CN202998757U

CN202998757U - Electron equipment

Info

Publication number: CN202998757U
Application number: CN 201220603991
Authority: CN
Inventors: 村上和則; 西家徹; 三好良平
Original assignee: Toshiba TEC Corp
Current assignee: Toshiba TEC Corp
Priority date: 2012-11-15
Filing date: 2012-11-15
Publication date: 2013-06-12
Anticipated expiration: 2022-11-15

Abstract

The present utility model discloses electronic equipment. The equipment comprises a cabinet; at least one substrate accommodated inside the cabinet; an outer wall part which is used for forming at least one part of the cabinet and is made of materials with good heat conductivity; a heating component assembled on the substrate; and a non-heating component assembled on the substrate, and a first area of the substrate, which is provided with the heating component, is close to the outer wall part compared with a second area of the substrate, which is provided with the non-heating component.

Description

Electronic equipment

Technical field

The utility model relates to a kind of overheated electronic equipment of device interior of causing because of heater element of preventing.

Background technology

In recent years, along with the function of electronic equipment improves, increase from the caloric value of heater element, in addition, because having reduced in the space of the miniaturization device interior of device, the difficulty so natural heat dissipation becomes.

Summary of the invention

In view of above-mentioned technical problem, the purpose of this utility model is to provide a kind of overheated electronic equipment of device interior of causing because of heater element of can preventing.

The related electronic equipment of the utility model comprises: cabinet; At least one substrate is incorporated in described cabinet; The outer wall parts, at least a portion of the described cabinet of formation, the material good by heat conductivity consists of; Heater element is loaded on described substrate; And non-heater element, be loaded on described substrate, wherein, be mounted with first area on the described substrate of described heater element compare with the second area on the described substrate that is mounted with described non-heater element be set at described outer wall parts near.

In above-mentioned electronic equipment, described first area lays respectively on the opposite face of described substrate with described second area.

In above-mentioned electronic equipment, described outer wall parts comprise at least: top board, base plate, front panel, rear board and left plate, right plate.

In above-mentioned electronic equipment, also comprise heat transfer component, described heat transfer component has heat pipe and is arranged on the first heat transfer plate and second heat transfer plate at described heat pipe two ends, described heat transfer component is installed between described heater element and described left plate, described the first heat transfer plate is arranged on described heater element, and described the second heat transfer plate is arranged on described left plate.

In above-mentioned electronic equipment, also comprise dividing plate, be arranged on the top of described substrate.

In above-mentioned electronic equipment, also comprise longitudinal wall, vertically be configured in the rear of described substrate, in the outside of described longitudinal wall, rear board is installed.

In above-mentioned electronic equipment, described the first heat transfer plate and described the second heat transfer plate are formed with slot part, and the end of described heat pipe is installed in the inside of described slot part.

In above-mentioned electronic equipment, described the first heat transfer plate and described the second heat transfer plate at right angles configure.

In above-mentioned electronic equipment, described left plate and described base plate and described right plate link.

In above-mentioned electronic equipment, the storage battery that is used for drive electronics is installed in described longitudinal wall.

According to electronic equipment of the present utility model, can prevent that the device interior that causes because of heater element is overheated.

Description of drawings

Fig. 1 means the stereogram of observing the related information terminal of the utility model from the rear.

Fig. 2 means the stereogram of the perspective under the state of the display part of opening this information terminal.

Fig. 3 means the vertical view of the substrate of this information terminal.

Fig. 4 means the front view of the substrate of this information terminal.

Fig. 5 means the sectional view of the inside of this information terminal.

Fig. 6 means the stereogram of the heat transfer component of this information terminal.

Embodiment

Below, with reference to accompanying drawing, the related electronic equipment of the utility model is described in detail.When considered in conjunction with the accompanying drawings, by the following detailed description of reference, can more completely understand better the utility model and easily learn wherein many advantages of following, but accompanying drawing described herein is used to provide further understanding of the present utility model, consist of the application's a part, illustrative examples of the present utility model and explanation thereof are used for explaining the utility model, do not consist of to improper restriction of the present utility model, wherein:

Below, be example take electronic equipment as information terminal with reference to accompanying drawing, the embodiment as the information terminal of electronic equipment is described.

This information terminal is to accept the input of Transaction Information (merchandise news) by input operation, uses the Transaction Information inputted transaction to be carried out the POS(Point Of Sales of settlement process: the point of sale) terminal etc.

