TWI398599B - Led illumination device - Google Patents
Led illumination device Download PDFInfo
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- TWI398599B TWI398599B TW97124114A TW97124114A TWI398599B TW I398599 B TWI398599 B TW I398599B TW 97124114 A TW97124114 A TW 97124114A TW 97124114 A TW97124114 A TW 97124114A TW I398599 B TWI398599 B TW I398599B
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Description
本發明涉及一種發光二極體燈具,特別涉及一種具有散熱結構之發光二極體照明裝置。 The invention relates to a light-emitting diode lamp, in particular to a light-emitting diode lighting device with a heat dissipation structure.
發光二極體光源作為一種新興之第三代光源,雖然現在還不能大規模取代傳統之白熾燈,但係其具有工作壽命長、節能、環保等優點,而普遍被市場所看好。而且,目前由發光二極體組成之模組能產生大功率、高亮度之光源,完全可以取代現有白熾燈實現室內外照明,也將廣泛地、革命性地取代傳統之白熾燈等現有之光源,進而成為符合節能環保主題之主要光源。 As a new generation of light source, the light-emitting diode light source can not replace the traditional incandescent lamp on a large scale, but it has the advantages of long working life, energy saving and environmental protection, and is generally favored by the market. Moreover, the module composed of the light-emitting diode can generate a high-power, high-brightness light source, which can completely replace the existing incandescent lamp to achieve indoor and outdoor illumination, and will also widely and revolutionarily replace the existing light source such as the traditional incandescent lamp. And become the main light source in line with the theme of energy conservation and environmental protection.
然而,功率、亮度越大之發光二極體或其模組產生之熱量越大,在體積有限之發光二極體燈具內累積難於及時散發出去。故,發光二極體在照明上之應用尚存在較大散熱技術瓶頸,此亦係目前大功率、高亮度發光二極體燈具市場化最難突破之關鍵之處。目前業界通用之散熱方案係在該燈具內設置一散熱器,通過該散熱器表面與自然對流空氣接觸之方式將熱量散發到周圍空氣中。因此,一般要提高發光二極體燈具內散熱結構之散熱效率,以滿足高功率、高亮度之發光二極體燈散熱需求而使其能正常工作,只有通過增加散熱面積之方式來實現。然而,增大這種單純由鋁擠、鑄模等方式形成之散熱器之散熱面積同時,也會增加散熱器之體積和重量,進而使整體燈具體積變大、變重而不易於被廣泛應用。 However, the greater the heat generated by the light-emitting diode or its module, the greater the power and brightness, the accumulation in the limited-volume LED lamp is difficult to dissipate in time. Therefore, the application of the light-emitting diode in lighting still has a large heat-dissipation technology bottleneck, which is also the key point for the current market breakthrough of high-power, high-brightness light-emitting diode lamps. At present, the general heat dissipation scheme in the industry is to provide a heat sink in the luminaire, and the heat is radiated into the surrounding air through the surface of the heat sink in contact with natural convection air. Therefore, it is generally required to improve the heat dissipation efficiency of the heat dissipation structure in the light-emitting diode lamp to meet the heat dissipation requirement of the high-power, high-brightness light-emitting diode lamp, so that it can work normally only by increasing the heat dissipation area. However, increasing the heat dissipation area of the heat sink formed by aluminum extrusion, molding, etc., also increases the volume and weight of the heat sink, thereby making the overall lamp volume larger and heavier and less prone to widespread use.
有鑒於此,有必要提供一種主動散熱結構之發光二極體照明裝置。 In view of this, it is necessary to provide a light-emitting diode lighting device with an active heat dissipation structure.
