CN107197615B - Heat radiation structure subassembly and intelligent wearing equipment - Google Patents

Heat radiation structure subassembly and intelligent wearing equipment Download PDF

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Publication number
CN107197615B
CN107197615B CN201710573808.2A CN201710573808A CN107197615B CN 107197615 B CN107197615 B CN 107197615B CN 201710573808 A CN201710573808 A CN 201710573808A CN 107197615 B CN107197615 B CN 107197615B
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heat
heat conduction
side wall
bottom shell
heat conducting
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CN107197615A (en
Inventor
黄耀胜
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Guangdong Genius Technology Co Ltd
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Guangdong Genius Technology Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • H05K5/0243Mechanical details of casings for decorative purposes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat radiation structure component and intelligent wearing equipment, wherein the heat radiation structure component comprises a support shell, a main board, a heating component and a heat conduction component, wherein the support shell comprises a bottom shell and a side wall which is positioned at one side of the bottom shell and is connected with the periphery of the bottom shell; the main board is positioned in the supporting shell and is arranged on the bottom shell; the heating component is arranged on one side of the main board far away from the bottom shell; the heat conduction assembly comprises at least one first heat conduction part, and the first heat conduction part is connected with the heating component and the side wall and is used for transferring heat of the heating component to the side wall. According to the invention, the space of the supporting shell is fully utilized, and the heat of the heating component is transferred to the side wall through the first heat conduction part, so that the heat accumulated on the bottom shell is reduced, and the influence on wearing comfort of a user due to overheat of the bottom shell is avoided; meanwhile, after the heat of the heating component is diffused to the side wall, the influence on the service life of the intelligent wearable device due to overheat of the heating component can be avoided.

Description

Heat radiation structure subassembly and intelligent wearing equipment
Technical Field
The invention relates to the technical field of intelligent wearing equipment, in particular to a heat dissipation structure component and intelligent wearing equipment comprising the same.
Background
In traditional intelligent wearing equipment such as intelligent wrist-watch, the inside mainboard of intelligent wrist-watch, battery etc. are as main heat source, can produce a large amount of heat in the use of intelligent wrist-watch. On one hand, the heat dissipation in the intelligent watch is slow, and the service life of the intelligent watch can be influenced; on the other hand, the case of the smart watch may generate heat, and the case is tightly attached to the skin, resulting in discomfort of wearing by the user.
At present, the intelligent wrist-watch that is on sale in the market has carried out the heat dissipation improvement. As shown in fig. 1, the smart watch includes a case 1' and a watchband 2' connected to two ends of the case 1', in which a touch screen 3', a display screen 4', a battery 5', a main board 6' and a heat dissipation material 7' are sequentially disposed in the case 1' from top to bottom, and an electronic device is disposed on the main board 6', and the electronic device is a main heat source on the main board 6', and heat of the electronic device is mainly diffused to the bottom of the case 1' through the heat dissipation material 7 '. The smart watch has a certain heat dissipation effect due to the heat dissipation material 7', the service life of the smart watch can be prolonged to a certain extent, but the smart watch is small in size, the space in the watch case 1' is limited, and the available heat dissipation conditions are limited, so that the heat dissipation effect of the smart watch is not ideal. Moreover, heat is accumulated at the bottom of the case 1', resulting in overheating of the bottom of the case 1', which seriously affects wearing comfort and user experience of the user.
Disclosure of Invention
An object of the present invention is to provide a heat dissipation structure assembly with good heat dissipation effect.
Another object of the invention is to provide an intelligent wearing device which is comfortable to wear.
To achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a heat dissipating structure assembly is provided, comprising:
the support shell comprises a bottom shell and a side wall which is positioned on one side of the bottom shell and connected with the periphery of the bottom shell;
the main board is positioned in the supporting shell and is arranged on the bottom shell;
the heating component is arranged on one side of the main board away from the bottom shell;
the heat conduction assembly comprises at least one first heat conduction part, and the first heat conduction part is connected with the heating component and the side wall and used for transferring heat of the heating component to the side wall.
