CN114236903A - Direct type backlight source and preparation method thereof - Google Patents
Direct type backlight source and preparation method thereof Download PDFInfo
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- CN114236903A CN114236903A CN202111400557.0A CN202111400557A CN114236903A CN 114236903 A CN114236903 A CN 114236903A CN 202111400557 A CN202111400557 A CN 202111400557A CN 114236903 A CN114236903 A CN 114236903A
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- 238000002360 preparation method Methods 0.000 title abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims description 48
- 238000005476 soldering Methods 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000000178 monomer Substances 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000010023 transfer printing Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 239000005028 tinplate Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 18
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000011324 bead Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007731 hot pressing Methods 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
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Abstract
The invention relates to the technical field of display, and provides a direct type backlight source and a preparation method thereof. The direct type backlight includes: the LED backlight module comprises a backlight substrate, a plurality of single lamp sources and a plurality of heat conduction channels, wherein the single lamp sources and the heat conduction channels are arranged on the backlight substrate; the heat conduction channels are arranged in one-to-one correspondence with the single lamp sources, and the single lamp sources are arranged on the backlight substrate in an array manner and are connected with the backlight substrate through the heat conduction channels; different single lamp sources are connected in series or in parallel. The backlight source has the advantages that the utilization rate of the backlight source is improved, and meanwhile, the heat dissipation effect of the single lamp source is effectively improved, so that the display effect of the LCD panel is improved. The preparation method is used for realizing the direct type backlight source, and introduces the series welding and one-time wiring process, thereby not only realizing the effective preparation of the backlight source, but also being beneficial to realizing the simplification of the preparation process and the replacement of any single lamp source in the later period.
Description
Technical Field
The invention relates to the technical field of display, in particular to a direct type backlight source and a preparation method thereof.
Background
With the development of display technology, various new generation display panels, such as OLED panels and QLED panels, gradually occupy larger and larger market shares due to the advantages of wider color gamut, higher refresh frequency and lower energy consumption. However, due to the influence of the manufacturing process and the lifetime of the device, the LCD panel still has an absolute leading position in the fields of large-size display and super-large-size display.
The LCD panel is a passive light emitting type panel, and light emission is realized by means of a backlight source. The existing backlight sources are mainly divided into a side-in type backlight source and a direct type backlight source, wherein the direct type backlight source has wide and important application in LCD panels with various sizes, particularly large-size and oversized LCD panels due to better light-emitting uniformity.
The existing direct type backlight source base structure comprises a backlight substrate and a plurality of LED lamp strips arranged on the backlight substrate. However, due to the influence of high integration of the LED light bars, when one LED light bead is damaged, the whole LED light bar needs to be replaced, which results in a low utilization rate of the backlight light source and a high cost of the light source of the LCD panel. And the LED lamp beads can generate a large amount of heat in the working process, and the heat dissipation effect of the LED lamp beads can influence the light attenuation rate of the backlight source and the light emitting uniformity of the LCD panel. However, the flexible carrier on the existing LED lamp strip forms a blocking structure between the LED lamp bead and the backlight substrate, so that the heat dissipation effect of the LED lamp bead is affected.
Disclosure of Invention
The invention aims to provide a direct type backlight source, which is arranged on the basis of a plurality of independent single lamp sources, and a heat conduction channel is arranged between each single lamp source and a backlight substrate, so that the utilization rate of the backlight sources is improved, the heat dissipation effect of each single lamp source is effectively improved, and the display effect of an LCD panel is improved.
The invention also provides a preparation method of the direct type backlight source, the preparation method is used for preparing the backlight source, and a series welding and one-time wiring process is introduced in the preparation process, so that the effective preparation of the backlight source is realized, the simplification of the preparation process is facilitated, and any single lamp source can be replaced in the later period.
In order to achieve the above purpose, the invention provides the following technical scheme:
a direct type backlight source comprises a backlight substrate, a plurality of monomer lamp sources and a plurality of heat conduction channels, wherein the monomer lamp sources and the heat conduction channels are arranged on the backlight substrate; the heat conduction channels are arranged in one-to-one correspondence with the single lamp sources, and the single lamp sources are arranged on the backlight substrate in an array manner and are connected with the backlight substrate through the heat conduction channels; different single lamp sources are connected in series or in parallel through conducting circuits.
