CN205693973U - A kind of pcb board assembly - Google Patents
A kind of pcb board assembly Download PDFInfo
- Publication number
- CN205693973U CN205693973U CN201620676387.7U CN201620676387U CN205693973U CN 205693973 U CN205693973 U CN 205693973U CN 201620676387 U CN201620676387 U CN 201620676387U CN 205693973 U CN205693973 U CN 205693973U
- Authority
- CN
- China
- Prior art keywords
- heat sink
- pcb board
- board assembly
- base plate
- installation region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000009434 installation Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000010276 construction Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001154 acute Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Abstract
The utility model discloses a kind of pcb board assembly, including pcb board, it is provided with installation region；Radiating element, is arranged on installation region, for absorbing the heat that pcb board distributes；Wherein radiating element includes: base plate, is arranged on installation region；First heat sink, is fixedly installed on one end of base plate；Second heat sink, is fixedly installed on the base plate other end away from the first heat sink；Multiple fin, are disposed between the first heat sink and the second heat sink；Wherein, one one end in first heat sink and the second heat sink is provided with tongue, another one one end in first heat sink and the second heat sink is provided with groove, tongue is for being connected with the groove of other radiating elements, groove is for being connected with the tongue of other radiating elements, so that interconnecting between radiating element.By the way, the good heat dissipation effect of pcb board assembly of the present utility model, simple in construction, it is possible to the life-span of effective guarantee pcb board.
Description
Technical field
This utility model relates to electronic technology field, especially relates to a kind of pcb board assembly.
Background technology
Nowadays, electronic technology updates rapidly, and the electronic product produced has enter into the various aspects of people's life, with people
Life closely related.In the life of people, the most increasingly pay close attention to performance and the quality of electronic product.The property of electronic product
Its main competitiveness commercially can be also become with quality.In the prior art, the operation of electronic product much relies on
It it is pcb board technology.But, the caloric value in pcb board running is relatively big, easily affects performance and the quality of pcb board.Cause
How this, terminate the problem that the heat of above-mentioned pcb board is difficult to distribute, it has also become problem demanding prompt solution.
Summary of the invention
This utility model is mainly solving the technical problems that provide a kind of pcb board assembly, it is possible to effectively solve pcb board heating
Measure big problem.
For solving above-mentioned technical problem, the technical scheme that this utility model uses is: provide a kind of pcb board assembly,
Including: pcb board, it is provided with installation region；Radiating element, is arranged on installation region, for absorbing the heat that pcb board distributes；
Wherein radiating element includes: base plate, is arranged on installation region；First heat sink, is fixedly installed on one end of base plate；Second dissipates
Hot plate, is fixedly installed on the base plate other end away from the first heat sink；Multiple fin, are disposed on the first heat sink and
Between two heat sinks；Wherein, the one one end in the first heat sink and the second heat sink is provided with tongue, the first heat sink and second
Another one one end in heat sink is provided with groove, and tongue is for being connected with the groove of other radiating elements, and groove is used for and other
The tongue of radiating element connects, so that interconnecting between radiating element.
Wherein, installation region is provided with radiating electronic element.
Wherein, installation region is provided with supporting pillar, and radiating element is arranged on installation region by supporting pillar.
Wherein, radiating electronic element is provided with thermal grease.
Wherein, the thickness of base plate is all thick than the thickness of the first heat sink and the second heat sink.
Wherein, the thickness of the first heat sink and the second heat sink is all thick than the thickness of multiple fin.
Wherein, multiple fin include the unequal fin of multiple height.
Wherein, multiple fin include the fin that multiple height is equal.
Wherein, base plate, the first heat sink, the second heat sink and multiple fin are constituted by metallic aluminum material.
This utility model obtains and provides the benefit that: be different from prior art, a kind of pcb board group disclosed in this utility model
Part, solves in electronic product running, the problem that pcb board caloric value is big, its good heat dissipation effect, it is possible to accelerate pcb board
Heat radiation, effective guarantee pcb board properly functioning, ensured performance and the quality of electronic product.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model a kind of pcb board assembly；
Fig. 2 is the installation region schematic diagram of pcb board in Fig. 1；
Fig. 3 is the cutting structural representation of radiating element in Fig. 1.
