CN101191949A - Backlight module and LCD device - Google Patents
Backlight module and LCD device Download PDFInfo
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- CN101191949A CN101191949A CNA2006101631143A CN200610163114A CN101191949A CN 101191949 A CN101191949 A CN 101191949A CN A2006101631143 A CNA2006101631143 A CN A2006101631143A CN 200610163114 A CN200610163114 A CN 200610163114A CN 101191949 A CN101191949 A CN 101191949A
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- metal backing
- insulation course
- emitting diode
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Abstract
The invention provides a backlight module, comprising a metal backboard, an insulating barrier, a metal routing layer and at least one LED, wherein, the metal backboard is provided with a right side; the insulating barrier is arranged on the right side of the metal backboard; the metal routing layer is arranged on the right side of the metal backboard and is positioned on the insulating barrier; at least one LED is arranged on the right side of the metal backboard; the LED is coupled with the metal routing layer.
Description
Technical field
The present invention relates to a kind of backlight module and use its liquid crystal indicator, relate in particular to and a kind ofly can effectively improve radiating efficiency, the light-emitting diode (LED) backlight module of stabilized light source is provided and uses its liquid crystal indicator.
Background technology
Light emitting diode (light emitting diode, LED) luminescence efficiency has breakthrough progress in recent years, but but owing to have high color rendering, low driving voltage, no mercury, do not radiate the ultraviolet ray fast lighting and start, adopt multiple advantages such as the not easily broken dynamic regulation colourity of solid-state encapsulation, thereby be regarded as the optimal selection of light source of new generation.Yet the application of LED often is accompanied by a large amount of heat and produces, and variation of temperature influences the performance of briliancy, colourity and the efficient of LED.Therefore, affect to the key to the issue of heat radiation the application of LED in backlight module.On the other hand, (cold cathode fluorescent lamp, it is still higher CCFL) to compare price because LED is with cathode fluorescent tube that tradition is adopted.Therefore reduce material and use saving cost, very important in as the backlight module of light source with LED.
Please refer to Fig. 1, it illustrates conventional LED light-source module synoptic diagram.Light source module 10 comprises metal backing 1, circuit board 2, light emitting diode 3, lead 4 and radiating fin 5.Wherein circuit board 2 also comprises metal routing layer 6, base material 7 and insulation course 9, and insulation course 9 is arranged on the base material 7, and metal routing layer 6 is arranged on the insulation course 9.Light emitting diode 3 is arranged on the circuit board 2, and 2 of circuit boards are arranged on the metal backing 1.Generally for the consideration of dispelling the heat, circuit board 2 adopts metal-cored circuit board mostly, and (metal core printed circuit board, MCPCB), that is base material 7 is metal material, as silver or copper.Electrically connect by lead 4 again between different light emitting diodes 3 and the circuit board 2.On the back side of metal backing 1 radiating fin 5 is set in addition, in order to increase surface area to improve radiating efficiency.Because light emitting diode 3 must just can conduct the heat on the metal backing 1 by circuit board 2.The flatness of ifs circuit plate 2 or metal backing 1 is not good, causes having the space between two surface of contact, will cause great heat conduction impedance.And general light emitting diode is very responsive for temperature, in case surpass the proper temperature scope, can cause the reduction of light extraction efficiency, even influence life of product.And the light emitting diode of different colours, Yin Wendu raise and the degree difference that causes light extraction efficiency to reduce, will cause the colour temperature of originally adjusting to change, and influence the display quality of display.
Commonly used to promote the mode of heat dissipation, be the base material 7 that heat that light emitting diode 3 is produced is directed at circuit board 2 fast, by metal backing 1 and radiating fin 5 heat is shed again.At the insulating radiation glue 8 of filling high heat conduction between light emitting diode 3 and the circuit board 2 and between circuit board 2 and the metal backing 1, avoid contact interface to form the air heat-insulation layer of high thermal resistance in addition.But highly heat-conductive material is quite expensive, uses this material not only to increase process complexity, and is also quite unfavorable to the control of cost.And light emitting diode 3 causes cost to increase each other with lead 4 polyphones easily, and reduces production reliability because of lead 4 damages easily.