The direct type backlight source comprises a plurality of independent single lamp sources, when one of the single lamp sources is damaged, only the damaged single lamp source needs to be replaced in a targeted mode, and compared with a lamp bar in the existing structure, the light source loss rate of the backlight source is greatly reduced.
And a plurality of heat conduction channels are arranged between the backlight substrate and the single lamp sources, the heat conduction channels can fix the single lamp sources on the backlight substrate, and have good heat conduction effect, so that the heat of the single lamp sources can be quickly conducted to the backlight substrate, and the influence of overheating of the single lamp sources on the display effect is prevented.
Furthermore, the heat conducting channel is a columnar soldering tin structure or a disc-shaped soldering tin structure which is positioned between the single lamp source and the backlight substrate and corresponds to the single lamp source one to one.
Furthermore, the height of the columnar soldering tin structure or the thickness of the disc-shaped soldering tin structure is 1-2 mm.
Furthermore, the cross section area of the columnar soldering tin structure or the disc-shaped soldering tin structure is not smaller than the bottom surface area of the single lamp source.
Furthermore, the backlight substrate is made of metal.
Furthermore, the single lamp source comprises a metal substrate, an insulating layer, an LED chip and a lampshade, wherein the metal substrate, the insulating layer and the LED chip are sequentially attached to each other, and the lampshade is sleeved on the LED chip; and the insulating layer is also provided with a graphical conductive circuit for forming a wiring pin of the LED chip.
Furthermore, the single lamp source comprises an insulating layer, an LED chip and a lampshade, wherein the insulating layer and the LED chip are attached to each other, and the lampshade is sleeved on the LED chip; and the insulating layer is also provided with a graphical conductive circuit for forming a wiring pin of the LED chip.
A method for preparing a direct type backlight source is used for preparing the direct type backlight source and comprises the following steps:
preparing a plurality of single lamp sources;
arranging the single lamp sources along the same direction at fixed intervals, and performing series welding on the arranged single lamp sources to form a series lamp source;
preparing a backlight substrate, and cleaning the backlight substrate by water bath ultrasonic or alkaline water washing;
arranging a plurality of solder paste columns or solder paste discs on the backlight substrate through transfer printing, and enabling the positions of the solder paste columns or the solder paste discs to correspond to the positions of the single lamp sources in the series lamp sources one by one;
placing the series lamp sources on the backlight substrate, and enabling each single lamp source to correspond to each solder paste column or each solder paste disc one by one; fixing two ends of the soldering tin column or the soldering tin plate with the backlight substrate and the single lamp source respectively through reflow soldering;
and repeating all the steps in sequence, forming a plurality of series-connected lamp sources which are arranged in parallel on the backlight substrate, and connecting the series-connected lamp sources in parallel through conductive circuits.
Furthermore, the single lamp sources are arranged at fixed intervals along the same direction through an adsorption type arranging machine.
The other preparation method of the direct type backlight source is used for preparing the direct type backlight source and comprises the following steps:
preparing a plurality of single lamp sources;
preparing a backlight substrate, and cleaning the backlight substrate by water bath ultrasonic or alkaline water washing;
arranging a plurality of solder paste columns or solder paste discs on the backlight substrate in an array manner, wherein the array arrangement rule of the solder paste columns or the solder paste discs is consistent with the arrangement rule of the single lamp sources;
placing the single lamp sources on the soldering paste columns or the soldering paste discs in a one-to-one correspondence manner, and fixing two ends of each soldering paste column or each soldering paste disc with the backlight substrate and the single lamp sources respectively through reflow soldering;
conducting circuit wiring is carried out between the single lamp sources according to actual requirements, so that the single lamp sources are connected in series or in parallel.
Has the advantages that:
according to the technical scheme, the invention provides the direct type backlight source. Different from the prior art that a lamp bar with high integration level is adopted as a light source, the backlight source is designed based on the idea of relatively independent point light sources, and a plurality of single lamp sources are adopted, so that when one of the single lamp sources is damaged, only the damaged single lamp source needs to be replaced in a targeted manner, and compared with the existing structure that the lamp bar where the damaged LED lamp bead is needed to be replaced, the light source loss rate of the backlight source is greatly reduced. The design of the whole backlight source fully considers the heat dissipation problem of the single lamp sources, a heat conduction channel corresponding to any single lamp source is arranged, the heat conduction channel can fix the single lamp source on the backlight substrate, and has good heat conduction effect, so that the heat of the single lamp source can be quickly conducted to the backlight substrate, and the influence of overheating of the single lamp source on the display effect is prevented.
