1360620 ---- , 100年.11月10日修正t«百 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種帶有散熱裝置之發光二極體燈具。 【先前技術】 [0002] 發光二極體光源作為一種新興之第三代光源，雖目前還 不能大規模取代傳統之白域燈，但其具有工作壽命長、 節能、環保等優點，而普遍被市場看好。且目前由發光 二極體组成之模組能產生大功率、高亮度之光源，因此 將廣泛地、革命性地取代傳統之白熾燈等習知光源，進 而成為符合節能環保主題之主要光源β [0003] 然，隨著發光二極體或其模組之功率、亮度之增大，其 產生之熱量亦越來越大，且在體積相對較小之發光二極 體燈具内更是難於散發出去。故，發光二極體尚存在較 大散熱技術瓶頸，此亦為目前大功率、高亮度發光一極 體燈具市場化最難突破之關鍵。 [0004] 另，由於發光二極體都有一定之照射角度，而發光二極 體燈具中之發光二極體通常都設置在平直之電路板上， 使燈具之照射面積有限，报多情況下都難以使用戶滿意 〇 【發明内容】 [0005] 有鑒於此，有必要提供一種散熱良好，又能增大照明面 積之發光二極體燈具。 [0006] 一種發光二極體燈具，包括一散熱器，該散熱器具有一 基板及形成於基板上之複數散熱鰭片，一導熱體形成於 096145568 表單編號Α0101 第3頁/共16頁 1003415206-0 1360620 100年.11月10日孩正替换頁 該基板上，該導熱體之橫截面呈三角形，該導熱體橫向 上之高度由其頂端向兩側逐漸減小，縱向上之高度沿其 一端向另一端逐漸減小。 [0007] 該發光二極體燈具在散熱器上設置高熱傳導性能之導熱 體對發光二極體模組進行散熱，可有效解決高功率發光 二極體燈具之發熱問題。該導熱體傾斜及三角形截面之 構造，使安裝在其上之發光二極體模組與水平面形成一 定之夾角，在不增加發光二極體數量之前提下，能增大 燈具之照射角度，進而增大照明面積，且同時還能滿足 用戶特定照明角度之需要。 【實施方式】 [0008] 請參考圖卜3，本發明發光二極體燈具包括一散熱器10、 置於該散熱器10上之一導熱體20及貼設在導熱體20上之 發光二極體模組30。該散熱器10和導熱體20用來對發光 二極體模組30散熱，使發光二極體模組30保持在其允許 之溫度範圍内工作。 [0009] 散熱器10包括一基板12、由基板12之底面向下延伸而成 之複數第一散熱鰭片142及由基板12之頂面向上延伸形成 之複數第二散熱鰭片144。基板12大致呈矩形塊狀，其具 有兩個縱向之相對長邊和兩個橫向之相對短邊。基板12 上相對導熱體20之外邊緣之位置開設有複數第一通孔124 ，該等第一通孔124用於將導熱體20安裝於基板12上。在 第一通孔124之周圍還開設有複數第二通孔125，該等第 二通孔125供固定·件（圖未示）穿過用於固定該發光二極 體燈具。第一散熱鰭片142垂直於基板12且沿縱向互相平 096145568 表單编號A0101 第4頁/共16頁 1003415206-0 1360620 100年.11月10日梭正替換頁 行延伸。沿基板12之中間位置向基板12之兩側方向第一 散熱縛片142之高度逐漸減小，從而散熱器1〇之底端呈弧 狀（請參圖4)。第二散熱鰭片144垂直於基板12且分佈 在基板12之頂面靠向兩側邊之位置。沿基板12之内側向 基板12之邊緣方向第二散熱鰭片144之高度逐漸減小。第 二散熱韓片144與第一散熱鰭片142互相平行，且兩相鄰 之第一散熱鰭片142和兩相鄰之第二散熱鰭片144之間形 成供氣流通過之流道14〇 ,該等流道140之延伸方向與基 板12之長邊平行。基板12之兩側分別開設有複數兩兩相 對之切口 16，該等切口 16沿與第一散熱鰭片】42垂直之方 向向基板12内延伸並將第二散熱鰭片} 44和部分第一散熱 鰭片142切斷。在基板12之底面上還設有複數切斷第一散 熱鰭片142之溝槽18，該等溝槽18沿與切口 16平行之方 向延伸，且每一溝槽18都與其中之一對切口 16直接相連 通。在本實施例中’溝槽丨8之數量少於切口 16之對數， 且每相隔一對切口 16開設有一溝槽is。 [0010] 導熱體2 0置於基板12之頂面上。導熱體2 〇由具有高導熱 性之材料如銅、鋁或其合金製成。本實施例中，導熱體 20為一與散熱器1〇分離之導熱塊，可以理解地，該導熱 體20可從散熱器1〇之基板12之頂面向上一體延伸形成。 該導熱體20亦不限於為金屬導熱塊，可以為相變化散熱 體，其内形成空腔，然後填充工作液體于其内利用液體 之相變化過程傳導熱量，如熱導管、均熱板等。導熱體 20之橫截面呈三角形，且導熱體2〇沿基板12之縱向方向 上延伸。導熱體20之頂部21與第二散熱鰭片144平行且位 096145568 表單編號A0101 第5頁/共16頁 1003415206-0 1360620 100年11月10日孩正替換頁 於基板12之頂面上之中間位置。導熱體2〇橫向上之高度 沿其頂部21向其兩側逐漸減小，且導熱體2〇之兩個側面 (未標示）沿其頂部21對稱’因而導熱㈣之兩個側面 升>成與基板12之頂面有-定之夾角之傾斜面。導熱體2〇 之兩個側面上形成複數安裝孔2〇1用於將發光二極體模組 30安裝於其上。導熱體2G之外邊緣上對應基板12上之第 一通孔124還開設有複數第三通孔205，用以將導熱體2〇 安裝在散熱器10上。導熱體20在縱向上之高度沿其後端 23向其前端22逐漸減小，因而導熱體2〇之頂部21與基板 12之頂面在縱向上形成一個夾角（請參圖5)。第二散熱 鰭片144置於導熱體20之兩側。 [0011] 發光一極體模組30包括複數長條狀之電路板31，每一電 路板31上設置有複數發光二極體32 ^每—電路板31均勻 地议置在導熱體2 0之兩個側面上〇可以理解地，該等電 路板31可以用一整塊大之電路板代替，發光二極體32可 呈矩陣式排列在該整塊電路板上。 [0012] 該發光二極體燈具組裝時，導熱體20置於散熱器10之基 板12之頂面上，發光二極體模組3〇之電路板31置於導熱 體20之兩側面上。 [0013] 請同時參考圖4和圖5，該發光二極體燈具工作時，發光 二極趙模組30產生之熱量能被導熱體2〇吸收並及時地傳 遞到散熱器10之基板12上，從而不會在發光二極體模組 30附近聚集。最後透過自然空氣對流流過第一、第二散 熱鰭片142、144將熱量散發到周圍空氣中。在本實施例 中，一部分冷卻空氣可沿著第一、第二散熱鰭片142、 096145568 表單編號A0101 第6頁/共丨6頁 1003415206-0 1360620 100年.11:月10日修正替換頁 14 4間之流道14 0流動並由該基板1 2之兩個短邊方向流出 ，另外一部分氣流會沿著切口 16和溝槽18流動並由基板 12之兩個長邊流出。如此冷卻氣流將由四個方向流出並 帶走發光二極體模組20工作時產生之熱量。該等切口 16 和溝槽18之設置將大大增強散熱器10之散熱鰭片14間之 空氣對流，同時減小散熱器10之重量，因此，該散熱器 10在不增加其體積和散熱鰭片密度之條件下而具有更高 之散熱效率。另外本發明結合導熱體20高效之熱傳導性 能，可解決發光二極體燈具之散熱問題。 [0014] 因為設置在導熱體20之兩側面上之電路板31與散熱器10 之基板12呈一定之夾角，使得發光二極體32之光線其照 射角度可向散熱器10之兩側擴張，因而朝散熱器10之兩 側之照射面積增大。與發光二極體32水平地設置在基板 12上相比，在發光二極體32之數量相同之前提下，本發 明之發光二極體32之照射面積更大。另外，由於導熱體 20在縱向上之高度沿前前端22到其後端22逐漸增大，置 於導熱體20之後端22部分之電路板31向上凸起，因而發 光二極體32之照射角度與水平設置時相比能向圖5箭頭所 示方向偏擺，使其朝向該方向之照射面積增大，以滿足 用戶於該角度下之照明需要。 [0015] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 096145568 表單編號A0101 第7頁/共16頁 1003415206-0 1360620 100年.11月10日核正替换頁 【圖式簡單說明】 [0016] 圖1為本發明發光二極體燈具之一優選實施例之立體組合 圖。 [0017] 圖2為圖1中發光二極體燈具之立體分解圖。 [0018] 圖3為圖1中發光二極體燈具之另一視角圖。 [0019] 圖4為圖1中發光二極體燈具之正視圖。 [0020] 圖5為圖1中發光二極體燈具之側視圖。 【主要元件符號說明】 [0021] 散熱器：10 [0022] 基板：12 [0023] 第一通孔：124 [0024] 第二通孔：125 [0025] 流道：140 [0026] 第一散熱鰭片：142 [0027] 第二散熱鰭片：144 [0028] 切口 ： 1 6 [0029] 溝槽：18 [0030] 導熱體：20 [0031] 安裝孔：201 [0032] 第三通孔：20 5 096145568 表單编號A0101 第8頁/共16頁 1003415206-0 100年.11月10日核正替换頁 1360620.1360620 ----, 100 years. November 10th revision t«100, invention description: [Technical field of invention] [0001] The present invention relates to a light-emitting diode lamp with a heat sink. [Prior Art] [0002] As a new generation of light source, the light-emitting diode light source can not replace the traditional white-field lamp on a large scale, but it has the advantages of long working life, energy saving, environmental protection, etc. The market is optimistic. At present, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, and thus will widely and revolutionarily replace the conventional light source such as a conventional incandescent lamp, thereby becoming a main light source that conforms to the theme of energy conservation and environmental protection [ [ 0003] However, as the power and brightness of the light-emitting diode or its module increase, the heat generated is also larger and larger, and it is more difficult to emit in a relatively small-sized light-emitting diode lamp. . Therefore, the LED has a large heat dissipation technology bottleneck, which is the key to the breakthrough of the current market for high-power, high-brightness illuminating one-pole lamps. [0004] In addition, since the light-emitting diodes have a certain illumination angle, the light-emitting diodes in the light-emitting diode lamps are usually disposed on a flat circuit board, so that the illumination area of the lamps is limited, and the situation is reported. It is difficult to satisfy the user. [Invention] [0005] In view of the above, it is necessary to provide a light-emitting diode lamp that has good heat dissipation and can increase the illumination area. [0006] A light-emitting diode lamp includes a heat sink having a substrate and a plurality of heat-dissipating fins formed on the substrate, and a heat conductor formed on 096145568 Form No. 1010101 Page 3 / Total 16 Page 1003415206-0 1360620 100. On November 10th, the child replaces the substrate. The heat conductor has a triangular cross section. The height of the heat conductor is gradually reduced from the top to the sides, and the height in the longitudinal direction is along one end. The other end is gradually decreasing. [0007] The light-emitting diode lamp is provided with a heat conduction body with high thermal conductivity on the heat sink to dissipate heat from the light-emitting diode module, which can effectively solve the heat problem of the high-power light-emitting diode lamp. The structure of the inclined and triangular cross-section of the heat conductor is such that the LED module mounted thereon forms an angle with the horizontal plane, and can be raised before the number of the LEDs is increased, thereby increasing the illumination angle of the lamp, and further Increase the lighting area while still meeting the user's specific lighting angle. [0008] Referring to FIG. 3, the LED lamp