TWI420040B - Led lamp assembly - Google Patents

Led lamp assembly Download PDF

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Publication number
TWI420040B
TWI420040B TW97125357A TW97125357A TWI420040B TW I420040 B TWI420040 B TW I420040B TW 97125357 A TW97125357 A TW 97125357A TW 97125357 A TW97125357 A TW 97125357A TW I420040 B TWI420040 B TW I420040B
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Taiwan
Prior art keywords
heat
lamp
light
plate
cover
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TW97125357A
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Chinese (zh)
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TW201002983A (en
Inventor
Yu Zhang
Guang Yu
Cheng Tien Lai
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Foxconn Tech Co Ltd
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Publication of TWI420040B publication Critical patent/TWI420040B/en

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

發光二極體燈具 Light-emitting diode lamp

本發明涉及一種照明裝置,特別係指一種發光二極體燈具。 The invention relates to a lighting device, in particular to a light-emitting diode lamp.

發光二極體光源作為一種新興之第三代光源,其具有工作壽命長、環保、省電、壽命長等諸多特點。而且,目前由發光二極體組成之模組能產生大功率、高亮度之光源,因此將廣泛地、革命性地取代傳統之白熾燈等習知光源,進而成為符合節能環保主題之主要光源。 As a new generation of light source, the light-emitting diode light source has many characteristics such as long working life, environmental protection, power saving and long life. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, and thus will widely and revolutionarily replace the conventional light source such as a conventional incandescent lamp, thereby becoming a main light source that meets the theme of energy conservation and environmental protection.

然而,隨著發光二極體或其模組之功率、亮度之增大,其產生之熱量也越來越大,若不能及時解決發光二極體之發熱問題,則發光二極體燈具之工作壽命將受到嚴重影響。因此,業界通常在發光二極體模組上安裝一散熱器對其散熱,該發光二極體模組則水平貼置於所述散熱器底部而成為平面光源。由於平面光源之照射方向單一,使燈具之照射面積有限。 However, as the power and brightness of the LED or its module increase, the amount of heat generated is also increased. If the heating problem of the LED is not solved in time, the operation of the LED lamp is completed. Life expectancy will be severely affected. Therefore, the industry usually installs a heat sink on the light emitting diode module to dissipate heat, and the light emitting diode module is horizontally placed on the bottom of the heat sink to become a planar light source. Due to the single illumination direction of the planar light source, the illumination area of the luminaire is limited.

有鑒於此,有必要提供一種照射範圍較大之發光二極體燈具。 In view of this, it is necessary to provide a light-emitting diode lamp having a large irradiation range.

一種發光二極體燈具,包括一燈架、位於該燈架一側之散熱 器、複數發光二極體模組及一將該等發光二極體模組罩設其內之燈罩,還包括至少二位於燈罩內且供發光二極體模組貼設之吸熱件,每一吸熱件具有一與所述散熱器連接之底板及一與該底板相對傾斜之頂板,且二頂板互成一定角度。 A light-emitting diode lamp comprising a light frame and heat dissipation on a side of the light stand And a plurality of light-emitting diode modules and a light-emitting cover for illuminating the light-emitting diode modules, and at least two heat-absorbing members disposed in the light cover and disposed for the light-emitting diode module, each The heat absorbing member has a bottom plate connected to the heat sink and a top plate inclined relative to the bottom plate, and the two top plates are at an angle to each other.

由於所述頂板與底板相對傾斜且二頂板互成一定角度使得二頂板分別朝向二相對之方向,從而位於該頂板上之發光二極體模組朝向二相對之方向,使發光二極體燈具照射之區域較傳統發光二極體燈具廣闊,在確保燈具使用壽命之同時,又能達到更好之照明效果。 Because the top plate and the bottom plate are inclined relative to each other and the two top plates are at an angle to each other, the two top plates are respectively oriented in opposite directions, so that the light emitting diode modules on the top plate face in opposite directions, so that the light emitting diode lamps are illuminated. The area is wider than the traditional light-emitting diode lamps, and it can achieve better lighting effects while ensuring the service life of the lamps.