Fig. 1 means from stereogram, Fig. 2 of rear observed information terminating machine 10 and means that stereogram, the Fig. 3 of the inside under the state of the display part 14 of opening information terminal 10 mean that vertical view, Fig. 4 of the substrate 22 of information terminal 10 mean that front view, Fig. 5 of substrate 22 mean that sectional view, Fig. 6 of the inside of information terminal 10 mean the stereogram of the heat transfer component 72 of information terminal 10.

The card reading part 18 that information terminal 10 has main part 12, display part 14 and reads magnetic information from magnetic card.

Main part 12 by cabinet 20 surround main parts 12 around, have as shown in Figure 2 substrate 22, thermal printer 24 and storage battery 31(in the inside of cabinet 20 with reference to Fig. 1).

Central processing unit) 40, carry out relaying and the chipset 42 of management and other the electronic component class 44 of CPU40, various interface as shown in Figure 3, be mounted with CPU(Central Processing Unit on substrate 22:.

As shown in Figures 3 and 4, the formed first area 43 of substrate 22 left that will be loaded in substrate 22 as CPU40 and the chipset 42 of heater element (in Fig. 3 right-hand).And, as shown in Figure 4, on the rear side of the substrate 22 that is mounted with CPU40 etc., be loaded in the right-hand formed second area 45 at substrate 22 that separates with CPU40 etc. as the electronic component class 44 of athermic non-heater element almost.

Cabinet 20 is formed by top board 50, base plate 52, front panel 54, rear board 56 and right plate 58, left plate 60 as the outer wall parts basically.And, as shown in Figure 5, by base plate 52 and with base plate 52 continuously and be erected at right plate 58 and left plate 60 and be formed with upper opening

The pedestal 62 of word shape.Pedestal 62 is formed by the good metallic plate of the heat conductivities such as aluminium.

Front panel 54 one are arranged on the front of pedestal 62.Rear board 56 loading and unloading are arranged on pedestal 62 freely.Fig. 1 illustrates rear board 56 with double dot dash line.As shown in Figure 1, the installed inside of plate 56 has the storage battery 31 of activation bit terminating machine 10 in the back.

Fig. 5 illustrates the internal structure of main part 12.As shown in Figure 5, be provided with substrate 22 by dividing plate 70 below thermal printer 24.As mentioned above, substrate 22 will be configured in the first area 43 of left (in Fig. 4 right-hand) as the CPU40 of heater element and chipset 42.In addition, be not limited to CPU40 and chipset 42, other heater elements that information terminal 10 uses are loaded in the first area 43 of substrate 22 lefts basically.

Between the left plate 60 of the heater element of CPU40 and chipset 42 etc. and pedestal 62, heat transfer component 72 is installed.Fig. 6 illustrates heat transfer component 72.Heat transfer component 72 has two heat pipes 74 and is arranged on the

heat transfer plate

76,78 at heat pipe 74 two ends.Heat pipe 74 is used in inside and takes in the body of heat conducting material and by heat conducting material, heat is delivered to low-temperature region from high-temperature area.

Heat pipe 74 bending as shown in Figure 6, and be provided with

heat transfer plate

76,78 in each crooked end with the state that is configured to approximate right angle.Heat transfer plate 76, the 78 high materials of heat conductivity by aluminium etc. form.

Heat transfer plate

76,78 is formed with slot part 80, and the end of heat pipe 74 closely is arranged on the inside of slot part 80.

As shown in Figure 5, a heat transfer plate 76 with can heat conducting state be arranged on CPU40 and chip 42 above.Another heat transfer plate 78 is being close on left plate 60 by heat conducting state.

To produce hardly the electronic component class of heat when working in the interior set electronic component class 44 of right-hand second area 45 of substrate 22.And as mentioned above, electronic component class 44 is loaded in the second area 45 of the opposite one side of one side (in table) with the substrate 22 that is mounted with CPU40.

Be provided with dividing plate 70 above substrate 22.Heat-sensitive paper incorporating section 64 is arranged on the right-hand of main part 12 across dividing plate 70 above as described above substrate 22.

As shown in Figure 1, be provided with longitudinal wall 82 at the rear of substrate 22.Longitudinal wall 82 vertically is configured in the rear of substrate 22.In the outside of longitudinal wall 82, rear board 56 is installed.Be equipped with on longitudinal wall 82 and drive with storage battery 31.Storage battery 31 is in longitudinal wall 82 outsides, and is arranged on the inboard of rear board 56.

