CN101466244B - Radiator - Google Patents
Radiator Download PDFInfo
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- CN101466244B CN101466244B CN2007102033480A CN200710203348A CN101466244B CN 101466244 B CN101466244 B CN 101466244B CN 2007102033480 A CN2007102033480 A CN 2007102033480A CN 200710203348 A CN200710203348 A CN 200710203348A CN 101466244 B CN101466244 B CN 101466244B
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- radiating fin
- fin group
- side plate
- radiator
- radiating
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Abstract
The invention relates to a heat radiator, comprising a first radiating fin group and a second radiating fin group, wherein, each radiating fin group comprises a side plate arranged at one side of the radiating fin group and a plurality of radiating fins connected with the side plate; the side plate of the first radiating fin group is jointed with the side plate of the second radiating fin group; at least one side plate is sagged downwards to form a containing part used for containing a direct-insertion heating electronic component; and the electronic component is contained in the containing space between the two radiating fins. The contact area between the electronic component and the radiator is large, and the heat transfer rate is high, so as to improve the heat radiating effect.
Description
Technical field
The present invention relates to a kind of radiator, refer to a kind of radiator that is applicable to direct insertion electronic element radiating especially.
Background technology
Along with large scale integrated circuit continuous advancement in technology and extensive use; Computer is widely used in all trades and professions; For adapting to the development trend that data processing amount constantly increases and the promptness requirement improves constantly, the function of all kinds of electronic components makes the unit interval produce a large amount of heats also from strength to strength; To cause the rising of electronic component self temperature like these heats of untimely eliminating, the safety and the performance of system made a big impact.
Usually industry is installed auxiliary its heat radiation of radiator in a side of electronic component, simultaneously, fan is installed on radiator, impels the heat of radiator to distribute fast so that forced draft to be provided, thereby heat-generating electronic elements is carried out more efficiently heat radiation.This radiator comprises a base and the some radiating fins that are arranged in parallel that extend to form from this base; When using this radiator to those direct insertion electronic element radiatings, by a fastener with a plurality of radiators be fixed on make around the electronic component its with electronic component between hot the contact, yet; There is the air gap easily between fixing back of this radiator and the electronic component; Radiating effect is not good, and this kind fixed pattern structure complicacy, assembling inconvenience.
Summary of the invention
In view of this, be necessary to provide a kind of radiator that has than high cooling efficiency in fact.
A kind of radiator; Be applicable to that to direct insertion electronic element radiating this radiator comprises at least two radiating fin groups, each radiating fin group comprises a base and is positioned at the some radiating fins on this base; In every two adjacent radiating fin groups; Wherein a radiating fin group is provided with fixing hole, and another radiating fin group is provided with the fixed leg corresponding with this fixing hole, is formed with a receiving space of accommodating said electronic component between these two adjacent radiating fin groups.
A kind of radiator; Comprise the first radiating fin group and the second radiating fin group; Each radiating fin group comprise the side plate that is positioned at a side wherein and with the hot linked some radiating fins of this side plate; Corresponding being fitted and connected together of side plate of the side plate of the said first radiating fin group and the said second radiating fin group, and at least one side plate is recessed to form the receiving space of accommodating a direct insertion heat-generating electronic elements downwards.
A kind of radiator; Comprise a radiating fin group; This radiating fin group comprises that being positioned at outermost at least one side plate reaches and the hot linked some radiating fins of this side plate; The side plate of said radiating fin group is recessed to form the receiving space of accommodating a direct insertion heat-generating electronic elements downwards, the shape of said receiving space, size and the shape of heat-generating electronic elements, big or small identical.
Compared with prior art; Be formed with on this radiator and can electronic component be contained in its inner receiving space, therefore, electronic component is contained in this receiving space; Whole outer surfaces of electronic component all contact with the radiator heat conduction; This thermocontact area is big, and heat transfer rate is high, thereby radiating effect promotes.
Description of drawings
Fig. 1 is the schematic perspective view of radiator first embodiment of the present invention.
Fig. 2 is the decomposing schematic representation of radiator among Fig. 1.
Fig. 3 be among Fig. 2 radiator from the sketch map of another angle.