10‧‧‧發光二極體燈具 10‧‧‧Lighting diode lamps

22‧‧‧燈框 22‧‧‧light frame

20‧‧‧燈架 20‧‧‧Light stand

24‧‧‧殼體 24‧‧‧Shell

26‧‧‧蓋體 26‧‧‧ Cover

28‧‧‧拱形部 28‧‧‧Arch

30‧‧‧吸熱體 30‧‧‧heat absorber

31‧‧‧吸熱件 31‧‧‧Hybrid

32‧‧‧底板 32‧‧‧floor

34‧‧‧頂板 34‧‧‧ top board

36‧‧‧連接板 36‧‧‧Connecting board

38‧‧‧氣流通道 38‧‧‧Air passage

40‧‧‧散熱器 40‧‧‧heatsink

42‧‧‧導熱板 42‧‧‧heat conducting plate

44‧‧‧第一散熱鰭片 44‧‧‧First heat sink fin

46‧‧‧第二散熱鰭片 46‧‧‧Second heat sink fins

50‧‧‧發光二極體模組 50‧‧‧Lighting diode module

52‧‧‧電路板 52‧‧‧ boards

54‧‧‧發光二極體 54‧‧‧Lighting diode

56‧‧‧接頭 56‧‧‧Connectors

60‧‧‧燈罩 60‧‧‧shade

62‧‧‧罩體 62‧‧‧ Cover

64‧‧‧框體 64‧‧‧ frame

66‧‧‧折邊 66‧‧‧Folding

70‧‧‧驅動電路模組 70‧‧‧Drive Circuit Module

80、90‧‧‧墊圈 80, 90‧‧‧ washers

100‧‧‧緩衝墊 100‧‧‧ cushion

220‧‧‧框架 220‧‧‧Frame

222、242‧‧‧側壁 222, 242‧‧‧ side walls

240‧‧‧底壁 240‧‧‧ bottom wall

620‧‧‧開口 620‧‧‧ openings

圖1係本發明發光二極體燈具之立體組裝圖。 1 is a perspective assembled view of a light-emitting diode lamp of the present invention.

圖2係圖1中發光二極體燈具之立體分解圖。 2 is an exploded perspective view of the light-emitting diode lamp of FIG. 1.

圖3係圖2中發光二極體模組及吸熱體之立體圖。 3 is a perspective view of the light emitting diode module and the heat absorbing body of FIG. 2.

圖4係圖2中發光二極體燈具之另一方向之立體分解圖。 4 is an exploded perspective view of the other direction of the light-emitting diode lamp of FIG. 2.

請參閱圖1和圖2,本發明之發光二極體燈具10包括一燈架20、分別安裝於燈架20上下兩側之一吸熱體30及一散熱器40、複數貼置於吸熱體30上之發光二極體模組50及一蓋置於燈架20上側並將吸熱體30及發光二極體模組50罩設於其內之燈罩60。 Referring to FIG. 1 and FIG. 2 , the LED lamp 10 of the present invention includes a lamp holder 20 , a heat absorbing body 30 and a heat sink 40 respectively mounted on the upper and lower sides of the lamp holder 20 , and a plurality of stickers attached to the heat absorbing body 30 . The upper LED module 50 and a cover 60 are disposed on the upper side of the lamp holder 20 and the heat absorbing body 30 and the LED module 50 are disposed therein.