As a preferred technical scheme of the heat radiation structure assembly, the heat radiation structure assembly further comprises a decoration piece, wherein the side wall is provided with a mounting hole along the thickness direction of the side wall, and the first heat conduction part penetrates through the mounting hole to be connected with the decoration piece, or the decoration piece penetrates through the mounting hole to be connected with the first heat conduction part.
As a preferred technical scheme of the heat dissipation structure assembly, the heat conduction assembly comprises at least two first heat conduction parts, each first heat conduction part comprises a heat conduction rod and a heat conduction plate, one end of each heat conduction rod is connected with the heating component, the other end of each heat conduction rod is connected with the heat conduction plate, and one side, far away from the heat conduction rod, of each heat conduction plate is in surface contact with the decorating part.
As a preferred technical solution of the heat dissipation structure assembly, the heat conduction plate completely covers a side surface of the decoration piece, which is close to the heat conduction plate.
As a preferable technical scheme of the heat radiation structure component, the decorating part is provided with a plurality of ventilation holes along the thickness direction of the decorating part, one end of each ventilation hole is communicated with the outside, and the other end of each ventilation hole is opposite to the heat conducting plate.
As a preferred technical scheme of the heat dissipation structure assembly, the heat conduction assembly comprises a first heat conduction part, the first heat conduction part comprises a heat conduction plate and a plurality of heat conduction rods arranged at intervals, one end of each heat conduction rod is connected with the heating component, the other end of each heat conduction rod is connected with the heat conduction plate, and the heat conduction plates are annularly arranged on the inner periphery of the side wall.
As a preferable technical scheme of the heat radiation structure component, the heat conduction plate comprises a heat conduction plate body which is annularly arranged at the inner periphery of the side wall, and a connecting convex part which is opposite to the mounting hole and is convexly arranged on the heat conduction plate body, and the connecting convex part is in plug-in fit with the mounting hole; or alternatively, the process may be performed,
the heat conducting plate comprises a heat conducting plate body which is arranged on the inner periphery of the side wall in a surrounding mode, and a connecting groove which is opposite to the mounting hole and is concavely arranged on the heat conducting plate body, and the decorating part penetrates through the mounting hole to be in plug-in fit with the connecting groove.
As a preferred technical solution of the heat dissipation structure assembly, the decoration is made of a heat conduction material.
As a preferred technical solution of the heat dissipation structure assembly, the heat conduction assembly further includes a second heat conduction portion, and the second heat conduction portion is located between the main board and the bottom shell.
On the other hand, still provide an intelligent wearing equipment, including heat radiation structure subassembly.
The invention has the beneficial effects that: the invention fully utilizes the space of the supporting shell, adopts the first heat conduction part to connect the heating component and the side wall, and the side wall is directly contacted with the external air so as to realize the heat transfer of the heating component to the side wall, and the side wall is in heat exchange with the external air, thereby reducing the heat accumulated on the bottom shell and avoiding the influence on the wearing comfort of users due to the overheat of the bottom shell; meanwhile, after the heat of the heating component is diffused to the side wall, the influence on the service life of the intelligent wearable device due to overheat of the heating component can be avoided.
Drawings
Fig. 1 is a schematic structural diagram of a conventional smart watch.
Fig. 2 is a schematic structural diagram of a heat dissipation structure assembly according to an embodiment of the invention.
Fig. 3 is a schematic structural diagram of a heat dissipation structure assembly according to another embodiment of the invention.
In fig. 1:
1', watch case; 2', watchband; 3', a touch screen; 4', a display screen; 5', a battery; 6', a main board; 7', heat sink material.
