CN202472503U - Computer host - Google Patents

Computer host Download PDF

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Publication number
CN202472503U
CN202472503U CN2012200654543U CN201220065454U CN202472503U CN 202472503 U CN202472503 U CN 202472503U CN 2012200654543 U CN2012200654543 U CN 2012200654543U CN 201220065454 U CN201220065454 U CN 201220065454U CN 202472503 U CN202472503 U CN 202472503U
Authority
CN
China
Prior art keywords
cabinet
cover
case
heat
mainboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012200654543U
Other languages
Chinese (zh)
Inventor
熊艳平
熊艳斌
Original Assignee
熊艳平
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 熊艳平 filed Critical 熊艳平
Priority to CN2012200654543U priority Critical patent/CN202472503U/en
Application granted granted Critical
Publication of CN202472503U publication Critical patent/CN202472503U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model relates to a computer host which comprises a case, a mainboard and a power supply. The mainboard and the power supply are arranged in the case, and the mainboard comprises a central processing unit (CPU) and an auxiliary high-heating element. The computer host is characterized by further comprising a high heat conductor, the case is made of a high heat-conducting material and comprises a case top cover and a case rear casing, a power interference and an external equipment interference are arranged on the case rear cover, and the case top cover and the case rear casing are seamlessly connected to form a closed box body. The high heat conductor is made of the same material of the case, the power supply is fixedly arranged on a bottom face in the case rear casing and supplies power to parts inside the host. And the CPU and the auxiliary high-heating element on the mainboard are in contact with the lateral wall of the case rear casing through the high heat conductor. The computer host utilizes the high heat-conducting case to dissipate heat, achieves the case without a fan, is strong in heat dissipation function, achieves relative seal of the case, reduces dust entering, and is convenient to maintain.

Description

A kind of main frame
Technical field
The utility model relates to a kind of main frame, belongs to the computer hardware field.
Background technology
Along with electronic technology is maked rapid progress, more and more accurate across the assembling of electronic installations such as computing machine, server, also increasingly high for the requirement of design, manufacturing and the assembling of hardware; For adapting to people's each side demand, main frame is more and more littler, has caused the bad problem of dispelling the heat when simultaneously; Present main frame mainly dispels the heat by fan; For the bad solution of heat radiation, also mainly be that the parts in the main frame are concentrated, make the interior air of cabinet be able to circulation; But only depend on fan for cooling, main frame is still of common occurrence because of the too high phenomenon that crashes of inner part temperature.
Because falling in fan, heat need keep circulation simultaneously with outside air; The main frame inner part equals to be exposed in the air, uses a large amount of dusts to get in the mainframe box for a long time, a lot of faults can occur; Directly influence is used; Make main frame need periodic cleaning, could guarantee the normal use of computing machine, cause a lot of unnecessary troubles to the user.
The utility model content
The utility model is bad to active computer main frame heat sinking function, and advances the deficiency of dust easily, and a kind of main frame that does not adopt the good heat dissipation effect of fan heat radiation is provided.
The technical scheme that the utility model solves the problems of the technologies described above is following: a kind of main frame; Comprise cabinet, mainboard, power supply, other accessories and high heat conductive body; Said mainboard, power supply and other accessories are located in the cabinet; Said mainboard comprises CPU and auxiliary pyrogen part occurred frequently, and said cabinet adopts highly heat-conductive material to process, and said cabinet comprises cabinet top cover and cabinet back cover; Said cabinet back cover is provided with power interface and interfaces for external devices; Said interfaces for external devices comprises mouse interface, keyboard interface, network interface and USB interface etc., said cabinet top cover and cabinet back cover seamless combination, and said cabinet top cover and cabinet back cover seamless combination also constitute the casing of a sealing;
Said high heat conductive body adopts with the cabinet same material and processes;
Said power supply is fixed on the bottom surface in the cabinet back cover, and is each parts power supply in the main frame;
CPU on the said mainboard contacts through the sidewall of said high heat conductive body with the cabinet back cover with auxiliary pyrogen part occurred frequently.
The cabinet top cover does not have screw with the cabinet back cover and engages; Inner high heater element of mainboard such as CPU pass to the cabinet surface to heat with the high element of other heating through highly heat-conductive material and carry out passive heat radiation; Adopt no fan ac power panel in the cabinet; Inside has no fan, and the cabinet outside does not have louvre, and the high original paper of main frame internal heat generation utilizes the main case heat radiation; Cabinet has no screw and rivet except that the data interface; Cabinet is outside to adopt pure flat aluminium sheet but not zig-zag fins, and cabinet inside adopts built formula structure, adopts main flow and the non-low-power consumption of high-end mainboard not to have fan in the main frame and integrates mainboard.
The beneficial effect of the utility model is: the described main frame of the utility model, adopt high heat conduction case radiation, and realized no fan cabinet, and heat sinking function is powerful; Cabinet has been realized relative sealing, has significantly reduced the entering of dust, makes host maintenance convenient.
On the basis of technique scheme, the utility model can also be done following improvement.
Further, the side that said cabinet back cover is connected with the cabinet top cover is provided with draw-in groove, and said cabinet top cover is provided with and the corresponding convexity of draw-in groove, and said cabinet back cover and cabinet top cover are through draw-in groove and the protruding seamless combination that realizes.
Adopt the beneficial effect of above-mentioned further scheme to be, realized the relative closure of cabinet, and do not have scattered parts such as screw, be convenient to more install.
Further, the sidewall thickness of said cabinet top cover and cabinet back cover is 3 to 6 millimeters.
Adopt the beneficial effect of above-mentioned further scheme to be, because cabinet adopts highly heat-conductive material to process, so the thickness of cabinet is big more, radiating effect is good more.
Further, said highly heat-conductive material adopts aluminium or copper, perhaps other high heat conductive metal materials.
The utility model is specious, performance main flow or integration platform high-end but not low performance, and main frame all can be with telepilot Convenient switch machine and operations; Do not have fan in the cabinet, totally enclosed type has no louvre, realizes quiet and dustproof effect fully; Cabinet inside such as CPU pass through heat conductor such as copper with the high original paper of other thermal value; Aluminium, ultra-soft heat conduction silica gel, soft heat conductive silica gel etc. pass to the cabinet surface to heat and carry out passive heat radiation; Or the dress heat radiator carries out heat radiation in the case in the cabinet; Suitable volume productions such as cabinet surface removes that other place has no screw or rivet the necessary screw of data interface, and cabinet is outside to use pure flat aluminium alloy and some surface treatments, and casing structure advanced person and good looking appearance cost are low.The utility model can be done and can do for a short time greatly, can adorn the mainboard top on the market and the mainboard of main flow, only can accomplish bigger little by little and basic hardware is the same does not lack than mainboard; And thermal diffusivity is good; Htpc no longer is the representative of low performance, can accomplish to have only 8k book paper little by little big, and performance but is a main flow; And basic hardware is the same scarce, and the inner built formula structure that adopts can effectively be utilized the space and not influence heat radiation.
Description of drawings
Fig. 1 is the said main frame cut-away view of the utility model;
Fig. 2 is the said computer mainframe box front view of the utility model.
Embodiment
Below in conjunction with accompanying drawing the principle and the characteristic of the utility model are described, institute gives an actual example and only is used to explain the utility model, is not the scope that is used to limit the utility model.
As shown in Figure 1; The utility model specific embodiment 1 described a kind of main frame; Comprise cabinet 1, mainboard 3, power supply 2, high heat conductive body 4 and a plurality of assembly (not shown), said mainboard 3, power supply 2, high heat conductive body 4 and a plurality of assembly are located in the cabinet 1;
Said cabinet 1 adopts highly heat-conductive material aluminium to process with high heat conductive body 4; Said cabinet 1 comprises cabinet top cover 12 and cabinet back cover 11; Said cabinet back cover 11 1 sides are provided with power interface and other equipment interfaces 13, said cabinet top cover 12 and cabinet back cover 11 seamless combination;
Said power supply 2 is fixed on the bottom surface in the cabinet back cover 11, and is each parts power supply in the main frame;
Said mainboard 3 comprises CPU 31 and pyrogen part (not shown) occurred frequently, and said CPU 31 and pyrogen part occurred frequently are connected with sidewall near the cabinet back cover 11 of mainboard 3 through high heat conductive body 4.
As shown in Figure 2, said cabinet back cover 11 open sides are provided with draw-in groove 111, and said cabinet top cover 12 is provided with draw-in groove corresponding protruding 121, and said cabinet back cover 11 is realized seamless combination through draw-in groove 111 with protruding 121 with cabinet top cover 12.
The sidewall thickness of said cabinet top cover 12 and cabinet back cover 11 far is 4 millimeters.
The above is merely the preferred embodiment of the utility model, and is in order to restriction the utility model, not all within the spirit and principle of the utility model, any modification of being done, is equal to replacement, improvement etc., all should be included within the protection domain of the utility model.