Description of reference numerals: 1, radiating element, 2, pcb board, 11, base plate, the 12, first heat sink, the 13, second heat sink,
14, multiple fin, 21, installation region, 22, radiating electronic element, 23, supporting pillar.
Detailed description of the invention
With embodiment, this utility model is described in detail below in conjunction with the accompanying drawings.
With reference to shown in Fig. 1-3, Fig. 1 is the structural representation of this utility model a kind of pcb board assembly, and Fig. 2 is PCB in Fig. 1
The installation region schematic diagram of plate, Fig. 3 is the cutting structural representation of radiating element in Fig. 1.This pcb board assembly includes pcb board 6 He
Radiating element 1.
PCB (Printed Circuit Board, printed circuit board) plate 2 is provided with installation region 21.Wherein, installation region
21 are provided with radiating electronic element 22.Radiating electronic element 22 is specifically as follows chip, motor, electric capacity or resistance.
Radiating element 1 is arranged on installation region 21, for absorbing the heat that pcb board 2 distributes.
Should be understood that installation region 21 is provided with supporting pillar 23, radiating element 1 is arranged on installation region 21 by supporting pillar 23
On.It addition, radiating electronic element 22 is provided with thermal grease, thermal grease is a low thermal resistance and high thermal conductivity, highly-flexible
Property Heat Conduction Material, it is laid on radiating electronic element 22 so that the heat on radiating electronic element 22 surface by heat radiation
Silica gel distributes.
Wherein, radiating element 1 includes base plate the 11, first heat sink the 12, second heat sink 13 and multiple fin 14.
Base plate 11 is arranged on pcb board 2 by supporting pillar 23, for receiving the heat that pcb board 2 distributes.Should be understood that this reality
Being arranged on pcb board with the novel base plate 11 that do not limits, base plate 11 can also be arranged on other electronic devices, such as motor etc..
First heat sink 12 is fixedly installed on one end of base plate 11, and the second heat sink 13 is fixedly installed on base plate 11 away from
The other end of one heat sink 12.Preferably, the one one end in the first heat sink 12 and the second heat sink 13 is provided with tongue, and first
Another one one end in heat sink 12 and the second heat sink 13 is provided with groove, say, that the first heat sink 12 is provided with tongue, the
Two heat sinks 13 are provided with groove, or say that the first heat sink 12 is provided with groove, and the second heat sink 13 is provided with tongue.In this enforcement
In example, tongue is for being connected with the groove of other radiating elements, and groove is used for being connected with the tongue of other radiating elements, so that
Interconnect between radiating element, detachably arrange.
Multiple fin 14 are disposed between the first heat sink 12 and the second heat sink 13.In the present embodiment, many
Individual fin 14 includes the unequal fin of multiple height, the fin that multiple height are equal.Use between multiple fin 14
Every setting, add the surface area of radiating element 1, improve distributing of the air circulation between fin, beneficially heat.Should
Understanding, in other embodiments, multiple fin 14 include the fin that multiple height is equal.
In the present embodiment, the thickness of the first heat sink 12 and the thickness of the second heat sink 13 are equal, and the thickness of base plate 11
Spend all thick than the thickness of the first heat sink 12 and the second heat sink 13, further, the first heat sink 12 and the second heat sink 13
Thickness all thickness than multiple fin 14 after.By the way, improve the steadiness of radiating element 1 structure.
In the present embodiment, first heat sink the 12, second heat sink 13 and multiple fin 14 vertical base plate 11 are arranged, and
Base plate the 11, first heat sink the 12, second heat sink 13 and multiple fin 14 are one-body molded.Should be understood that in other embodiments,
First heat sink 12 becomes angle with base plate 11 row respectively with the second heat sink 13, and this angle is acute angle, and the first heat sink 12 He
Second heat sink 13 extends towards away from fin 14 direction respectively, it is preferred that this angle is 60 degree, so can strengthen heat radiation model
Enclose, faster dispel the heat.