請參閱圖2,所述燈架20包括一呈矩形之燈框22、從該燈框22之一端一體形成之供接線或安裝之用之殼體24及一蓋設於 該殼體24上之弧形蓋體26。該燈框22包括一設有開口(未標示)之框架220及從該框架220向上延伸之首尾相接之四側壁222。該殼體24包括一底壁240及由該底壁240四周向上延伸之側壁242。該底壁240呈兩端上翹之弧形結構,該底壁240向下超出該燈框22之底部。該殼體24之相對兩側超出所述燈框22之相對兩側。位於該底壁240一端且靠近燈框22之側壁242把殼體24和燈框22分為相隔開之兩個容腔。該殼體24之中部從該底壁240向上延伸設有一拱形部28。一穿孔(圖未示)穿過該殼體24之位於該底壁240另一端之側壁242及該拱形部28,以方便將所述發光二極體燈具10安裝於一燈桿(圖未示)上。在本實施例中,一驅動電路模組70安裝於該殼體24與弧形蓋體26所形成之容置空間內,並位於所述拱形部28之一側。在其他實施例中,二驅動電路模組70安裝於該殼體24與弧形蓋體26所形成之容置空間內,並位於所述拱形部28之相對兩側。 Referring to FIG. 2, the lamp holder 20 includes a rectangular lamp frame 22, a housing 24 integrally formed from one end of the lamp frame 22 for wiring or mounting, and a cover. An arcuate cover 26 on the housing 24. The light frame 22 includes a frame 220 having an opening (not shown) and four side walls 222 extending upwardly from the frame 220. The housing 24 includes a bottom wall 240 and side walls 242 extending upwardly from the periphery of the bottom wall 240. The bottom wall 240 has an arcuate structure with both ends upturned, and the bottom wall 240 extends downward beyond the bottom of the lamp frame 22. The opposite sides of the housing 24 extend beyond opposite sides of the light frame 22. A side wall 242 at one end of the bottom wall 240 and adjacent to the light frame 22 divides the housing 24 and the light frame 22 into two spaced apart cavities. An arch portion 28 extends from the bottom wall 240 to the middle of the housing 24. A through hole (not shown) passes through the side wall 242 of the housing 24 at the other end of the bottom wall 240 and the arch portion 28 to facilitate mounting the LED device 10 to a light pole. Show). In this embodiment, a driving circuit module 70 is mounted in the accommodating space formed by the housing 24 and the curved cover 26, and is located on one side of the arch portion 28. In other embodiments, the two driving circuit modules 70 are mounted in the accommodating space formed by the housing 24 and the curved cover 26, and are located on opposite sides of the arch portion 28.

請同時參閱圖3,所述吸熱體30由導熱性能良好之金屬如銅、鋁等製成。該吸熱體30由八個吸熱件31組合而成,該等吸熱件31佈置成平行於所述燈架20之燈框22之一側邊之兩排,每排佈置四個吸熱件31。每一吸熱件31包括一呈矩形板狀之底板32、位於該底板32上之矩形狀之頂板34及連接該頂板34和底板32之複數連接板36。頂板34由所述吸熱體30之內側向外向下傾斜並與底板32成銳角相隔設置,使得所述兩排吸熱件31之頂板34朝向吸熱體30之相對兩側。該頂板34在底板32 上之投影與該底板32重疊。所述連接板36垂直於所述底板32,各個連接板36相互平行且間隔設置以形成複數氣流通道38。連接板36之高度沿著頂板34之傾斜方向由所述吸熱體30之內側向外側逐漸減小。 Referring to FIG. 3 at the same time, the heat absorbing body 30 is made of a metal having good thermal conductivity such as copper, aluminum or the like. The heat absorbing body 30 is composed of eight heat absorbing members 31 which are arranged in parallel to two rows of one side of the light frame 22 of the lamp holder 20, and four heat absorbing members 31 are arranged in each row. Each of the heat absorbing members 31 includes a bottom plate 32 having a rectangular plate shape, a rectangular top plate 34 on the bottom plate 32, and a plurality of connecting plates 36 connecting the top plate 34 and the bottom plate 32. The top plate 34 is inclined downwardly from the inner side of the heat absorbing body 30 and spaced apart from the bottom plate 32 such that the top plate 34 of the two rows of heat absorbing members 31 faces the opposite sides of the heat absorbing body 30. The top plate 34 is on the bottom plate 32 The upper projection overlaps the bottom plate 32. The connecting plate 36 is perpendicular to the bottom plate 32, and each connecting plate 36 is parallel and spaced apart from each other to form a plurality of air flow passages 38. The height of the connecting plate 36 gradually decreases from the inner side to the outer side of the heat absorbing body 30 along the inclined direction of the top plate 34.

