CN105739174A - Backlight module and display device with same - Google Patents
Backlight module and display device with same Download PDFInfo
- Publication number
- CN105739174A CN105739174A CN201610080857.8A CN201610080857A CN105739174A CN 105739174 A CN105739174 A CN 105739174A CN 201610080857 A CN201610080857 A CN 201610080857A CN 105739174 A CN105739174 A CN 105739174A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- sub
- backlight module
- backboard
- guide plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a backlight module and a display device with the same. The backlight module comprises a light source, a light guide plate, a back plate and a heat sink. The heat sink is arranged on the back plate. The light guide plate is arranged above the heat sink. The light source is arranged corresponding to the light receiving surface of the light guide plate. A circular layer is arranged on the back plate. The light source is arranged on the circuit layer. According to the technical scheme, the light source and the heat sink are designed in an integrated mode, and the thickness of the side edge of the heat sink, the thickness of heat conduction glue and the thickness of a base of a printed circuit board are effectively removed, so that the width of a frame of the lateral approach type backlight module is reduced, and the frame of the backlight module can be narrower. Meanwhile, according to the technical scheme, the light source is directly arranged on the heat sink, heat resistance generated in the heat conduction process is reduced, and the heat dissipation performance and heat dissipation efficiency of the backlight module are improved, so that the heat dissipation performance of the backlight module is better, cost is lower, and better assembling manufacturability is achieved.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of backlight module and display device thereof.
Background technology
In liquid crystal indicator, narrow frame and high-cooling property are the important indicators of backlight module.Fig. 1 is the structural representation of backlight module in prior art.As it is shown in figure 1, backlight module is provided with light source 402 at the incidence surface of light guide plate 401, described light source 402 is arranged on printed circuit board (PCB) (not shown), is connected by heat-conducting glue 502 between the pedestal 501 of described printed circuit board (PCB) and heat sink 2.Therefore, the seal ring thickness of backlight module is formed by the thickness of glue frame 3, the thickness of backboard 1, the thickness of heat sink 2, the thickness of heat-conducting glue 502 and the thickness superposition of printed circuit board (PCB) pedestal 501, cause that the seal ring thickness of display device is excessive, it is impossible to meet the requirement of narrow frame.It addition, existing backlight module conducts heat to heat sink 2 by printed circuit board (PCB) pedestal 501 and heat-conducting glue 502, dispelling the heat again through heat sink 2, cause that the thermal resistance of backlight module is high, radiating efficiency is low.
Summary of the invention
For solving the problems referred to above, the present invention provides a kind of backlight module and display device thereof, is used for solving existing backlight module frame thick, the problem that radiating efficiency is low.
For this, the present invention provides a kind of backlight module, including light source, light guide plate, backboard and heat sink, described heat sink is arranged on described backboard, described light guide plate is arranged on the top of described heat sink, the incidence surface of described light source and described light guide plate is correspondingly arranged, and is provided with line layer on described backboard, and described light source is arranged on described line layer.
Optionally, described backboard includes cross one another first sub-backboard and the second sub-backboard, described heat sink is arranged on described first sub-backboard, described heat sink includes cross one another first sub-heat sink and the second sub-heat sink, described light guide plate is arranged on the top of described first sub-heat sink, described second sub-heat sink is arranged between described second sub-backboard and described light guide plate, described in have line layer to be arranged on described second sub-heat sink.
Optionally, described first sub-heat sink is provided with multiple projection away from the one side of described light guide plate, and described first sub-backboard is provided with multiple through hole, and described projection is arranged within described through hole.
Optionally, described projection is laminated structure.
Optionally, multiple described laminated structures are uniformly distributed formation laminated structure array, and multiple described through holes are uniformly distributed formation via-hole array.
Optionally, also including glue frame, described glue frame includes cross one another first sub-glue frame and the second sub-glue frame, and described first sub-glue frame is arranged on the top of described backboard, and described second sub-glue frame is arranged on the outside of described second sub-backboard.
