CN100391324C - Heat elimination mechanism of electronic equipment - Google Patents
Heat elimination mechanism of electronic equipment Download PDFInfo
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- CN100391324C CN100391324C CNB2004101019779A CN200410101977A CN100391324C CN 100391324 C CN100391324 C CN 100391324C CN B2004101019779 A CNB2004101019779 A CN B2004101019779A CN 200410101977 A CN200410101977 A CN 200410101977A CN 100391324 C CN100391324 C CN 100391324C
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- metal plate
- cooling mechanism
- conductive metal
- thermal conductive
- heat
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Abstract
The present invention discloses a heat elimination mechanism of an electronic device. One end of a heat conducting metal sheet is connected with a heating element in the electronic device, and the other end is attached to a heat elimination opening region of a casing body. Thus, the heat quantity generated by the heating element is effectively conducted to the surface of the casing body and dissipated outward by a heat elimination opening. The heat elimination mechanism is also suitable for small and portable electronic devices. The present invention can effectively solve the problem that the small electronic devices have difficult heat elimination.
Description
Technical field
The present invention is relevant for a kind of cooling mechanism, particularly a kind of cooling mechanism that utilizes thermal conductive metal plate thermal energy conduction to be done heat exchange to electronic installation.
Background technology
Some electronic installation elements, as the CPU in the computer, north bridge chips etc., in transmission or processing signal of telecommunication process, can produce a large amount of heats because of the impedance consumed power, if these heat ground not yet in effect dissipations are gone out, can influence usefulness, loss useful life of electronic installation, can damage what is more and can't use.Therefore if an electronic installation has the above-mentioned element that can produce a large amount of heat energy, when design, must consider its heat dissipation problem to guarantee the device operational effectiveness, the life-span of extension fixture.Have many heat dissipating methods to be applied in various different field, the device at present, with the restriction of device objective condition, the different heat dissipating method of can arranging in pairs or groups during design is to reach the heat radiation purpose according to demand.
Be generally the protection electronic installation, protect the user or be purpose attractive in appearance, often its electronic component is placed in the housing, as computer, TV, walkman ... etc., majority element all is coated in the plastic shell.Yet so, the heat that produces of electronic component is hoarded in housing and the injury electronic installation easily.The common heat dissipating method of electronic installation (as computer) with this class formation is, one heat abstractor is set on the electronic installation heater element, as fan, radiating fin etc., allow heat energy transfer in the air of housing by heater element earlier, on housing, offer several heat radiation perforates again, allow heat dissipate to the housing outside through the thermal convection mode.And, also can increase by a fan in order to increase thermal convection efficient, allow fan produce forced convertion to quicken the eliminating of heat energy in the housing.
Radiating fin, heat radiation perforate, fan etc. are all a kind of heat dissipating method, are to be used according to different demands.The heat dissipating method of heat radiation perforate need cooperate other devices to increase thermal convection efficient, for example above-mentioned fan usually.Yet use the fan must consumed power, also take up space simultaneously, on some electronic installation and inapplicable (for example product such as thumb drive, wireless network card).But if only simple the use when dispelling the heat perforate, its radiating efficiency is not good again.So the present invention proposes a kind of cooling mechanism of electronic installation, though also be to see through the heat radiation perforate to allow heat dissipate to outside the housing, the better radiating efficiency of tool.
Summary of the invention
A purpose of the present invention is to propose a kind of cooling mechanism of electronic installation, and the heat radiation perforate dissipation that makes the heat of electronic installation heater element see through housing is effectively gone out.
Another object of the present invention system proposes to be suitable for cooling mechanism small-sized, portable electronic device, the heat that produces with dissipation effectively.And at considering on using, scalded by the element of cooling mechanism for preventing human body skin, has done partly restriction in the design of heat radiation aperture area, make human body skin can not sink into to touch thermal conductive metal plate in the perforate and scald.
The cooling mechanism of a kind of electronic installation of the present invention comprises: a substrate, and at least one heater element is fixed in this substrate; One housing, this substrate is fixed in this housing, and wherein, at least one heat radiation aperture area comprises plurality of openings and connects this housing; And a thermal conductive metal plate, it is formed with two ends at least, and wherein an end connects this heater element, and it is other end connection and at least one this heat radiation aperture area of fitting at least.