請參閱圖2,所述散熱器40採用高導熱率之金屬或合金,如銅、鋁或銅鋁合金材料製成。該散熱器40包括一平板形之導熱板42、從該導熱板42頂面和底面分別一體延伸之複數平行之第一散熱鰭片44及複數平行之第二散熱鰭片46。該第一散熱鰭片44由導熱板42頂面之相對兩側部向上垂直一體延伸而成。導熱板42之中部未設置散熱鰭片,上述吸熱體30之底板32平行貼置於該導熱板42頂面之中部。該第一散熱鰭片44之高度從靠近吸熱體30一側向導熱板42之對應側邊遞減。請同時參閱圖4,所述第二散熱鰭片46由散熱器40橫向、縱向剖溝而成從而在導熱板42之底面排佈成複數列、複數行,相鄰行、列之間形成氣流通道,從而該第二散熱鰭片46在該導熱板42之底面形成縱橫交錯之氣流通道(未標示)。位於該導熱板42底面之二相對側部之第二散熱鰭片46較中部之第二散熱鰭片46矮。該第二散熱鰭片46之高度從該導熱板42底面之相對兩側邊向中部逐漸增加,從而該第二散熱鰭片46之端部在該導熱板42底面之一側形成該散熱器40之弧狀底部輪廓。所述燈架20之燈框22平行該等散熱鰭片44、46貼置於該導熱板42上,並將所述吸熱體30包容在燈框22內。該燈架20之殼體24超出該散熱器40之一端,其中一大致呈矩形之環形墊圈 80夾置於燈架20與散熱器40之間。 Referring to FIG. 2, the heat sink 40 is made of a high thermal conductivity metal or alloy such as copper, aluminum or copper aluminum alloy. The heat sink 40 includes a flat plate-shaped heat conducting plate 42 , a plurality of parallel first heat radiating fins 44 and a plurality of parallel second heat radiating fins 46 extending integrally from a top surface and a bottom surface of the heat conducting plate 42 . The first heat dissipation fins 44 are vertically and integrally extended from opposite sides of the top surface of the heat conduction plate 42. The heat dissipating fins 42 are not provided with heat dissipating fins, and the bottom plate 32 of the heat absorbing body 30 is placed in parallel on the top surface of the heat conducting plate 42 in parallel. The height of the first heat dissipation fins 44 decreases from the corresponding side of the heat guide plate 42 near the heat absorbing body 30 side. Referring to FIG. 4 , the second heat dissipation fins 46 are formed by the lateral and longitudinal grooves of the heat sink 40 so as to be arranged in a plurality of rows and a plurality of rows on the bottom surface of the heat conduction plate 42 , and an air flow is formed between adjacent rows and columns. The channel, such that the second heat sink fin 46 forms a cross-flow channel (not labeled) on the bottom surface of the heat conducting plate 42. The second heat dissipation fins 46 on the opposite sides of the bottom surface of the heat conducting plate 42 are shorter than the second heat dissipation fins 46 in the middle portion. The height of the second heat dissipating fins 46 is gradually increased from the opposite sides of the bottom surface of the heat conducting plate 42 toward the middle portion, so that the end portion of the second heat dissipating fins 46 forms the heat sink 40 on one side of the bottom surface of the heat conducting plate 42. Curved bottom profile. The lamp frame 22 of the lamp holder 20 is placed on the heat conducting plate 42 in parallel with the heat dissipating fins 44 and 46, and the heat absorbing body 30 is housed in the lamp frame 22. The housing 24 of the lamp holder 20 extends beyond one end of the heat sink 40, wherein a substantially rectangular annular washer The 80 is sandwiched between the lamp holder 20 and the heat sink 40.

