CN207116002U - Heat abstractor and mainboard - Google Patents
Heat abstractor and mainboard Download PDFInfo
- Publication number
- CN207116002U CN207116002U CN201721127153.8U CN201721127153U CN207116002U CN 207116002 U CN207116002 U CN 207116002U CN 201721127153 U CN201721127153 U CN 201721127153U CN 207116002 U CN207116002 U CN 207116002U
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- CN
- China
- Prior art keywords
- heat
- mainboard
- radiator body
- heat abstractor
- heat radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of heat abstractor and mainboard.The heat abstractor includes：Heat radiator body and heat-conducting pad, the underrun heat-conducting pad of the heat radiator body are contacted with the euthermic chip on the mainboard, and front is bonded with cabinet inwall, and the heat of the euthermic chip is conducted to the cabinet surface.The utility model can increase area of dissipation, improve the radiating efficiency of mainboard.
Description
Technical field
It the utility model is related to heat abstractor technical field, more particularly to a kind of heat abstractor and master for mainboard radiating
Plate.
Background technology
With the progress of society, increasing electronic equipment enters the life of people, and people set to electronics
While standby functional requirement is increasing, higher requirement also is proposed to the performance of electronic equipment.
At work, the CPU on its mainboard can produce many heats to electronic equipment, if now heat can not shed in time
Go, the normal work of mainboard can be influenceed, therefore corresponding heat abstractor is provided with mainboard, for reducing CPU temperature.
In general heat abstractor is radiated using fan to CPU, and this radiating mode area of dissipation is small, radiating efficiency
It is low.
Utility model content
In view of this, the utility model provides a kind of heat abstractor and mainboard, by increasing capacitance it is possible to increase area of dissipation, improves mainboard
Radiating efficiency.
In a first aspect, the utility model provides a kind of heat abstractor, it is arranged on mainboard, including：Heat radiator body and heat conduction
Pad；The underrun heat-conducting pad of the heat radiator body contacts with the euthermic chip on the mainboard, front and cabinet inwall
Fitting, the heat of the euthermic chip is conducted to the cabinet surface.
Alternatively, the bottom surface of the heat radiator body and the position of the euthermic chip face are provided with contact block, the contact
Post the heat-conducting pad in block surface.
Alternatively, the bottom surface of the heat radiator body is provided with the fixed part with blind hole, for the heat radiator body to be fixed
Onto the mainboard.
Alternatively, the bottom surface of the heat radiator body sets protuberance in edge, for that will carry the heat radiator body
Mainboard be fixed to cabinet on.
Alternatively, the protuberance is provided with fixed perforation.
Alternatively, the front of the heat radiator body opens up fluted, forms multiple radiating fins.
Alternatively, the edge of the heat radiator body is concordant with the edge of the mainboard and leaves for through wire
Breach.
Alternatively, the specification of the heat radiator body is 200mmX180mm.
Second aspect, the utility model provide a kind of mainboard, and the mainboard includes above-mentioned heat abstractor.
Optionally, the mainboard is fixed on cabinet by the protuberance of the heat abstractor.
Heat abstractor and mainboard provided by the utility model, the heat abstractor is arranged on mainboard, including heat radiator body
And heat-conducting pad, the underrun heat-conducting pad of the heat radiator body contact with the euthermic chip on the mainboard, front and machine
Chamber interior wall is bonded, and the heat of the euthermic chip is conducted to the cabinet surface.Pass through this heat abstractor, euthermic chip production
Raw heat can quickly be delivered to cabinet surface, and so as to reduce the temperature of euthermic chip, compared with prior art, this practicality is new
Type adds area of dissipation, it is possible to increase radiating efficiency, improves radiating effect, meets that the work of mainboard in high temperature environments will
Ask.Further, the utility model eliminates fan, and structure is simpler, it is easier to designs.