Summary of the invention
In view of this, purpose of the present invention is exactly a kind of backlight module to be provided and to use its liquid crystal indicator, giving up the use of metal-cored circuit board (MCPCB), the metal routing layer is set directly on the metal backing.Light emitting diode is arranged on the metal routing layer and couples with it, the function that just can utilize metal backing to replace the metal base of virgin metal core circuit board like this, but the heat that light emitting diode is produced is directed at metal backing apace.Because metal-cored circuit board price is very expensive, the present invention can significantly reduce production costs and can reduce module thickness.In addition, because significantly reduce the use of thermal paste material, add metal routing layer all light emitting diode of can directly connecting, and do not need additionally to be provided with lead to connect.The present invention has improved the radiating efficiency of light emitting diode greatly, reduces production costs.
According to first purpose of the present invention, a kind of backlight module is proposed, comprise metal backing, insulation course, metal routing layer and at least one light emitting diode.Metal backing has a front, and insulation course is arranged on the front of metal backing.The metal routing layer is arranged on the front of metal backing and is positioned on the insulation course, and at least one light emitting diode is arranged on the front of metal backing, and light emitting diode couples the metal routing layer.
According to second purpose of the present invention, a kind of backlight module is proposed, comprise metal backing, light guide plate, insulation course, metal routing layer and at least one light emitting diode.Metal backing has front and opening, and light guide plate is arranged at opening part and has the side, and the side is towards the front.Insulation course is arranged on the front of metal backing, and the metal routing layer is arranged on the front of metal backing and is positioned on the insulation course.Light emitting diode is arranged on the front of metal backing, and light emitting diode couples the metal routing layer.
According to the 3rd purpose of the present invention, a kind of liquid crystal indicator is proposed, comprise backlight module and display panels.Backlight module comprises metal backing, insulation course, metal routing layer and at least one light emitting diode.Metal backing has the front, and insulation course is arranged on the front of metal backing.The metal routing layer is arranged on the front of metal backing and is positioned on the insulation course, and light emitting diode is arranged on the front of metal backing, and light emitting diode couples the metal routing layer.Display panels is arranged on the backlight module, and is positioned on the light emitting diode.
According to the 4th purpose of the present invention, a kind of liquid crystal indicator is proposed, comprise backlight module and display panels.Backlight module comprises metal backing, light guide plate, insulation course, metal routing layer and at least one light emitting diode.Metal backing has front and opening.Light guide plate is arranged at opening part, and has side and end face, and the side is towards the front.Insulation course is arranged on the front of metal backing, and the metal routing layer is arranged on the front of metal backing and is positioned on the insulation course.Light emitting diode is arranged on the front of metal backing, and light emitting diode couples the metal routing layer.Display panels is arranged on the backlight module, and is positioned on the end face.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Fig. 1 illustrates conventional LED light-source module synoptic diagram;
Fig. 2 illustrates a kind of synoptic diagram with liquid crystal indicator of direct type backlight module of the embodiment of the invention one;
Fig. 3 A～Fig. 3 D illustrates the layering synoptic diagram of first kind of the present invention～4th kind of metal backing, insulation course and metal routing layer respectively; And
Fig. 4 illustrates a kind of synoptic diagram with liquid crystal indicator of side light type back light module of the embodiment of the invention two.
The Reference numeral simple declaration
1,110,210,310: metal backing
2: circuit board
3,140,240: light emitting diode
4: lead
5,112,212: radiating fin
6,130,230: the metal routing layer
7: base material
8: insulating radiation glue
9,120,220: insulation course
10: light source module
100,200: liquid crystal indicator
114,214: the front
116,216: the back side
145,245: backlight module
150,252: blooming piece
160,260: display panels
162,262: go up polaroid
164,264: following polaroid
170: lower frame
180,270: upper ledge
250: light guide plate
254: reflector plate
256: the side
257: end face
258: the back side
280: back of the body frame
320: copper foil layer
330: viscose
The 340:FR/CEM substrate
Embodiment
Purpose of the present invention is to propose a kind of LED light-source module, and the metal routing layer is set directly on the metal backing, and light emitting diode is arranged on the metal routing layer and with the metal routing layer and couples, to finish electric connection and to carry out the signal transmission.Simultaneously, by the good thermal conductivity of metal backing, the heat that light emitting diode produced can be overflowed fast, reliably keeps the luminescence efficiency of light emitting diode.As for detailed embodiment, below elaborate respectively at each embodiment.