In fig. 2 and 3:
100. a heat dissipation structure assembly; 200. a belt body;
1. a support housing; 11. a bottom case; 12. a sidewall; 2. a main board; 3. a heat generating component; 4. a first heat conduction part; 41. a heat conduction rod; 42. a heat conductive plate; 5. and (5) decorating pieces.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
In the description of the present invention, unless explicitly stated and limited otherwise, the term "coupled" is to be interpreted broadly, and may be, for example, fixedly coupled, detachably coupled, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between the two parts or interaction relationship between the two parts. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The "under" of a first feature with respect to a second feature includes both the first feature being directly under and obliquely under the second feature, or simply indicates that the first feature is less level than the second feature.
As shown in fig. 2 and 3, in the present embodiment, the heat dissipation structure assembly includes a support housing 1, a motherboard 2, a heat generating component 3, and a heat conducting assembly, where the support housing 1 includes a bottom shell 11 and a side wall 12 located at one side of the bottom shell 11 and connected to the periphery of the bottom shell 11; the main board 2 is positioned in the support shell 1 and is arranged on the bottom shell 11; the heating component 3 is arranged on one side of the main board 2 away from the bottom shell 11; the heat conducting assembly comprises at least one first heat conducting part 4, wherein the first heat conducting part 4 is connected with the heating component 3 and the side wall 12, and is used for transferring heat of the heating component 3 to the side wall 12. The space of the supporting shell 1 is fully utilized, the first heat conduction part 4 is adopted to connect the heating component 3 and the side wall 12, the side wall 12 is directly contacted with the external air, so that the heat of the heating component 3 is transferred to the side wall 12, and the side wall 12 is in heat exchange with the external air, thereby reducing the heat accumulated on the bottom shell 11 and avoiding the influence on wearing comfort of a user due to overheat of the bottom shell 11; meanwhile, after heat of the heating component 3 is transferred and diffused to the side wall 12, the influence on the service life of the intelligent wearable device due to overheat of the heating component 3 can be avoided.
In the present invention, the heat conductive material includes, but is not limited to, graphite, copper foil, or a heat radiating pipe.
Wherein the heat generating component 3 refers to an electronic device.
The first heat conducting part 4 is adhered and fixed with the heat generating component 3 and the side wall 12 through heat conducting gel, so that heat of the heat generating component 3 is effectively transferred to the side wall 12 through the first heat conducting part 4.
The heat dissipation structure assembly of the embodiment further comprises a decoration 5 to improve the aesthetic degree of the intelligent wearing equipment, the side wall 12 is provided with a mounting hole along the thickness direction of the side wall, the first heat conduction part 4 penetrates through the mounting hole to be connected with the decoration 5, heat conduction gel is filled between the outer side of the first heat conduction part 4 and the hole wall of the mounting hole to improve the mounting stability of the first heat conduction part 4, and heat of the first heat conduction part 4 can be directly transferred to the side wall 12 and the decoration 5 to be in contact with external air through the side wall 12 and the decoration 5 to be in contact with the external air for heat dissipation; wherein, a terminal surface that the heating element 3 was kept away from to first heat conduction portion 4 aligns with the outside of lateral wall, and decoration 5 is glued on a terminal surface that the heating element 3 was kept away from to first heat conduction portion 4 through heat conduction gel, and the clearance between first heat conduction portion 4 and the mounting hole is covered to decoration 5 to avoid the ash layer to fall into the heat conduction effect of influence heat conduction gel and the decorative effect of decoration 5 in this clearance.
Or, the decoration 5 penetrates through the mounting hole to be connected with the first heat conduction part 4, the decoration 5 can be inserted into the mounting hole from the inside of the support shell 1 to be clamped with the mounting hole, or can be inserted into the mounting hole from the outside of the support shell 1 to be clamped with the mounting hole, and heat conduction gel is filled between the mounting hole and the decoration 5, so that the mounting stability of the decoration 5 is improved; preferably, the cross section of the decoration 5 is a T-shaped structure, i.e. the decoration 5 is composed of a wide portion and a narrow portion, the narrow portion of the decoration 5 is inserted into the mounting hole from the outside of the support housing 1, the heat conducting gel is filled between the narrow portion and the mounting hole, and the wide portion is clamped on the outside of the support housing 1 and covers the gap between the narrow portion and the mounting hole.