Cooling mechanism of the present invention can see through this perforate and cool ambient air and do heat exchange with heat radiation with heat by conducting to the heat radiation aperture area on the heater element.
Description of drawings
Figure 1A and Figure 1B are the external view and the profile of a preferred embodiment of the cooling mechanism of the present invention's announcement;
Fig. 1 C is a kind of structural representation of retaining element snib;
Fig. 1 D is the structural representation of another retaining element screw;
Fig. 1 E is a kind of schematic diagram of structure of fixedly thermal conductive metal plate;
Fig. 1 F one has the structural representation of depressed part;
Fig. 1 G is the structural representation of a sheet of thermal conductive metal plate;
Fig. 1 H is the structural representation of the thermal conductive metal plate of another sheet;
Fig. 2 is the structural representation of general compact electronic device; And
Fig. 3 A and Fig. 3 B are applied to the heat radiation aperture area design diagram of compact electronic device and watch in-house schematic diagram from the 3B-3B direction.
Embodiment
Some embodiments of the present invention can be described in detail as follows.Yet except the content of describing in detail, the present invention can also be widely implements at other embodiment, and scope of the present invention do not limited, and it is as the criterion with accompanying Claim institute restricted portion.
In addition, for making the graphic inventive features that more succinctly shows clearly, correlative type has omitted some and the outside joint of doing the signal transmission, has also omitted some and the irrelevant mechanism's part of heat radiation, and focuses on the structure of explanation cooling mechanism.
Figure 1A and Figure 1B are the external view and the profile of inwardly seeing from the 1B-1B tangent plane of a preferred embodiment of the heat elimination mechanism of electronic equipment of the present invention's announcement.Fix at least one heater element 102 on the substrate 100, be that heat main in the electronic installation produces the source, and comprise other elements 103.In the present embodiment, the preferable material of substrate 100 is a printed circuit board (PCB) (PCB).Substrate 100, heater element 102 is to place housing 104 with other elements 103, offered plurality of openings on the housing 104 and be distributed in zones of different, these perforates can allow heat energy by in the electronic installation to flowing to outside the device.For convenience of description, the perforate group that each is comparatively intensive is called the heat radiation aperture area, comprises more than one heat radiation aperture area (as 106,107) on the housing 104.Certainly the heat radiation aperture area also can only contain a perforate, and the present invention does not limit perforate quantity.
Thermal conductive metal plate 108 is to make strip and the two ends warpage in graphic, and wherein an end connects above-mentioned heater element 102, and the other end then connects and the heat radiation aperture area 106 of fitting.In this mandatory declaration, the present invention does not limit the face shaping of thermal conductive metal plate 108, also is not limited to only can connect a heater element or a heat radiation aperture area.For example, thermal conductive metal plate 108 can design as Y-shaped, and the one end is connected to heater element, and two ends then are connected to different heat radiation aperture area respectively in addition.That is, thermal conductive metal plate 108 can conform to a plurality of heat radiation aperture area.
For respectively clear, the heat radiation aperture area with the applying thermal conductive metal plate is called heat exchange zone especially, is a heat exchange zone as heat radiation aperture area 106.Thermal conductive metal plate 108 is formed with the metal material of a tool high-termal conductivity, normally as copper, aluminium or other alloy materials.102 of thermal conductive metal plate 108 and heater elements can be pasted by the conduction material of tool stickiness such as heat-conducting glue and fix.The other end that is connected to heat radiation aperture area 106 then utilizes some retaining elements, the snib 140 of Fig. 1 C for example, cooperate and make the thermal conductive metal plate front end 141 of structure as shown in drawings, can insert snib 140 with fixing thermal conductive metal plate 108 in the below of housing 104, or with a screw 150 with fixing thermal conductive metal plate 108 (with reference to figure 1D).Certainly also can design the shape of thermal conductive metal plate 108 especially, when itself and housing 104 are assembled, allow an end of thermal conductive metal plate 108 applying heat radiation aperture area 106 be positioned at the below of heat radiation aperture area 106 just and to fit in heat radiation aperture area 106 naturally, and exempted retaining elements such as use screw, snib; Or further make a plurality of protuberances 1081 as Fig. 1 thermal conductive metal plate that E is shown in 108 1 ends, need not utilize retaining element equally and protuberance 1081 be aimed at and filled in the perforate of heat radiation aperture area 106, but and make thermal conductive metal plate 108 planforms just driving fit be fixed in the heat radiation aperture area, with fixing thermal conductive metal plate 108; Even shown in Fig. 1 F, can design and allow housing 104 have a depressed part 1041, with fixing thermal conductive metal plate 108.Certainly, the structure of depressed part 1041 is not limited in shown in the figure, also can make suitable variation on demand.Or use the thermal conductive metal plate 108 (as Fig. 1 G) of sheet, and when assembling, be clipped between heat radiation aperture area 106 and the heater element 102 and fix with heat-conducting glue, viscose, can make simplifying the structure and reducing the thickness of electronic installation of thermal conductive metal plate 108.In addition if with thermal conductive metal plate 108 whole fitting in the housing 104, and when assembling, allow heater element 102 directly clip thermal conductive metal plate 108, but and make the thermal conductive metal plate planform just driving fit be fixed in housing 104, then more can deduct heat-conducting glue, retaining element and not need extra means to fix thermal conductive metal plate 108 fully.