Embodiment one
Please refer to Fig. 2, it illustrates a kind of synoptic diagram with liquid crystal indicator of direct type backlight module of the embodiment of the invention one.Liquid crystal indicator 100 comprises backlight module 145, display panels 160, upper ledge 180 and lower frame 170.Backlight module 145 comprises metal backing 110, insulation course 120, metal routing layer 130 and light emitting diode 140.Metal backing 110 has front 114, and insulation course 120 is arranged on the front 114 of metal backing 110.Metal routing layer 130 is arranged on the front 114 of metal backing 110 and is positioned on the insulation course 120, and light emitting diode 140 is arranged on the front 114 of metal backing 110, and light emitting diode 140 couples metal routing layer 130.Display panels 160 is arranged on the backlight module 145, and is positioned on the light emitting diode 140.Upper ledge 180 and lower frame 170 insert and put display panels 160 and connect metal backing 110.
Yet, the general technical staff of the technical field of the invention, technology of the present invention as can be known is not limited thereto.For example, insulation course 120 can comprise glass fabric epoxy resin base plate, composite epoxy resin substrate, insulating radiation glue or the combination of above-mentioned material.
In addition, metal backing 110 also has the back side 116, and the back side 116 is relative with positive 114.The material of metal backing 110 can be aluminium or zinc, or other has the metal material of high-cooling property.Backlight module 145 also comprises radiating fin 112, and radiating fin 112 is arranged on the back side 116 of metal backing 110.Radiating fin 112 can be a same material with metal backing 110, also can be different materials.
In addition, liquid crystal indicator 100 also comprises blooming piece 150, and blooming piece 150 is folded between metal backing 110 and the lower frame 170 and is positioned on the light emitting diode 140.Blooming piece 150 can be a prismatic lens, a diffusion sheet or a reflective bright enhancement film (DBEF), can also be the combination of multi-disc prismatic lens, diffusion sheet or reflective bright enhancement film.Liquid crystal indicator 100 comprises that also polaroid 162 and following polaroid 164 are attached at respectively on the end face and the back side of display panels 160, upper ledge 180 and lower frame holding liquid crystal display panel 160 170 about, go up polaroid 162 and polaroid 164 down, and go up polaroid 162 and under the light penetrating shaft direction of polaroid 164 vertical mutually.
In addition, please refer to Fig. 3 A～3D, it illustrates the layering synoptic diagram of first kind of the present invention～4th kind of metal backing, insulation course and metal routing layer respectively.As shown in Figure 3A, copper foil layer 320 is arranged on the metal backing 310 with viscose 330, and copper foil layer 320 can be handled and form cabling (layout); Wherein copper foil layer 320 is metal routing layer 130 wherein a kind of among Fig. 2, and viscose 330 is insulating radiation glue 124 wherein a kind of among Fig. 2.Shown in Fig. 3 B, two copper foil layers 320 with viscose 330 in conjunction with after, be arranged on the metal backing 310 with viscose 330 again; Owing to have a two-layer copper foil layer 320, by the conductive through hole that runs through viscose 330 (via) mutual conduction and can form more complicated cabling and connect.Shown in Fig. 3 C, with copper foil layer 320 be arranged at the glass fabric epoxy resin base plate (fier reinforced, FR)/(composite epoxy materials CEM) on 340, is arranged on the metal backing 310 with viscose 330 the composite epoxy resin substrate again.FR/CEM substrate 340 has high-k, can improve insulativity, avoids the cabling on the copper foil layer 320 to be interfered.Shown in Fig. 3 D, two copper foil layers 320 are arranged at the two sides of FR/CEM substrate 340 respectively, be arranged on the metal backing 310 with viscose 330 again; Except two-layer copper foil layer 320 can lay out the more complicated cabling, FR/CEM substrate 340 also can avoid the cabling on the two-layer copper foil layer 320 to interfere with each other.
Embodiment two
Please refer to Fig. 4, it illustrates a kind of synoptic diagram with liquid crystal indicator of side light type back light module of the embodiment of the invention two.Liquid crystal indicator 200 comprises backlight module 245, display panels 260, back of the body frame 280 and upper ledge 270.Backlight module 245 comprises metal backing 210, light guide plate 250, insulation course 220, metal routing layer 230 and light emitting diode 240.Metal backing 210 has front 214 and opening.Light guide plate 250 is arranged at opening part, and has side 256 and end face 257, and side 256 is towards positive 214.Insulation course 220 is arranged on the front 214 of metal backing 210, and metal routing layer 230 is arranged on the front 214 of metal backing 210 and is positioned on the insulation course 220.Light emitting diode 240 is arranged on the front 214 of metal backing 210, and light emitting diode 240 couples metal routing layer 230.Display panels 260 is arranged on the backlight module 245, and is positioned on the end face 257.The back of the body frame 280 and upper ledge 270 can adopt snapping, clamping or the mode that is spirally connected connects.