The technical scheme of the invention also provides a preparation method of at least one direct type backlight source.
In one method, the existing preparation method of the lamp strip type direct type backlight source is improved, a series welding process is introduced, and the series connection of the single lamp sources on the same row or column is quickly and effectively realized.
In another preparation method, a brand new preparation process is designed based on the idea of the single lamp sources, namely, the single lamp sources are firstly arranged in an array mode according to requirements, then all the single lamp sources and the backlight substrate are fixed at one time through the heat conduction channel, and finally all the single lamp sources are connected in series or in parallel through a primary wiring line according to requirements. The preparation method not only realizes the process simplification, but also is beneficial to realizing the series-parallel connection mode with different requirements among all the monomer lamp sources.
It should be understood that all combinations of the foregoing concepts and additional concepts described in greater detail below can be considered as part of the inventive subject matter of this disclosure unless such concepts are mutually inconsistent.
The foregoing and other aspects, embodiments and features of the present teachings can be more fully understood from the following description taken in conjunction with the accompanying drawings. Additional aspects of the present invention, such as features and/or advantages of exemplary embodiments, will be apparent from the description which follows, or may be learned by practice of specific embodiments in accordance with the teachings of the present invention.
Drawings
The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. Embodiments of various aspects of the present invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a side view of a direct backlight according to the present invention;
FIG. 2 is a schematic diagram of a single lamp source of FIG. 1;
FIG. 3 is a schematic view of another embodiment of the single lamp source of FIG. 1;
FIG. 4 is a top view of a direct type backlight using the single lamp source of FIG. 2;
FIG. 5 is a top view of a direct type backlight using the single lamp source of FIG. 3;
FIG. 6 is a flow chart of a process for preparing a direct backlight according to the present invention;
FIG. 7 is a flow chart of another direct backlight according to the present invention.
In the figure, the reference numbers are that 1 is a single lamp source, 2 is a backlight substrate, 3 is a heat conduction channel, 4 is a conductive circuit, 5 is a diffusion sheet, and 6 is a brightness enhancement film; reference numeral 11 denotes a metal substrate, 12 denotes an insulating layer, 13 denotes an LED chip, and 14 denotes a lamp cover.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.
The use of "first," "second," and similar terms in the description and claims of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Similarly, the singular forms "a," "an," or "the" do not denote a limitation of quantity, but rather denote the presence of at least one, unless the context clearly dictates otherwise. The terms "comprises," "comprising," or the like, mean that the elements or items listed before "comprises" or "comprising" encompass the features, integers, steps, operations, elements, and/or components listed after "comprising" or "comprising," and do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. "upper", "lower", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships may also be changed accordingly.
The invention provides a direct type backlight source which is arranged on the basis of a plurality of independent single lamp sources, and a heat conduction channel is arranged between each single lamp source and a back plate substrate, so that the utilization rate of the backlight sources is improved, the heat dissipation effect of the single lamp sources is effectively improved, and the display effect of an LCD panel is improved.
The invention also provides a preparation method of at least one direct type backlight source, the preparation method is used for preparing the backlight source, and a series welding and one-time wiring process is introduced in the preparation process, so that the effective preparation of the backlight source is realized, the simplification of the preparation process is facilitated, and any single lamp source can be replaced in the later period.
The direct backlight disclosed in the present invention will be further described in detail with reference to the embodiments shown in the drawings.
As shown in fig. 1, the backlight source includes a backlight substrate 2, and a plurality of single light sources 1 and a plurality of heat conducting channels 3 disposed on the backlight substrate 2. The heat conduction channels 3 are arranged in one-to-one correspondence with the single lamp sources 1, and the single lamp sources 1 are arranged on the backlight substrate 2 in an array manner and are connected with the backlight substrate 2 through the heat conduction channels 3; different single lamp sources 1 are connected in series or in parallel through the conducting circuit 4.
Because this embodiment the backlight designs based on the thought of relatively independent pointolite, has adopted a plurality of monomer lamp sources 1, consequently when one of them takes place to damage, only need to damage the monomer lamp source carry out the pertinence replacement can, compare with the whole lamp strip that needs the replacement to damage LED lamp pearl place among the current structure, very big reduction the light source loss rate of backlight.
In addition, the existing light bar takes an FPC (flexible printed circuit) as a carrier, the structure can generate a large amount of pollution in the preparation process, and the backlight source described in the embodiment does not need the structure, so that the environment-friendly development of the whole process chain of the backlight source is favorably realized.
