the windshield 52 is made into hot air, and along the airflow direction formed by the cooling fan 53, the hot air is blown to the second tuyere 526 to be discharged, so as to simultaneously heat the main heat source 4 and the secondary heat source 6 By dissipating heat, the primary and secondary heat sources 4 and 6 can be maintained within an appropriate operating temperature range and operate normally.

It can be seen from the above that the integrated heat dissipation module 5 of the present invention is arranged on the computer motherboard 8, the heat conduction effect of the heat dissipation device 51 and the heat dissipation fan 53 can be used to form a large amount of airflow in the wind cover 52, and the main heat source 4 can be operated. The generated heat energy is continuously exported and discharged quickly, so that the main heat source 4 can be kept running at normal operating temperature, and at the same time, the wind cover 52 of high thermal conductivity material is in contact with the secondary heat source 6 around the main heat source 4, and the wind The top surface 521 of the cover 52 is attached to the computer case 7, so that the heat energy generated by the operation of the secondary heat source 6 can be conducted to the external heat dissipation fins 523 of the wind cover 52, and the heat can be naturally dissipated by the system, and can also be conducted to the wind cover 52 at the same time. The internal heat dissipation fins 525 of the heat dissipation fan 53 are forced to dissipate heat, and can be conducted to the computer casing 7 by the wind cover 52, and then radiate out of the computer casing 7, so that the heat energy generated by the operation of the secondary heat source 6 can be dissipated rapidly, so , the utility model can continuously dissipate heat on the main heat source 4 and the secondary heat source 6 at the same time, maintain the main and secondary heat sources 4 and 6 in a normal operating temperature range, and do not need to additionally set the secondary heat source 6 for heat dissipation Therefore, the purpose of effectively improving the heat dissipation effect and reducing the temperature in the computer mainframe can be achieved while saving the cost and occupying the internal space of the computer mainframe.

Claims (6)

1. integrated radiating module, it is mounted in the main pyrotoxin of computer main frame panel and is positioned on the inferior pyrotoxin around this main pyrotoxin, it is characterized in that: comprise:

One heat abstractor, this heat abstractor have a heat-radiating substrate that contacts with this main pyrotoxin essence, and most the radiating fins that are arranged at intervals at this heat-radiating substrate upper surface;

One fan housing of making by high thermal conducting material, this fan housing has top board, two the opposite two sides difference downward extended side plates by this top board of a block in this main pyrotoxin top, from the extended butt plate of this each side plate lower end difference, and most external heat fins that extend outward by the outer surface of this each side plate, this each side plate is that enclosing is in these main pyrotoxin two sides, and this each butt plate contacts with this time pyrotoxin essence, and the forward and backward two ends of this fan housing are established one first air port and one second air port respectively;

One radiator fan, this radiator fan are to be arranged at this place, first air port.

2. integrated radiating module as claimed in claim 1, it is characterized in that: this fan housing also is provided with most by this top board inner surface extended inner heat fins in interval in this fan housing, and this each radiating fin of this each inner heat fins and this heat abstractor is staggered state.

3. integrated radiating module as claimed in claim 1 or 2 is characterized in that: the top board of this fan housing is to be attached on this casing.

4. integrated radiating module as claimed in claim 1 is characterized in that: the material of this fan housing is a copper.

5. integrated radiating module as claimed in claim 1 is characterized in that: the material of this fan housing is an aluminium.

6. integrated radiating module as claimed in claim 1 is characterized in that: this radiator fan is a tube-axial fan.