201000813 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體燈具，特別、井 種具有散熱結構之發光二極體照明裝置。v 【先前技術】 源’雖然現在還不能大規模取代傳 一代光 係其具有工作壽命長、節能、環織二但 :皮市場所看好。而且’目前由發光二極體組成：遍 :能產生大功率、高亮度之光源，完全可以取代： 有白熾燈實現室内外照明，也將廣泛地、革务 :代傳統之白熾燈等現有之光源，進而成為：合： 月巨5哀保主題之主要光源。 然而，功率、亮度越大之發光二極體或其模紐 生之熱量越大，在體積有限之發光二極體燈且内 累積難於及時散發出去。故，發光二極體在照明上 •^應用尚存在較大散熱技術瓶頸，此亦係目前大功 率、高亮j發光二極體燈具市場化最難突破之關鍵 目前業界通用之散熱方案係在該燈具内設置 一散熱器，通過該散熱器表面與自然對流空氣接觸 t方式將熱董散發到周圍空氣中。因此，一般要提 :七光一極體燈具内散熱結構之散熱效率，以滿足 问2率、尚凴度之發光二極體燈散熱需求而使其能 正吊工作’只有通過增加散熱面積之方式來實現。 6 201000813 然而’支曰大這種單純由鋁擠、鑄模等 熱器之散熱面積同時，也會增加散熱^形 量’進而使整體燈具體積變大 體 泛應用。 不易 【發明内容】 有鐾於此，有必要提供一種主 光二極體照明震置。 …、結 一種發光二極體照明裝置，其包括 貼設在散熱器頂部之複數發光二極體模組' 器包括一基板和間隐μ丨 间排列於基板底面之滿 片，該等散熱片間开5古、# ]升少成有軋流通道，還包括 基板上並正對散敎片pi # 、’、月間乳流通道之一鼓風弟 體與基板相配合將今為u 、 将散熱片及鼓風機罩於其户 板一端於罪近散熱片 …、月軋流通道之位置處開 風口，該基板之另—山 ^ ^與殼體之間形成一 tl201000813 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode lamp, and in particular to a light-emitting diode lighting device having a heat dissipation structure. v [Prior Art] Although the source has not been able to replace the generation of light systems on a large scale, it has a long working life, energy saving, and woven fabrics: the skin market is optimistic. And 'currently composed of light-emitting diodes: all: can produce high-power, high-intensity light source, can completely replace: with incandescent lamps to achieve indoor and outdoor lighting, will also be extensive, leather: the traditional incandescent lamps and other existing The light source, and then become: the main source of the theme of the moon giant 5 sorrow. However, the greater the power and brightness of the light-emitting diode or the heat generated by the mold, the accumulation of the light-emitting diode lamp with a limited volume is difficult to dissipate in time. Therefore, there are still large heat dissipation technology bottlenecks in the application of LEDs in lighting. This is also the key to the marketization of high-power, high-brightness j-light diode lamps. A heat sink is disposed in the luminaire, and the heat is dissipated into the surrounding air by contacting the surface of the heat sink with natural convective air. Therefore, it is generally necessary to mention: the heat dissipation efficiency of the heat dissipation structure inside the seven-light one-pole lamp, so as to meet the heat dissipation requirement of the light-emitting diode lamp of the 2nd rate and the sufficiency, so that it can be hoisted work only by increasing the heat dissipation area. to realise. 6 201000813 However, the large heat dissipation area of the aluminum squeezing and molding heat exchangers, as well as the large amount of heat dissipation, has increased the overall volume of the luminaire. It is not easy [Inventive content] In view of this, it is necessary to provide a main light diode illumination. a light-emitting diode lighting device comprising a plurality of light-emitting diode modules attached to the top of the heat sink, the substrate comprising a substrate and a thin film arranged on the bottom surface of the substrate, the heat sinks Between the 5th and the 5th, there is a rolling flow channel, which also includes the substrate pi #, ', one of the monthly milk flow channels, and the typhoon brother and the substrate are matched with the substrate. The heat sink and the blower cover are formed at the end of the household plate at the position of the sin near heat sink ... and the monthly rolling flow passage, and the other side of the substrate forms a tl between the shell and the casing.
