TWI334640B - Led lamp - Google Patents

Description

1334640 Revision of the replacement page on June 21, 099. Description of the Invention: [Technical Field] [0001] The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp incorporating a heat dissipation structure. [Prior Art] [0002] A Light Emitting Diode (LED) is a semiconductor solid-state light-emitting device that uses a semiconductor wafer as a light-emitting device to cause excess energy generated by carrier recombination in a semiconductor. Photon emission, direct red, yellow, blue, green, blue, orange, purple light, light-emitting diode lighting products are made using light-emitting diodes as a light source, widely used in communications, lighting, transportation, Outdoor billboards and other fields. However, high-brightness, high-power light-emitting diodes may cause a significant decrease in luminous efficiency due to an increase in temperature, and even cause component damage. Therefore, how to keep the operating temperature of the light-emitting diode lamp within a certain range to avoid the above phenomenon Occurrence, the problem that people urgently need to solve. At present, it is common practice in the industry to place a heat sink under the LED board to dissipate heat, as shown in US Pat. No. 6,517,218 B2, but this increases the thickness of the LED. It is not convenient to install and apply the illuminating diode lamp. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a light-emitting diode lamp having a thin thickness, easy installation, and good heat dissipation. [0004] A light-emitting diode lamp includes a light-emitting diode module, a base, and at least one heat sink, wherein the light-emitting diode module is fixed on the base, and at least one heat-conducting component is from the base Extending laterally, the heat sink and 096124621 Form No. A0101 Page 4 / Total 17 Page 0993215319-0 1334640 0 June 21, 2017 Correction Replacement Page The heat conduction element is fixedly connected to be disposed around the LED module The base includes two heat conducting plates, a part of the heat conducting element is sandwiched between the two heat conducting plates, and another part is laterally extended by the two heat conducting plates and connected to the heat sink. [0005] A light-emitting diode lamp comprising a light-emitting diode module and a heat-dissipating structure, wherein the light-emitting diode module is fixed on the heat-dissipating structure, the heat-dissipating structure comprises a heat conducting plate and is in contact with the heat conducting plate The light-emitting diode module is disposed on the heat-conducting plate; the heat-conducting plate is a two-plate structure symmetrically distributed above and below the heat pipe; the heat conducting component is partially disposed on the heat conducting plate Externally, the heat sink is fixedly connected to a portion of the heat conducting component outside the heat conducting plate to be disposed around the side of the light emitting diode module. [0006] The light-emitting diode lamp transmits heat generated by the light-emitting diode module to a heat sink located on a side of the light-emitting diode module by using a heat-conducting element, and fully utilizes the level around the light-emitting diode module Space, which reduces product thickness. Therefore, the light-emitting diode lamp can be easily mounted on a building such as a roof or a wall where space is limited to realize a lighting function. [Embodiment] [0007] Please refer to FIG. 1, which is an embodiment of a light-emitting diode lamp of the present invention. The light-emitting diode lamp has a substantially rectangular shape and includes a light source structure 10, a heat dissipation structure 30, and a support structure 50. The light source structure 10 is configured to provide a light source, and the heat dissipation structure 30 is configured to conduct and dissipate heat generated by the light source structure 10 during operation; the support structure 50 is configured to support and connect the light source structure 10 and the heat dissipation structure 30, and The light source structure 10 and the heat dissipation structure 30 are fixed to a building (not shown). 096124621 Form No. A0101 Page 5 of 17 0993215319-0 1334640 June 21, 2009, Junzheng Replacement Page [0008] Please also refer to FIG. 2, the light source structure 10 includes a light emitting diode module 12 and a cover The lamp cover 15 is disposed on the LED module 12. The LED module 12 includes a rectangular circuit board 120. The shape of the circuit board 120 is not limited to a rectangle, but may be other squares or have a curved shape. A plurality of light emitting diodes 122 are distributed on the circuit board 120. The light emitting diodes 122 are regularly distributed on the circuit board 120 and electrically coupled to the circuit board 120. The lamp cover 15 is a rectangular hollow structure. The lamp cover 15 is hollow toward the bottom of the circuit board 120 and slightly larger than the circuit board 120. The material of the lamp cover 15 can be transparent material in the transparent part, and other parts are adopted.