Brief description of the drawings
Fig. 1 is the bottom view of the heat abstractor of the embodiment of the utility model one；
Fig. 2 is the front view of the heat abstractor of the embodiment of the utility model one；
Fig. 3 is the actual installation design sketch of the mainboard of the embodiment of the utility model one.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that is retouched
The embodiment stated is only the utility model part of the embodiment, rather than whole embodiments.Based in the utility model
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of the utility model protection.
The utility model embodiment provides a kind of heat abstractor, is radiated for mainboard, reference picture 3, the heat abstractor bag
Include：Heat radiator body 10 and heat-conducting pad 11 and 12, heat radiator body 10 is fixed on mainboard 40, is made, led of 2A12 aluminium materials
Hot 205W/M DEG C of coefficient, the underrun heat-conducting pad 11 and 12 of heat radiator body 10 respectively with the euthermic chip on mainboard 40
31st, 32 contact, heat-conducting pad 11 are brought into close contact with euthermic chip 31, and heat-conducting pad 12 is brought into close contact with euthermic chip 32, heat conduction
Pad 11 and 12 is made of silicone grease material,
4.5W/M DEG C of thermal conductivity factor, while there is good elasticity, the front of heat radiator body 10 is bonded with cabinet inwall,
Most heat caused by euthermic chip 32 and 32 is conducted to cabinet surface at last.
As can be seen that whole heat conduction path is：Heat passes through heat-conducting pad 11 and 12 caused by euthermic chip 31 and 32
Conduction is conducted to cabinet surface to heat radiator body 10, then by heat radiator body 10, is entered eventually through the convection action of outside air
Row radiating.
As shown in figure 1, the bottom surface of heat radiator body 10 and the position of the euthermic chip face on mainboard 40 are provided with contact block,
Two contact blocks are provided with due to there are two euthermic chips 31 and 32 to need to radiate on mainboard 40, therefore in 10 bottom surface correspondence positions
101 and 102, and heat-conducting pad 11 is posted on the surface of contact block 101, heat-conducting pad 12 is posted on the surface of contact block 102, it is actual
During work, heat-conducting pad 11 is brought into close contact with euthermic chip 31, and heat-conducting pad 12 is brought into close contact with euthermic chip 32, by heat generating core
The heat of piece is transmitted in heat radiator body 10.
In order to ensure that heat radiator body 10 is fixed firmly on mainboard 40, band blind hole is provided with the bottom surface of heat radiator body 10
Fixed part 104, only have chosen three fixed parts in Fig. 1 and be labeled, each fixed part and the fixing hole position pair on mainboard 40
Should, heat radiator body 10 is fixed on mainboard 40 from the underrun screw of mainboard 40.
Further, the mainboard 40 for being provided with heat radiator body 10 is fixed on cabinet, in the bottom surface of heat radiator body 10
Edge is provided with protuberance 109, and offers sunk type on protuberance 109 and fix perforation 107, can pass through from front
The mainboard 40 for being provided with heat radiator body 10 is fixed to cabinet inside by screw, in screw connection added with insulation spacer.Then, cover
Upper case lid, the front of heat radiator body 10 is bonded with the inwall of chassis lid, the heat of euthermic chip on mainboard 40 is conducted
To the cabinet surface.
Due to the presence of contact block 101 and 102, they and protuberance 109 can form a cavity 103, be easy to mainboard 40
The heat of other upper devices outwards transmits.
As shown in Fig. 2 being further opened with groove 105 in the front of heat radiator body 10, multiple radiating fins 106 can be formed,
So as to increase area of dissipation, the specification of radiating fin 106 is 5mm X 10mm in the present embodiment.
Further, on the basis of the size of mainboard 40 is considered, with reference to the face of mainboard structure, as far as possible increase heat radiator body 10
Product, enables heat radiator body 10 to cover whole mainboard 40, and the edge of heat radiator body 10 is concordant with the edge of the mainboard 40,
And in the top position leaving certain gaps uncovered by the economic plan 108 positioned at the connector of mainboard 40, to facilitate mainboard wiring.Heat radiator body 10 in the present embodiment
Dimensions be 200mmX180mm.