請參閱圖3,每一發光二極體模組50包括一呈矩形狀之電路板52、複數均勻固定於電路板52一側面之發光二極體54及安裝於電路板52底端一角之接頭56。該等電路板52之另一側面貼合於所述吸熱體30之頂板34上。該等發光二極體54佈置成平行於所述吸熱體30之複數排,每排之兩端分別延伸至電路板52之相對兩側邊緣。接頭56用以與所述驅動電路模組70電性連接,進而為發光二極體模組50供電。該發光二極體模組50之電路板52之面積與所述吸熱體30之頂板34之面積相同,在其他實施例中,發光二極體模組50之電路板52之面積與該頂板34之面積可不同。頂板34之數量與發光二極體模組50之數量對應,在本實施例中,發光二極體模組50及頂板34之數量均係八個,而其他實施例中,發光二極體模組50及頂板34可係其他數量。 Referring to FIG. 3 , each LED module 50 includes a rectangular circuit board 52 , a plurality of LEDs 54 uniformly fixed to one side of the circuit board 52 , and a connector mounted at a corner of the bottom end of the circuit board 52 . 56. The other side of the circuit board 52 is attached to the top plate 34 of the heat absorbing body 30. The light emitting diodes 54 are arranged in parallel with the plurality of rows of the heat absorbing bodies 30, and the two ends of each row extend to opposite side edges of the circuit board 52, respectively. The connector 56 is electrically connected to the driving circuit module 70 to supply power to the LED module 50. The area of the circuit board 52 of the LED module 50 is the same as the area of the top plate 34 of the heat absorbing body 30. In other embodiments, the area of the circuit board 52 of the LED module 50 and the top plate 34 are the same. The area can vary. The number of the top plates 34 corresponds to the number of the LED modules 50. In this embodiment, the number of the LED modules 50 and the top plate 34 are eight, and in other embodiments, the LED module is used. Group 50 and top plate 34 can be other numbers.

請同時參閱圖4,所述燈罩60通常係由透明之塑膠、玻璃或其他材料製成。該燈罩60包括一罩體62及壓置於該罩體62邊緣並與所述燈框22結合之框體64。該罩體62呈半圓柱形殼體,一開口620朝向所述散熱器40。自該罩體62之邊緣向外延伸有圍繞所述開口620之折邊66。該等折邊66置於上述燈架20之框架220上以將上述發光二極體模組50和吸熱體30罩設在該罩體62內。該等折邊66與框架220之間夾置一呈矩形狀之環形墊圈90。所述框體64藉由螺釘(圖未示)固定至該框架220上並將所述罩體62夾置在其間。一矩形環狀緩衝墊100 夾置在框體64與折邊66之間起到緩衝作用。 Referring to FIG. 4 at the same time, the lamp cover 60 is usually made of transparent plastic, glass or other materials. The lamp cover 60 includes a cover 62 and a frame 64 pressed against the edge of the cover 62 and coupled to the lamp frame 22. The cover 62 has a semi-cylindrical housing with an opening 620 facing the heat sink 40. A flange 66 surrounding the opening 620 extends outwardly from the edge of the cover 62. The hem 66 is placed on the frame 220 of the lamp holder 20 to cover the illuminating diode module 50 and the heat absorbing body 30 in the hood 62. An annular gasket 90 having a rectangular shape is interposed between the flanges 66 and the frame 220. The frame 64 is fixed to the frame 220 by screws (not shown) and the cover 62 is sandwiched therebetween. a rectangular ring cushion 100 The clamping between the frame 64 and the flange 66 serves as a buffering function.