I Use aluminum or plastic material as the reflective part, the surface of which is usually galvanized or silver plated to enhance the reflectivity. The lamp cover 15 can be used to protect the LED module 12 and can also be used to guide light. The light-emitting diodes 122 emit light when they are energized, and condense or astigmatize under the guidance of the lamp cover 15 to diverge outward. Considering the light guiding and the illuminating effect, the top of the lamp cover 15 protrudes from the longitudinal sides toward the center to form an arc shape. Of course, the shape of the lamp cover 15 can also be designed according to the light guiding direction (as the case may be) and the aesthetic needs. Other shapes. A plurality of cylindrical structures (not shown) extend inwardly from the four corners of the lamp cover 15, and four fixing holes 157 are communicated from the top of the lamp cover 15 through the respective cylindrical structures to the bottom. The heat dissipating structure 30 mainly includes two heat conducting plates 31, two parallel heat pipes 35 and two heat sinks 38. The two heat pipes 35 are sandwiched between the two heat conducting plates 31 and extend out of the two heat conducting plates 31. The heat exchangers are disposed on the two sides of the heat pipe 31 and are disposed on the two sides of the two heat pipes 35. The two heat pipes 31 and the heat sinks 38 are respectively located at the bottom and the longitudinal sides of the light source structure 10. [00103] The heat conducting plate 31 can be made of a copper plate or an aluminum plate with better thermal conductivity, the heat conduction 096124621 Form No. A0101 Page 6 of 17 0993215319-0 1334640

[0011]

On June 21, 099, the shape of the replacement page board 31 is similar to that of the circuit board 120, and is slightly larger than the area of the circuit board 120. The two heat conducting boards 31 are symmetrically distributed above and below the two parallel heat pipes 35, wherein Each of the heat conducting plates 31 is provided with two parallel semicircular grooves 312 on one side of the heat pipe 35. The two grooves 31 2 are spaced apart from each other and extend through the heat conducting plate 31 in the longitudinal direction. When assembled, the two heat conducting plates 31 are assembled. The grooves 312 are combined with each other to form a circular passage for receiving the two parallel heat pipes 35 therein. A top-down through hole 315 is disposed in the middle of each of the heat conducting plates 31. The through hole 315 can be used to pierce the wires. The heat conducting plate 31 is provided with four fixing holes 317 corresponding to the fixing holes 157 of the lamp cover 15 at four corners. The two heat pipes 35 are straight tubular heat pipes. The two heat pipes 35 are parallel to each other and are located on a horizontal 'face parallel to the circuit board 120. The length of the two heat pipes 35 is opposite to that of the two heat conducting plates 31. Long length. Each of the heat pipes 353a includes an evaporation section 351 sandwiched between the two heat conducting plates 31 and two condensation sections 352 on both sides. The length of the evaporating section 351 is substantially the same as the length of the two heat conducting plates 31, and is disposed in a circular passage formed by the recess 312 of the upper and lower heat conducting plates 31. The outer surface of the evaporating section 351 can be coated with a thermal conductive adhesive. When the two heat pipes 35 are inserted through the circular passage, they can be in close contact with the surface of the heat conduction 31. The condensation section 352 of the two heat pipes 35 protrudes from the longitudinal sides of the two heat conducting plates 31. The shape of the two heat pipes 35 is not limited to a straight pipe, and may be other bent or curved shapes, such as an L shape or a U shape, etc., and the two heat pipes 35 are not limited to being arranged in parallel or in a staggered arrangement, but should be made as far as possible. The heat pipes 35 are on the same level so as to fully utilize the heat dissipation space around the heat conducting plate 31. The heat pipe 35 can also be other types of heat conductive elements having a higher thermal conductivity or a better connection structure, such as a plate heat pipe, a solid copper bar or an ingot. [0012] The two heat sinks 38 are a plurality of square heat radiating fins 381 arranged at intervals 096124621 Form No. A0101 Page 7 / 17 pages 0993215319-0 5553⁄41334640 099 June 21, these heat sink fins only 381 can be borrowed It is integrated by welding or fastening. Two parallel fixing holes 385 are formed in the middle of each of the heat dissipating fins 381. The two fixing holes 385 are used to receive the condensation section 352 of the heat pipe 35, so that the heat sink 38 is tightly connected to the heat pipe 35. The two heat sinks 38 are not limited to the combination of the heat sink fins 381. The heat sink 38 may not be limited to a square shape. The shape of the heat sink 38 may not be limited to a circular shape or a heat dissipation of other shapes or forms in which the fixing holes 385 are opened. The heat sinks should be easily extended laterally or laterally of the heat conducting plates 31 to take advantage of the heat dissipation space around the heat conducting plates 31. [0013] The supporting structure 50 is located at the bottom of the lower heat conducting plate 31. The supporting structure 5 is a rectangular rectangular box structure. The top of the supporting structure 5 is provided with an opening 51 facing the heat conducting plate 31. The supporting structure is closed at the bottom. The enclosed space can be used to mount an electronic rectifier (not shown). The electric rectifier wire is electrically connected to the upper LED module 12 through the through hole 315 of the heat conducting plate 31, thereby being a light emitting diode. Body 122 is powered. The electronic rectifier may also be disposed outside the structure of the light-emitting diode lamp, such as a building in which the light-emitting diode lamp is embedded, such as a roof or a wall. The column structure 5 extends to the inner side of the four cylinders 5 2 , and the cylinders 5 2 are used to support the heat conducting plates 31 above the cylinders. Each of the cylinders 52 is respectively provided with a fixing hole 527 in the middle thereof, and the fixing holes 527 are The fixing holes 317 of the upper heat conducting plate 31 correspond to each other. The heat conducting plate 31 and the supporting structure 50 may also be replaced by a pedestal (not shown). The pedestal top supports the circuit board 120. The pedestal is solid above and is provided with two horizontal through holes for the heat pipe 35 to penetrate. The bottom of the base is hollow and can be connected to an electronic rectifier. [0014] When assembling, firstly, the two heat pipes 35 are sleeved on the grooves of the lower heat conducting plate 31. 096124621 Form No. 1010101 Page 8 of 17 0993215319-0 1334640