The general technical staff of the technical field of the invention, technology of the present invention as can be known is not limited thereto.For example, insulation course 220 comprises glass fabric epoxy resin base plate, composite epoxy resin substrate, insulating radiation glue or the combination of above-mentioned material.
In addition, metal backing 210 also has the back side 216, and the back side 216 is relative with positive 214, and radiating fin 212 is arranged on the back side 216 of metal backing 210.Radiating fin 212 can be a same material with metal backing 210, or different materials.
In addition, liquid crystal indicator 200 also comprises blooming piece 252, and blooming piece 252 is arranged on the end face 257 of light guide plate 250, and is positioned under the display panels 260.Blooming piece 252 can be a prismatic lens, a diffusion sheet or a reflective bright enhancement film, or the combination of multi-disc prismatic lens, diffusion sheet or reflective bright enhancement film.Reflector plate 254 is arranged on the bottom surface 258 of light guide plate 250, and bottom surface 258 is relative with end face 257, and side 256 connects end face 257 and bottom surface 258.The material of metal backing 210 is aluminium or zinc, or other has the metal material of good heat radiating efficient.Polaroid 264 was attached at respectively on the end face and the back side of display panels 260 under last polaroid 262 reached, and the light penetrating shaft direction of polaroid 264 was vertical mutually under upward polaroid 262 reached.Back of the body frame 280 and upper ledge clamping metal backing 210, light guide plate 250, reflector plate 254, blooming piece 252, display panels 260 270 about, go up polaroid 262 and under polaroid 264.
In addition, the metal backing 210 of present embodiment also can form the insulation course and the metal routing layer of different structure as a series of set-up modes of Fig. 3 A-3D among the embodiment one according to application target.
The disclosed backlight module of the above embodiment of the present invention and use its liquid crystal indicator, change the structure of traditional LED light-source module, the metal routing layer is set directly on the metal backing, and light emitting diode is arranged on the metal routing layer and couples with it.Because metal-cored circuit board costs an arm and a leg, the omission of metal-cored circuit board can significantly reduce cost and can reduce module thickness.And because significantly reduce the use of thermal paste material, add metal routing layer all light emitting diode of can directly connecting, connect and do not need additionally to be provided with lead.The present invention has improved the radiating efficiency of light emitting diode greatly, reduces production costs.
In sum, though the present invention discloses as above with a preferred embodiment, so it is not in order to limit the present invention.The general technical staff of the technical field of the invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (10)
1. backlight module comprises:
Metal backing has the front;
Insulation course is arranged on this front of this metal backing;
The metal routing layer is arranged on this front of this metal backing and is positioned on this insulation course; And
At least one light emitting diode is arranged on this front of this metal backing, and this light emitting diode couples this metal routing layer.
2. backlight module as claimed in claim 1, wherein this insulation course is glass fabric epoxy resin base plate or composite epoxy resin substrate.
3. backlight module as claimed in claim 1, wherein this insulation course also comprises insulating radiation glue.
4. backlight module comprises:
Metal backing has front and opening;
Light guide plate is arranged at this opening part, and has the side, and this side is towards this front;
Insulation course is arranged on this front of this metal backing;
The metal routing layer is arranged on this front of this metal backing and is positioned on this insulation course; And
At least one light emitting diode is arranged on this front of this metal backing, and this light emitting diode couples this metal routing layer.
5. backlight module as claimed in claim 4, wherein this insulation course is glass fabric epoxy resin base plate or composite epoxy resin substrate.
6. backlight module as claimed in claim 4, wherein this insulation course also comprises insulating radiation glue.
7. liquid crystal indicator comprises:
Backlight module comprises:
Metal backing has the front;
Insulation course is arranged on this front of this metal backing;
The metal routing layer is arranged on this front of this metal backing and is positioned on this insulation course;
And
At least one light emitting diode is arranged on this front of this metal backing, and this light emitting diode couples this metal routing layer; And
Display panels is arranged on this backlight module, and is positioned on this light emitting diode.
8. liquid crystal indicator as claimed in claim 7, wherein this insulation course is glass fabric epoxy resin base plate or composite epoxy resin substrate.
9. liquid crystal indicator as claimed in claim 7, wherein this insulation course also comprises insulating radiation glue.