上述發光二極體燈具10使用時,將一燈桿(圖未示)穿入上述燈架20之穿孔(未標示)內,該燈具10之發光二極體54有電流流過而點亮,同時該發光二極體54產生熱量,該等熱量藉由吸熱體30傳遞到上述散熱器40之導熱板42上,進而藉由第一散熱鰭片44和第二散熱鰭片46散熱到周圍空氣中。如此,燈罩60之罩體62內之溫度得到降低,發光二極體54工作於正常溫度範圍內,延長燈具之使用壽命。同時,由於所述吸熱體30之吸熱件31頂板34由該吸熱體30之內側向外側向下傾斜,使得兩排吸熱件31之頂板34朝向吸熱體30之相對兩側,從而位於該頂板34上之發光二極體模組50斜向外而朝向吸熱體30之相對兩側,使發光二極體燈具10照射之區域較傳統發光二極體燈具廣闊,在確保燈具使用壽命之同時,又能達到更好之照明效果。 When the LED device 10 is used, a light pole (not shown) is inserted into the through hole (not shown) of the lamp holder 20, and the light emitting diode 54 of the lamp 10 has a current flowing to illuminate. At the same time, the light-emitting diodes 54 generate heat, which is transferred to the heat-conducting plate 42 of the heat sink 40 by the heat-absorbing body 30, and then radiates heat to the surrounding air by the first heat-dissipating fins 44 and the second heat-dissipating fins 46. in. Thus, the temperature in the cover 62 of the lamp cover 60 is lowered, and the light-emitting diode 54 operates in a normal temperature range to extend the service life of the lamp. At the same time, since the top plate 34 of the heat absorbing member 31 of the heat absorbing body 30 is inclined downward from the inner side of the heat absorbing body 30, the top plate 34 of the two rows of heat absorbing members 31 faces the opposite sides of the heat absorbing body 30, thereby being located at the top plate 34. The upper LED module 50 is obliquely outward and faces the opposite sides of the heat absorbing body 30, so that the area illuminated by the LED illuminator 10 is wider than that of the conventional illuminating diode lamp, and while ensuring the service life of the lamp, Can achieve better lighting effects.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧發光二極體燈具 10‧‧‧Lighting diode lamps

22‧‧‧燈框 22‧‧‧light frame

20‧‧‧燈架 20‧‧‧Light stand

24‧‧‧殼體 24‧‧‧Shell

26‧‧‧蓋體 26‧‧‧ Cover

28‧‧‧拱形部 28‧‧‧Arch

30‧‧‧吸熱體 30‧‧‧heat absorber

40‧‧‧散熱器 40‧‧‧heatsink

42‧‧‧導熱板 42‧‧‧heat conducting plate

44‧‧‧第一散熱鰭片 44‧‧‧First heat sink fin

46‧‧‧第二散熱鰭片 46‧‧‧Second heat sink fins

50‧‧‧發光二極體模組 50‧‧‧Lighting diode module

60‧‧‧燈罩 60‧‧‧shade

62‧‧‧罩體 62‧‧‧ Cover

64‧‧‧框體 64‧‧‧ frame

66‧‧‧折邊 66‧‧‧Folding

70‧‧‧驅動電路模組 70‧‧‧Drive Circuit Module

80、90‧‧‧墊圈 80, 90‧‧‧ washers

100‧‧‧緩衝墊 100‧‧‧ cushion

220‧‧‧框架 220‧‧‧Frame

222、242‧‧‧側壁 222, 242‧‧‧ side walls

240‧‧‧底壁 240‧‧‧ bottom wall

Claims (10)