In the present embodiment, base plate the 1, first heat sink the 12, second heat sink 13 and multiple fin 14 are by metallic aluminium
Material is constituted, and the heat conductivility of metallic aluminum material is good, is used for making radiating element 1, improves the performance of radiating element 1, profit
In the heat that absorption distributes from pcb board, improve radiating efficiency.
To sum up, disclosed in this utility model, a kind of pcb board assembly, can also connect another radiator on radiating element
Part, is different from prior art, solves in electronic product running, the problem that pcb board caloric value is big, good heat dissipation effect, protects
Hinder the properly functioning of pcb board, also ensure performance and the quality of electronic product.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, all
It is the equivalent structure utilizing this utility model description and accompanying drawing content to be made or equivalence flow process conversion, or directly or indirectly uses
In the technical field that other are relevant, the most in like manner it is included in scope of patent protection of the present utility model.
Claims (9)
1. a pcb board assembly, it is characterised in that including:
Pcb board, it is provided with installation region；
Radiating element, is arranged on described installation region, for absorbing the heat that pcb board distributes；
Wherein, described radiating element includes:
Base plate, is arranged on described installation region；
First heat sink, is fixedly installed on one end of described base plate；
Second heat sink, is fixedly installed on the described base plate other end away from described first heat sink；
Multiple fin, are disposed between described first heat sink and described second heat sink；
Wherein, the one one end in described first heat sink and described second heat sink is provided with tongue, described first heat sink and
Another one one end in described second heat sink is provided with groove, and described tongue is used for being connected with the groove of other radiating elements, institute
State groove to be connected for the tongue with other radiating elements, so that interconnecting between described radiating element.
Pcb board assembly the most according to claim 1, it is characterised in that: described installation region is provided with radiating electronic element.
Pcb board assembly the most according to claim 2, it is characterised in that: described installation region is provided with supporting pillar, described scattered
Thermal device is arranged on described installation region by described supporting pillar.
Pcb board assembly the most according to claim 3, it is characterised in that: described radiating electronic element is provided with thermal grease.
Pcb board assembly the most according to claim 1, it is characterised in that: the thickness of described base plate is all than described first heat radiation
The thickness of plate and described second heat sink is thick.
Pcb board assembly the most according to claim 5, it is characterised in that described first heat sink and described second heat sink
Thickness all thick than the thickness of the plurality of fin.
Pcb board assembly the most according to claim 6, it is characterised in that the plurality of fin includes multiple height not phase
Deng fin.
Pcb board assembly the most according to claim 6, it is characterised in that the plurality of fin includes that multiple height is equal
Fin.
9. according to the pcb board assembly described in claim 7 or 8, it is characterised in that described base plate, described first heat sink, described
Second heat sink and the plurality of fin are constituted by metallic aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620676387.7U CN205693973U (en) | 2016-06-28 | 2016-06-28 | A kind of pcb board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620676387.7U CN205693973U (en) | 2016-06-28 | 2016-06-28 | A kind of pcb board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205693973U true CN205693973U (en) | 2016-11-16 |
Family
ID=57259333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620676387.7U Active CN205693973U (en) | 2016-06-28 | 2016-06-28 | A kind of pcb board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205693973U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686954A (en) * | 2017-02-10 | 2017-05-17 | 联想(北京)有限公司 | Heat radiation structure, electronic equipment and assembly method of electronic equipment |
| CN109565930A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
-
2016
- 2016-06-28 CN CN201620676387.7U patent/CN205693973U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686954A (en) * | 2017-02-10 | 2017-05-17 | 联想(北京)有限公司 | Heat radiation structure, electronic equipment and assembly method of electronic equipment |
| CN106686954B (en) * | 2017-02-10 | 2020-09-25 | 联想(北京)有限公司 | Heat dissipation structure, electronic equipment and assembling method thereof |
| CN109565930A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |