TW200923249A - LED lamp - Google Patents

LED lamp Download PDF

Info

Publication number
TW200923249A
TW200923249A TW96145568A TW96145568A TW200923249A TW 200923249 A TW200923249 A TW 200923249A TW 96145568 A TW96145568 A TW 96145568A TW 96145568 A TW96145568 A TW 96145568A TW 200923249 A TW200923249 A TW 200923249A
Authority
TW
Taiwan
Prior art keywords
heat
light
substrate
emitting diode
diode lamp
Prior art date
Application number
TW96145568A
Other languages
Chinese (zh)
Other versions
TWI360620B (en
Inventor
Wen-Xiang Zhang
Guang Yu
Cheng-Tien Lai
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW96145568A priority Critical patent/TWI360620B/en
Publication of TW200923249A publication Critical patent/TW200923249A/en
Application granted granted Critical
Publication of TWI360620B publication Critical patent/TWI360620B/en

Links

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

An LED lamp includes a heat sink and a heat conducting block formed on the heat sink. The heat sink includes a base and a plurality of fins extending from the base. The heat conducting block is substantially triangular and a longitudinal height of the heat conducting block increases gradually from one end thereof to the other thereof.

Description

200923249 九、發明說明: 【發明所屬之技術領域】 本發明涉及-種帶有散熱農置之發光二極體燈具。 【先前技術】 發光二極體光源作為-種新興之第三代光源,雖目前 還不能大規模取代傳統之白熾燈,但其具有工作壽命長、 節能、環保等優點,而普遍被市場看好。且目前由發光二 極體組成之模組能產生大功率、高亮度之光源,因此將廣 ^也、革命性地取代傳統之白熾燈等習知光源,進而成為 符合節能環保主題之主要光源。 … 然,隨著發光二極體或其模組之功 其產生之熱量亦越來越大,且右儿度之曰大, p · 體積相對較小之發光二極 妝燈具内更疋難於散發出去。 , 又 ^九一極體尚存在較大 政,,、、技術瓿頸,此亦為目前大功率、言宾 具市場化最難突破之關鍵。 w冗又,一極體燈 另,由於發光二極體都有一 極體燈具中之發光二極體通常都:=;度,而發光二 使燈具之照射_限,❹m直之電路板上, 【發明内容】 又巾尸/兩心 有宴於此,有必要與也 要徒供一種散熱良好, 面積之發光二極體燈具。 ba大…、月 一種發光二極體燈具, -基板及形成於基板上 ::熱器’該散熱器具有 該基板上’該導熱體之橫 形成於 一月形,且該導熱體縱向 200923249 上之冋度沿其—端向另—端逐漸減小。 埶體極體燈具在散熱器上設置高熱傳導性能之導 …體對發先二極體模組進行散熱,可有效解決高功率發光 :極體:具之發熱問題。該導熱體傾斜及三角形截面之構 ^使安衣在其上之發光二極體模組與水平面形成一定之 “角’在不增加發光二極體數量之前提下,能增大燈具之 ㈣角度’進而增大照明面積’且同時還能滿足用戶特定 照明角度之需要。 【實施方式】 明多芩圖1-3,本發明發光二極體燈具包括一散熱器 1〇置於該政熱器10上之一導熱體2〇及貼設在導熱體加 上^發光二極體模組30。該散熱器1〇和導熱體2〇用來對 發光-極體模組3G散熱’使發光二極體模組%保持在其 允許之溫度範圍内工作。 〃 散熱器10包括一基板12、由基板12之底面向下延伸 k而成之複數第一散熱鰭片142及由基板12之頂面向上延伸 形成之複數第二散熱鰭片144。基板12大致呈矩形塊狀, 其具有兩個縱向之相對長邊和兩個橫向之相對短邊。基板 12上相對導熱體20之外邊緣之位置開設有複數第一通孔 124’該等第一通孔124用於將導熱體2〇安裝於基板上。 在第一通孔124之周圍還開設有複數第二通孔125,該等第 一通孔125供固定件(圖未示)穿過用於固定該發光二極 體燈具。第一散熱鰭片142垂直於基板12且沿縱^互二平 行延伸。沿基板12之中間位置向基板12之兩側方向第一 200923249 散熱鰭片142之高度逐漸減小 •狀(請參圖4)。第m H u 10之底端呈弧 •在基板u之頂面144垂直於基板12且分佈 美柘η 兩側邊之位置。沿基板12之内側向 基板12之邊綠門W句 - I埶鍺' ° 一放*、、、‘,、、9片144之高度逐漸減小。第 ==44與第一散熱鰭互相平行,且兩相: 成供氣流通過之流道140, :—^ 144之間形 19 w等机還140之延伸方向盘美杯 12之長邊平行。基板i2 /、基板 切口 16,!^^ κ、U稷數兩兩相對之 μ 16沿與第—散熱鰭片142垂直之方南& 基板12内延伸並將第二 向向 142切斷。在 二一曰片144和部分第-散熱鰭片 ,149 ^ 土板之底面上還設有複數切斷第一散埶銼 片⑷之溝槽18,該等溝槽⑺沿與切口 伸,且每一溝槽18都金甘 丁之方向延 在太音η/Γ 中之—對切σ 16直接相連通。 =:溝槽18之數量少於切…對數,且每 相1W—對切口 16開設有一溝槽18。 導熱體2G置於基板12之頂面上。導熱體 且 導熱性之材料如銅、鋁< 八有间 2 〇為一與散熱器10分離之導熱塊,可以理解地,兮導 熱體2〇可從散熱器10之基板12之頂面向 ;二 熱體,其内形成空:二S’可以她 之相變化過程ΐ導:量二充;作液體于其内利用液趙 之浐1 熱¥官、均熱板等。導熱體20 只截二角形,且導熱體2〇沿基板 延伸。導熱體2。之頂部21與第二_14=: 200923249 於基板12之頂面上之中間位置。導熱體2〇橫 )〜、頂# 21對稱,因而導熱體20之兩個側面 形成與基板12之頂面有一定之夾角之傾斜面。導哉體加 之兩個侧面上形成複數安裝孔2G1用於將發光體 30安裝於其上。導熱體2Q之外邊緣上對應基板12=第 還開設有複數第三通孔2〇5,用以將導熱體2〇 文裝在政熱裔1〇上。導熱體2〇在縱向上之高度沿其後端 23向其前端22逐漸減小,因而導熱體2()之頂端21與基板 12之頂面在縱向上形成一個夾角(請參圖” 二 鰭片144置於導熱體20之兩侧。 弟一政… 發光二極體模組30包括複數長條狀之電路板31,每一 電路板31上設置有複數發光二極體% 句地設置在導熱體2。之兩個侧面上。可以理解 路板31可以用一举地女夕带心 ' ^正巩大之私路板代替,發光二極體32可 呈矩陣式排列在該整塊電路板上。 該發光二極體燈具組裝時,導熱體2〇置於散熱器忉 :基板12之頂面上’發光二極體模組3〇之電路板”置於 導熱體20之兩側面上。 、 請同時參考圖4和圖5,該發光二極體燈具工作時,發 先二極體模組3〇產生之熱量能被導熱體2〇 ^ 傳遞到散熱器1G之基板12上,從而不會在發光二極= 組30附近聚集。最後透過自然空氣對流流過第一、第二散 熱韓片142、144將熱量散發到周圍空氣中。在本實施例中月, 200923249 一部分冷卻空氣可沿著第-、第二散㈣片142、144間之 流道140流動並由該基板12之兩個短邊方向流出,另外一 ‘= 氣流會沿著切口 16和溝槽18流動並由基板12之兩個 長邊流出。如此冷卻氣流將由四個方向流出並帶走發光二 極體模組20工作時產生之熱量。該等.切口 16和溝槽181 大增強散熱器1〇之散熱鰭片14間之空氣對流, 小散熱HH)之重量’因此,該散熱器iq在不增加 f 散熱韓片密度之條件下而具有更高之散熱效率。 ::發明結合導熱體20高效之熱傳導性能,可解決發光 二極體燈具之散熱問題。 九 因為設置在導執體2〇夕+ ㈣之基板面上之電路板31與散熱 其照射角度可向散教發光二極體32之光線 之雨如”“ 兩側擴張’因而朝散熱器10 :之:射面積增大。