Optionally, also including reflector plate and blooming, described reflector plate is arranged between described first sub-heat sink and described light guide plate, and described blooming is arranged on described light guide plate.
Optionally, described light source includes light emitting diode.
The present invention also provides for a kind of display device, including any of the above-described backlight module.
The present invention has following beneficial effect:
Among provided by the invention kind of backlight module and display device thereof, described backlight module includes light source, light guide plate, backboard and heat sink, described heat sink is arranged on described backboard, described light guide plate is arranged on the top of described heat sink, the incidence surface of described light source and described light guide plate is correspondingly arranged, being provided with line layer on described backboard, described light source is arranged on described line layer.Technical scheme provided by the invention is by light source and heat sink Integrated design, effectively eliminate the base thickness of the side thickness of heat sink, heat-conducting glue thickness and printed circuit board (PCB), thus reducing the border width of side entrance back module so that backlight module frame can be made narrower.Simultaneously, technical scheme provided by the invention decreases the use of printed circuit board (PCB) pedestal and heat-conducting glue, light source is set directly on heat sink, heat that backlight module produces is dispelled the heat either directly through the laminated structure of heat sink, decrease the thermal resistance among heat conductive process, improve heat dispersion and the radiating efficiency of backlight module, so that the heat dispersion of backlight module is better, lower in cost, there is better packaging technology.
Accompanying drawing explanation
Fig. 1 is the structural representation of backlight module in prior art；
The structural representation of a kind of backlight module that Fig. 2 provides for the embodiment of the present invention one；
Fig. 3 is the assembling schematic diagram of heat sink shown in Fig. 2；
Fig. 4 is the structural representation of heat sink shown in Fig. 2；
Wherein, accompanying drawing is labeled as: 1, backboard；2, heat sink；3, glue frame；101, the first sub-backboard；102, the second sub-backboard；103, through hole；201, the first sub-heat sink；202, the second sub-heat sink；203, laminated structure；301, the first sub-glue frame；302, the second sub-glue frame；401, light guide plate；402, light source；403, reflector plate；404, blooming；501, pedestal；502, heat-conducting glue.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, below in conjunction with accompanying drawing, backlight module provided by the invention and display device thereof are described in detail.
Embodiment one
The structural representation of a kind of backlight module that Fig. 2 provides for the embodiment of the present invention one.As shown in Figure 2, described backlight module includes light source 402, light guide plate 401, backboard 1 and heat sink 2, described heat sink 2 is arranged on described backboard 1, described light guide plate 401 is arranged on the top of described heat sink 2, the incidence surface of described light source 402 and described light guide plate 401 is correspondingly arranged, being provided with line layer (not shown) on described backboard 1, described light source 402 is arranged on described line layer.Optionally, described light source includes light emitting diode.The technical scheme that the present embodiment provides is by light source and heat sink Integrated design, effectively eliminate the base thickness of the side thickness of heat sink, heat-conducting glue thickness and printed circuit board (PCB), thus reducing the border width of side entrance back module so that backlight module frame can be made narrower.
The heat of light source is conducted to heat sink by existing backlight module by printed circuit board (PCB) pedestal and heat-conducting glue, dispels the heat again through heat sink.Therefore, between light source with printed circuit board (PCB) pedestal, there is face and contact, between printed circuit board (PCB) pedestal and heat-conducting glue, there is face and contact, there is between heat-conducting glue with heat sink face and contact.When heat flows through the interface of two solids contacted with each other, hot-fluid is presented obvious thermal resistance by interface itself, is called thermal contact resistance.Therefore, the face contact between above-mentioned multiple parts all can form thermal contact resistance, to stop the transmission of heat, thus increasing the thermal resistance of backlight module, reduces radiating efficiency and the heat dispersion of backlight module.The backlight module that the present embodiment provides decreases the use of printed circuit board (PCB) pedestal and heat-conducting glue, is set directly on heat sink 2 by light source 402.Owing to decreasing the face contact between multiple parts, thus decreasing the thermal contact resistance of backlight module, therefore the heat that light source 402 produces dispels the heat either directly through heat sink 2, decrease the thermal resistance among heat conductive process, improve the radiating efficiency of backlight module, so that the heat dispersion of backlight module is better, lower in cost, there is better packaging technology.