10. liquid crystal indicator comprises:
Backlight module comprises:
Metal backing has front and opening;
Light guide plate is arranged at this opening part, and has side and end face, and this side is towards this front;
Insulation course is arranged on this front of this metal backing;
The metal routing layer is arranged on this front of this metal backing and is positioned on this insulation course;
And
At least one light emitting diode is arranged on this front of this metal backing this light emitting diode
Couple this metal routing layer; And
Display panels is arranged on this backlight module, and is positioned on this end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101631143A CN101191949A (en) | 2006-11-30 | 2006-11-30 | Backlight module and LCD device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101631143A CN101191949A (en) | 2006-11-30 | 2006-11-30 | Backlight module and LCD device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101191949A true CN101191949A (en) | 2008-06-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101631143A Pending CN101191949A (en) | 2006-11-30 | 2006-11-30 | Backlight module and LCD device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101191949A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101441340B (en) * | 2008-12-17 | 2010-06-02 | 友达光电股份有限公司 | Method for fixing plane display device and circuit board |
| CN101737641A (en) * | 2008-11-11 | 2010-06-16 | 奇美电子股份有限公司 | Light-emitting diode light source module and application thereof |
| CN101968207A (en) * | 2010-07-30 | 2011-02-09 | 南京中电熊猫液晶显示科技有限公司 | Directly-stuck LED backlight source back board |
| CN103543559A (en) * | 2013-11-05 | 2014-01-29 | 深圳市华星光电技术有限公司 | Direct type backlight module |
| CN103925518A (en) * | 2013-12-16 | 2014-07-16 | 上海天马微电子有限公司 | Backlight module and liquid crystal display device |
| CN104848084A (en) * | 2012-03-29 | 2015-08-19 | 乐金显示有限公司 | Backlight assembly and liquid crystal display device using the same |
| CN105739174A (en) * | 2016-02-04 | 2016-07-06 | 京东方科技集团股份有限公司 | Backlight module and display device with same |
| WO2019134198A1 (en) * | 2018-01-04 | 2019-07-11 | 惠州市华星光电技术有限公司 | Backplate, backlight module, and liquid crystal display device |
| CN114236903A (en) * | 2021-11-24 | 2022-03-25 | 安徽四季电子科技有限公司 | Direct type backlight source and preparation method thereof |
| CN115390314A (en) * | 2022-09-16 | 2022-11-25 | 合肥京东方瑞晟科技有限公司 | Backlight module, display module and display device |
-
2006
- 2006-11-30 CN CNA2006101631143A patent/CN101191949A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101737641A (en) * | 2008-11-11 | 2010-06-16 | 奇美电子股份有限公司 | Light-emitting diode light source module and application thereof |
| CN101737641B (en) * | 2008-11-11 | 2013-07-31 | 群创光电股份有限公司 | Light-emitting diode light source module and application thereof |
| CN101441340B (en) * | 2008-12-17 | 2010-06-02 | 友达光电股份有限公司 | Method for fixing plane display device and circuit board |
| CN101968207A (en) * | 2010-07-30 | 2011-02-09 | 南京中电熊猫液晶显示科技有限公司 | Directly-stuck LED backlight source back board |
| CN104848084A (en) * | 2012-03-29 | 2015-08-19 | 乐金显示有限公司 | Backlight assembly and liquid crystal display device using the same |
| CN103543559A (en) * | 2013-11-05 | 2014-01-29 | 深圳市华星光电技术有限公司 | Direct type backlight module |
| US9304353B2 (en) | 2013-11-05 | 2016-04-05 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Direct backlight module |
| CN103543559B (en) * | 2013-11-05 | 2016-11-02 | 深圳市华星光电技术有限公司 | Down straight aphototropism mode set |
| CN103925518A (en) * | 2013-12-16 | 2014-07-16 | 上海天马微电子有限公司 | Backlight module and liquid crystal display device |
| CN105739174A (en) * | 2016-02-04 | 2016-07-06 | 京东方科技集团股份有限公司 | Backlight module and display device with same |
| WO2019134198A1 (en) * | 2018-01-04 | 2019-07-11 | 惠州市华星光电技术有限公司 | Backplate, backlight module, and liquid crystal display device |
| CN114236903A (en) * | 2021-11-24 | 2022-03-25 | 安徽四季电子科技有限公司 | Direct type backlight source and preparation method thereof |
| CN115390314A (en) * | 2022-09-16 | 2022-11-25 | 合肥京东方瑞晟科技有限公司 | Backlight module, display module and display device |
| CN115390314B (en) * | 2022-09-16 | 2024-06-07 | 合肥京东方瑞晟科技有限公司 | Backlight module, display module and display device |
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Open date: 20080604 |