與發光:極體32水平地設 板12上相比,在發光二極體32 二 ί發明之發光二極體32之昭射 里=之别提下’本 20在縱向上之高戶”Γ積更大。另外,由於導熱體 20 22 ^ ^ 光-朽舻π 2邛刀之氣路板31向上凸起,因而發 射角度與水平設置時相比能向圖5箭頭所 使其朝向該方向之照射面積增大,以滿足用 尸於該角度下之照明需要。 利以=符合發明專利要件,爱依法提出專 熟悉本案技藝之人士 :僅為本發明之較佳實施例,舉凡 在菱依本發明精神所作之等效修飾 10 200923249 或變化’皆應涵蓋於以下之_請專利範圍内。 【圖式簡單說明】 ,圖1為本發明發光二極體燈具之—優選實施例之立 圖2為圖1中發光二極體燈具之立體分解圖。 圖3為圖i中發光二極體燈具之另一視角圖。 圖4為圖}中發光二極體燈具之正視圖。 圖5為圖i中發光二極體燈具之側視圖。 【主要元件符號說明】 散熱器 10 第一通孔 124 流道 140 第二散熱鰭片 144 溝槽 18 安裝孔 201 頂端 21 後端 23 電路板 31 12 125 142 16 20 205 22 30 32 基板 第二通孔 第一散熱鰭片 切口 導熱體 第三通孔 前端 發光二極體模組 發光二極體 11200923249 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a light-emitting diode lamp with a heat-dissipating agricultural device. [Prior Art] As a new generation of light source, the light-emitting diode light source can not replace the traditional incandescent lamp on a large scale, but it has the advantages of long working life, energy saving and environmental protection, and is generally favored by the market. At present, the module consisting of a light-emitting diode can generate a high-power, high-brightness light source, and thus will replace the conventional light source such as a conventional incandescent lamp, and become a main light source that meets the theme of energy conservation and environmental protection. ... However, with the work of the light-emitting diode or its module, the heat generated by it is getting larger and larger, and the right-handedness is large, and the light-emitting diode lamp with relatively small volume is more difficult to distribute. Go out. , and the nine-in-one polar body still has a large political,, and technical neck, which is also the key to the most difficult breakthrough in the current high-power, market-oriented market. w redundant, one pole body lamp, because the light-emitting diode has a polar body in the body of the light-emitting diode usually: =; degrees, and the light two makes the illumination of the lamp _ limit, ❹m straight on the circuit board, [ SUMMARY OF THE INVENTION The towel body/two hearts have a feast for this, it is necessary to provide a kind of light-emitting diode lamp with good heat dissipation. a large light-emitting diode lamp, a substrate and a substrate formed on the substrate: a heat sink having a heat-transfer body formed on the substrate and having a lateral shape formed in a moon shape, and the heat conductor is longitudinally viewed on 200923249 The twist gradually decreases along its end to the other end. The body of the body is equipped with a high thermal conductivity on the heat sink. The heat dissipation of the first diode module can effectively solve the high power illumination: the polar body: the heating problem. The tilting and triangular cross-section of the heat conductor can form a certain "angle" of the light-emitting diode module and the horizontal plane on the surface of the heat-conducting body without increasing the number of light-emitting diodes, thereby increasing the angle of the lamp. 'Increase the illumination area' and at the same time also meet the needs of the user-specific illumination angle. [Embodiment] In the present invention, the light-emitting diode lamp of the present invention comprises a heat sink 1〇 placed in the political heater A heat conductor 2 is attached to the heat conductor and the light emitting diode module 30 is attached to the heat conductor. The heat sink 1 and the heat conductor 2 are used to dissipate heat from the light body module 3G. The polar body module % keeps working within its allowable temperature range. 