of the present invention includes a heat sink 10, a heat conductor 20 disposed on the heat sink 10, and a light emitting diode attached to the heat conductor 20. Body module 30. The heat sink 10 and the heat conductor 20 are used to dissipate heat from the LED module 30 to keep the LED module 30 operating within its allowable temperature range. The heat sink 10 includes a substrate 12, a plurality of first heat dissipation fins 142 extending downward from a bottom surface of the substrate 12, and a plurality of second heat dissipation fins 144 extending upward from a top surface of the substrate 12. The substrate 12 has a generally rectangular block shape having two longitudinally opposite long sides and two laterally opposite short sides. A plurality of first through holes 124 are formed on the substrate 12 at a position opposite to the outer edge of the heat conductor 20, and the first through holes 124 are used to mount the heat conductor 20 on the substrate 12. Further, a plurality of second through holes 125 are formed around the first through holes 124, and the second through holes 125 are passed through a fixing member (not shown) for fixing the light emitting diode lamp. The first heat dissipation fins 142 are perpendicular to the substrate 12 and are horizontally aligned with each other. 096145568 Form No. A0101 Page 4 of 16 Page 1003415206-0 1360620 100. On November 10, the shuttle is replacing the page line extension. The height of the first heat dissipating tab 142 is gradually decreased toward the both sides of the substrate 12 along the intermediate position of the substrate 12, so that the bottom end of the heat sink 1 is curved (see Fig. 4). The second heat dissipation fins 144 are perpendicular to the substrate 12 and are distributed on the top surfaces of the substrate 12 at positions on both sides. The height of the second heat radiation fins 144 gradually decreases toward the edge of the substrate 12 along the inner side of the substrate 12. The second heat dissipation fins 144 and the first heat dissipation fins 142 are parallel to each other, and a flow path 14 供 is formed between the two adjacent first heat dissipation fins 142 and the two adjacent second heat dissipation fins 144 for airflow. The flow channels 140 extend in a direction parallel to the long sides of the substrate 12. A plurality of opposite slits 16 are respectively formed on two sides of the substrate 12, and the slits 16 extend in the direction perpendicular to the first heat sink fins 42 toward the substrate 12 and the second heat sink fins 44 and portions are first The heat sink fins 142 are cut. A plurality of grooves 18 for cutting the first heat dissipation fins 142 are further disposed on the bottom surface of the substrate 12, and the grooves 18 extend in a direction parallel to the slits 16, and each of the grooves 18 is incision with one of the grooves 16 is directly connected. In the present embodiment, the number of the groove knuckles 8 is smaller than the number of the slits 16 and a groove is is formed each other across the pair of slits 16. [0010] The thermal conductor 20 is placed on the top surface of the substrate 12. The heat conductor 2 is made of a material having high thermal conductivity such as copper, aluminum or an alloy thereof. In this embodiment, the heat conductor 20 is a heat conducting block separated from the heat sink 1 . It can be understood that the heat conductor 20 can be integrally formed from the top surface of the substrate 12 of the heat sink 1 . The heat conductor 20 is also not limited to a metal heat conducting block, and may be a phase change heat sink in which a cavity is formed, and then the working liquid is filled therein to conduct heat by a phase change process of the liquid, such as a heat pipe, a heat equalizing plate, or the like. The heat conductor 20 has a triangular cross section, and the heat conductor 2 extends in the longitudinal direction of the substrate 12. The top portion 21 of the heat conductor 20 is parallel to the second heat dissipation fins 144 and has a position of 096145568. Form No. A0101 Page 5 of 16 pages 1003415206-0 1360620 On November 10, 100, the child replaces the page on the top surface of the substrate 12. position. The height of the heat conductor 2 〇 is gradually reduced along the top portion 21 thereof toward both sides thereof, and the two sides (not labeled) of the heat conductor 2 are symmetric along the top portion 21 thereof, and thus the two sides of the heat conduction (four) are raised. An inclined surface having a predetermined angle with the top surface of the substrate 12. A plurality of mounting holes 2?1 are formed on both sides of the heat conductor 2''' to mount the LED module 30 thereon. The first through hole 124 of the corresponding substrate 12 on the outer edge of the heat conductor 2G is further provided with a plurality of third through holes 205 for mounting the heat conductor 2 on the heat sink 10. The height of the heat conductor 20 in the longitudinal direction gradually decreases toward the front end 22 along the rear end 23 thereof, so that the top portion 21 of the heat conductor 2 forms an angle with the top surface of the substrate 12 in the longitudinal direction (refer to Fig. 5). The second heat dissipation fins 144 are placed on both sides of the heat conductor 20. [0011] The light-emitting diode module 30 includes a plurality of strip-shaped circuit boards 31, and each of the circuit boards 31 is provided with a plurality of light-emitting diodes 32. Each of the circuit boards 31 is uniformly disposed on the heat-conducting body 20 It can be understood that the two circuit boards 31 can be replaced by a single large circuit board, and the light emitting diodes 32 can be arranged in a matrix on the whole circuit board. [0012] When the light-emitting diode lamp is assembled, the heat conductor 20 is placed on the top surface of the base plate 12 of the heat sink 10, and the circuit board 31 of the light-emitting diode module 3 is placed on both sides of the heat conductor 20. [0013] Referring to FIG. 4 and FIG. 5 simultaneously, when the LED device is in operation, the heat generated by the LED module 30 can be absorbed by the heat conductor 2 and transmitted to the substrate 12 of the heat sink 10 in time. Therefore, it does not gather near the light emitting diode module 30. Finally, convection through natural air flows through the first and second heat radiating fins 142, 144 to dissipate heat into the surrounding air. In this embodiment, a part of the cooling air may be along the first and second heat dissipation fins 142, 096145568 Form No. A0101 Page 6 / Total 6 pages 1003415206-0 1360620 100 years. 11: Month 10 correction replacement page 14 The four flow paths 140 flow and flow out from the two short sides of the substrate 12, and another portion of the air flows along the slits 16 and the grooves 18 and flows out from the two long sides of the substrate 12. Thus, the cooling airflow will flow out in four directions and take away the heat generated by the operation of the LED module 20. The arrangement of the slits 16 and the grooves 18 will greatly enhance the air convection between the heat sink fins 14 of the heat sink 10, while reducing the weight of the heat sink 10, so that the heat sink 10 does not increase its volume and heat sink fins. Under the condition of density, it has higher heat dissipation efficiency. In addition, the present invention combines the high thermal conductivity of the heat conductor 20 to solve the heat dissipation problem of the LED lamp. [0014] Since the circuit board 31 disposed on both sides of the heat conductor 20 is at an angle with the substrate 12 of the heat sink 10, the illumination angle of the light emitting diode 32 can be expanded toward both sides of the heat sink 10. Therefore, the irradiation area toward both sides of the heat sink 10 is increased. The illumination area of the light-emitting diode 32 of the present invention is larger as compared with the case where the light-emitting diodes 32 are horizontally disposed on the substrate 12 before the number of the light-emitting diodes 32 is the same. In addition, since the height of the heat conductor 20 in the longitudinal direction gradually increases along the front front end 22 to the rear end 22 thereof, the circuit board 31 placed at the end 22 portion of the heat conductor 20 is upwardly convex, and thus the illumination angle of the light emitting diode 32 is obtained. Compared with the horizontal setting, it can be yawed in the direction indicated by the arrow in FIG. 5, so that the irradiation area in the direction is increased to meet the illumination needs of the user at the angle. [0015] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. 096145568 Form No. A0101 Page 7 / Total 16 Page 1003415206-0 1360620 100. November 10th Nuclear Replacement Page [Simple Description] [0016] FIG. 1 is a preferred embodiment of a light-emitting diode lamp of the present invention The three-dimensional combination map. 2 is an exploded perspective view of the light-emitting diode lamp of FIG. 1. 3 is another perspective view of the light-emitting diode lamp of FIG. 1. 4 is a front elevational view of the light emitting diode lamp of FIG. 1. 5 is a side view of the light emitting diode lamp of FIG. 1. [Main component symbol description] [0021] Heat sink: 10 [0022] Substrate: 12 [0023] First through hole: 124 [0024] Second through hole: 125 [0025] Flow path: 140 [0026] First heat dissipation Fin: 142 [0027] Second heat sink fin: 144 [0028] Cut: 1 6 [0029] Trench: 18 [0030] Thermal conductor: 20 [0031] Mounting hole: 201 [0032] Third through hole: 20 5 096145568 Form No. A0101 Page 8 / Total 16 Page 1003415206-0 100 years. November 10th Nuclear Replacement Page 1360620.
[0033] 頂部：21 [0034] 前端：22 [0035] 後端：23 [0036] 發光二極體模組：30 [0037] 電路板：31 [0038] 發光二極體：32 096145568 表單編號A0101 第9頁/共16頁 1003415206-0[0033] Top: 21 [0034] Front end: 22 [0035] Back end: 23 [0036] Light-emitting diode module: 30 [0037] Circuit board: 31 [0038] Light-emitting diode: 32 096145568 Form number A0101 Page 9 of 16 page 1003415206-0