Fig. 4 is the schematic perspective view of radiator second embodiment of the present invention.
Embodiment
With reference to the accompanying drawings, be described further in conjunction with embodiment.
As shown in Figure 1, be the first embodiment of the present invention, this radiator comprises one first radiating fin group 20, second a radiating fin group 40 and is connected in said first, second radiating fin group 20, one the 3rd radiating fin group 30 between 40.
Please be simultaneously referring to figs. 2 and 3, this first radiating fin group 20 comprise a plate base 21, be located at the fixed mount 22 of these base 21 belows, from the upwardly extending some radiating fin of this base 21 23, from the upwardly extending side plate 24 in the edge of this base 21 and be connected in the heat radiation of one between these some radiating fins 23 wall 25.This base 21 has relative upper surface and lower surface, and these some radiating fins 23 extend from the upper surface of base 21 vertically upward, and vertically being arranged in parallel along this base 21.This heat radiation wall 25 extends from the upper surface of this base 21 vertically upward; And along the horizontally set of this base 21; Arbitrary radiating fin 23 in this heat radiation wall 25 and said radiating fin 23 is mutual vertical; And be connected in the roughly position intermediate of each radiating fin 23, the both sides that make each radiating fin 23 are axis and symmetry with this heat radiation wall 25.In different embodiment, this heat radiation wall 25 can be obliquely installed along the different directions of base 21, thus with said radiating fin 23 between become different angles.
This fixed mount 22 is arranged at the outside of the lower surface of this base 21, and this fixed mount 22 comprises the rectangular wall 221 of a level and two connecting pins 222 that extend vertically downward from the two ends of the outer ledge of this rectangular wall 221 respectively.The lower surface of this base 21 is formed with a square groove 211 and is positioned at two fastening arms 212 of these square groove 211 both sides.The shape of this square groove 211, size and location are corresponding each other with shape, the size and location of the rectangular wall 221 of this fixed mount 22 respectively.This fastens arm 212 and extends from two side direction central horizontal of square groove 211 respectively; It is equal with the lower surface of this base 21 that each fastens arm 212; When the rectangular wall 221 of fixed mount 22 is inserted in this square groove 211; Two fasten the outer surface that arm 212 is fastened on this rectangular wall 221, thereby this rectangular wall 221 is housed in the inside of square groove 211 regularly.
This side plate 24 is parallel with said radiating fin 23; And through base 21 and the heat radiation wall 25 be connected with said radiating fin 23; The thickness of this side plate 24 is greater than the thickness of each radiating fin 23, and is positioned at this first radiating fin group, 20 outermost near the second radiating fin group 30.The position of the substantial middle of the outer surface of this side plate 24 forms a receiving space 2312.The shape of this receiving space 2312 and size are roughly the same with the shape and the size of the electronic component that uses this radiating fin group 20 to be used to dispel the heat (figure does not show) respectively.In the present embodiment; This electronic component is a direct insertion electronic component; Comprise an encapsulation main body and two from the encapsulation main body bottom to extending below the leg that is connected with the external circuit board (figure does not show); Therefore, this receiving space 2312 comprises can be with the accepting groove 2312a of this encapsulation main body in being housed in accordingly, and be positioned at this accepting groove 2312a below and can wear groove 2312b with what this leg was located in accordingly.The thickness of this side plate 24 is slightly larger than the half the thickness of this electronic package body; The degree of depth of this receiving space 2312 equals the half the thickness of this electronic package body; And this wears the below that groove 2312b is positioned at side plate 24; And be connected with the lower surface of the base 21 of this radiating fin group 20; When electronic component is contained in this receiving space 2312 when inner, the leg of its bottom can be convenient to itself and circuit board electric connection via the lower surface that groove 2312b stretches out this radiating fin group 20 that wears of these receiving space 2312 bottoms.The top of the outer surface of this side plate 24 and bottom are around the fixing hole 2314 of three circles of these receiving space 2312 formation, and said three fixing holes 2314 are Chinese character pin-shaped distribution.