The rear of the base plate 52 of 52 of plate 56 and base plates is formed with the space in the back, and the flexible cord class that set connector 28 connects at the rear of substrate 22 is pulled to the outside of information terminal 10.

CPU40 and chipset 42 generate heat when making information terminal 10 work, thereby temperature rises.CPU40 and chipset 42 are equipped with a heat transfer plate 76 of heat transfer component 72.In addition, another heat transfer plate 78 of heat transfer component 72 is arranged on left plate 60.By like this, the heat that is produced by CPU40 and chipset 42 heats by an end of heat transfer plate 76 opposite heat tubes 74.Heat pipe 74 is vaporized because of the inner heat conducting material of heating, thus from CPU40 and chip 42 seize heat make CPU40 and chip 42 cooling.

Therefore, the heat that is produced by CPU40, chipset 42 passes to left plate 60 by heat transfer component 72, and CPU40 and chipset 42 are cooled effectively.Left plate 60 is extensively disperseed from the heat of CPU40 and chipset 42 also with the base plate 52 of information terminal 10 and link with the opposed right plate 58 of left plate 60, thereby sufficiently cooled,

In addition, storage battery 31 is due on the set longitudinal wall 82 in the rear that is arranged on substrate 22, so the heat of the heater element of CPU40 and chipset 42 is isolated.Therefore, hardly heat is passed to storage battery 31 from heater element, thereby can prevent the overheated of storage battery 31.

Such as described above, information terminal 10 according to the present embodiment, because passing to from the heat that the heater element of CPU40 and chipset 42 produces left plate 60, that CPU40 and chipset 42 efficient highlands are cooling, thus can prevent the overheated of CPU40 and chipset 42.

Storage battery 31, non-febrifacient electronic component class 44 are separated setting with the heater element of CPU40 and chipset 42 when the heater element of CPU40 and chipset 42 is cooled by heat transfer component 72, so can be not overheated because of the heat from heater element.

As mentioned above, embodiment of the present utility model is explained, but as long as not breaking away from fact inventive point of the present utility model and effect can have a lot of distortion, this will be readily apparent to persons skilled in the art.Therefore, within such variation also all is included in protection range of the present utility model.

Description of reference numerals

10 information terminals

22 substrates

40 CPU

42 chipsets

43 first areas

44 electronic component classes

45 second areas

62 pedestals

70 dividing plates

72 heat transfer components

74 heat pipes

76,78 heat transfer plates

80 slot parts

82 longitudinal walls

Claims

1. electronic equipment comprises:

Cabinet;

At least one substrate is incorporated in described cabinet;

The outer wall parts, at least a portion of the described cabinet of formation, the material good by heat conductivity consists of;

Heater element is loaded on described substrate; And

Non-heater element is loaded on described substrate,

Wherein, be mounted with first area on the described substrate of described heater element compare with the second area on the described substrate that is mounted with described non-heater element be arranged on described outer wall parts near.

2. electronic equipment according to claim 1, wherein,

Described first area lays respectively on the opposite face of described substrate with described second area.

3. electronic equipment according to claim 1, wherein,

Described outer wall parts comprise at least: top board, base plate, front panel, rear board and left plate, right plate.

4. electronic equipment according to claim 3, also comprise,

Heat transfer component, described heat transfer component has heat pipe and is arranged on the first heat transfer plate and second heat transfer plate at described heat pipe two ends, described heat transfer component is installed between described heater element and described left plate, described the first heat transfer plate is arranged on described heater element, and described the second heat transfer plate is arranged on described left plate.

5. electronic equipment according to claim 4 also comprises:

Dividing plate is arranged on the top of described substrate.

6. electronic equipment according to claim 5, also comprise,

Longitudinal wall vertically is configured in the rear of described substrate, in the outside of described longitudinal wall, rear board is installed.

7. electronic equipment according to claim 4, wherein,

Described the first heat transfer plate and described the second heat transfer plate are formed with slot part, and the end of described heat pipe is installed in the inside of described slot part.

8. electronic equipment according to claim 4, wherein,

Described the first heat transfer plate and described the second heat transfer plate at right angles configure.

9. electronic equipment according to claim 4, wherein,

Described left plate and described base plate and described right plate link.

10. electronic equipment according to claim 6, wherein,

The storage battery that is used for drive electronics is installed in described longitudinal wall.