The heat dissipation problem of the single lamp sources 1 is fully considered in the design of the whole backlight source, the heat conduction channel 3 corresponding to any single lamp source 1 is arranged, the heat conduction channel 3 can fix the single lamp source 1 on the backlight substrate 2, and has a good heat conduction effect, so that the heat of the single lamp source 1 can be quickly conducted to the backlight substrate 2, and the influence of overheating of the single lamp source 1 on the display effect is prevented.
In this embodiment, the heat conducting channel 3 is a columnar solder structure or a disc-shaped solder structure located between the single light source 1 and the backlight substrate 2 and corresponding to the single light source 1 one to one.
In order to ensure the heat dissipation effectiveness of the heat conduction channel 3, the height of the columnar soldering tin structure or the thickness of the disc-shaped soldering tin structure is set to be 1-2 mm.
In order to increase the firmness of the heat conduction channel 3 connecting the single light source 1 and the backlight substrate 2, the cross section area of the columnar soldering tin structure or the disc-shaped soldering tin structure is not smaller than the bottom surface area of the single light source. In this embodiment, the cross-sectional area of the columnar solder structure or the disc-shaped solder structure is equal to the bottom surface area of the single light source.
In order to increase the heat dissipation effect of the backlight substrate, the backlight substrate 2 in this embodiment is made of metal, specifically, aluminum, steel, or copper.
In order to increase the overall light-emitting uniformity of the backlight source, the backlight source further comprises a diffusion sheet 5 and a brightness enhancement film 6 which are sequentially arranged on each monomer lamp source.
As shown in fig. 2, in the structural arrangement of the single light source 1, the single light source in this embodiment includes a metal substrate 11, an insulating layer 12, an LED chip 13, and a lampshade 14 covering the LED chip 13, which are sequentially attached to each other; the insulating layer 12 is further provided with a patterned conductive circuit for forming a wiring pin of the LED chip.
Fig. 4 is a top view of a direct type backlight using the single lamp source shown in fig. 2.
In order to simplify the overall structure of the direct type backlight source, the present embodiment further includes another single lamp source structure. As shown in fig. 3, the LED module includes an insulating layer 12, an LED chip 13, and a lampshade 14 covering the LED chip 13; and the insulating layer is also provided with a graphical conductive circuit for forming a wiring pin of the LED chip.
Fig. 5 is a top view of a direct type backlight using the single lamp source shown in fig. 3.
The following describes the method for manufacturing a direct type backlight according to the present disclosure in detail with reference to the embodiments shown in the drawings.
As shown in fig. 6, the method for manufacturing the conventional light bar type direct type backlight is improved. The preparation process comprises the following steps:
s102, preparing a plurality of single lamp sources; the structure of the single lamp source is shown in figure 2 or figure 3.
S104, arranging the single lamp sources along the same direction at fixed intervals, and performing series welding on the arranged single lamp sources to form a series lamp source;
the series welding process introduced in the step can quickly and effectively realize the series connection between the monomer lamp sources in the same direction.
In this step, the regularity of the arrangement of the individual light sources affects the overall light-emitting uniformity of the LCD display panel. Therefore, in order to ensure that the single lamp sources are arranged according to the specified direction and the specified distance, an adsorption type cloth arranging machine is adopted. The adsorption type arranging machine effectively fixes the monomer lamp sources on the carrying platform according to the preset direction and the preset distance through the positioning clamp and the vacuum adsorption effect.
S106, preparing a backlight substrate, and cleaning the backlight substrate by water bath ultrasonic or alkaline water washing;
s108, arranging a plurality of solder paste columns or solder paste discs on the backlight substrate through transfer printing, and enabling the positions of the solder paste columns or the solder paste discs to correspond to the positions of the single lamp sources in the series lamp sources one by one;
in this step, the specific process of performing transfer printing on the solder paste column or the solder paste tray may be screen printing, 3D printing, inkjet printing, or the like. When 3D printing or inkjet printing is used, it is generally necessary to perform transfer printing a plurality of times at the same position in order to form a solder paste column or a solder paste tray having a certain height.
In an alternative embodiment, the solder paste column or the solder paste disc can be directly transfer printed on the bottom surface of the single light source. At this time, the light emitting surfaces of the series light sources need to be fixed by an adsorption type cloth arranging machine or other adsorption equipment, and then corresponding solder paste columns or solder paste discs are arranged on the back surfaces of the single light sources by transfer printing.