Wherein, the decoration 5 is kept away from the inside one side of support casing 1 and is the decorative face, and it provides decorative effect for intelligent wearing equipment, and first heat conduction portion 4 is fixed through heat conduction gel and the bonding of the one side that decoration 5 kept away from its decorative face.
In one preferred embodiment of the present invention, the heat conduction assembly includes at least two first heat conduction parts 4, the first heat conduction parts 4 including a heat conduction rod 41 and a heat conduction plate 42, one end of the heat conduction rod 41 being connected to the heat generating part 3, the other end being connected to the heat conduction plate 42, one side of the heat conduction plate 42 in the thickness direction thereof being in surface contact with the garnish 5. The "rod" and the "plate" in the heat-conducting rod 41 and the heat-conducting plate 42 have no special meaning, and are both made of a heat-conducting material, which is different in that the cross section of the heat-conducting rod 41 is smaller than that of the heat-conducting plate 42, the heat-conducting rod 41 with smaller cross section is more convenient when connected with the heating component 3, the height of the heat-conducting rod 41 is not greater than that of the heating component 3, and the heat-conducting rod 41 is adhered and fixed with one side, close to the bottom shell 11, of the heat-conducting plate 42 through heat-conducting gel, so that the heat-conducting rod 41 is prevented from affecting the installation of other components such as a battery; when the heat conducting plate 42 with a larger cross section is connected with the decoration piece 5 through the heat conducting gel, the contact area between the heat conducting plate 42 and the decoration piece is larger, and the heat dissipation effect of the heating component 3 can be improved.
In this embodiment, the smart wearable device includes a belt body connected to two side walls 12 opposite to the support housing 1, and the first heat conducting portion 4 is disposed on the side walls 12 at a position avoiding the belt body.
Preferably, the heat conducting assembly comprises at least two first heat conducting parts 4 arranged at intervals.
In one specific embodiment, as shown in fig. 2, the heat conducting assembly includes two first heat conducting parts 4, the two first heat conducting parts 4 are oppositely disposed on the side wall 12 and located at the center of the side wall 12 along the length direction thereof, and are respectively connected with one decoration piece 5, and the heat conducting rods 41 of the two first heat conducting parts 4 are connected with two opposite sides of the heat generating part 3, so that the heat of the heat generating part 3 is transferred to the two opposite side walls 12 through the two first heat conducting parts 4.
In another specific embodiment, as shown in fig. 3, the heat conducting assembly includes four first heat conducting parts 4, the four first heat conducting parts 4 are disposed on two opposite side walls 12 at intervals and adjacent to corner positions of the side walls 12, the four first heat conducting parts 4 are respectively connected with one decoration piece 5, and the heat conducting rods 41 of the four first heat conducting parts 4 are symmetrically disposed and connected with the heat generating component 3, so that heat of the heat generating component 3 is transferred to the two opposite side walls 12 through the four first heat conducting parts 4.
The heat conductive plate 42 completely covers a side of the decoration 5 near the heat conductive plate 42 to maximize a contact area between the decoration 5 and the heat conductive plate 42, thereby improving a heat transfer rate.
In a preferred embodiment of the present invention, the decoration 5 is provided with a plurality of ventilation holes in a thickness direction thereof, one end of the ventilation holes being communicated with the outside, and the other end being faced to the heat-conductive plate 42. The air in the external relatively low-temperature environment is in direct contact with the heat conductive plate 42 through the vent hole, so that the temperature of the heat conductive plate 42 can be rapidly reduced, thereby accelerating the heat dissipation speed of the heat generating component 3.