In addition, can stay several heat radiation aperture area and do not make its applying thermal conductive metal plate, purely as thermal convection usefulness, that is the present invention does not limit the number of heat exchange zone, and the heat radiation aperture area is also non-must fit a heat dissipation metal plate and form heat exchange zone.
When heater element in the electronic installation 102 produced a large amount of heat, thermal conductive metal plate 108 contacted part with heater element 102, contacted the temperature of part with cool ambient air in heat radiation aperture area 106 for high with respect to thermal conductive metal plate 108.According to heat-conduction principle, heat will be transmitted to the low temperature direction by the high temperature place.When heat transferred to heat exchange zone 106, make cool ambient air contact by top plurality of openings with thermal conductive metal plate 108, can carry out heat exchange and reach the heat radiation purpose.
Mandatory declaration is in addition, the cooling mechanism that invention discloses is the heat radiation aperture area that can be connected to housing by thermal conductive metal plate, with as main heat radiation part, and the heat radiation aperture area is not shown in Figure 1B, can only be positioned at heater element 102 or substrate 100 directly over; No matter so be that any one direction, zone etc. at housing 104 all can offer the heat radiation aperture area according to need, and make it become main heat dissipation region.
In addition, the structure that the present invention proposes also is suitable for electronic installation small-sized, portable, as thumb drive, wireless network card etc., with effective difficult problem of this type of device radiation of improving.As Fig. 2 is the structural representation of present common compact electronic device, and a heater element 202 is arranged on the substrate 200, and it is sealed in the housing 204.The heat that heater element 202 produces be with housing 204 in air do heat exchange, and make the device internal convection and be dispersed to housing 204 zoness of different.Because the device inner space is narrow and small, spread heat can be lowered the temperature to each zone when making internal convection, so its heat is hoarded in narrow space easily not as large-scale electronic installation.
In addition, if only by heat radiation perforate heat radiation, heat in the housing that only can leave slightly are set.The heat radiation perforate that compact electronic device can be offered is less, and the circulation of air convection current is difficult relatively.And being limited to inner space and power supply supply restriction, major part does not allow to be provided with fan to add strong convection.Following table is the compact electronic device that different heat dissipating methods are applied to Fig. 2, the radiating effect comparison sheet that obtains through simulation, and wherein last uses cooling mechanism of the present invention, is the heat radiation aperture area that a plurality of perforates of a tool are set and the heat radiation result of a thermal conductive metal plate.
| Heat dissipating method | Chip surface temperature (Celsius) |
| Sealing fully | 98.39 |
| On heater element, add a copper sheet (do not have heat radiation perforate) | 96.12 |
| On housing, open a perforate (do not have heat dissipation metal plate) | 96.29 |
| On housing, open a plurality of perforates (do not have heat dissipation metal plate) | 96.05 |
| Cooling mechanism of the present invention | 61.78 |
Learn that by last table result compact electronic device is owing to being difficult to do the thermal convection heat radiation by being provided with of heat radiation perforate, so its chip surface temperature is higher all the time many.