散热器 The heat sink 10 includes a substrate 12, a plurality of first heat dissipation fins 142 extending downward from the bottom surface of the substrate 12, and a top surface of the substrate 12 The plurality of second heat dissipation fins 144 are formed to extend upwardly. The substrate 12 has a substantially rectangular block shape with two longitudinally opposite long sides and two laterally opposite short sides. The position of the substrate 12 opposite to the outer edge of the heat conductor 20 Opening a plurality of first through holes 124' The hole 124 is used for mounting the heat conductor 2 on the substrate. A plurality of second through holes 125 are defined around the first through hole 124, and the first through holes 125 are used for fixing the fixing member (not shown). The first heat dissipating fins 142 are perpendicular to the substrate 12 and extend in parallel along the longitudinal direction. The height of the first heat dissipation fins 142 of the first 200923249 is directed to the sides of the substrate 12 along the intermediate position of the substrate 12. Gradually reduce the shape (see Figure 4). The bottom end of the m H u 10 is arced. • The top surface 144 of the substrate u is perpendicular to the substrate 12 and is located on both sides of the substrate 。. The green door to the side of the substrate 12 - I埶锗' ° The height of the *, ,, ',,, and 9 pieces 144 gradually decreases. The ==44 and the first heat radiating fin are parallel to each other, and the two phases: The flow path 140 through which the airflow passes is formed, and the long side of the Panmei cup 12 is parallel. The substrate i2 /, the substrate slit 16 , ! ^ ^ κ, U 稷 two The two opposite μ 16 extend along the square south & substrate 12 perpendicular to the first heat sink fin 142 and cut the second direction 142. In the two slices 144 and the portion The first fin and the fin 149 ^ are further provided with a plurality of grooves 18 for cutting the first diffuser (4) on the bottom surface of the soil plate, the grooves (7) extending along the slit, and each groove 18 is golden The direction of D is extended in the yin η/Γ—the direct connection of the tangent σ 16. =: The number of the grooves 18 is less than the tan... logarithm, and each phase is 1 W—the trench 16 is provided with a trench 18. 2G is placed on the top surface of the substrate 12. The heat conductor and the material of thermal conductivity such as copper, aluminum < Between the two are a heat-conducting block separated from the heat sink 10, it is understood that the heat-conducting body can be The top surface of the substrate 12 of the heat sink 10 faces; the second heat body, which forms an empty space therein: the second S' can change the phase of her phase: the amount of two charges; as the liquid in the liquid, the use of liquid Zhao Zhiyi 1 hot ¥ official, Soaking plates, etc. The heat conductor 20 has only a truncated shape, and the heat conductor 2 extends along the substrate. Thermal conductor 2. The top 21 and the second _14=: 200923249 are in the middle of the top surface of the substrate 12. The heat conductor 2 is horizontally symmetrical, and the top # 21 is symmetrical, so that the two side faces of the heat conductor 20 form an inclined surface having a certain angle with the top surface of the substrate 12. A plurality of mounting holes 2G1 are formed on both sides of the guide body for mounting the illuminator 30 thereon. The corresponding substrate 12 on the outer edge of the heat conductor 2Q is further provided with a plurality of third through holes 2〇5 for mounting the heat conductor 2 on the political heat. The height of the heat conductor 2 is gradually decreased along the rear end 23 toward the front end 22 thereof, so that the top end 21 of the heat conductor 2 () forms an angle with the top surface of the substrate 12 in the longitudinal direction (refer to the figure). The sheet 144 is placed on both sides of the heat conductor 20. The LED module 30 includes a plurality of strip-shaped circuit boards 31, each of which is provided with a