S110, placing the series lamp sources on the backlight substrate, and enabling the single lamp sources to correspond to the solder paste columns or the solder paste discs one by one; fixing two ends of the soldering tin column or the soldering tin plate with the backlight substrate and the single lamp source respectively through reflow soldering;
and S112, repeating the steps S102-S110, forming a plurality of series lamp sources which are arranged in parallel on the backlight substrate, and connecting the series lamp sources in parallel through a conducting circuit.
In the step, the parallel arrangement of the series-connected lamp sources is completed by the aid of the mechanical arm, so that the arrangement speed and the arrangement regularity are improved, and the damage rate of the series-connected lamp sources is reduced.
In this embodiment, the single lamp source in step S102 may be purchased directly from the outside, or may be prepared by itself. When the single lamp source shown in fig. 2 is obtained by preparation, the preparation process thereof includes:
s302, preparing a metal substrate and an insulating layer, and fixing the metal substrate and the insulating layer by hot pressing;
in this step, the metal substrate is an aluminum plate or a copper plate, and the insulating layer is made of a heat-conducting insulating material such as a ceramic polymer.
S304, patterning the insulating layer to form a wiring pin of the LED chip;
in this step, the specific process for patterning may be chemical etching; physical printing such as screen printing, ink jet printing, and the like is also possible.
S306, placing the LED chip between the wiring pins of the insulating layer;
in this step, the LED chip is of a patch structure, and thus may be attached to the insulating layer in a specific operation.
And S308, sleeving the lamp cap on the LED chip and fixing the lamp cap and the insulating layer in a hot-pressing manner.
In this step, the lamp cap is of a hemispherical structure, and in order to prevent the light-emitting effect of the LED chip from being affected, the LED chip is just arranged at the center of the lamp cap after the lamp cap is sleeved.
When the single lamp source shown in fig. 3 is obtained by preparation, since the metal substrate is omitted in this structure, it is sufficient to directly perform steps S304 to S308 in order.
Another method for manufacturing a direct type backlight according to the present disclosure is described in detail below with reference to the embodiments shown in the drawings.
As shown in fig. 7, a completely new manufacturing process is designed based on the concept of a single lamp source. The preparation process comprises the following steps:
s202, preparing a plurality of single lamp sources; the structure of the single lamp source is shown in figure 2 or figure 3.
S204, preparing a backlight substrate, and cleaning the backlight substrate by water bath ultrasonic or alkaline water washing;
s206, arranging a plurality of solder paste columns or solder paste discs which are arranged in an array manner on the backlight substrate, wherein the array arrangement rule of the solder paste columns or the solder paste discs is consistent with the target arrangement rule of the single lamp source;
s208, correspondingly placing the single lamp sources on the soldering paste columns or the soldering paste discs one by one, and fixing two ends of each soldering paste column or each soldering paste disc with the backlight substrate and the single lamp sources respectively through reflow soldering;
and S210, conducting circuit wiring is conducted among the single lamp sources according to actual requirements, so that the single lamp sources are connected in series or in parallel.
In the step, the wiring of the primary conductive circuit among the single lamp sources is realized by means of a wiring welding machine, and the specific wiring path is carried out according to a program preset according to actual requirements in the wiring welding machine. The preparation method of the primary wiring not only realizes the process simplification, but also is beneficial to realizing the series-parallel connection mode with different requirements among all the single lamp sources.
In this embodiment, the single lamp source in step S202 may be purchased directly from the outside, or may be prepared by itself. When the single lamp source shown in fig. 2 is obtained by preparation, the preparation process thereof includes:
s302, preparing a metal substrate and an insulating layer, and fixing the metal substrate and the insulating layer by hot pressing;
in this step, the metal substrate is an aluminum plate or a copper plate, and the insulating layer is made of a heat-conducting insulating material such as a ceramic polymer.
S304, patterning the insulating layer to form a wiring pin;
in this step, the insulating layer is patterned to form a wiring pin of the LED chip. The specific process for performing the patterning treatment may be chemical etching; physical printing such as screen printing, ink jet printing, and the like is also possible.
S306, placing the LED chip between the wiring pins of the insulating layer;
in this step, the LED chip is of a patch structure, and thus may be attached to the insulating layer in a specific operation.