Claims (4)

1. a main frame comprises cabinet, mainboard and power supply, and said mainboard and power supply are located in the cabinet; Said mainboard comprises CPU and auxiliary pyrogen part occurred frequently, it is characterized in that, also comprises high heat conductive body; Said cabinet adopts highly heat-conductive material to process; Said cabinet comprises cabinet top cover and cabinet back cover, and said cabinet back cover is provided with power interface and interfaces for external devices, and said cabinet top cover and cabinet back cover seamless combination also constitute the casing of a sealing;
Said high heat conductive body adopts with the cabinet same material and processes;
Said power supply is fixed on the bottom surface in the cabinet back cover, and is each parts power supply in the main frame;
CPU on the said mainboard contacts through the sidewall of said high heat conductive body with the cabinet back cover with auxiliary pyrogen part occurred frequently.
2. main frame according to claim 1; It is characterized in that; The side that said cabinet back cover is connected with the cabinet top cover is provided with draw-in groove, and said cabinet top cover is provided with and the corresponding convexity of draw-in groove, and said cabinet back cover and cabinet top cover are through draw-in groove and the protruding seamless combination that realizes.
3. main frame according to claim 2 is characterized in that, the sidewall thickness of said cabinet top cover and cabinet back cover is 3 to 6 millimeters.
4. according to each described main frame of claim 1 to 3, it is characterized in that said highly heat-conductive material adopts aluminium or copper.
CN2012200654543U 2012-02-27 2012-02-27 Computer host Expired - Fee Related CN202472503U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200654543U CN202472503U (en) 2012-02-27 2012-02-27 Computer host

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200654543U CN202472503U (en) 2012-02-27 2012-02-27 Computer host

Publications (1)

Publication Number Publication Date
CN202472503U true CN202472503U (en) 2012-10-03

Family

ID=46920647

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012200654543U Expired - Fee Related CN202472503U (en) 2012-02-27 2012-02-27 Computer host

Country Status (1)

Country Link
CN (1) CN202472503U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107515650A (en) * 2017-10-25 2017-12-26 四川云玦科技有限公司 A kind of easy-to-mount computer mainframe box body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107515650A (en) * 2017-10-25 2017-12-26 四川云玦科技有限公司 A kind of easy-to-mount computer mainframe box body

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121003

Termination date: 20130227