201235606 ι :六、發明翁明' : 【發明所屬之技術領域】 本發明係有關於散熱結構，更特別關於應用於發光二 極體之散熱結構。 【先前技術】 發光二極體(LED)與傳統光源比較，發光二極體係具有 體積小、省電、發光效率佳、壽命長、操作反應速度快、 且無熱輻射與水銀等有毒物質的污染等優點，因此近幾年 | 來，發光二極體的應用面已極為廣泛。過去由於發光二極 體之亮度還無法取代傳統之照明光源，但隨著技術領域之 不斷提升，目前已研發出高照明輝度之發光二極體（高功率 LED)，其足以取代傳統之照明光源。 再者，由於發光二極體燈具的耐熱性較差，通常需要 藉助導熱元件或散熱元件來將發光二極體所產生之熱量導 離或散開，以使得發光二極體燈具能在一較低的溫度下正 常操作。如何藉由結構的設計，來提升發光二極體燈具整 φ 體的導熱或散熱效果，已成為該技藝人士之重要課題。 【發明内容】 本發明一實施例提供一種散熱結構，包括基板；發熱 元件，位於基板上；複數個散熱片，位於基板上且鄰近發 熱元件；以及複數個穿孔，穿過基板，其中散熱片底部接 觸穿孔之部份邊緣。 【實施方式】 如第1圖所示，本發明一實施例之散熱結構100含有 發光二極體12位於基板10正面上，以及多個散熱片14鄰 201235606 近發光一極體12。上述勘叙g u (; 示，自mo 之料枝如第2圖所 自基板1G ^顿puneh)形成穿孔】6 二。可以理解的是’散熱片]4的底部仍連接至::熱 孔16之部份邊緣。由於㈣製程只可能損耗 I = t =散熱片14之基板1〇,散熱片二 乂…、小於或#於穿孔16的面 m 利對流的穿“與 成散熱片的製程。於先沖堡形成穿孔再另外形 為了增加散熱的對流效果，第 平行且相隔固定距離，且㈣H/的散…片14彼此 體12之侧壁垂直;:片14之平行方向與發光二極 m j.,.、在八他貫施例中，多個散熱片14可採 同Γ式比如彼此平行但彼此之間相隔的距離不 ^甚以此之間不平行，端視製程及設計而定 :大:然：i圖中不同的散熱片14 (穿孔16)具 ”大^但亦可採用不同大小的散熱片14 (穿孔16)。 兩者= t極體12與散熱片14之間的接觸，可在 散熱片日Η之二二3結，如第3圖所示。可以理解的是， 1圖所示以外，==直發光二極體12之側壁如第 片14將不會接觸發并丁士極體12之側壁。此時散熱 合發光二極體124:=12”壁’亦不需焊 基板10上，以電性t接不门此外，可形成接觸塾18於 ,_ .. 運接不同的發光二極體12。實際製作 ° θ供基板10如印刷電路板。基板1〇正面具有接 201235606 觸塾18，可對應發光二極體12與義不同發光二極體i2 之間的電路，其上視圖如第4圖所示。接著以沖壓法自基 板ίο背面沖壓出穿孔16與對應之散熱片14，再形成^ 二極體12於基板10正面上所對應之接觸墊“上。最後以 焊料Π進-步增加發光二極體12與散熱片14的熱接觸面 積’以增進散熱結構100之散熱效果。 在本發明其他實施射，可在基板1G背面另外形成Α t習知的散熱結構，比如整片散熱板或其他散熱器如散敎 .、，、曰片（fm)及/或熱管(heat pipe)。在本發明的另一實施例中， 可進-步架設風扇（未圖示）以增加對流效果。在這必 ^^基㈣中的積層電路(未圖示)與基㈣正面的 ，觸塾18的主要部份需避開散熱片Η (或穿孔16)的區 1⑽二沖㈣程中受損。另-方面’上述散熱結構 替換!IS:發光二極體12外，亦可將發光二極體12 理=PU曰Γ牛，甚至替換為其他發熱元件如中央處 口。（CPU)、日日片、或其他類似元件。 之第m'L 及接觸塾18的形成方式與前述 進行沖：不=結構100相同，亦是由基板10背面 製 成穿孔16與對應之散熱片盘前述 如Μ列不_是，散熱結構之散 =:::二非第2圖所收結構。== 笋井-极興7先—體之邊緣平行。如此一來， X 的側面逸光51之方向可藉由散熱片14之弧 201235606 r 面肩整至垂直基板1〇的方向 丨 14反射光的現象可進L $圖所示。上述散熱片 積。為提升上述之反射牛的亮度及發光面 散熱片14其朝向發 :在”近發光二極體U之 性材料。在本發明一實_由的弧面（凹面）上形成反射 板10上的#'，可先塗佈反射性材料於基 -實心1 沖㈣成散熱片…在本發明另 料成散熱…，再塗佈反二 在本發明另一實施例中， 形結構的散熱片14A、14B、及;構具有不同大小之弧 散熱片14A之f产小於和备 如第7圖所示，由於 之高度又小於::片、14c:f:B之高度’且散熱片14B 穿孔的#ηι 之回度’因此對應散熱片14A之 對應散熱:二之亦穿為=广與ί4Β之間㈣ 之間距)。與第6圖之結構相;W第(==14β與14C 蛴氺-托触^ 再邳权弟7圖之結構可進一步讓 不同角度的侧面逸光51的方向調整至垂 直基=〇 ,進-步增加發光元件之亮度與發光面積。 體的封裳4::=例中’發光二極趙12為發光二極 U為發:: = 34第5.7圖之實施例中，發光二極體 中散熱片二是’第]-4圖之實施例 二第3 構亦可應用於發光二_封裝結構。 ⑽，還結構除了可有效散熱 還了牦加發光7G件之亮度與發光面積。 雖然本發明已以數個較佳實施例揭露如上，铁其並非 201235606 用以限定本發明，任何熟習此技藝者丨:，在不脫離本發明之 精神和範圍内，當可作任意之更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範圍所界定者為準。 201235606 【圖式簡單說明】 ，1圖係本發明一實施例中，散熱結構之立體圖； 第2-3圖係第丨圖之散熱結構其部份立體放大圖； 第4圖係第1圖之散熱結構之上視圖； ，5圖係本發明一實施例中，散熱結構之立體圖； ^囷係第5圖之散熱結構其部份側視圖；以及 第7圖係本發明—實_巾，散熱結構之部份侧視圖 【主要元件符號說明】201235606 ι: 六,发明翁明': TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure applied to a light emitting diode. [Prior Art] Compared with traditional light sources, the light-emitting diode (LED) has small volume, power saving, good luminous efficiency, long life, fast operation response, and no pollution of toxic substances such as heat radiation and mercury. And so on, so in recent years | come, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-luminance LEDs (high-power LEDs) with high illumination brightness have been developed, which are sufficient to replace the traditional illumination sources. . Furthermore, since the heat resistance of the light-emitting diode lamp is poor, it is usually necessary to conduct or dissipate the heat generated by the light-emitting diode by means of a heat-conducting element or a heat-dissipating element, so that the light-emitting diode lamp can be at a lower level. Normal operation at temperature. How to improve the heat conduction or heat dissipation effect of the entire φ body of the light-emitting diode lamp by the design of the structure has become an important issue for the skilled person. SUMMARY OF THE INVENTION An embodiment of the present invention provides a heat dissipation structure including a