The structure of this second radiating fin group 40 and the structure of the first radiating fin group 20 are roughly the same, comprise base 41, fixed mount 42, some radiating fins 43, side plate 44 and heat radiation wall 45.This fixed mount 42 comprises the rectangular wall 421 of level and the connecting pin 422 that extends vertically downward from the two ends of the outer ledge of this rectangular wall 421 respectively.The lower surface of this base 41 forms the square groove 411 in can this rectangular wall 421 being housed in, and auxiliary this rectangular wall 421 is contained in the fastening arm 412 of square groove 411 inside regularly.Its difference is: the side plate 44 in this second radiating fin group 40 and this fixed mount 42 towards respectively with these first radiating fin group, 20 latus inframediums 24 and fixed mount 22 towards on the contrary, and form three fixed legs 4313 that are Chinese character pin-shaped distribution on this side plate 44.This fixed leg 4313 is cylindric; Its shape, position and size are corresponding with shape, position and the size of fixing hole 2312 in this first radiating fin group 20 respectively; Each fixed leg 4313 extends to these first radiating fin group, 20 positions from the outer surface of this side plate 44, and the position of the substantial middle of the outer surface of this side plate 44 is formed with a receiving space 4312.
The 3rd radiating fin group 30 comprises a plate base 31, from these base 31 upwardly extending some radiating fins 33, upwardly extending two side plates 34 and be connected in the heat radiation of one between these some radiating fins 33 wall 35 from the relative both sides of the edge of this base 21 respectively.Wherein, the structure of base 21, radiating fin 23 and the wall 25 that dispels the heat is identical in the structure of base 31 in the 3rd radiating fin group 30, radiating fin 33 and heat radiation wall 35 and the first radiating fin group 20.Said two side plates 24 lay respectively at two relative outermost of the 3rd radiating fin group 30; The position of the substantial middle of the outer surface of each side plate 24 is formed with a receiving space 3312, the shape of this receiving space 3312, size and the degree of depth respectively with the first radiating fin group 20 in shape, size and the degree of depth of receiving space 2312 identical.The side that the 3rd radiating fin group 30 is relative with the first radiating fin group 20; Promptly form the fixed leg 3313 of three cylindrical shape on the side plate 34 near the first radiating fin group, 20 1 sides respectively; Said three fixed legs 3313 are Chinese character pin-shaped distribution; Each fixed leg 3313 can be contained in the fixing hole 2314 in the first corresponding radiating fin group 20 by friction tight mode, thereby said the first, the 3rd radiating fin group 20,30 is connected to form an integral body.The side that the 3rd radiating fin group 30 is relative with the second radiating fin group 40; Promptly the same with side plate 24 in the first radiating fin group 20 near the side plate 34 of these second radiating fin group, 40 1 sides; Chinese character pin-shaped distribution fixing hole 3314 is formed on top and bottom in its outer surface; In each fixing hole 3314 also can be housed in the fixed leg 4313 in the second radiating fin group 40 of correspondence by friction tight mode, thereby said the 3rd, the second radiating fin group 30,40 is connected into an integral body.
During assembling; In the receiving space that is positioned over the first radiating fin group 20 2312 that one electronic component is corresponding; Fixed leg 3313 with the 3rd radiating fin group 30 inserts and is contained in just in the fixing hole 2314 corresponding in this first radiating fin group 20 then; The receiving space 2312 of this first radiating fin group 20 and the receiving space 3312 of the 3rd radiating fin group 30 are interconnected and form a degree of depth and equal the space of electronic component thickness just, thereby this first, the 3rd radiating fin group 20,30 is linked together.In like manner; Three, the receiving space 3312,4312 of the second radiating fin group 30,40 is interconnected and forms the space that another degree of depth equals one second electronic component thickness just; With this second electronic component be located in the 3rd, the second radiating fin group 30, between 40; And the fixed leg through this second radiating fin group 40 4313 inserts and is contained in just in the fixing hole 3314 corresponding in the 3rd radiating fin group 30, and then the second radiating fin group 40 is linked together with this first, the 3rd radiating fin group 20,30.This first, second and third radiating fin group 20,30,40 forms a radiator integral through the assembling that cooperatively interacts of fixing hole 2312,3312 and fixed leg 3313,4313 respectively; This first, second electronic component is contained in the inside of radiator; The outer surface of this first, second electronic component can apply heat-conducting glue or other hot interface conductive material, to fill the air gap between itself and the radiator, therefore; Whole outer surfaces of this first, second electronic component all contact with the radiator heat conduction; Its thermocontact area is big, and heat transfer rate is high, and radiating effect promotes.The rectangular wall 221,421 of this fixed mount 22,42 is inserted respectively and is contained in the square groove 211,411 of this first, second radiating fin group 20,40; When being fixed in radiator on the circuit board; Only need to get final product in the slot that is inserted in corresponding position on this circuit board with 222,422 correspondences of the connecting pin on this fixed mount 22,42; Thereby localization method is simple, and is easy to assembly.