Use cooling mechanism of the present invention in compact electronic device the time, can scald because of thermal contact conductance sheet metal 108 accidentally to prevent the user, therefore can consider the anti-scald design through special design.Fig. 3 A is the design diagram of the heat radiation aperture area (being meant heat exchange zone especially) that is applied to compact electronic device, and Fig. 3 B then is from the in-house schematic diagram of 3B-3B direction side-looking.That perforate can be designed to is netted 304, circular 307 or strip 306, the thermal conductive metal plate 308 of can fitting down.
The perforate size and the degree of depth of heat exchange zone can be designed to allow human body skin be unlikely to touch thermal conductive metal plate 308 on demand, when particularly taking as Fig. 1 E design with fixing thermal conductive metal plate.For instance, housing is usually with the injection molding method moulding, and its thickness is slightly larger than 1 least bit approximately.Its heat exchange zone can be designed to netted (as 304), circular (as 307), and bore size can be less than 2 least bit, or strip (as 306), and width can be less than 1.5 least bit, touches heat dissipation metal plate 308 in the perforate and scalds to prevent that skin is absorbed in.307 of the heat radiation aperture area of certain thermal conductive metal plate of not fitting not necessarily need to observe above-mentioned restriction.In addition, housing 302 itself can be that the material of counting is formed by being difficult for heat conduction, hanging down thermal conductance, as acryl or plastic cement etc., to avoid scalding human body skin.
The design of above-mentioned heat radiation aperture area, particularly heat exchange zone, only for illustrating possible implementation of the present invention, the perforate design can be a principle to prevent that human body skin (particularly finger) from scalding especially, and non-limiting can only enforcement with the above-mentioned size that exemplifies.And the various cooling mechanisms among Figure 1A to Fig. 1 H are during as cooling mechanism small-sized, portable electronic device, and some mechanisms form can be as above-mentioned content and shrinkage limit in addition, and it can be considered another preferred embodiment of the present invention.
The above is preferred embodiment of the present invention only, is not in order to limit the right of applying for a patent of the present invention; Above simultaneously description, should understand and implement for the special personage who knows the present technique field, therefore other do not break away from the equivalence change of being finished under the disclosed spirit or modify, and all should be included in following the application's claim institute restricted portion.
Claims (14)
1. a cooling mechanism is applied to portable electronic device, and this cooling mechanism comprises:
One substrate, at least one heater element is fixed in this substrate;
One housing, this substrate is fixed in this housing, and wherein, at least one heat radiation aperture area comprises plurality of openings and connects this housing; And
One thermal conductive metal plate connects this heater element, and fits at least one this heat radiation aperture area;
Wherein this housing forms with a low heat conductivity material.
2. cooling mechanism as claimed in claim 1 is characterized in that this thermal conductive metal plate connects this heater element by a stickiness conduction material.
3. cooling mechanism as claimed in claim 1 is characterized in that this low heat conductivity material comprises acryl.
4. cooling mechanism as claimed in claim 1 is characterized in that this low heat conductivity material comprises plastic cement.
5. cooling mechanism as claimed in claim 1, it is netted to it is characterized in that this plurality of openings is designed to, and this perforate is arranged to not make human body skin to be absorbed in this perforate and is touched this thermal conductive metal plate.
6. cooling mechanism as claimed in claim 1 is characterized in that this plurality of openings is designed to circle, and this perforate is arranged to not make human body skin to be absorbed in this perforate and is touched this thermal conductive metal plate.
7. cooling mechanism as claimed in claim 1 is characterized in that this plurality of openings is designed to strip, and this perforate is arranged to not make human body skin to be absorbed in this perforate and is touched this thermal conductive metal plate.
8. cooling mechanism as claimed in claim 1 is characterized in that this thermal conductive metal plate is fixed in this heat radiation aperture area by a retaining element.
9. cooling mechanism as claimed in claim 8 is characterized in that this retaining element comprises a snib.
10. cooling mechanism as claimed in claim 8 is characterized in that this retaining element comprises a screw.
11. cooling mechanism as claimed in claim 1, but it is characterized in that this thermal conductive metal plate planform just driving fit be fixed in this heat radiation aperture area.