一種發光二極體照明裝置,其包括一散熱器及貼設在散熱器頂部之複數發光二極體模組,該散熱器包括一基板和間隔排列於基板底面之複數散熱片,該等散熱片間形成有氣流通道,還包括安裝於基板上並正對散熱片間氣流通道之一鼓風機,一殼體與基板相配合將散熱片及鼓風機罩於其內,該基板一端於靠近散熱片氣流通道之位置處開設一進風口,該基板之另一端與殼體之間形成一出風口。 A light emitting diode lighting device includes a heat sink and a plurality of light emitting diode modules attached to the top of the heat sink, the heat sink comprising a substrate and a plurality of heat sinks spaced apart from the bottom surface of the substrate, the heat sinks An air flow passage is formed between the air flow passages, and a blower mounted on the substrate and facing the air flow passage between the heat sinks. A casing and the substrate cooperate to cover the heat sink and the blower, and the one end of the substrate is adjacent to the air flow passage of the heat sink An air inlet is defined at the position, and an air outlet is formed between the other end of the substrate and the casing.
上述發光二極體照明裝置之鼓風機使外界氣流從基板一端之進風口進入,並在殼體之引導下經過散熱片間之氣流通道後從基座另一端出風口處流出,從而在發光二極體照明裝置內形成通暢之冷卻氣流循環系統,進而能及時地將由發光二極體模組之熱量散發到外界中去。 The blower of the above-mentioned light-emitting diode lighting device allows external airflow to enter from the air inlet of one end of the substrate, and passes through the airflow passage between the heat sinks under the guidance of the casing, and then flows out from the air outlet of the other end of the base, thereby being in the light-emitting diode An unobstructed cooling air circulation system is formed in the body lighting device, so that the heat from the LED module can be dissipated to the outside in time.
如圖1-3所示,本發明發光二極體照明裝置包括一散熱器10、安裝在散熱器10一側之一鼓風機20、貼設在散熱器10頂部之複數發光二極體模組30、位於散熱器10上面並將散熱器10及鼓風機20罩於其內之一殼體40和位於散熱器10下面並將發光二極體模組30罩於其內之一燈蓋50。 As shown in FIG. 1-3, the illuminating diode device of the present invention comprises a heat sink 10, a blower 20 mounted on one side of the heat sink 10, and a plurality of LED modules 30 attached to the top of the heat sink 10. The heat sink 10 is disposed on the heat sink 10 and covers the heat sink 10 and the blower 20 in a housing 40 and a light cover 50 under the heat sink 10 and covers the light emitting diode module 30 therein.
上述散熱器10由導熱性能良好之金屬如銅、鋁等製成,其包括一矩形基板12和垂直排列於基板12底面之複數散熱片14。該等散熱片14相互等距間隔且與基板12之相對 兩長邊緣平行,每相鄰兩散熱片14之間形成有供氣流通過之氣流通道。該基板12在散熱片14之短邊緣一側並正對散熱片14間之氣流通道處開設有一長方形進氣口120,該進氣口120之長邊緣與散熱片14及基板12之長邊緣垂直且緊靠基板12之一短邊緣。 The heat sink 10 is made of a metal having good thermal conductivity such as copper, aluminum or the like, and includes a rectangular substrate 12 and a plurality of fins 14 vertically arranged on the bottom surface of the substrate 12. The fins 14 are equally spaced from each other and opposite to the substrate 12 The two long edges are parallel, and an air flow passage for airflow is formed between each adjacent two fins 14. The substrate 12 defines a rectangular air inlet 120 at a short edge side of the heat sink 14 and adjacent to the air flow passage between the heat sinks 14. The long edge of the air inlet 120 is perpendicular to the long edges of the heat sink 14 and the substrate 12. And close to one of the short edges of the substrate 12.
上述鼓風機20安裝於基板12底面上,其位於散熱片14一側並正對散熱片14間之氣流通道。該鼓風機20包括分別固定於基板12上並分位於進氣口120相對兩短邊緣外側之二安裝架22和位於安裝架22之間並正處於基板12進氣口120正上方且呈圓柱狀之葉輪組24。 The blower 20 is mounted on the bottom surface of the substrate 12, and is located on the side of the heat sink 14 and faces the air flow passage between the fins 14. The air blower 20 includes two mounting brackets 22 respectively fixed on the base plate 12 and located outside the two short edges of the air inlet 120 and between the mounting bracket 22 and directly above the air inlet 120 of the base plate 12 and having a cylindrical shape. Impeller group 24.
上述發光二極體模組30相互並排地貼設在散熱器10基板12頂面並平行於散熱片14,每一發光二極體模組30包括一長條形電路板32和沿電路板32長度方向呈兩排排列之複數發光二極體元件34。 The LED modules 30 are disposed side by side on the top surface of the substrate 12 of the heat sink 10 and parallel to the heat sink 14 . Each of the LED modules 30 includes an elongated circuit board 32 and a circuit board 32 . The plurality of light emitting diode elements 34 are arranged in two rows in the longitudinal direction.
上述殼體40為朝向散熱器10開口之一長方形盒體,其包括圍繞散熱片14及鼓風機20之四側壁44和連接四側壁44底端緣之一頂壁42。該殼體40大小正好與散熱器10基板12之相對兩側長邊緣配合以在基板12與殼體40間形成容置散熱片14及鼓風機20之空間,且該殼體40靠近基板12進風口120之一端側壁44與基板12底面靠近其短邊緣處接合,而殼體40之另一端側壁44則從基板12遠離進風口120之一端伸出基板12並在該側壁44頂端與基板12之間形成一出風口100(如圖1所示)。此外,殼體40在對應進風口120及出風口100之角落上形成用於導引氣流之圓弧形倒角(未標號)。 The housing 40 is a rectangular box facing the opening of the heat sink 10. It includes four side walls 44 surrounding the fins 14 and the blower 20 and a top wall 42 connecting the bottom edges of the four side walls 44. The housing 40 is sized to fit the long sides of the opposite sides of the substrate 12 of the heat sink 10 to form a space between the substrate 12 and the housing 40 for accommodating the heat sink 14 and the blower 20, and the housing 40 is adjacent to the air inlet of the substrate 12. One end side wall 44 of the 120 is joined to the bottom surface of the substrate 12 near its short edge, and the other end side wall 44 of the housing 40 extends from the substrate 12 away from one end of the air inlet 120 to the substrate 12 and between the top end of the side wall 44 and the substrate 12. An air outlet 100 is formed (as shown in FIG. 1). In addition, the housing 40 forms a circular chamfer (not labeled) for guiding the airflow at the corners of the corresponding air inlet 120 and the air outlet 100.
上述燈蓋50由有機玻璃或樹脂等透明或半透明材料一體形成,其安裝於散熱器10基板12之頂面上並正好將發光二極體模組30罩設其內,該燈蓋50位於基板12進氣口120之一側並未覆蓋到進氣口120上。該燈蓋50包括覆蓋在發光二極體模組30上之一蓋板52和從蓋板52周緣向下再向外延伸之安裝緣520。該安裝緣520圍繞在發光二極體模組30周圍並與基板12連接。 The lamp cover 50 is integrally formed of a transparent or translucent material such as plexiglass or resin, and is mounted on the top surface of the substrate 12 of the heat sink 10 and covers the LED module 30 therein. The lamp cover 50 is located therein. One side of the inlet port 120 of the substrate 12 is not covered on the intake port 120. The lamp cover 50 includes a cover 52 covering the LED module 30 and a mounting edge 520 extending downwardly from the periphery of the cover 52. The mounting edge 520 surrounds the light emitting diode module 30 and is connected to the substrate 12 .