Radiator is combined by three radiating fin groups 20,30,40 in twos among this first embodiment; Therefore can be simultaneously to two electronic element radiatings; In the different embodiment, the number of radiating fin group 20,30,40 can be done suitable adjustment according to the quantity and the relative position of electronic component.Be illustrated in figure 4 as the second embodiment of the present invention; This radiator is applicable to an electronic component is dispelled the heat, and connected to form through fixed leg 4313 and fixing hole 2314 correspondences by one first radiating fin group 20 and one the second radiating fin group 40 among above-mentioned first embodiment.When need be to more a plurality of such electronic element radiating, can be through realizing in inner the 3rd radiating fin group 30 that increases corresponding number of radiator.
In addition, those skilled in the art also can do other and change in spirit of the present invention, as change shape, quantity and the arrangement mode of this fixed leg 3313,4313 and fixing hole 2312,3312; This receiving space 2312,3312,4312 is arranged on the side plate 24,34,44 in the radiating fin group 20,30,40 wherein; And the degree of depth that changes this receiving space 2312,3312,4312 equates with the thickness of electronic component; As long as perhaps other can form the design that a degree of depth equals the receiving space of this electronic component thickness in adjacent two radiating fin groups 20,30,40, only otherwise departing from technique effect of the present invention all can.These all should be included within the present invention's scope required for protection according to the variation that the present invention's spirit is done.
Claims (14)
1. radiator; Be applicable to that to direct insertion electronic element radiating this radiator comprises at least two radiating fin groups, each radiating fin group comprises a base and is positioned at the some radiating fins on this base; It is characterized in that: in every two adjacent radiating fin groups; Wherein a radiating fin group is provided with fixing hole, and another radiating fin group is provided with the fixed leg corresponding with this fixing hole, is formed with a receiving space of accommodating said electronic component between these two adjacent radiating fin groups.
2. radiator as claimed in claim 1 is characterized in that: each radiating fin group is formed with side plate in the outermost near another radiating fin group, and this receiving space is formed on this side plate.
3. radiator as claimed in claim 2 is characterized in that: this receiving space comprises an accepting groove that is positioned at this side plate centre position and wears groove near one of base that this wears groove and is connected with the lower surface of base.
4. radiator as claimed in claim 1 is characterized in that: each radiating fin group also comprises a heat radiation wall, and this heat radiation wall is connected between said some radiating fins.
5. radiator as claimed in claim 1; It is characterized in that: this radiator also comprises at least one fixed mount; This at least one fixed mount comprises that a rectangular wall reaches at least one connecting pin that extends below from a side direction of this rectangular wall, and the lower surface of this radiator is formed with the square groove in can this rectangular wall being housed in the corresponding position of the rectangular wall of this at least one fixed mount.
6. radiator as claimed in claim 5 is characterized in that: the both sides of this square groove are formed with the fastening arm respectively, and this fastens arm and extends from the two side direction central authorities of square groove respectively.
7. radiator; Comprise the first radiating fin group and the second radiating fin group; Each radiating fin group comprise the side plate that is positioned at a side wherein and with the hot linked some radiating fins of this side plate; It is characterized in that: corresponding being fitted and connected together of side plate of the side plate of the said first radiating fin group and the said second radiating fin group, and at least one side plate is recessed to form the receiving space of accommodating a direct insertion heat-generating electronic elements downwards.
