CN205693973U - A kind of pcb board assembly - Google Patents

Abstract

The utility model discloses a PCB board assembly, which comprises a PCB board, which is provided with an installation area; a heat dissipation device, which is arranged on the installation area, and is used to absorb the heat emitted by the PCB board; wherein the heat dissipation device includes: a bottom plate, which is arranged in the installation area The first cooling plate is fixed on one end of the bottom plate; the second cooling plate is fixed on the other end of the bottom plate away from the first cooling plate; a plurality of cooling fins are arranged at intervals between the first cooling plate and the second cooling plate Among them, one end of the first heat dissipation plate and the second heat dissipation plate is provided with a convex groove, and the other end of the first heat dissipation plate and the second heat dissipation plate is provided with a groove, and the convex groove is used for connecting with other heat dissipation plates. The grooves of the devices are connected, and the grooves are used to connect with the convex grooves of other heat dissipation devices, so that the heat dissipation devices are connected to each other. Through the above method, the PCB board assembly of the present invention has a good heat dissipation effect, a simple structure, and can effectively guarantee the life of the PCB board.

Description

A PCB board assembly

technical field

The utility model relates to the field of electronic technology, in particular to a PCB board assembly.

Background technique

Nowadays, electronic technology is updated rapidly, and the electronic products produced have entered all aspects of people's lives and are closely related to people's lives. In people's life, more and more attention has been paid to the performance and quality of electronic products. The performance and quality of electronic products have also become their main competitiveness in the market. In the prior art, the operation of electronic products largely depends on the PCB board technology. However, the heat generated during the operation of the PCB board is large, which easily affects the performance and quality of the PCB board. Therefore, how to solve the above-mentioned problem that the heat of the PCB board is difficult to dissipate has become an urgent problem to be solved.

Contents of the invention

The technical problem mainly solved by the utility model is to provide a PCB board assembly, which can effectively solve the problem of high heat generation of the PCB board.

In order to solve the above-mentioned technical problems, a technical solution adopted by the utility model is: provide a PCB board assembly, comprising: a PCB board, which is provided with an installation area; a heat dissipation device, arranged on the installation area, for absorbing heat; wherein the heat dissipation device includes: a bottom plate, which is arranged on the installation area; a first heat dissipation plate, which is fixedly arranged at one end of the bottom plate; a second heat dissipation plate, which is fixedly arranged at the other end of the bottom plate away from the first heat dissipation plate; a plurality of heat sinks, Intervals are arranged between the first heat dissipation plate and the second heat dissipation plate; wherein, one end of the first heat dissipation plate and the second heat dissipation plate is provided with a convex groove, and the other of the first heat dissipation plate and the second heat dissipation plate One end is provided with a groove, and the convex groove is used for connecting with the grooves of other heat dissipation devices, and the groove is used for connecting with the convex grooves of other heat dissipation devices, so that the heat dissipation devices are connected to each other.

Wherein, the installation area is provided with heat-dissipating electronic components.

Wherein, a support column is provided on the installation area, and the heat dissipation device is arranged on the installation area through the support column.

Wherein, heat dissipation silica gel is arranged on the heat dissipation electronic component.

Wherein, the thickness of the bottom plate is thicker than that of the first heat dissipation plate and the second heat dissipation plate.

Wherein, the thicknesses of the first heat dissipation plate and the second heat dissipation plate are thicker than those of the plurality of heat dissipation fins.

Wherein, the plurality of cooling fins includes a plurality of cooling fins with unequal heights.

Wherein, the plurality of cooling fins includes a plurality of cooling fins with equal heights.

Wherein, the bottom plate, the first heat dissipation plate, the second heat dissipation plate and the plurality of heat dissipation fins are all made of metal aluminum.

The beneficial effects obtained by the utility model are: different from the prior art, a PCB board assembly disclosed by the utility model solves the problem of large heat generation of the PCB board during the operation of electronic products, and has a good heat dissipation effect and can accelerate The heat dissipation of the PCB board effectively guarantees the normal operation of the PCB board and the performance and quality of electronic products.