And S308, sleeving the lamp cap on the LED chip and fixing the lamp cap and the insulating layer in a hot-pressing manner.
In this step, the lamp cap is of a hemispherical structure, and in order to prevent the light-emitting effect of the LED chip from being affected, after the lamp cap is sleeved, the LED chip is just arranged at the center of the lamp cap.
When the single lamp source shown in fig. 3 is obtained by preparation, since the metal substrate is omitted in this structure, it is sufficient to directly perform steps S304 to S308.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention should be determined by the appended claims.
Claims (10)
1. A direct type backlight source is characterized by comprising a backlight substrate, a plurality of monomer lamp sources and a plurality of heat conduction channels, wherein the monomer lamp sources and the heat conduction channels are arranged on the backlight substrate; the heat conduction channels are arranged in one-to-one correspondence with the single lamp sources, and the single lamp sources are arranged on the backlight substrate in an array manner and are connected with the backlight substrate through the heat conduction channels; different single lamp sources are connected in series or in parallel through conducting circuits.
2. The direct backlight source of claim 1, wherein the heat conducting channels are columnar solder structures or disc-shaped solder structures located between the single light sources and the backlight substrate and corresponding to the single light sources one to one.
3. The direct backlight according to claim 2, wherein the height of the columnar solder structures or the thickness of the disk-shaped solder structures is 1-2 mm.
4. The direct backlight according to claim 3, wherein the cross-sectional area of the columnar solder structures or the disk-shaped solder structures is not smaller than the area of the bottom surface of the single light source.
5. The direct type backlight source according to claim 4, wherein the backlight substrate is made of metal.
6. The direct type backlight source according to claim 1, wherein the single lamp source comprises a metal substrate, an insulating layer, an LED chip, and a lamp cover covering the LED chip, which are sequentially attached to each other; and the insulating layer is also provided with a graphical conductive circuit for forming a wiring pin of the LED chip.
7. The direct type backlight source according to claim 1, wherein the single light source comprises an insulating layer, an LED chip, and a lampshade covering the LED chip; and the insulating layer is also provided with a graphical conductive circuit for forming a wiring pin of the LED chip.
8. A method for preparing a direct type backlight source, which is used for preparing the direct type backlight source of any one of claims 1 to 7, comprising the following steps:
preparing a plurality of single lamp sources;
arranging the single lamp sources along the same direction at fixed intervals, and performing series welding on the arranged single lamp sources to form a series lamp source;
preparing a backlight substrate, and cleaning the backlight substrate by water bath ultrasonic or alkaline water washing;
arranging a plurality of solder paste columns or solder paste discs on the backlight substrate through transfer printing, and enabling the positions of the solder paste columns or the solder paste discs to correspond to the positions of the single lamp sources in the series lamp sources one by one;
placing the series lamp sources on the backlight substrate, and enabling each single lamp source to correspond to each solder paste column or each solder paste disc one by one; fixing two ends of the soldering tin column or the soldering tin plate with the backlight substrate and the single lamp source respectively through reflow soldering;
and repeating all the steps in sequence, forming a plurality of series-connected lamp sources which are arranged in parallel on the backlight substrate, and connecting the series-connected lamp sources in parallel through conductive circuits.
9. The method of claim 8, wherein the individual lamp sources are arranged in the same direction at regular intervals by an adsorption type arranging machine.
10. A method for preparing a direct type backlight source, which is used for preparing the direct type backlight source of any one of claims 1 to 7, comprising the following steps:
preparing a plurality of single lamp sources;
preparing a backlight substrate, and cleaning the backlight substrate by water bath ultrasonic or alkaline water washing;
arranging a plurality of solder paste columns or solder paste discs on the backlight substrate in an array manner, wherein the array arrangement rule of the solder paste columns or the solder paste discs is consistent with the arrangement rule of the single lamp sources;
placing the single lamp sources on the soldering paste columns or the soldering paste discs in a one-to-one correspondence manner, and fixing two ends of each soldering paste column or each soldering paste disc with the backlight substrate and the single lamp sources respectively through reflow soldering;
conducting circuit wiring is carried out between the single lamp sources according to actual requirements, so that the single lamp sources are connected in series or in parallel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111400557.0A CN114236903A (en) | 2021-11-24 | 2021-11-24 | Direct type backlight source and preparation method thereof |
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| CN202111400557.0A CN114236903A (en) | 2021-11-24 | 2021-11-24 | Direct type backlight source and preparation method thereof |
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