The heat abstractor provided by the utility model embodiment, heat caused by euthermic chip first pass through heat-conducting pad biography
Heat radiator body is led, then cabinet surface is transmitted to by heat radiator body, heat exchange is carried out by cabinet and outside air, most heat at last
Distribute, whole thermally conductive pathways thermal resistance is small, and area of dissipation is big, compared with prior art, it is possible to increase radiating efficiency, improve and dissipate
Thermal effect, meet the job requirement of mainboard in high temperature environments.Further, the utility model eliminates fan, and structure is simpler
It is single, it is easier to design.
The utility model embodiment also provides a kind of mainboard, and the mainboard includes above-mentioned heat abstractor, first will by screw
Heat abstractor is fixed on mainboard, then the fixed perforation on the protuberance for passing through heat abstractor will be provided with the mainboard of heat abstractor
Fixed on cabinet, chassis lid is covered afterwards, heat abstractor is bonded with the inwall of chassis lid, by euthermic chip on mainboard
Heat is conducted to the cabinet surface.The mainboard good heat dissipation effect, meet the job requirement of mainboard in high temperature environments.
It is described above, only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art is in the technical scope that the utility model discloses, the change that can readily occur in
Change or replace, should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be with power
The protection domain that profit requires is defined.
Claims (10)
1. a kind of heat abstractor, is arranged on mainboard, it is characterised in that including：Heat radiator body and heat-conducting pad；The radiating is originally
The underrun heat-conducting pad of body is contacted with the euthermic chip on the mainboard, and front is bonded with cabinet inwall, by the hair
The heat of hot chip is conducted to the cabinet surface.
2. heat abstractor according to claim 1, it is characterised in that the bottom surface of the heat radiator body and the euthermic chip
The position of face is provided with contact block, and the heat-conducting pad is posted on the contact block surface.
3. heat abstractor according to claim 1 or 2, it is characterised in that the bottom surface of the heat radiator body is provided with blind
The fixed part in hole, for the heat radiator body to be fixed into the mainboard.
4. heat abstractor according to claim 3, it is characterised in that the bottom surface of the heat radiator body is set in edge
Have the protuberance mainboard with the heat radiator body being fixed on cabinet.
5. heat abstractor according to claim 4, it is characterised in that the protuberance is provided with fixed perforation.
6. heat abstractor according to claim 1 or 2, it is characterised in that the front of the heat radiator body open up it is fluted,
Form multiple radiating fins.
7. heat abstractor according to claim 1 or 2, it is characterised in that the edge of the heat radiator body with it is described
The edge of mainboard is concordant and leaves for the breach through wire.
8. heat abstractor according to claim 7, it is characterised in that the specification of the heat radiator body is 200mmX180mm.
9. a kind of mainboard, it is characterised in that including the heat abstractor described in any one in the claims 1-8.
10. mainboard according to claim 9, it is characterised in that the mainboard is consolidated by the protuberance of the heat abstractor
Determine onto cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721127153.8U CN207116002U (en) | 2017-09-04 | 2017-09-04 | Heat abstractor and mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721127153.8U CN207116002U (en) | 2017-09-04 | 2017-09-04 | Heat abstractor and mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207116002U true CN207116002U (en) | 2018-03-16 |
Family
ID=61574636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721127153.8U Active CN207116002U (en) | 2017-09-04 | 2017-09-04 | Heat abstractor and mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207116002U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111079370A (en) * | 2019-12-18 | 2020-04-28 | 林换堂 | Secondary development and revision method for mainboard based on thermal management |
-
2017
- 2017-09-04 CN CN201721127153.8U patent/CN207116002U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111079370A (en) * | 2019-12-18 | 2020-04-28 | 林换堂 | Secondary development and revision method for mainboard based on thermal management |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Patentee after: Loongson Zhongke Technology Co.,Ltd. Address before: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Patentee before: LOONGSON TECHNOLOGY Corp.,Ltd. |