Description of drawings

Fig. 1 is the structural representation of a kind of PCB assembly of the utility model;

Fig. 2 is a schematic diagram of the installation area of the PCB board in Fig. 1;

FIG. 3 is a schematic cut-away structure diagram of the heat dissipation device in FIG. 1 .

Explanation of reference signs: 1. heat dissipation device, 2. PCB board, 11. bottom plate, 12. first heat dissipation plate, 13. second heat dissipation plate, 14. multiple heat dissipation fins, 21. installation area, 22. heat dissipation electronic components , 23, support column.

detailed description

The utility model will be described in detail below in conjunction with the accompanying drawings and embodiments.

Referring to Figures 1-3, Figure 1 is a schematic structural view of a PCB board assembly of the present invention, Figure 2 is a schematic view of the installation area of the PCB board in Figure 1, and Figure 3 is a schematic cutaway structure diagram of the heat dissipation device in Figure 1. The PCB board assembly includes a PCB board 6 and a heat dissipation device 1 .

A PCB (Printed Circuit Board, printed circuit board) board 2 is provided with an installation area 21 . Wherein, the installation area 21 is provided with a heat dissipation electronic component 22 . The heat dissipation electronic component 22 may specifically be a chip, a motor, a capacitor or a resistor.

The heat dissipation device 1 is arranged on the installation area 21 for absorbing the heat dissipated by the PCB board 2 .

It should be understood that the installation area 21 is provided with support columns 23 , and the heat dissipation device 1 is disposed on the installation area 21 through the support columns 23 . In addition, heat-dissipating electronic components 22 are provided with heat-dissipating silica gel. Heat-dissipating silica gel is a heat-conducting material with low thermal resistance, high thermal conductivity, and high flexibility. Heat dissipation silicone is given off.

Wherein, the heat dissipation device 1 includes a bottom plate 11 , a first heat dissipation plate 12 , a second heat dissipation plate 13 and a plurality of heat dissipation fins 14 .

The bottom plate 11 is arranged on the PCB board 2 through the support column 23 for receiving the heat emitted by the PCB board 2 . It should be understood that the present invention does not limit the base plate 11 to be disposed on the PCB, and the base plate 11 may also be disposed on other electronic devices, such as motors.

The first heat dissipation plate 12 is fixedly arranged on one end of the bottom plate 11 , and the second heat dissipation plate 13 is fixedly arranged on the other end of the bottom plate 11 away from the first heat dissipation plate 12 . Preferably, one end of the first heat dissipation plate 12 and the second heat dissipation plate 13 is provided with a convex groove, and the other end of the first heat dissipation plate 12 and the second heat dissipation plate 13 is provided with a groove, that is, The first heat dissipation plate 12 is provided with a convex groove, and the second heat dissipation plate 13 is provided with a groove, or in other words, the first heat dissipation plate 12 is provided with a groove, and the second heat dissipation plate 13 is provided with a convex groove. In this embodiment, the convex groove is used for connecting with the groove of other heat dissipation devices, and the groove is used for connecting with the convex groove of other heat dissipation devices, so that the heat dissipation devices are connected to each other and can be detachably arranged.

A plurality of cooling fins 14 are arranged at intervals between the first cooling plate 12 and the second cooling plate 13 . In this embodiment, the plurality of cooling fins 14 includes a plurality of cooling fins with unequal heights and a plurality of cooling fins with equal heights. A plurality of cooling fins 14 are arranged at intervals, which increases the surface area of the cooling device 1, improves the air circulation between the cooling fins, and facilitates the dissipation of heat. It should be understood that in other embodiments, the plurality of fins 14 includes a plurality of fins of equal height.

In this embodiment, the thickness of the first heat dissipation plate 12 is equal to the thickness of the second heat dissipation plate 13, and the thickness of the bottom plate 11 is thicker than the thickness of the first heat dissipation plate 12 and the second heat dissipation plate 13, further, the first Thicknesses of the heat dissipation plate 12 and the second heat dissipation plate 13 are both thicker than those of the plurality of heat dissipation fins 14 . Through the above method, the structural stability of the heat dissipation device 1 is improved.

