CN112640395A

CN112640395A - Flexible electronic device

Info

Publication number: CN112640395A
Application number: CN201880094124.7A
Authority: CN
Inventors: 刘景�; 陈松亚
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-09-14
Filing date: 2018-11-05
Publication date: 2021-04-09
Also published as: WO2020052030A1; CN112640597A; WO2020051904A1; CN112639671A; WO2020052028A1

Abstract

The first portion (10) comprises a first heat radiator (11), the second portion (20) comprises a second heat radiator (21), the connecting portion (30) can be bent, the connecting portion (30) is connected with the first portion (10) and the second portion (20), the flexible heat conduction layer (40) is connected with the first heat radiator (11) and the second heat radiator (21) in a heat conduction mode, a bending area (403) of the flexible heat conduction layer (40) corresponds to the connecting portion (30), and the bending area (403) of the flexible heat conduction layer (40) is not fixedly connected with the connecting portion (30).

Description

Flexible electronic device

Technical Field

The present application relates to the field of consumer electronics, and more particularly, to a flexible electronic device.

Background

A flexible electronic device in the related art, such as a flexible cellular phone, includes a first portion and a second portion. Typically, the first part is provided with a main board and the second part is provided with a battery. Because the heat generated by the heating of the main board is large, the flexible electronic device in the related art transfers the heat from the first portion to the second portion to form uniform temperature heat dissipation by arranging the flexible heat conduction layer connecting the first portion and the second portion. However, after the flexible electronic device is folded and bent for many times, the flexible heat conduction layer is easily stressed to generate a bubbling wrinkle phenomenon, which may cause the flexible heat conduction layer to generate a fault, and may affect the heat dissipation capability of the flexible heat conduction layer, thereby affecting the user experience.

Content of application

The application provides a flexible electronic device.

The flexible electronic device comprises a first portion, a second portion, a connecting portion and a flexible heat conduction layer, wherein the connecting portion and the flexible heat conduction layer can be bent, the first portion comprises a first radiator, the second portion comprises a second radiator, the connecting portion is connected with the first portion and the second portion, the flexible heat conduction layer is connected with the first radiator and the second radiator in a heat conduction mode, the bending area of the flexible heat conduction layer corresponds to the connecting portion, and the bending area of the flexible heat conduction layer is not fixedly connected with the connecting portion.

Among the above-mentioned flexible electronic device, because the bending region of flexible heat-conducting layer is not with connecting portion fixed connection, can reduce the stress that the bending region of flexible heat-conducting layer received when buckling like this, consequently flexible heat-conducting layer is difficult to produce bubble or fold phenomenon because the many times of buckling of connecting portion, and flexible heat-conducting layer is difficult to produce the fault, then can guarantee the ability of the conduction heat of flexible heat-conducting layer, improves user experience.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic perspective view of a flexible electronic device according to an embodiment of the present application when laid flat;

fig. 2 is a schematic perspective view of a flexible electronic device according to an embodiment of the present application when folded;

fig. 3 is a schematic perspective exploded view of a flat-laid partial structure of the flexible electronic device according to the embodiment of the present application;

fig. 4 is an exploded perspective view of another perspective view of a portion of a flat flexible electronic device according to an embodiment of the present application;

fig. 5 is an exploded perspective view of a portion of a flexible electronic device according to an embodiment of the present application from a further perspective when the flexible electronic device is laid flat;

fig. 6 is an exploded perspective view of a flat-laid partial structure of the flexible electronic device according to the embodiment of the present application;

fig. 7 is an exploded perspective view of the flexible electronic device according to the embodiment of the present disclosure when it is laid flat;

FIG. 8 is a schematic cross-sectional view of a flexible electronic device according to an embodiment of the present application when laid flat;

fig. 9 is a schematic cross-sectional view of a flat-laid partial structure of a flexible electronic device according to an embodiment of the present application;

fig. 10 is a schematic cross-sectional view of a flexible electronic device according to an embodiment of the present application when folded.

Description of the main element symbols:

a flexible electronic device 100;

the first portion 10, the first heat sink 11, the receiving cavity 110, the first recess 111, the main board member 12, the main board 121, the first chip portion 122, the first shielding cover 1221, the first chip 1222, the first heat conduction layer 1223, the second chip portion 123, the second shielding cover 1231, the second chip 1232, the second heat conduction layer 1233, the sub-board 124, the first cover 13, the first mounting cavity 130, the third heat conduction layer 14, the second portion 20, the second heat sink 21, and the second recess 211, the flexible display panel comprises a battery component 22, a second cover 23, a second mounting cavity 230, a fourth heat conduction layer 24, a connecting portion 30, a supporting plate 31, a bent piece 32, a connecting piece 33, a first notch 34, a second notch 35, a flexible heat conduction layer 40, a first non-bent area 401, a second non-bent area 402, a bent area 403, a gap 41, an adhesive layer 50, a first adhesive layer 51, a second adhesive layer 52, a flexible display panel assembly 60, a supporting frame 61 and a flexible display panel 62.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1 to 10, the flexible electronic device 100 of the present disclosure can be bent. The flexible electronic device 100 may be, for example, a flexible folding mobile phone or a flexible folding tablet computer. The flexible electronic device 100 comprises a first portion 10, a second portion 20, a connection 30 and a flexible thermally conductive layer 40.

The first portion 10 comprises a first heat sink 11. The second portion 20 includes a second heat radiator 21. The connecting portion 30 can be bent. The connecting portion 30 connects the first portion 10 and the second portion 20. The flexible heat conductive layer 40 thermally connects the first heat sink 11 and the second heat sink 21. The bent regions 403 of the flexible heat conductive layer 40 correspond to the connection portions 30 and the bent regions of the flexible heat conductive layer 40 are not fixedly connected to the connection portions 30. So, because the bending region 403 of flexible heat conduction layer 40 is not fixedly connected with connecting portion 30, can reduce the stress that the bending region 403 of flexible heat conduction layer 40 receives when buckling like this, consequently flexible heat conduction layer 40 is difficult to produce bubble or fold phenomenon because connecting portion 30 buckle many times, and flexible heat conduction layer 40 is difficult to produce the fault, then can guarantee the ability of the conduction heat of flexible heat conduction layer 40, improves user experience.

It should be noted that the connecting portion 30 can realize the relative rotation of the first portion 10 and the second portion 20. The bending region 403 of the flexible heat conductive layer 40 can bend along with the bending of the connection portion 30.

In some embodiments, a gap 41 is provided between the bent region 403 of the flexible heat conductive layer 40 and the connection portion 30.

It can be understood that the size of the gap 41 left between the bending region 403 of the flexible heat conducting layer 40 and the connection portion 30 can be set according to specific situations, and the setting of the gap 41 can provide a buffer space for the flexible heat conducting layer 40 subjected to bending, so that the stress on the whole flexible heat conducting layer 40 can be more uniform, and wrinkles can be prevented from being generated. Also, since there is a gap 41 between the flexible heat conductive layer 40 and the connection portions 30, it is also possible to prevent the connection portions 30 from contacting the flexible heat conductive layer 40 to wear the flexible heat conductive layer 40.

In some embodiments, the bent regions 403 of the flexible heat conductive layer 40 can contact the connection portions 30 when an external force is applied. When an external force (for example, a pressing force) is applied, the hollow phenomenon is less likely to occur between the bent region 403 of the flexible heat conductive layer 40 and the connection portion 30.

In some embodiments, the bent region 403 of the flexible heat conductive layer 40 can be separated from the connection portion 30 when the external force is removed. Thus, a certain buffer space is provided between the bent region 403 of the flexible heat conductive layer 40 and the connection portion 30, and the occurrence of wrinkles can be reduced to some extent.

In some embodiments, when the flexible electronic device 100 is bent, the bent region 403 of the flexible heat conductive layer 40 slides relative to the connection portion 30. It is understood that the bent regions 403 of the flexible heat conductive layer 40 and the connection portions 30 may be in loose fit.

In some embodiments, the conductive heat quantity of the first heat sink 11 is higher than the conductive heat quantity of the second heat sink 21. In this way, the heat of the first portion 10 can be conducted to the second heat sink 21 via the first heat sink 11 for dissipation.

In some embodiments, the connection portion 30, the first heat sink 11 and the second heat sink 21 are disposed on the same side of the flexible heat conduction layer 40 to facilitate heat dissipation.

In some embodiments, the flexible electronic device 100 includes an adhesive layer 50. The adhesive layer 50 is located between the flexible heat conduction layer 40 and the first and

second heat sinks

11 and 21. The adhesive layer 50 can improve the stability of the flexible heat conduction layer 40 in connecting the first heat sink 11 and the second heat sink 21.

In certain embodiments, the flexible thermally conductive layer 40 includes a first non-bent region 401 and a second non-bent region 402. The bending region 403 connects the first non-bending region 401 and the second non-bending region 402. The first non-bent region 401 corresponds to the first heat sink 11. The second non-bent region 402 corresponds to the second heat radiator 21. The adhesive layer 50 includes a first adhesive layer 61 and a second adhesive layer 62 spaced apart. The first adhesive layer 51 is located between the first non-bent region 401 and the first heat sink 11, and the second adhesive layer 52 is located between the second non-bent region 402 and the second heat sink 21. This can further improve the stability of the arrangement of the flexible heat conductive layer 40.

In some embodiments, flexible electronic device 100 includes support plate 31. The supporting plate 31 is located between the flexible heat conduction layer 40 and the first and

second heat sinks

11 and 21. The first adhesive layer 51 adheres the first non-bent region 401 to one end of the support plate 31. The second adhesive layer 52 adheres the second non-bent area 402 to the other end of the support plate 31. In this way, the support plate 31 can support the flexible heat conducting layer 40, and the support plate 31 can separate the connection portion 30 from the flexible heat conducting layer 40, so that the connection portion 30 can be prevented from wearing the flexible heat conducting layer 40 when being bent, and the flexible heat conducting layer 40 can be protected.

In the present embodiment, the first and

second radiators

11 and 21 are provided on one side of the support plate 31. A flexible heat conductive layer 40 is provided on the other side of the support plate 31. The flexible heat conductive layer 40 is supported by the support plate 31. So, the higher radiator of temperature in first radiator 11 and the second radiator 21 can be with the heat by backup pad 31 conduction to flexible heat-conducting layer 40, then flexible heat-conducting layer 40 can be with the lower radiator of temperature in heat conduction to first radiator 11 and the second radiator 21, then realize the samming heat dissipation.

Preferably, the orthographic area of the support plate 31 on the flexible heat conductive layer 40 substantially covers the flexible heat conductive layer 40 (the size of the support plate 31 may be consistent with the size of the flexible heat conductive layer 40, or the size of the support plate 31 is slightly larger than the size of the flexible heat conductive layer 40), so that the support plate 31 can completely separate the flexible heat conductive layer 40 from the connection portion 30.

In some embodiments, the portion of the flexible heat conductive layer 40 located between the first adhesive layer 61 and the second adhesive layer 62 covers the connection portion 30 in an orthogonal projection of the connection portion 30. The flexible heat conducting layer 40 is not provided with the adhesive layer 50 at the portion facing the connection portion 30, and free bending can be achieved.

In the present embodiment, the bent region 403 covers the connection portion 30 in an orthogonal projection of the connection portion 30.

In some embodiments, the flexible heat conducting layer 40 is made of graphene or graphite. The support plate 31 is made of metal. Thus, the heat conduction effect of the flexible heat conduction layer 40 and the support plate 31 is better. In one example, support plate 31 may be fabricated from sheet metal steel.

In the present embodiment, the adhesive layer 50 bonds the flexible heat conductive layer 40 and the support plate 31. The adhesive layer 50 is located between the flexible heat conductive layer 40 and the support plate 31. The adhesive layer 50 can improve the stability of the flexible heat conduction layer 40 in connecting the support plate 31. Specifically, the first adhesive layer 61 bonds the first non-bent region 401 to one end of the support plate 31, and the second adhesive layer 62 bonds the second non-bent region 402 to the other end of the support plate 31. That is, the support plate 31 is bonded to both end portions of the flexible heat conductive layer 40 by the adhesive layer 50, and the bent region 403 (the middle portion of the flexible heat conductive layer 40) is spaced apart from the support plate 31. Thus, when the flexible electronic device 100 is bent, the bending region 403 is free from the adhesive layer 50, so that the flexible electronic device can be bent freely without wrinkles and blisters, and the uniform temperature heat dissipation capability of the flexible heat conduction layer 40 is not affected.

In some embodiments, the adhesive layer 50 is a double-sided tape. This further improves the stability of the flexible heat conducting layer 40 in connection with the support plate 31.

In some embodiments, the first heat sink 11 is formed with a first groove 111. The second heat radiator 21 is formed with a second recess 211. The first and

second grooves

111 and 211 together form the receiving groove 110. The flexible heat conductive layer 40 is partially or completely received in the receiving cavity 110. In this way, the accommodating groove 110 improves the mounting stability of the flexible heat conduction layer 40, and increases the contact area between the first heat sink 11 and the flexible heat conduction layer 40 and the second heat sink 21. In some embodiments, the first portion 10 includes a main board assembly 12. The main board member 12 is thermally connected to one side of the first heat radiator 11. The second portion 20 includes a battery component 22. The battery part 22 is thermally connected to one side of the second heat radiator 21.

It can be understood that the flexible heat conduction layer 40 is connected to the first heat sink 11 and the second heat sink 21 in a heat conduction manner, the heat of the main board component 12 can be transferred to the second heat sink 21 for heat dissipation through the first heat sink 11 and the flexible heat conduction layer 40, and similarly, the heat of the battery component 22 can also be transferred to the first heat sink 11 for heat dissipation through the second heat sink 21 and the flexible heat conduction layer 40. When the heat generation amount of the main board component 12 or the battery component 22 is large, the heat dissipation area is large, so that the heat can be better dissipated, and further, the local overheating of the flexible electronic device 100 can be prevented, thereby improving the user experience. In particular, since the heat generation amount of the main board member 12 is larger than that of the battery member 22, the flexible heat conductive layer 40 can transfer the heat from the area of the main board member 12 to the area of the battery member 22, thereby achieving a good temperature equalization effect.

The flexible electronic device 100 may be provided in a rectangular parallelepiped shape, for example, as the case may be. The flexible electronic device 100 is capable of being switched between an unfolded state and a folded state. When the flexible electronic device 100 is bent up to approximately 180 degrees (as shown in fig. 2 and 10), the first portion 10 and the second portion 20 substantially overlap, and the spacing between the main board member 12 and the battery member 22 is small, which may result in heat dissipation between the main board member and the battery member being affected if the flexible heat conductive layer 40 is not provided. In the embodiment of the present application, the first heat sink 11 and the second heat sink 21 are located on the same side of the flexible heat conduction layer 40, and the flexible heat conduction layer 40 can increase the heat dissipation area of the main board component 12 and the battery component 22, which is then beneficial to heat dissipation. In addition, "thermally conductively connected" in the present application means that heat exchange can take place between two thermally conductively connected components.

It can be understood that in order to make the first and

second heat radiators

11 and 21 have a large heat dissipation area, the first heat radiator 11 may be shaped like a plate, and the second heat radiator 21 may be shaped like a plate.

In some embodiments, the first heat sink 11 and the second heat sink 21 are entirely close to each other when the flexible electronic device 100 is bent, and are entirely away from each other when the flexible electronic device 100 is unfolded. Even if the main board component 12 and the battery component 22 approach each other when the flexible electronic device 100 is bent, the first heat sink 11 and the second heat sink 21 in combination with the flexible heat conduction layer 40 can dissipate heat generated by the main board component 12 and heat generated by the battery component 22, and when the flexible electronic device 100 is unfolded, the first heat sink 11 and the second heat sink 21 are away from each other as a whole, which is favorable for heat dissipation.

In some embodiments, the flexible heat conduction layer 40 is used for transferring heat between the first heat sink 11 and the second heat sink 21. In the present embodiment, the flexible heat conductive layer 40 is used to transfer heat of the first heat radiator 11 to the second heat radiator 21 and radiate the heat. Thus, the heat generated by the main board component 12 can be dissipated in time, and then the balanced heat dissipation is achieved.

In some embodiments, the flexible heat conductive layer 40 is located on the opposite side of the first heat sink 11 from the main board member 12 and the battery member 22. Thus, the flexible heat conduction layer 40 is fully contacted with the first heat sink 11, so that heat generated by the main board component 12 can be fully dissipated to the flexible heat conduction layer 40 through the first heat sink 11, and the purpose of balanced heat dissipation is achieved.

In the present embodiment, the connection portion 30 is bendable as a whole. The first portion 10 and the second portion 20 are symmetrically disposed at both sides of the connection portion 30. The first and

second portions

10 and 20 are capable of rotating about the connection portion 30 to switch the flexible electronic device 100 between the unfolded state and the folded state.

In the present embodiment, the support plate 31, the adhesive layer 50, and the flexible heat conductive layer 40 are stacked and bonded in this order in the accommodation groove 110. The shape of both ends of the support plate 31 is matched to the shape of the adhesive layer 50. The support plate 31 is located between the adhesive layer 50 and the bottom wall of the receiving groove 110. An adhesive layer 50 is located between the support plate 31 and the flexible heat conductive layer 40. The flexible heat conducting layer 40 is completely received in the receiving cavity 110, and the thickness of the flexible heat conducting layer 40 is smaller than the depth of the receiving cavity 110, so that other components can be received in the receiving cavity 110.

Further, the connecting portion 30 includes a bendable bending member 32 and two bendable connecting members 33 provided on the bending member 32. The bending member 32 connects the first portion 10 and the second portion 20. A first notch 34 is formed on one side of the first groove 111, and a second notch 35 is formed on one side of the second groove 211. The top surface of the bent piece 32 is substantially coplanar with the bottom surfaces of the first and

second grooves

111 and 211. The two connectors 33 are oppositely arranged on two sides of the top surface of the bent piece 32 close to the edge, and the connectors 33 are connected with the edges of the first notch 34 and the second notch 35, that is, the connectors 33 can be connected with the first heat radiator 11 and the second heat radiator 21, and can play a role in heat conduction to a certain extent.

The bending member 32 may be a hinge, for example.

In some embodiments, referring to fig. 6-8, the main board 12 includes a main board 121 and a first chip portion 122. The first chip part 122 includes a first shield case 1221 and a first chip 1222. The first chip 1222 and the first shield case 1221 are disposed on the main board 121. A first shielding 1221 encloses the first chip 1222 and is thermally conductively connected to the first chip 1222. The first shield 1221 is thermally conductively connected to the first heat sink 11. In this way, the heat generated by the first chip 1222 can be dissipated by the first shielding case 1221 being conducted to the first heat sink 11. The first shield 1221 may be used to protect the first chip 1222.

It should be noted that the flexible electronic device 100 may further include a sub-board 124. The main board 121 may be connected to the sub-board 124 through a wire. The sub-board 124 can be provided with a connection port (universal serial bus (USB) port) or a speaker or other electrical device.

In certain embodiments, the first core portion 122 includes a first thermally conductive layer 1223. The first thermally conductive layer 1223 thermally conductively connects the first shield 1221 and the first chip 1222. As such, the first thermally conductive layer 1223 improves the efficiency of thermal conduction between the first chip 1222 and the first shield cover 1221. The first thermally conductive layer 1223 may be, for example, thermally conductive silicone gel or thermally conductive silicone grease.

In some embodiments, the main board component 12 includes a second chip section 123. The second chip part 123 includes a second shield 1231 and a second chip 1232. The second chip portion 123 is disposed on a side of the main board 121 facing away from the first chip portion 122. The second shield 1231 covers the second chip 1232 and is thermally connected to the second chip 1232. The second shield 1231 increases the heat dissipation area of the main board assembly 12 and serves to protect the second chip 1232. The heat dissipation between the first chip part 122 and the second chip part 123 does not affect each other, and the heat dissipation efficiency is improved.

In some embodiments, the second chip portion 123 includes a second thermally conductive layer 1233. The second heat conductive layer 1233 thermally connects the second shield 1231 and the second chip 1232. As such, the second heat conductive layer 1233 improves the efficiency of heat conduction between the second chip 1232 and the second shield cover 1231. The second thermal conductive layer 1233 may be, for example, thermally conductive silicone or thermally conductive silicone grease.

In certain embodiments, the first portion 10 includes a thermally conductive first cover 13. The first cover 13 and the first radiator 11 are connected to form a first mounting cavity 130. The main board member 12 is accommodated in the first mounting cavity 130. The second shield 1231 is thermally conductively coupled to the first cover 13. In this way, the first cover 13 can protect the main board 12 while increasing the heat dissipation area of the main board 12.

In certain embodiments, the first portion 10 includes a third thermally conductive layer 14. The third heat conducting layer 14 thermally conductively connects the second shield 1231 and the first cover 13. In this way, the third heat conduction layer 14 improves the efficiency of heat conduction between the second shield 1231 and the first cover 13. The third layer 14 may be made of graphite material, for example the third layer 14 may be a graphite sheet.

In certain embodiments, the second portion 20 includes a second thermally conductive cover body 23. The second cover 23 and the second radiator 21 are connected to form a second mounting cavity 230. Battery component 22 is located within second mounting cavity 230. The battery part 22 is thermally conductively connected to the second cover 23. In this way, the second lid 23 can protect the battery member 22 while increasing the heat dissipation area of the battery member 22.

It can be understood that, during the bending process of the connecting portion 30, the first cover 13 and the second cover 23 are integrally close to each other, and the distance between the first cover 13 and the second cover 23 is smaller than the distance between the first heat radiator 11 and the second heat radiator 21. Thus, when the connecting portion 30 is bent, the first radiating member 11 and the second radiating member 21 are located outside the first cover body 13 and the second cover body 23, which is more beneficial to heat dissipation.

In certain embodiments, the second portion 20 includes a fourth thermally conductive layer 24. The fourth thermally conductive layer 24 thermally conductively connects the battery component 22 and the second cover 23. In this manner, the fourth heat conduction layer 24 improves the efficiency of heat conduction between the battery part 22 and the second cover 23. The fourth layer 24 may be made of graphite material, for example the fourth layer 24 may be a graphite sheet.

In some embodiments, the flexible electronic device 100 includes a flexible screen assembly 60. A flexible screen assembly 60 is mounted on the flexible heat conductive layer 40. Specifically, the flexible screen assembly 60 is mounted on a side of the flexible heat conduction layer 40 away from the first heat sink and the second heat sink. This, in turn, facilitates heat dissipation from the flexible screen assembly 60.

In this embodiment, the flexible heat conductive layer 40 is located between the flexible screen assembly 60 and the adhesive layer 50.

In some embodiments, flexible screen assembly 60 includes a support frame 61 and a flexible display screen 62. The support brackets 61 are arranged on the side of the flexible heat conducting layer 40 facing away from the first portion 10 and the second portion 20. The flexible display screen 62 is arranged on a side of the support frame 61 facing away from the flexible heat conducting layer 40. Thus, the support frame 61 can improve the overall stability of the flexible screen assembly 60. In one example, the support 61 is a liquid metal support.

The first cover 13 and the second cover 23 form two heat dissipation paths, respectively, that is, the first cover 13 can dissipate heat of the main board component 12, and the second cover 23 can dissipate heat of the battery component 22. When the flexible electronic device 100 is in the unfolded state, the first cover 13 and the second cover 23 do not affect each other, and each of them radiates heat. However, when the flexible electronic device 100 is in the folded state, the first cover 13 and the second cover 23 are close to each other or even contact each other, so that the space for dissipating heat outwards is small, and the heat dissipation efficiency is low. In addition, when the first cover 13 and the second cover 23 are made of a non-heat-conductive material such as plastic, heat dissipation is further affected. In the folded state, the heat is thus dissipated primarily via the additional heat dissipation path, i.e. via the heat dissipation body which is still located on the outside. The heat of main board component 12 is homogenized to the second radiator 21 of battery component 22 through the heat conduction assembly, the heat of battery component 22 and the heat of main board component 12 that transmits over give off through second radiator 21, and the heat of main board component 12 gives off through first radiator 11 simultaneously to ensure holistic radiating efficiency. When the flexible electronic device 100 is in the unfolded state, the first cover 13, the second cover 23, the first heat sink 11 and the second heat sink 21 all function as a main heat dissipation path for heat dissipation.

It will be appreciated that the heat conducting assembly may also comprise only the flexible heat conducting layer 40 (and may comprise the adhesive layer 50), i.e. both heat conducting and support may be provided by the flexible heat conducting layer 40, in which case the support plate 31 may be omitted.

Further, when the connecting portion 30 is made of a metal material, it can also serve as a heat dissipation path for dissipating heat from the battery part 22 and the main board part 12. Namely, the first cover 13, the second cover 23, the heat conducting assembly, the first heat sink 11 and the second heat sink 21 can further transfer heat to the connecting portion 30, and then radiate the heat outwards through the connecting portion 30, so as to further improve the heat dissipation effect.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

A flexible electronic device, comprising:

a first portion including a first heat radiator;

a second portion including a second heat radiator;

a bendable connecting portion connecting the first portion and the second portion;

the flexible heat conduction layer is connected with the first radiator and the second radiator in a heat conduction mode, the bending area of the flexible heat conduction layer corresponds to the connecting portion, and the bending area of the flexible heat conduction layer is not fixedly connected with the connecting portion.
The flexible electronic device according to claim 1, wherein a gap is provided between the bent region of the flexible heat conductive layer and the connection portion.
The flexible electronic device of claim 1, wherein the bent region of the flexible thermal conductive layer is capable of contacting the connection portion when subjected to an external force.
The flexible electronic device of claim 1, wherein the bent region of the flexible thermal conductive layer is capable of separating from the connection portion when the external force is removed.
The flexible electronic device according to claim 1, wherein the bent region of the flexible heat conductive layer slides relative to the connection portion when the flexible electronic device is bent.
The flexible electronic device of claim 1, wherein the first heat spreader has a higher conductive heat capacity than the second heat spreader.
The flexible electronic device of claim 1, wherein the connection portion, the first heat sink, and the second heat sink are disposed on a same side of the flexible heat conductive layer.
The flexible electronic device of claim 1, wherein the flexible electronic device comprises an adhesive layer between the flexible thermally conductive layer and the first and second heat sinks.
The flexible electronic device of claim 8, wherein the flexible thermally conductive layer comprises a first non-bent region and a second non-bent region, the bent region connecting the first non-bent region and the second non-bent region; the first non-bending area corresponds to the first heat radiator, and the second non-bending area corresponds to the second heat radiator;

the bonding layer comprises a first bonding layer and a second bonding layer which are spaced, the first bonding layer is located between the first non-bending area and the first radiator, and the second bonding layer is located between the second non-bending area and the second radiator.
The flexible electronic device of claim 9, wherein the flexible electronic device comprises a support plate positioned between the flexible thermally conductive layer and the first and second heat sinks; the first bonding layer is bonded with the first non-bending area and one end of the support plate, and the second bonding layer is bonded with the second non-bending area and the other end of the support plate.
The flexible electronic device according to claim 9, wherein a portion of the flexible thermal conductive layer between the first adhesive layer and the second adhesive layer covers the connection portion in an orthographic projection of the connection portion.
The flexible electronic device of claim 8, wherein the adhesive layer is a double-sided adhesive tape.
The flexible electronic device according to claim 10, wherein the flexible heat conducting layer is made of a graphene material or a graphite material, and the supporting plate is made of a metal.
The flexible electronic device of claim 1, wherein the flexible thermally conductive layer is to transfer heat between the first heat sink and the second heat sink.
The flexible electronic device of claim 1, wherein the first heat sink is formed with a first recess, the second heat sink is formed with a second recess, the first recess and the second recess together form a receiving slot, and the flexible heat conducting layer is partially or completely received in the receiving slot.
The flexible electronic device of claim 1, wherein the first portion comprises a motherboard component thermally coupled to a side of the first heat sink, the second portion comprises a battery portion thermally coupled to a side of the second heat sink, and the flexible thermally conductive layer is on an opposite side of the first heat sink from the motherboard component and the battery component.
The flexible electronic device of claim 16, wherein the motherboard component comprises a motherboard and a first chip portion, the first chip portion comprising a first shield can and a first chip, the first chip and the first shield can being disposed on the motherboard, the first shield can housing the first chip and being thermally coupled to the first chip, the first shield can being thermally coupled to the first heat sink.
The flexible electronic device of claim 17, wherein the motherboard component includes a second chip section including a second shielding cage and a second chip, the second core section being disposed on a side of the motherboard facing away from the first chip section, the second shielding cage housing the second chip and being thermally conductively coupled to the second chip.
The flexible electronic device of claim 17, wherein the first chip portion comprises a first thermally conductive layer that thermally conductively connects the first shield can and the first chip.
The flexible electronic device of claim 18, wherein the second chip portion comprises a second thermally conductive layer thermally connecting the second shield can and the second chip.
The flexible electronic device according to claim 18, wherein the first portion comprises a thermally conductive first cover, the first cover and the first heat sink are coupled and together form a first mounting cavity, the motherboard component is located in the first mounting cavity, and the second shield is thermally coupled to the first cover.
The flexible electronic device of claim 21, wherein the first portion comprises a third thermally conductive layer thermally coupling the second shield and the first cover.
The flexible electronic device of claim 1, wherein the second portion comprises a thermally conductive second cover, the second cover and the second heat sink being coupled and collectively forming a second mounting cavity, the battery component being located within the second mounting cavity, the battery component being thermally coupled to the second cover.
The flexible electronic device of claim 23, wherein the second portion comprises a fourth thermally conductive layer that thermally conductively connects the battery component and the second cover.
The flexible electronic device of claim 1, wherein the electronic device comprises a flexible screen assembly mounted on the flexible thermally conductive layer.