plurality of light-emitting diodes. On the two sides of the heat conductor 2. It can be understood that the road plate 31 can be replaced by a private board of the same name, and the light-emitting diodes 32 can be arranged in a matrix on the whole circuit board. When the light-emitting diode lamp is assembled, the heat-dissipating body 2 is placed on the heat sink 忉: the top surface of the substrate 12 'the circuit board of the light-emitting diode module 3 置于 is placed on both sides of the heat conductor 20 . Referring to FIG. 4 and FIG. 5, when the LED device is in operation, the heat generated by the first diode module 3 can be transferred to the substrate 12 of the heat sink 1G by the heat conductor 2, so that The light-emitting diodes are gathered near the group 30. Finally, the first and second heat-dissipating Korean films 142 are convected by natural air. 144 dissipates heat into the surrounding air. In this embodiment, a portion of the cooling air may flow along the flow path 140 between the first and second (four) sheets 142, 144 and the two short sides of the substrate 12 The direction flows out, and another '= airflow flows along the slit 16 and the groove 18 and flows out from the two long sides of the substrate 12. Thus, the cooling airflow will flow out in four directions and take away the light-emitting diode module 20 to work. The heat of the slit 16 and the groove 181 greatly enhances the air convection between the heat sink fins 14 of the heat sink 1 and the heat dissipation of the small heat sink HH. Therefore, the heat sink iq does not increase the heat density of the heat sink. Under conditions, it has higher heat dissipation efficiency. The invention combines the high-efficiency heat conduction performance of the heat conductor 20 to solve the heat dissipation problem of the light-emitting diode lamp. Nine because the circuit board 31 disposed on the substrate surface of the guide body 2 + + + (4) and the heat dissipation angle thereof can be directed to the light of the light-emitting diode 32, such as "the side is expanded" and thus toward the heat sink 10 : The: the shot area increases. Compared with the illuminating: the polar body 32 is horizontally disposed on the board 12, in the illuminating diode 32, the illuminating diode 32 of the illuminating diode 32 is not included in the 'high 20 in the vertical direction' hoarding In addition, since the heat exchanger 20 22 ^ ^ light 舻 π 2 邛 blade of the air passage plate 31 is upwardly convex, the emission angle can be made to the direction of the arrow of FIG. 5 as compared with the horizontal setting. The irradiation area is increased to meet the lighting needs of the corpse at this angle. Benefiting = complying with the patent requirements of the invention, and those who are familiar with the art of the present invention in accordance with the law: only the preferred embodiment of the present invention, Equivalent Modifications 10 200923249 or variations of the spirit of the invention are to be included in the following claims. [Simplified Schematic] FIG. 1 is a schematic view of a preferred embodiment of a light-emitting diode lamp of the present invention. 3 is an exploded perspective view of the light-emitting diode lamp of FIG. 1. Figure 3 is another perspective view of the light-emitting diode lamp of Figure i. Figure 4 is a front view of the light-emitting diode lamp of Figure}. Side view of the light-emitting diode lamp in i. [Main component symbol description] Heat sink 10 first through hole 124 flow path 140 second heat sink fin 144 groove 18 mounting hole 201 top end 21 rear end 23 circuit board 31 12 125 142 16 20 205 22 30 32 substrate second through hole first heat sink fin Incision heat conductor third through hole front end light emitting diode module light emitting diode 11