In this embodiment, the first heat dissipation plate 12, the second heat dissipation plate 13 and the plurality of heat dissipation fins 14 are arranged vertically to the bottom plate 11, and the bottom plate 11, the first heat dissipation plate 12, the second heat dissipation plate 13 and the plurality of heat dissipation fins 14 are integrated forming. It should be understood that, in other embodiments, the first heat dissipation plate 12 and the second heat dissipation plate 13 respectively form an included angle with the bottom plate 11, the included angle is an acute angle, and the first heat dissipation plate 12 and the second heat dissipation plate 13 respectively face away from The heat sink 14 extends in a direction, preferably, the included angle is 60 degrees, which can increase the heat dissipation range and dissipate heat faster.

In this embodiment, the bottom plate 1, the first heat dissipation plate 12, the second heat dissipation plate 13 and a plurality of heat dissipation fins 14 are all made of metal aluminum material, which has good thermal conductivity and is used to make heat dissipation device 1, which improves the The performance of the heat dissipation device 1 is conducive to absorbing the heat emitted from the PCB board and improving the heat dissipation efficiency.

In summary, a PCB board assembly disclosed by the utility model can also be connected to another heat dissipation device on the heat dissipation device, which is different from the prior art, and solves the problem of large heat generation of the PCB board during the operation of electronic products, and the heat dissipation effect Well, the normal operation of the PCB board is guaranteed, and the performance and quality of electronic products are also guaranteed.

The above is only the embodiment of the utility model, and does not limit the patent scope of the utility model. Any equivalent structure or equivalent process transformation made by using the utility model specification and accompanying drawings, or directly or indirectly used in other Related technical fields are all included in the patent protection scope of the present utility model in the same way.

Claims (9)

1. A PCB assembly, characterized in that, comprising: PCB board, which is provided with a mounting area; The heat dissipation device is arranged on the installation area and is used to absorb the heat emitted by the PCB board; Wherein, the heat dissipation device includes: a bottom plate arranged on the installation area; The first heat dissipation plate is fixedly arranged at one end of the bottom plate; The second heat dissipation plate is fixedly arranged on the other end of the bottom plate away from the first heat dissipation plate; a plurality of cooling fins arranged at intervals between the first cooling plate and the second cooling plate; Wherein, one end of the first heat dissipation plate and the second heat dissipation plate is provided with a convex groove, and the other end of the first heat dissipation plate and the second heat dissipation plate is provided with a groove, so The convex grooves are used for connecting with the grooves of other heat dissipation devices, and the grooves are used for connecting with the convex grooves of other heat dissipation devices, so that the heat dissipation devices are connected to each other. 2. The PCB board assembly according to claim 1, wherein the mounting area is provided with heat dissipation electronic components. 3. The PCB board assembly according to claim 2, wherein a support column is provided on the installation area, and the heat dissipation device is arranged on the installation area through the support column. 4 . The PCB board assembly according to claim 3 , wherein a heat-dissipating silica gel is provided on the heat-dissipating electronic component. 5. The PCB board assembly according to claim 1, wherein the thickness of the bottom plate is thicker than that of the first heat dissipation plate and the second heat dissipation plate. 6 . The PCB board assembly according to claim 5 , wherein the first heat dissipation plate and the second heat dissipation plate are both thicker than the plurality of heat dissipation fins. 7. The PCB board assembly according to claim 6, wherein the plurality of cooling fins comprises a plurality of cooling fins with unequal heights. 8. The PCB board assembly according to claim 6, wherein the plurality of cooling fins comprises a plurality of cooling fins having equal heights. 9. The PCB board assembly according to claim 7 or 8, wherein the bottom plate, the first heat dissipation plate, the second heat dissipation plate and the plurality of heat dissipation fins are all made of metal aluminum.