12. cooling mechanism as claimed in claim 1 is characterized in that this thermal conductive metal plate comprises a plurality of protuberances, fills in this perforate of being fixed in this heat radiation aperture area.
13. cooling mechanism as claimed in claim 1 is characterized in that this housing has a depressed part and fixes this thermal conductive metal plate.
14. cooling mechanism as claimed in claim 1, but it is characterized in that this thermal conductive metal plate planform just driving fit be fixed in this housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101019779A CN100391324C (en) | 2004-12-10 | 2004-12-10 | Heat elimination mechanism of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101019779A CN100391324C (en) | 2004-12-10 | 2004-12-10 | Heat elimination mechanism of electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1662127A CN1662127A (en) | 2005-08-31 |
| CN100391324C true CN100391324C (en) | 2008-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004101019779A Expired - Fee Related CN100391324C (en) | 2004-12-10 | 2004-12-10 | Heat elimination mechanism of electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN100391324C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103717024A (en) * | 2012-09-29 | 2014-04-09 | 辉达公司 | Rear cover for handheld mobile terminals and handheld mobile terminal |
| CN107197615B (en) * | 2017-07-14 | 2023-06-23 | 广东小天才科技有限公司 | Heat radiation structure subassembly and intelligent wearing equipment |
| EP3745576A4 (en) * | 2018-05-04 | 2021-02-17 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Buck conversion circuit assembly and electronic device |
| CN110505788B (en) * | 2019-07-24 | 2021-02-19 | 安徽科技学院 | Heat radiation structure of electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547968A (en) * | 1991-08-20 | 1993-02-26 | Fujitsu Ltd | Cooling structure of electronic device |
| JPH05327250A (en) * | 1992-05-22 | 1993-12-10 | Mitsubishi Electric Corp | Heat radiating device for electronic equipment |
| JPH10224065A (en) * | 1997-02-05 | 1998-08-21 | Japan Servo Co Ltd | Heat radiating structure of electronic circuit |
| JP2000022371A (en) * | 1998-07-02 | 2000-01-21 | Alps Electric Co Ltd | Electronic equipment |
| JP2000196269A (en) * | 1998-12-25 | 2000-07-14 | Toshiba Corp | Circuit module |
| US6313995B1 (en) * | 1999-08-18 | 2001-11-06 | Ando Electric Co., Ltd. | Cooling system of a printed board |
| JP2002353674A (en) * | 2001-05-30 | 2002-12-06 | Hitachi Ltd | Electronic apparatus |
| JP2003163477A (en) * | 2001-11-29 | 2003-06-06 | Seiko Epson Corp | Power supply cooling structure and projector |
-
2004
- 2004-12-10 CN CNB2004101019779A patent/CN100391324C/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547968A (en) * | 1991-08-20 | 1993-02-26 | Fujitsu Ltd | Cooling structure of electronic device |
| JPH05327250A (en) * | 1992-05-22 | 1993-12-10 | Mitsubishi Electric Corp | Heat radiating device for electronic equipment |
| JPH10224065A (en) * | 1997-02-05 | 1998-08-21 | Japan Servo Co Ltd | Heat radiating structure of electronic circuit |
| JP2000022371A (en) * | 1998-07-02 | 2000-01-21 | Alps Electric Co Ltd | Electronic equipment |
| JP2000196269A (en) * | 1998-12-25 | 2000-07-14 | Toshiba Corp | Circuit module |
| US6313995B1 (en) * | 1999-08-18 | 2001-11-06 | Ando Electric Co., Ltd. | Cooling system of a printed board |
| JP2002353674A (en) * | 2001-05-30 | 2002-12-06 | Hitachi Ltd | Electronic apparatus |
| JP2003163477A (en) * | 2001-11-29 | 2003-06-06 | Seiko Epson Corp | Power supply cooling structure and projector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1662127A (en) | 2005-08-31 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TAIJI HOLDING CO., LTD. Free format text: FORMER OWNER: XITONG SCIENCE AND TECHNOLOGY CO LTD Effective date: 20091113 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20091113 Address after: Delaware Patentee after: Silicon Integrated Systems Corporation Address before: No. 16, Xin Xin Road, Hsinchu Science Park, Taiwan Patentee before: Xitong Science & Technology Co., Ltd. |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080528 Termination date: 20131210 |