In another preferred embodiment of the present invention, the first heat conducting portion 4 is not required to be disposed so as to avoid the belt body position. Specifically, the heat conduction assembly includes a first heat conduction part 4, the first heat conduction part 4 includes a heat conduction plate 42 and a plurality of heat conduction rods 41 arranged at intervals, one end of each heat conduction rod 41 is connected with the heat generating component 3, the other end is connected with the heat conduction plate 42, and the heat conduction plate 42 is arranged around the inner circumference (not shown in the figure) of the side wall 12 so as to maximize the contact area between the heat conduction plate 42 and the side wall 12.
In one specific embodiment, the heat conducting plate 42 comprises a heat conducting plate body annularly arranged on the inner periphery of the side wall 12, and a connecting convex part which is arranged on the heat conducting plate body in a convex manner opposite to the mounting hole, wherein the connecting convex part is in plug-in fit with the mounting hole; the heat conductive plate body is in contact with the inner peripheral surface of the side wall 12, and can sufficiently transfer and diffuse the heat of the heat generating component 3 to the side wall 12. The connection convex part is matched with the mounting hole in a plugging manner, on one hand, the mounting stability of the heat conducting plate body can be improved, on the other hand, one side surface of the connection convex part, far away from the heat conducting plate body, is used for being connected with the decoration 5, has a supporting and fixing effect on the decoration 5, and meanwhile can radiate heat through the decoration 5.
In another specific embodiment, the heat-conducting plate 42 comprises a heat-conducting plate body annularly arranged on the inner periphery of the side wall 12, and a connecting groove concavely arranged on the heat-conducting plate body opposite to the mounting hole, and the decoration 5 is inserted and matched with the connecting groove through the mounting hole; the heat conductive plate body is in contact with the inner peripheral surface of the side wall 12, and can sufficiently transfer and diffuse the heat of the heat generating component 3 to the side wall 12. The connecting grooves are in plug-in connection with the decoration pieces 5, so that the installation stability of the heat-conducting plate body and the decoration pieces 5 can be improved.
Preferably, the decoration 5 is made of a heat conductive material to enhance the heat radiation effect of the heat generating part 3.
Preferably, the side wall 12 is made of a heat conductive material to further enhance the heat dissipation effect of the heat generating component 3.
In the present embodiment, the shape of the heat conduction rod 41 is not limited, and may be a long strip, a bent shape, or a meandering shape.
In this embodiment, the heat conduction assembly further includes a second heat conduction portion, the second heat conduction portion is located between the main board 2 and the bottom shell 11, and when the heat of the heating component 3 is transferred to the side wall 12 through the first heat conduction portion 4 to dissipate the heat, the heat of the heating component 3 can be transferred to the bottom shell 11 through the second heat conduction portion to dissipate the heat, so that the heat of the heating component 3 is fully diffused.
Preferably, a plurality of protruding portions are arranged on one side, far away from the main board 2, of the bottom shell 11, and the protruding portions can prevent the bottom shell 11 from being in direct contact with the skin of a user, so that the temperature of the bottom shell 11 is prevented from affecting wearing comfort of the user.
The heat radiation structure component of the invention fully utilizes the rest parts of the support shell 1 to radiate under the small space of the support shell 1, thereby greatly improving the heat radiation efficiency of the heating component 3, and simultaneously, the decorative pieces 5 can play a role in decorating the appearance of the support shell 1.
As shown in fig. 2 and 3, an embodiment of the present invention further provides an intelligent wearable device, which includes the heat dissipation structure assembly 100 of any one of the above embodiments, and further includes a belt body 200 connected to the heat dissipation structure assembly 100. The heat dissipation structure assembly 100 can enable the intelligent wearable device to have a good user experience effect.
The intelligent wearable device in this embodiment includes an intelligent watch, an intelligent bracelet, and the like.
It should be noted that the above embodiments are merely preferred embodiments of the present invention and the applied technical principles, and any changes or substitutions easily conceivable to those skilled in the art within the scope of the present invention are included in the scope of the present invention.