substrate, a heat generating component disposed on the substrate, a plurality of heat sinks on the substrate and adjacent to the heat generating component, and a plurality of through holes passing through the substrate, wherein the heat sink is at the bottom Touch the edge of the perforation. [Embodiment] As shown in Fig. 1, a heat dissipation structure 100 according to an embodiment of the present invention includes a light-emitting diode 12 on a front surface of a substrate 10, and a plurality of heat sinks 14 adjacent to the 201235606 near-light-emitting diode 12. The above-mentioned survey g u (; shows that the material from the mo is as shown in Fig. 2 from the substrate 1G ^puneh) to form a perforation] 6 II. It will be understood that the bottom of the 'heat sink' 4 is still connected to: a portion of the edge of the thermal aperture 16. Since (4) the process can only consume I = t = substrate 1 散热 of the heat sink 14 , the heat sink 2 乂 ..., less than or # on the surface of the hole 16 convection of the convection "and the process of forming the heat sink. The perforations are additionally shaped to increase the convection effect of heat dissipation, parallel and separated by a fixed distance, and (4) the H/scatter sheets 14 are perpendicular to the sidewalls of the body 12; the parallel direction of the sheets 14 and the light-emitting diodes m j.,. In the eight embodiments, the plurality of fins 14 may be of the same type, such as parallel to each other but separated from each other by a distance that is not parallel, depending on the process and design: large: The different fins 14 (perforations 16) in the figure have "large" but different sizes of fins 14 (perforations 16) can also be used. Both = the contact between the t-pole 12 and the heat sink 14 can be made at the end of the heat sink, as shown in Fig. 3. It can be understood that, except for the one shown in Fig. 1, the side wall of the == direct-emitting diode 12, such as the first sheet 14, will not contact the side wall of the dynode body 12. At this time, the heat-dissipating light-emitting diode 124:=12" wall' does not need to be soldered on the substrate 10, and the electrical contact is not connected. In addition, the contact 塾18 can be formed, and the different light-emitting diodes can be transported. 12. Actually making ° θ for the substrate 10 such as a printed circuit board. The front surface of the substrate 1 has a 201235606 contact 18, which can correspond to the circuit between the light-emitting diode 12 and the different light-emitting diodes i2, the upper view is as follows 4, the through hole 16 and the corresponding heat sink 14 are punched out from the back surface of the substrate by stamping, and the second contact 12 is formed on the contact pad corresponding to the front surface of the substrate 10. Finally, the thermal contact area of the light-emitting diode 12 and the heat sink 14 is increased by the solder advancement step to enhance the heat dissipation effect of the heat dissipation structure 100. In other embodiments of the present invention, a conventional heat dissipation structure may be formed on the back surface of the substrate 1G, such as a whole heat sink or other heat sink such as a heat sink, a chip, a fm, and/or a heat pipe. ). In another embodiment of the invention, a fan (not shown) may be erected to increase the convection effect. In the case of the laminated circuit (not shown) and the base (4) in the front (4), the main part of the contact 18 is to be damaged in the area 1 (10) of the heat sink Η (or the through hole 16). . In addition, the above heat-dissipating structure is replaced by the IS: the light-emitting diode 12, and the light-emitting diode 12 