8. radiator as claimed in claim 7; It is characterized in that: also comprise at least one the 3rd radiating fin group; The 3rd radiating fin group string is located between said first radiating fin group and the said second radiating fin group; The 3rd radiating fin group comprises at two outermost relatively biside plates and the some radiating fins between said biside plate; The wherein side plate of the 3rd radiating fin group is fitted and connected together with the side plate of the said first radiating fin group is corresponding, corresponding being fitted and connected together of side plate of another side plate of the 3rd radiating fin group and the said second radiating fin group.
9. like claim 7 or 8 described radiators, it is characterized in that: all be recessed to form said receiving space on the adjacent biside plate that is fitted and connected downwards, to accommodate said heat-generating electronic elements jointly.
10. like claim 7 or 8 described radiators, it is characterized in that: the thickness of said each side plate is greater than the thickness of each radiating fin.
11. like claim 7 or 8 described radiators; It is characterized in that: this receiving space comprise an accepting groove in the centre position that is positioned at side plate and be positioned at side plate lower position one wear groove; This accepting groove is used to accommodate the package main body of said heat-generating electronic elements, and this wears groove and is used to supply the leg of said heat-generating electronic elements to wear downwards.
12. radiator; Comprise a radiating fin group; This radiating fin group comprises that being positioned at outermost at least one side plate reaches and the hot linked some radiating fins of this side plate; It is characterized in that: the side plate of said radiating fin group is recessed to form the receiving space of accommodating a direct insertion heat-generating electronic elements downwards, the shape of said receiving space, size and the shape of heat-generating electronic elements, big or small identical.
13. radiator as claimed in claim 12 is characterized in that: this radiating fin group comprises and is positioned at two outermost relatively biside plates, and said some radiating fins are between said biside plate, and each side plate all is recessed to form said receiving space downwards.
14. radiator as claimed in claim 12; It is characterized in that: this receiving space comprise an accepting groove in the centre position that is positioned at side plate and be positioned at side plate lower position one wear groove; This accepting groove is used to accommodate the package main body of said heat-generating electronic elements, and this wears groove and is used to supply the leg of said heat-generating electronic elements to wear downwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007102033480A CN101466244B (en) | 2007-12-21 | 2007-12-21 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007102033480A CN101466244B (en) | 2007-12-21 | 2007-12-21 | Radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101466244A CN101466244A (en) | 2009-06-24 |
| CN101466244B true CN101466244B (en) | 2012-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007102033480A Expired - Fee Related CN101466244B (en) | 2007-12-21 | 2007-12-21 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101466244B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103415182A (en) * | 2013-07-19 | 2013-11-27 | 昆山维金五金制品有限公司 | Cooling fin |
| CN105241293B (en) * | 2015-10-30 | 2017-05-31 | 成都标建铝业有限公司 | A kind of shaped material of radiator for strengthening radiating effect |
| CN105371683A (en) * | 2015-10-30 | 2016-03-02 | 成都标建铝业有限公司 | Radiator sectional material simple in structure |
| CN106879230B (en) * | 2017-03-02 | 2019-09-17 | 广州程星通信科技有限公司 | A kind of cooling system of three-dimensional power amplifier |
| CN109152313A (en) * | 2018-10-26 | 2019-01-04 | 浙江佳乐科仪股份有限公司 | A kind of radiator of high efficiency and heat radiation |
| CN109375753A (en) * | 2018-12-14 | 2019-02-22 | 河南飙风信息科技有限公司 | A kind of radiator for big data server |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020041488A1 (en) * | 2000-10-05 | 2002-04-11 | Nec Corporation | Heat sink and power source unit employing the same |
| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
| CN1925144A (en) * | 2005-09-02 | 2007-03-07 | 富准精密工业(深圳)有限公司 | Heat dispersing module and its manufacturing method |
-
2007
- 2007-12-21 CN CN2007102033480A patent/CN101466244B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020041488A1 (en) * | 2000-10-05 | 2002-04-11 | Nec Corporation | Heat sink and power source unit employing the same |
| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
| CN1925144A (en) * | 2005-09-02 | 2007-03-07 | 富准精密工业(深圳)有限公司 | Heat dispersing module and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101466244A (en) | 2009-06-24 |
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