In the replacement page 312 of June 21, 099, the upper heat conducting plate 31 is then placed on the two heat pipes 35, and the groove 312 of the upper heat conducting plate 31 is corresponding to the heat pipe 35, so that the heat pipes 35 are made. Tightly penetrating through the circular passage formed by the grooves 312, the two heat conducting plates 31 are in close contact with each other in a plane; then, the circuit board 120 is fixed on the top of the upper heat conducting plate 31, and the lamp cover 15 is disposed on the circuit On the plate 120, the lower heat conducting plate 31 is placed on the top of the supporting structure 50, and the fixing hole 157 of the lamp cover 15, the fixing hole 317 of the heat conducting plate 31 and the fixing hole 527 of the supporting structure 50 are corresponding to each other by the four fixing members. (not shown) through the fixing holes 157, 317 and locked with the fixing hole 527, finally, the two heat sinks 38 are welded and fixed from the two sides to the condensation section 352 of the two heat pipes 35, and the heat pipe 35 In close contact, at this time, the two heat sinks 38 are located on the longitudinal sides of the light source structure 10, thereby completing the assembly of the light-emitting diode lamps. The method of assembling the light-emitting diode lamp is not limited thereto, and other effective assembly methods may be employed. [0015] When the light emitting diode lamp is in operation, the heat generated by the light emitting diode 122 is directly absorbed by the heat conducting plate 31 under the circuit board 120, and then the heat on the heat conducting plate 31 is quickly absorbed by the evaporation section 351 of the two heat pipes 35. And by the evaporation of the condensed liquid in the evaporation section 351, the heat is quickly conducted to the condensation sections 352 on both sides, and the condensation sections 352 conduct heat to the radiators by contact with the surrounding heat sinks 38. At 38, since the contact area of the heat sink 38 with the surrounding air is large, heat can be quickly dissipated into the surrounding air, thereby improving the heat dissipation efficiency of the light-emitting diode lamp. [0016] The light-emitting diode lamp transmits the heat generated by the light-emitting diode 122 to the light level 096124621 substantially flush with the light-emitting diodes 122 by the heat pipe 35. Form No. A0101 Page 9 / 17 pages 0993215319 -0 1334640 On June 21, 099, the replacement page heater 38 was modified to make full use of the horizontal space around the light source structure 10, so that the thickness of the product was reduced, so that the light-emitting diode lamp can be easily installed in the installation space. It is used for lighting on buildings such as roofs or walls; it also saves more space for the light-emitting diode lamp, and is designed to design a light source structure 10 having a larger size and a more complicated shape. In addition, when the light-emitting diode lamp is mounted on the roof, the heat emitted by the light-emitting diode lamp is transmitted to the surrounding air, so that the ambient air temperature rises and floats above the roof, and the cold air below the roof is automatically due to natural convection. The space around the illuminating diode lamp is supplemented from below, and the heat dissipation efficiency of the illuminating diode lamp is further improved to achieve a cooling effect. [0017] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a perspective assembled view of an embodiment of a light-emitting diode lamp of the present invention.