can be replaced by a PU yak or even replaced with another heat-generating component such as a central port. (CPU), day, or other similar components. The m'L and the contact meander 18 are formed in the same manner as the above-mentioned punching: not the same as the structure 100, and the through holes 16 and the corresponding heat sink disks are formed on the back surface of the substrate 10, and the heat dissipation structure is散 =::: 2 is not the structure received in Figure 2. == Bamboo well - extremely prosperous 7 first - the edge of the body is parallel. In this way, the direction of the side light 51 of the X can be reflected by the arc of the heat sink 14 201235606 r to the direction of the vertical substrate 1 丨 14 can be shown in the L $ picture. The above heat sinking film. In order to enhance the brightness of the reflective cow and the surface of the light-emitting surface of the light-emitting fins 14, the material of the near-light-emitting diode U is formed on the reflecting plate 10 on the curved surface (concave surface) of the present invention. #', the reflective material can be coated first on the base-solid 1 (four) into a heat sink... In the present invention, the heat is further dissipated..., and the second is coated. In another embodiment of the present invention, the heat sink 14A of the structure is formed. 14B, and; the arc fins 14A having different sizes are produced less than and as shown in Fig. 7, because the height is smaller than: the height of the sheet: 14c:f: B' and the fin 14B is perforated. #ηι回回度' Therefore corresponds to the corresponding heat dissipation of the heat sink 14A: the second is also worn as = between the wide and the ί4Β (four). The structure is compared with the structure of Fig. 6; W (==14β and 14C 蛴氺- The structure of the drawing can further adjust the direction of the side light 51 of different angles to the vertical basis = 〇, and increase the brightness and the light-emitting area of the light-emitting element in step-by-step. In the example, the light-emitting diode 12 is the light-emitting diode U is the following: In the embodiment of Figure 5.7, the heat-dissipating fin in the light-emitting diode is '第第-4' The third embodiment can also be applied to the illuminating two-package structure. (10) In addition to the effective heat dissipation, the brightness and the illuminating area of the illuminating 7G device are also disclosed. Although the present invention has been disclosed in several preferred embodiments as above It is not intended to limit the invention, and any skilled person skilled in the art can make any changes and refinements without departing from the spirit and scope of the invention, and therefore the scope of protection of the present invention is attached. 201235606 [Simplified illustration of the drawings], 1 is a perspective view of a heat dissipation structure in an embodiment of the present invention; and FIG. 2-3 is a partial enlarged view of a heat dissipation structure of the second embodiment 4 is a top view of the heat dissipation structure of FIG. 1; FIG. 5 is a perspective view of a heat dissipation structure according to an embodiment of the present invention; ^ a partial side view of the heat dissipation structure of the fifth embodiment; and FIG. The present invention - a solid _ towel, a side view of the heat dissipation structure [main component symbol description]
Dl、D2〜散熱片之間的距離； 10〜基板； 〜發光二極體； 14 ' 14A、14B、14C〜散熱片； 16〜穿孔； 17〜焊料； 18〜接觸墊； 51〜側面逸光； 100、500〜散熱結構。Dl, D2 ~ distance between the heat sink; 10 ~ substrate; ~ light-emitting diode; 14 '14A, 14B, 14C ~ heat sink; 16 ~ perforation; 17 ~ solder; 18 ~ contact pad; 51 ~ side light ; 100, 500 ~ heat dissipation structure.