Claims (1)

200923249 十、申請專利範圍·· 1. -種發光二極體燈具,包括一散熱器,該散熱器具有一 基板及形成於基板上之複數散熱鰭片,其改良在於:一 導熱體形成於該基板上,該導熱體之橫截面呈三角形, 且該導熱體縱向上之高度沿其一端向另一端逐漸減二 2. 如申請專利範圍第丄項所述之發光二極體燈具,其中該 ^熱體為相變化散熱體。 3. 如中請專利範圍第工項所述之發光二極體燈具, 導熱體與散熱器一體成型。 /、 4. 如申請專利範圍第i餐述之發光二極體燈具, 鰭二:括形成於該基板二相反表面之第—散熱鰭片 同’該導熱體與第二散熱·鰭片處在基板之 5. 如申請專利範圍第4項所述之發光二極體燈 導熱體置於基板之中央位置,且導敎體=,其中該 呈對稱分佈’該第二散熱轉片分佈在導熱體: Hr範圍第4項所述之發光二極體燈具,並中該 :韓片與第二散熱韓片互相平行, 向延伸方向與該第一、第二散熱 U呢 7.如申嗜赛未丨a "、、a 申方向平行。 J靶圍苐6項所述之發光二極體燈具,苴" ㈣其内延伸且至少切斷部分第-: 直於第―、第:;、二广切口’該專切口之延伸方向垂 ^ 第一散熱鰭片之延伸方向。 12 200923249 8,如申請專利範圍第7項所述之發光二極 切口兩兩相對設置,並置於導熱體之兩甸。且“ 1·如中請專利範圍第7項所述之發光二極體燈星 散熱器上還設有複數切斷第—散、= 槽沿與㈣平行之方岐伸,且兑巾槽,該等溝 中之_個細城1。 /、夕—個溝槽與其 讥如申請專利範圍第i項所述之發光二 發光二極體模組包括複數電路 二、、中該 數笋来-榀鯓 0 電路板上設有複 極體,且該電路板貼設在導熱體之兩側面上。 13200923249 X. Patent Application Scope 1. A light-emitting diode lamp includes a heat sink having a substrate and a plurality of heat-dissipating fins formed on the substrate, the improvement being: a heat conductor is formed on the substrate The heat conductor has a triangular cross section, and the height of the heat conductor in the longitudinal direction is gradually decreased by two from one end to the other end. The light emitting diode lamp according to the above claim, wherein the heat is The body is a phase change heat sink. 3. For the LED lamp as described in the Scope of the Patent, the heat conductor and the heat sink are integrally formed. /, 4. For the illuminating diode lamp of the i-species in the patent application scope, the fin 2: the first surface formed on the opposite surface of the substrate - the heat-dissipating fin is the same as the heat-dissipating body and the second heat-dissipating fin 5. The substrate of the light-emitting diode lamp according to claim 4, wherein the heat-conducting body of the light-emitting diode lamp is placed at a central position of the substrate, and the guiding body=, wherein the symmetric distribution is distributed, the second heat-dissipating fin is distributed on the heat-conducting body. : The light-emitting diode lamp according to item 4 of the Hr range, wherein: the Korean film and the second heat-dissipating Korean film are parallel to each other, and the extending direction is the first and second heat-dissipating U. 7.丨a ",, a apply parallel to the direction. J target 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 苐 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光^ The direction in which the first fins extend. 12 200923249 8, the light-emitting diode cuts described in item 7 of the patent application are arranged opposite each other and placed in the second heat conductor. And "1. The light-emitting diode lamp star radiator described in item 7 of the patent scope is also provided with a plurality of cut-off-distribution, = groove along the (four) parallel square extension, and the towel groove, _ 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细 细The 榀鯓0 circuit board is provided with a repolar body, and the circuit board is attached to both sides of the thermal conductor.
TW96145568A 2007-11-30 2007-11-30 Led lamp TWI360620B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96145568A TWI360620B (en) 2007-11-30 2007-11-30 Led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96145568A TWI360620B (en) 2007-11-30 2007-11-30 Led lamp