I

2 is an exploded perspective view of FIG. 1. [0020] FIG. 3 is a partial combination diagram of FIG. [Main component symbol description] [0021] Light source structure: 10 [0022] Light-emitting diode module: 12 [0023] Circuit board: 120 [0024] Light-emitting diode: 122 096124621 Form No. A0101 Page 10 / Total Page 0993215319-0 1334640 Correction replacement page on June 21, 099 [0025] Lampshade: 15 [0026] Fixing hole: 1 57, 317, 385, 527 [0027] Heat dissipating structure: 30 [0028] Thermal conducting plate: 31 [0029] Groove: 312 [0030] Through hole: 315 [0031] Heat pipe: 35

Evaporation section: 351 [0033] Condensation section: 352 [0034] Radiator: 38 [0035] Heat sink fin: 381 [0036] Support structure: 50 [0037] Opening: 5 1 [0038] Cylinder: 5 2 096124621 Form No. A0101 Page 11 of 17 0993215319-0

Claims (1)

1334640 __ June 21, 2017, the shuttle is replacing page 7. Patent application scope: 1. A light-emitting diode lamp, comprising: a light-emitting diode module; a base; at least one heat sink, the light-emitting diode The body module is fixed on the base; and at least one heat conducting component extends laterally from the base, and the heat sink and the heat conducting component are fixedly connected to be disposed around the light emitting diode module; wherein the base comprises The heat conducting plate is partially clamped between the two heat conducting plates, and the other portion is laterally extended from the two heat conducting plates and connected to the heat sink. 2. The illuminating two-pole illuminating device of claim 1, wherein the heating element comprises two heat pipes. 3. The illuminating diode lamp of claim 2, wherein the at least one heat sink is two, distributed on two longitudinal sides of the heat conducting plate and respectively connected to the two heat pipes. The light-emitting diode lamp of claim 2, wherein the two heat-conducting plates are symmetrically distributed above and below the heat pipe, and the two heat-conducting plates are disposed toward the heat pipe side with a groove, and the two heat-conducting plates are concave The grooves collectively form a circular passage for receiving the heat pipe. 5. The illuminating diode lamp of claim 1, wherein the bottom of the heat conducting plate is further provided with a supporting structure. 6. The illuminating diode lamp of claim 5, wherein the support structure has an opening at the top thereof facing the heat conducting plate, and the bottom of the supporting structure is closed to form a half enclosed space. 7. The illuminating diode lamp according to claim 1, wherein the scatter 096124621 form number A0101 page 12/total 17 page 0993215319-0 1334640 Correction Replacement Page, June 21, 099 The heat exchanger is a combination of a plurality of heat sink fins spaced apart and placed over the heat conducting element. 8. The illuminating diode lamp of claim 1, wherein the illuminating diode module comprises a circuit board and a plurality of illuminating diodes distributed on the circuit board, the illuminating diode lamp A light cover is also included, the light cover housing the light emitting diode module therein. 9. A light-emitting diode lamp, comprising: a light-emitting diode module; a heat-dissipating structure, the light-emitting diode module is fixed on the heat-dissipating structure, the heat-dissipating structure comprises a heat conducting plate and is in contact with the heat conducting plate The light-emitting diode module is disposed on the heat-conducting plate; the heat-conducting plate is a two-plate structure symmetrically distributed above and below the heat-conducting element; the heat-conducting component is partially disposed on the heat-conducting plate The heat sink is fixedly connected to a portion of the heat conducting element outside the heat conducting plate to be disposed around the side of the light emitting diode module. 10. The light-emitting diode lamp of claim 9, wherein the heat-conducting element comprises two heat pipes. 11. The illuminating diode lamp of claim 10, wherein the heat sinks are distributed on two longitudinal sides of the heat conducting plate and are respectively connected to the two heat pipes. 12. The illuminating diode lamp of claim 10, wherein the two-plate-shaped structure is provided with a groove toward the heat pipe side, and the groove of the plate-shaped structure collectively forms a circular passage for accommodating the heat pipe. 13. The illuminating diode lamp of claim 9, wherein the illuminating diode lamp further comprises a support structure, the support structure supporting the heat conducting plate at a bottom of the heat conducting plate. 14 · The light-emitting diode lamp according to claim 13 of the patent application, wherein the 0993215319-0 096124621 form number A0101 page 13 / 17 pages 1334640 099 June 21, according to the top of the replacement page support structure An opening faces the heat conducting plate, and the bottom of the supporting structure is closed to form a half enclosed space. The illuminating diode lamp according to claim 10, wherein the heat sink is formed by a plurality of heat dissipating fins arranged in a space and is sleeved on the heat pipe. 〇16. The light-emitting diode lamp module includes a circuit board and a plurality of light-emitting diodes distributed on the circuit board, the light-emitting diode lamp further includes a lamp cover, and the lamp cover is covered. On the light emitting diode module. 096124621 Form No. A0101 Page 14 of 17 0993215319-0