In the present embodiment, described backboard 1 includes cross one another first sub-backboard 101 and the second sub-backboard 102, described heat sink 2 is arranged on described first sub-backboard 101, described heat sink 2 includes cross one another first sub-heat sink 201 and the second sub-heat sink 202, described light guide plate 401 is arranged on the top of described first sub-heat sink 201, described second sub-heat sink 202 is arranged between described second sub-backboard 102 and described light guide plate 401, described in have line layer to be arranged on described second sub-heat sink 202.Owing to the second sub-heat sink 202 is arranged between described second sub-backboard 102 and described light guide plate 401, and there is line layer to be arranged on described second sub-heat sink 202, therefore have line layer to be arranged between described second sub-backboard 102 and described light guide plate 401.Owing to described light source 402 is arranged on described line layer, described light source 402 is arranged between described second sub-backboard 102 and described light guide plate 401, thus decreasing heat-conducting glue and the use of printed circuit board (PCB) pedestal.The heat of light source 402 is dispelled the heat by the present embodiment either directly through heat sink 2, decreases the thermal resistance among heat conductive process, thus improve radiating efficiency and the heat dispersion of backlight module.Therefore, the technical scheme that the present embodiment provides both had reduced the border width of backlight module, improve again the heat dispersion of backlight module.
Fig. 3 is the assembling schematic diagram of heat sink shown in Fig. 2.As it is shown on figure 3, described first sub-heat sink 201 is provided with multiple projection away from the one side of described light guide plate 401.In the present embodiment, described projection is laminated structure 203.Being provided with multiple through hole 103 on described first sub-backboard 101, described laminated structure 203 is arranged within described through hole 103.Fig. 4 is the structural representation of heat sink shown in Fig. 2.As shown in Figure 4, multiple described laminated structures 203 are uniformly distributed formation laminated structure array.Corresponding, multiple described through holes are uniformly distributed formation via-hole array.Described laminated structure 203 can increase the area of dissipation of backlight module, described pass through 103 can so that the laminated structure 203 being located therein be exposed among air.Therefore, laminated structure 203 is arranged among through hole 103 by the present embodiment, it is possible to increase the contact area of heat sink 2 and air, thus improving the heat dispersion of backlight module.
Referring to Fig. 2, described backlight module also includes glue frame 3, described glue frame 3 includes cross one another first sub-glue frame 301 and the second sub-glue frame 302, and described first sub-glue frame 301 is arranged on the top of described backboard 1, and described second sub-glue frame 302 is arranged on the outside of described second sub-backboard 102.Optionally, described backlight module also includes reflector plate 403 and blooming 404, and described reflector plate 403 is arranged between described first sub-heat sink 201 and described light guide plate 401, and described blooming 404 is arranged on described light guide plate 401.
The backlight module that the present embodiment provides includes light source, light guide plate, backboard and heat sink, described heat sink is arranged on described backboard, described light guide plate is arranged on the top of described heat sink, the incidence surface of described light source and described light guide plate is correspondingly arranged, being provided with line layer on described backboard, described light source is arranged on described line layer.The technical scheme that the present embodiment provides is by light source and heat sink Integrated design, effectively eliminate the base thickness of the side thickness of heat sink, heat-conducting glue thickness and printed circuit board (PCB), thus reducing the border width of side entrance back module so that backlight module frame can be made narrower.Simultaneously, the technical scheme that the present embodiment provides decreases the use of printed circuit board (PCB) pedestal and heat-conducting glue, light source is set directly on heat sink, heat that backlight module produces is dispelled the heat either directly through the laminated structure of heat sink, decrease the thermal resistance among heat conductive process, improve heat dispersion and radiating efficiency, so that the heat dispersion of backlight module is better, lower in cost, there is better packaging technology.