上述發光二極體照明裝置在使用時,外界空氣在鼓風機20之作用下從基板12一端之進風口120進入,並在殼體40之引導下經過散熱片14間之氣流通道後從基座12另一端出風口100處流出,從而在發光二極體照明裝置內形成通暢之冷卻氣流循環系統,進而,能及時地將由發光二極體模組30產生並經過基板12傳遞到散熱片14上之熱量散發到外界中去。上述發光二極體照明裝置通過鼓風機20在其內形成之氣流循環對發光二極體30進行主動散熱,來有效提高發光二極體照明裝置內散熱結構之散熱效率,從而滿足大功率一些發光二極體照明設備之散熱需求。 When the light-emitting diode lighting device is in use, the outside air enters from the air inlet 120 at one end of the substrate 12 under the action of the air blower 20, and passes through the air flow passage between the heat sinks 14 under the guidance of the housing 40 from the base 12 The other end of the air outlet 100 flows out to form an unobstructed cooling air circulation system in the LED illumination device, and then can be generated by the LED module 30 and transmitted to the heat sink 14 through the substrate 12 in time. Heat is released into the outside world. The above-mentioned light-emitting diode lighting device actively dissipates the light-emitting diode 30 by circulating airflow formed by the air blower 20, thereby effectively improving the heat dissipation efficiency of the heat-dissipating structure in the light-emitting diode lighting device, thereby satisfying the high-power some light-emitting two Thermal requirements for polar lighting equipment.
此外,在其他實施例中,發光二極體照明裝置之氣流循環方向可以與上一實施例相反,鼓風機20產生之氣流從出風口100進入,流經散熱片14後從進風口120流出。 In addition, in other embodiments, the airflow direction of the light-emitting diode lighting device may be opposite to that of the previous embodiment, and the airflow generated by the air blower 20 enters from the air outlet 100, flows through the heat sink 14, and flows out from the air inlet 120.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧散熱器 10‧‧‧ radiator
12‧‧‧基板 12‧‧‧Substrate
120‧‧‧進氣口 120‧‧‧air inlet
14‧‧‧散熱片 14‧‧‧ Heat sink
20‧‧‧鼓風機 20‧‧‧Blowers
22‧‧‧安裝架 22‧‧‧ Mounting bracket
24‧‧‧葉輪組 24‧‧‧Iron group
30‧‧‧發光二極體模組 30‧‧‧Lighting diode module
32‧‧‧電路板 32‧‧‧ boards
34‧‧‧發光二極體元件 34‧‧‧Lighting diode components
40‧‧‧殼體 40‧‧‧shell
42‧‧‧頂壁 42‧‧‧ top wall
44‧‧‧側壁 44‧‧‧ side wall
50‧‧‧燈蓋 50‧‧‧light cover
52‧‧‧蓋板 52‧‧‧ Cover
520‧‧‧安裝緣 520‧‧‧Installation edge
100‧‧‧出風口 100‧‧‧air outlet
圖1係本發明發光二極體照明裝置之一較佳實施例之立體組合圖。 1 is a perspective assembled view of a preferred embodiment of a light-emitting diode lighting device of the present invention.
圖2係圖1中發光二極體照明裝置之立體分解圖。 2 is an exploded perspective view of the light-emitting diode lighting device of FIG. 1.
圖3係圖2中發光二極體照明裝置之倒置分解圖。 3 is an inverted exploded view of the light-emitting diode lighting device of FIG. 2.
10‧‧‧散熱器 10‧‧‧ radiator
20‧‧‧鼓風機 20‧‧‧Blowers
30‧‧‧發光二極體模組 30‧‧‧Lighting diode module
40‧‧‧殼體 40‧‧‧shell
50‧‧‧燈蓋 50‧‧‧light cover
100‧‧‧出風口 100‧‧‧air outlet
Claims (5)
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TW97124114A TWI398599B (en) | 2008-06-27 | 2008-06-27 | Led illumination device |
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TW97124114A TWI398599B (en) | 2008-06-27 | 2008-06-27 | Led illumination device |
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TWI398599B true TWI398599B (en) | 2013-06-11 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM302117U (en) * | 2006-04-11 | 2006-12-01 | Advanced Electronics Co Ltd | Probe workstation device |
TWM323572U (en) * | 2007-01-25 | 2007-12-11 | Bo-Jang Chen | Improved heat dissipating device for lamp device |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWM302117U (en) * | 2006-04-11 | 2006-12-01 | Advanced Electronics Co Ltd | Probe workstation device |
TWM323572U (en) * | 2007-01-25 | 2007-12-11 | Bo-Jang Chen | Improved heat dissipating device for lamp device |
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