一種發光二極體燈具,包括一燈架、位於該燈架一側之散熱器、複數發光二極體模組及一將該等發光二極體模組罩設其內之燈罩,其改良在於:還包括至少二位於燈罩內且供發光二極體模組貼設之吸熱件,每一吸熱件具有一與該散熱器連接之底板及一與該底板相對傾斜之頂板,且二頂板互成一定角度。 A light-emitting diode lamp includes a light stand, a heat sink on one side of the light stand, a plurality of light-emitting diode modules, and a lamp cover in which the light-emitting diode modules are covered. The method further includes at least two heat absorbing members disposed in the lamp cover and disposed on the light emitting diode module, each heat absorbing member having a bottom plate connected to the heat sink and a top plate inclined relative to the bottom plate, and the two top plates are mutually formed A certain angle. 如申請專利範圍第1項所述之發光二極體燈具,其中該吸熱件平行設置,其頂板分別朝向二相對之方向。 The illuminating diode lamp of claim 1, wherein the heat absorbing members are arranged in parallel, and the top plates are respectively oriented in opposite directions. 如申請專利範圍第1或2項所述之發光二極體燈具,其中該每一吸熱件還包括複數平行間隔之連接板,該連接板連接該頂板和底板。 The illuminating diode lamp of claim 1 or 2, wherein each of the heat absorbing members further comprises a plurality of parallel spaced connecting plates, the connecting plate connecting the top plate and the bottom plate. 如申請專利範圍第3項所述之發光二極體燈具,其中該連接板垂直於該底板。 The illuminating diode lamp of claim 3, wherein the connecting plate is perpendicular to the bottom plate. 如申請專利範圍第1項所述之發光二極體燈具,其中該每一吸熱件之頂板和底板成銳角相隔設置。 The illuminating diode lamp of claim 1, wherein the top plate and the bottom plate of each of the heat absorbing members are disposed at an acute angle. 如申請專利範圍第1項所述之發光二極體燈具,其中該頂板在底板上之投影與該底板重疊。 The illuminating diode lamp of claim 1, wherein the projection of the top plate on the bottom plate overlaps the bottom plate. 如申請專利範圍第1或2項所述之發光二極體燈具,其中該散熱器包括一導熱板,該吸熱件之底板貼設於該導熱板之中部。 The illuminating diode lamp of claim 1 or 2, wherein the heat sink comprises a heat conducting plate, and the bottom plate of the heat absorbing member is attached to the middle of the heat conducting plate. 如申請專利範圍第7項所述之發光二極體燈具,其中該散熱 器還包括複數從該導熱板之頂面相對兩側延伸之第一散熱鰭片及從該導熱板之底面延伸之複數第二散熱鰭片,該第一散熱鰭片位於該吸熱件之兩側。 The illuminating diode lamp according to claim 7, wherein the heat dissipation The device further includes a plurality of first heat dissipating fins extending from opposite sides of the top surface of the heat conducting board and a plurality of second heat dissipating fins extending from a bottom surface of the heat conducting board, the first heat dissipating fins being located on opposite sides of the heat sink . 如申請專利範圍第1或2項所述之發光二極體燈具,其中該燈架包括一燈框、從該燈框之一端一體形成之供接線或安裝之用之殼體及一蓋設於該殼體上之蓋體。 The illuminating diode lamp of claim 1 or 2, wherein the lamp holder comprises a lamp frame, a housing integrally formed from one end of the lamp frame for wiring or mounting, and a cover a cover on the housing. 如申請專利範圍第9項所述之發光二極體燈具,其中該燈罩包括一蓋置於該吸熱件之罩體及壓置於該罩體邊緣並與該燈框結合之框體。 The illuminating diode lamp of claim 9, wherein the lamp cover comprises a cover that is placed on the heat absorbing member and a frame that is pressed against the edge of the cover and combined with the light frame.
TW97125357A 2008-07-04 2008-07-04 Led lamp assembly TWI420040B (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200134A (en) * 2002-12-19 2004-07-15 Shunji Kishimura White led lighting device
US20060012286A1 (en) * 2004-07-15 2006-01-19 Cull Brian D Display with bright backlight
TWM307091U (en) * 2006-09-08 2007-03-01 Augux Co Ltd LED lighting device
TWM325433U (en) * 2007-07-20 2008-01-11 Augux Co Ltd LED lighting apparatus
CN101105278A (en) * 2007-07-31 2008-01-16 李旭亮 Environment-friendly type LED road lamp
CN101144593A (en) * 2007-08-02 2008-03-19 李斯嘉 Large power wide-angle LED road lamp
US20080089070A1 (en) * 2006-10-12 2008-04-17 Chin-Wen Wang Led lamp module with adjustable illuminating angle

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200134A (en) * 2002-12-19 2004-07-15 Shunji Kishimura White led lighting device
US20060012286A1 (en) * 2004-07-15 2006-01-19 Cull Brian D Display with bright backlight
TWM307091U (en) * 2006-09-08 2007-03-01 Augux Co Ltd LED lighting device
US20080089070A1 (en) * 2006-10-12 2008-04-17 Chin-Wen Wang Led lamp module with adjustable illuminating angle
TWM325433U (en) * 2007-07-20 2008-01-11 Augux Co Ltd LED lighting apparatus
CN101105278A (en) * 2007-07-31 2008-01-16 李旭亮 Environment-friendly type LED road lamp
CN101144593A (en) * 2007-08-02 2008-03-19 李斯嘉 Large power wide-angle LED road lamp

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