Publications (2)

Publication Number Publication Date
TW200923249A true TW200923249A (en) 2009-06-01
TWI360620B TWI360620B (en) 2012-03-21

Family

ID=44728491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96145568A TWI360620B (en) 2007-11-30 2007-11-30 Led lamp

Country Status (1)

Country Link
TW (1) TWI360620B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399754B (en) * 2008-03-17 2013-06-21 Elpida Memory Inc Semiconductor device having single-ended sensing amplifier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399754B (en) * 2008-03-17 2013-06-21 Elpida Memory Inc Semiconductor device having single-ended sensing amplifier

Also Published As

Publication number Publication date
TWI360620B (en) 2012-03-21

Similar Documents

Publication Publication Date Title
JP5304198B2 (en) lighting equipment
TWI516713B (en) Led illuminating apparatus and heat dissipater thereof
US20090040760A1 (en) Illumination device having unidirectional heat-dissipating route
US20140078737A1 (en) Active heat dissipating light emitting diode illumination lamp
US20120080177A1 (en) High-power finless heat dissipation module
TW200849642A (en) LED heat dissipation module
TW200923249A (en) LED lamp
JP5390781B2 (en) Light source cooling device
TW201235606A (en) Thermal dissipation structures
JP2014067767A (en) Heat sink and lighting unit equipped with the same
TWI314204B (en) Led lamp having heat dissipation device
TWI331199B (en) Led lamp having heat dissipation structure
TWI331198B (en) Heat sink for led
CN211019783U (en) Quick heat dissipation device
TW200910547A (en) Heat sink
TW200928201A (en) LED lamp
TW200912188A (en) LED lamp
TW201040453A (en) LED lamp with a heat dissipation device
US20120153797A1 (en) Lamp body structure comprised of heat-dissipating fins
TWM366025U (en) Improved heat-dissipation fin structure for LED lamp
TWI312847B (en) Led lamp
JP5725109B2 (en) Lighting device
TWI334640B (en) Led lamp
TWI396811B (en) Light emitting module and an led lamp using the light source module
TW200909729A (en) Convective-type heat-dissipation device of LED lamp

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees