WO2016077993A1

WO2016077993A1 - Led light strip and led television

Info

Publication number: WO2016077993A1
Application number: PCT/CN2014/091408
Authority: WO
Inventors: 何素华
Original assignee: 何素华
Priority date: 2014-11-18
Filing date: 2014-11-18
Publication date: 2016-05-26

Abstract

An LED strip and LED television, the LED light strip comprising: a circuit board (1) and at least an LED chipset (2) provided on the circuit board. The LED chipset comprises at least two LED chips (21) and a transparent glue layer (22) covering the LED chip. A side of the circuit board provided with the LED chip is covered with a thermally conductive insulation layer (3) adhering to the LED chip. The LED chip is directly provided on the circuit board, simplifying manufacture process steps, and improving production efficiency; the heat generated by the LED chip is directly transferred to the circuit board for dissipation, thus reducing heat dissipation thermal resistance, improving dissipation efficiency, avoiding the occurrence of problems such as serious light attenuation and discoloring, and improving the quality of the LED strip and television.

Description

LED light bar and LED TV

Technical field

The present application relates to the field of light emitting diodes, and more particularly to an LED light bar and an LED television.

Background technique

Light Emitting Diode (LED) is widely used in the field of backlights. It has a subversive advantage in color reproduction, life and response speed, and has become the main backlight of LCD TVs. At present, the "LED module" has a rectangular shape, so the industry is also called an LED light bar. The LED light bar is composed of a chip type LED and a connector mounted on a printed circuit board (PCB) board. The PCB board has different types such as FR-4, CEM-3 and aluminum substrate, and the shape of the LED is also different. In the package form, the existing LED light bar comprises a PCB board, and the chip type LED is electrically connected to the PCB board. Specifically, the chip type LED is electrically connected to the PCB board by solder paste reflow mounting. In order to meet the requirements of backlight brightness, SMD LEDs generally use high-power LEDs. The existing LED strips have at least the following problems:

1. Long manufacturing cycle and high cost: When manufacturing the LED light bar, it is necessary to first produce a chip type LED, and then solder the LED on the PCB board, the manufacturing process is cumbersome, the manufacturing cycle is long, and the required cost is high;

2, poor heat dissipation: Because the SMD LED is directly soldered on the PCB, when the heat generated by the SMD LED is transferred to the PCB through the LED bracket, and then transferred to the heat sink set on the PCB, The heat dissipation of the heat dissipation is large, and the problem of light decay and color drift is easily generated, thereby affecting the quality of the LCD television image.

Summary of the invention

The present application aims to solve at least one of the above technical problems to some extent.

According to a first aspect of the present application, the present application provides an LED light bar comprising: a circuit board and at least one LED chip set disposed on the circuit board, the LED chip set including at least two LED chips and covering a transparent adhesive layer on the LED chip, wherein the LED chip is disposed on one side of the LED chip with a thermal conductive insulating layer attached to the LED chip.

Further, the thermally conductive insulating layer is made of graphene, alumina thermal conductive rubber or boron nitride thermal conductive rubber material.

Further, a heat sink is disposed on the opposite side of the LED chip of the circuit board.

Further, the thermally conductive insulating layer is provided with an extension that is in contact with the heat sink.

Further, a through hole for the extension portion to pass through is formed on the circuit board.

Further, the transparent adhesive layer is a fluorescent adhesive layer.

Further, the LED chip set includes 2, 3, 4 or 5 of the LED chips.

According to a second aspect of the present application, the present application provides an LED television comprising: a display screen provided with a plurality of LED light strips, the LED light strip comprising: a circuit board and at least one LED chip disposed on the circuit board The LED chipset includes at least two LED chips and a transparent adhesive layer covering the LED chip, and the LED chip is disposed on one side of the LED chip and is thermally insulated from the LED chip. Floor.

Further, the transparent adhesive layer is a fluorescent adhesive layer.

Further, the LED chip set includes 2, 3, 4 or 5 of the LED chips.

The beneficial effects of the application are:

By providing an LED strip and an LED television, the LED strip includes: a circuit board and at least one LED chip set disposed on the circuit board, the LED chip set including at least two LED chips and covering the LED A transparent adhesive layer on the chip, wherein the LED chip is disposed on one side of the LED chip with a thermal conductive insulating layer attached to the LED chip. In this way, the LED chip is directly disposed on the circuit board, which simplifies the manufacturing process and improves the production efficiency; the heat generated by the LED chip is directly transmitted to the circuit board, which reduces the heat dissipation resistance, improves the heat dissipation efficiency, and avoids occurrence of The problem of large light decay and color drift improves the quality of LED strips and TVs.

DRAWINGS

FIG. 1 is a schematic structural view of an LED light bar according to an embodiment of the present application.

[Corrected in accordance with Rule 91 12.12.2014]
2 is a schematic cross-sectional view of an LED light bar according to an embodiment of the present application.

detailed description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position of indications such as "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. It is not to be construed as limiting the application.

In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying that they are relatively important. Sexually or implicitly indicates the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

In the present application, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.

The present application will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1-2, the embodiment provides an LED television, which includes: a display screen provided with a plurality of LED light bars, and further includes other conventional components, such as a power supply, a casing, a control circuit board, and the like. The display usually also has a panel and an LED strip, and the light emitted by the LED strip presents an image through the panel.

The LED light bar mainly includes: a circuit board 1 and at least one LED chip set 2 disposed on the circuit board 1. The LED chip set 2 includes at least two LED chips 21 and a transparent adhesive layer 22 covering the LED chip 21, and the circuit The LED chip 21 of the board 1 is covered with a thermally conductive insulating layer 3 attached to the LED chip 21.

In this way, the LED chip is directly disposed on the circuit board, which simplifies the manufacturing process and improves the production efficiency; the heat generated by the LED chip is directly transmitted to the circuit board, which reduces the heat dissipation resistance, improves the heat dissipation efficiency, and avoids occurrence of The problem of large light decay and color drift improves the quality of LED strips and TVs. In addition, the thermal conductive insulating layer 3 further guides the heat dissipation of the LED chip on the basis of the signal and the power supply of the LED chip, thereby further enhancing the heat dissipation function.

Specifically, the thermally conductive insulating layer 3 may be made of a material such as graphene, alumina thermal conductive rubber or boron nitride thermal conductive rubber. In addition, in order to facilitate the bonding wire of the LED chip, a corresponding wire bonding hole may be disposed on the heat conductive insulating layer.

As a preferred embodiment, the heat sink 6 is disposed on the opposite side of the LED chip 21 of the circuit board 1 to enhance heat dissipation.

As another preferred embodiment, the thermally conductive insulating layer 3 is provided with an extension that is in contact with the heat sink described above. The thermal conductive insulating layer may be connected to the heat sink through the middle of the circuit board, or may be bent from the edge of the circuit board to be connected to the heat sink. When the middle portion of the circuit board is connected with the heat sink, the circuit board may be provided with an extension for wearing Through hole.

In specific applications, the transparent adhesive layer is a fluorescent adhesive layer, and the colloid may be a silica gel or the like. The LED chipset 2 may include 2, 3, 4 or 5 LED chips 21, and the number may be selected according to actual conditions.

In the description of the present specification, reference is made to the descriptions of the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" The specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

The above content is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For the ordinary person skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims

An LED light bar comprising: a circuit board and at least one LED chip set disposed on the circuit board, the LED chip set comprising at least two LED chips and a transparent adhesive layer covering the LED chip, The LED chip is disposed on one side of the circuit board to cover a thermal conductive insulating layer attached to the LED chip.
The LED light bar of claim 1 wherein said thermally conductive insulating layer is made of graphene, alumina thermally conductive rubber or boron nitride thermally conductive rubber material.
The LED light bar of claim 1 wherein said circuit board is provided with a heat sink on an opposite side of said LED chip.
The LED light bar of claim 3 wherein said thermally conductive insulating layer is provided with an extension that interfaces with said heat sink.
The LED light bar of claim 4, wherein the circuit board is provided with a through hole through which the extension portion passes.
The LED light bar according to any one of claims 1 to 5, wherein the transparent adhesive layer is a fluorescent adhesive layer.
The LED light bar of any of claims 1 to 5, wherein the LED chip set comprises 2, 3, 4 or 5 of the LED chips.
An LED television comprising: a display screen provided with a plurality of LED strips, the LED strip comprising: a circuit board and at least one LED chip set disposed on the circuit board, the LED chip set comprising at least two The LED chip and the transparent adhesive layer covering the LED chip are characterized in that the LED chip of the circuit board is covered with a thermal conductive insulating layer attached to the LED chip.
The LED television according to claim 8, wherein said thermally conductive insulating layer is made of graphene, alumina thermally conductive rubber or boron nitride thermally conductive rubber material.
The LED television of claim 8, wherein the circuit board is provided with a heat sink on an opposite side of the LED chip.