Embodiment two
The present embodiment provides a kind of display device, and including the backlight module that embodiment one provides, particular content can refer to the description of embodiment one, repeats no more herein.
Among the display device that the present embodiment provides, described backlight module includes light source, light guide plate, backboard and heat sink, described heat sink is arranged on described backboard, described light guide plate is arranged on the top of described heat sink, the incidence surface of described light source and described light guide plate is correspondingly arranged, being provided with line layer on described backboard, described light source is arranged on described line layer.The technical scheme that the present embodiment provides is by light source and heat sink Integrated design, effectively eliminate the base thickness of the side thickness of heat sink, heat-conducting glue thickness and printed circuit board (PCB), thus reducing the border width of side entrance back module so that backlight module frame can be made narrower.Simultaneously, the technical scheme that the present embodiment provides decreases the use of printed circuit board (PCB) pedestal and heat-conducting glue, light source is set directly on heat sink, heat that backlight module produces is dispelled the heat either directly through the laminated structure of heat sink, decrease the thermal resistance among heat conductive process, improve heat dispersion and radiating efficiency, so that the heat dispersion of backlight module is better, lower in cost, there is better packaging technology.
It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and the illustrative embodiments that adopts, but the invention is not limited in this.For those skilled in the art, without departing from the spirit and substance in the present invention, it is possible to make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (9)
1. a backlight module, it is characterized in that, including light source, light guide plate, backboard and heat sink, described heat sink is arranged on described backboard, described light guide plate is arranged on the top of described heat sink, the incidence surface of described light source and described light guide plate is correspondingly arranged, and is provided with line layer on described backboard, and described light source is arranged on described line layer.
2. backlight module according to claim 1, it is characterized in that, described backboard includes cross one another first sub-backboard and the second sub-backboard, described heat sink is arranged on described first sub-backboard, described heat sink includes cross one another first sub-heat sink and the second sub-heat sink, described light guide plate is arranged on the top of described first sub-heat sink, described second sub-heat sink is arranged between described second sub-backboard and described light guide plate, described in have line layer to be arranged on described second sub-heat sink.
3. backlight module according to claim 2, it is characterised in that described first sub-heat sink is provided with multiple projection away from the one side of described light guide plate, and described first sub-backboard is provided with multiple through hole, and described projection is arranged within described through hole.
4. backlight module according to claim 3, it is characterised in that described projection is laminated structure.
5. backlight module according to claim 4, it is characterised in that multiple described laminated structures are uniformly distributed formation laminated structure array, and multiple described through holes are uniformly distributed formation via-hole array.
6. backlight module according to claim 2, it is characterized in that, also include glue frame, described glue frame includes cross one another first sub-glue frame and the second sub-glue frame, described first sub-glue frame is arranged on the top of described backboard, and described second sub-glue frame is arranged on the outside of described second sub-backboard.
7. backlight module according to claim 2, it is characterised in that also include reflector plate and blooming, described reflector plate is arranged between described first sub-heat sink and described light guide plate, and described blooming is arranged on described light guide plate.
8. backlight module according to claim 1, it is characterised in that described light source includes light emitting diode.
9. a display device, it is characterised in that include the arbitrary described backlight module of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610080857.8A CN105739174A (en) | 2016-02-04 | 2016-02-04 | Backlight module and display device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610080857.8A CN105739174A (en) | 2016-02-04 | 2016-02-04 | Backlight module and display device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105739174A true CN105739174A (en) | 2016-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610080857.8A Pending CN105739174A (en) | 2016-02-04 | 2016-02-04 | Backlight module and display device with same |
Country Status (1)
| Country | Link |
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| CN (1) | CN105739174A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108803148A (en) * | 2018-04-09 | 2018-11-13 | 友达光电股份有限公司 | Backlight module and display device using same |
| CN110262131A (en) * | 2019-06-26 | 2019-09-20 | 厦门天马微电子有限公司 | A kind of backlight module and display device |
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Application publication date: 20160706 |