The present invention has been described above by way of specific examples, but the present invention is not limited to these specific examples. It will be apparent to those skilled in the art that various modifications, equivalents, variations, and the like can be made to the present invention. However, such modifications are intended to fall within the scope of the present invention without departing from the spirit of the present invention. In addition, some terms used in the specification and claims of the present application are not limiting, but are merely for convenience of description.

Claims (6)

1. A heat dissipating structure assembly, comprising:
the support shell comprises a bottom shell and a side wall which is positioned on one side of the bottom shell and connected with the periphery of the bottom shell;
the main board is positioned in the supporting shell and is arranged on the bottom shell;
the heating component is arranged on one side of the main board away from the bottom shell;
a heat conducting assembly including at least one first heat conducting portion connecting the heat generating component and the side wall for transferring heat of the heat generating component to the side wall;
the side wall is provided with a mounting hole along the thickness direction of the side wall, and the first heat conduction part penetrates through the mounting hole to be connected with the decoration, or the decoration penetrates through the mounting hole to be connected with the first heat conduction part;
the heat conducting component comprises at least two first heat conducting parts, or the heat conducting component comprises one first heat conducting part;
when the heat conduction assembly comprises at least two first heat conduction parts, each first heat conduction part comprises a heat conduction rod and a heat conduction plate, one end of each heat conduction rod is connected with the heating component, the other end of each heat conduction rod is connected with the heat conduction plate, and one side, away from the heat conduction rod, of each heat conduction plate is in surface contact with the decorating part;
the decorating part is provided with a plurality of vent holes along the thickness direction, one end of each vent hole is communicated with the outside, and the other end of each vent hole is opposite to the heat conducting plate;
when the heat conduction assembly comprises a first heat conduction part, the first heat conduction part comprises a heat conduction plate and a plurality of heat conduction rods arranged at intervals, one end of each heat conduction rod is connected with the heating component, the other end of each heat conduction rod is connected with the heat conduction plate, and the heat conduction plates are annularly arranged on the inner periphery of the side wall.
2. The heat dissipating structure assembly of claim 1, wherein said heat conductive plate completely covers a side of said trim piece adjacent to said heat conductive plate when said heat conductive assembly comprises at least two of said first heat conductive portions.
3. The heat dissipating structure assembly of claim 1, wherein when said heat conducting assembly comprises one of said first heat conducting portions, said heat conducting plate comprises a heat conducting plate body disposed around an inner periphery of said side wall, and a connecting protrusion protruding from said heat conducting plate body opposite to said mounting hole, said connecting protrusion being in plug-in engagement with said mounting hole; or alternatively, the process may be performed,
the heat conducting plate comprises a heat conducting plate body which is arranged on the inner periphery of the side wall in a surrounding mode, and a connecting groove which is opposite to the mounting hole and is concavely arranged on the heat conducting plate body, and the decorating part penetrates through the mounting hole to be in plug-in fit with the connecting groove.
4. The heat dissipating structure assembly of claim 1, wherein said decorative piece is made of a thermally conductive material.
5. The heat dissipating structure assembly of claim 1, further comprising a second thermally conductive portion located between the motherboard and the bottom case.
6. A smart wearable device comprising the heat dissipating structure assembly of any of claims 1-5.
CN201710573808.2A 2017-07-14 2017-07-14 Heat radiation structure subassembly and intelligent wearing equipment Active CN107197615B (en)

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CN107833443A (en) * 2017-11-17 2018-03-23 江苏省交通技师学院 Based reminding method and the bracelet using the based reminding method
CN107730848A (en) * 2017-11-17 2018-02-23 江苏省交通技师学院 A kind of bracelet and its implementation with prompting function
CN107767638A (en) * 2017-11-17 2018-03-06 江苏省交通技师学院 Portable alarm set and its used based reminding method
CN108093611B (en) * 2018-01-29 2024-03-29 广东小天才科技有限公司 Radiating structure of intelligent watch
CN113724594B (en) * 2021-08-27 2024-06-14 京东方科技集团股份有限公司 Display device and wearable display equipment

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