上述發光二搞挪n7J &體照明裝置之鼓風機使 流從基板一端之進涵1 運風口進入，並在殼體之引 過散熱片間之氣流搞、苦 L机通道後從基座另一端出 流出，從而在發光-β --一極體照明裝置内形成通 ^ ^ ^ ^ „進而能及時地將由發光二 組之熱里政發到外界中去。 【實施方式】 如圖1-3所示，，欲 括一散熱器1〇、安# 明發光二極體照明 褒在散熱器1 0 —側之一 成之散 積和重 於被廣 構之發 熱器及 該散熱 數散熱 安裝於 !，一殼 3，該基 設一進 I風口。 外界氣 導下經 風口處 暢之冷 極體模 裝置包 鼓風機 7 201000813 .20、貼設在散熱器10頂舍 3 0、位於散熱零1 〇上 、之複數發光一極體 20罩於其内之一殼體面並將散熱器10及鼓 將發光二極體模組3〇 和位於散熱器1〇下 上述散熱器10由薄於其内之一燈蓋50。 鋁等製成，其包括一矩，熱性能良好之金屬如 板12底面之複數散熱形基板12和垂直排列 等距間隔且與基板114 ° s亥等散熱片14 鄰兩散熱片“ 對兩長邊緣平行， 道。該基板12在散熱片x有供氣流通過之氣 熱片14間之氣流通、14之短邊緣一側並正 120，該進氣d 12〇 <道處開設有一長方形進 12之長邊緣垂直且緊a長邊緣與散熱片14及 上述鼓風機2〇安1基板12之一短邊緣。 散熱片14 一侧並正料=於基板12底面上’其 鼓風機20包括分別固定於、片14 ^ 口 120相對兩短邊緣外側之二安裝架22和位 裝架22之間教正處於基板12進氣口 12〇正上 呈圓柱狀之葉輪組24。 上述發光二極體模組30相互並排地貼設 熱器ίο基板12頂面並平行於散熱片14，每 光二極體模纽3〇包括一長條形電路板32和沿 板32長度方向呈兩排排列之複數發光二極體 3 4° [模組 .風機 面並 銅、 於基 相互 每相 流通 對散 氣口 基板 位於 卜該 進氣 於安 方且 在散 一發 電路 元件 8 201000813The above-mentioned illuminating two n7J & body illuminating device blower allows the flow to enter from the culvert 1 air inlet of one end of the substrate, and the airflow between the heat sinks of the casing is engaged, and the other end of the pedestal is taken from the base of the base. Outflow, so as to form a pass in the luminescence-β-integral illumination device, and then the heat from the illuminating group can be sent to the outside world in time. [Embodiment] Figure 1-3 As shown, it is necessary to include a heat sink 1 〇, an illuminating diode illuminator 褒 散 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器 散热器!, one shell 3, the base is set to enter the I tuyere. The cold air phantom device blower blower through the air outlet under the external air guide 7 201000813 .20, attached to the top of the radiator 10 3 0, located at the heat dissipation of 1 〇 The upper plurality of light-emitting diodes 20 are covered on one of the housing faces and the heat sink 10 and the drums are disposed on the light-emitting diode module 3 and the heat sink 10 is disposed below the heat sink 1 A lamp cover 50. Made of aluminum or the like, which comprises a moment, a metal having good thermal properties such as a bottom surface of the plate 12. Number-shaped substrate 12 and the heat radiating equally spaced and vertically aligned with the two fins 14 o 114 ° s Hai substrates like fins "on the two long edges parallel channel. The substrate 12 has a short edge side of the airflow passage 14 between the heat sink x for the airflow, and is 120, and the air inlet d12〇<the road has a long edge perpendicular to the edge of the rectangle 12 And a short edge of the a long edge and one of the heat sink 14 and the above-mentioned blower 2 基板1 substrate 12. One side of the heat sink 14 and the same material = on the bottom surface of the substrate 12, the blower 20 includes two mounting brackets 22 and a position carrier 22 respectively fixed to the outer side of the short edge of the sheet 14 and 120. The inlet port 12 has a cylindrical impeller group 24 directly above. The light-emitting diode modules 30 are disposed side by side with each other, and the top surface of the substrate 12 is parallel to the heat sink 14. Each of the light-emitting diodes 3 includes an elongated circuit board 32 and a length along the length of the board 32. Two rows of multiple light-emitting diodes 4 4° [module. Fan face and copper, each phase of each other flows to the base of the diffuser port. The air is placed in the square and is distributed in the circuit element 8 201000813
上述殼體40為朝合A 人祕^ ^ , 别向散熱器10開口之一長方形 孟體’其包括圍繞散熱片 6 1 4及政風機2 〇之四側壁 44和連接四側壁44底#从 & k緣之一頂壁42。該殼體 40大小正好與散熱器1 10基板12之相對兩侧長邊 緣配合以在基板1 2斑拉μ j Λ ，、双體40間形成容置散熱片 14及鼓風機2 0之空問 工間’且該殼體40靠近基板12 進風口 12 0之一端側| 4 4與基板12底面靠近其短 邊緣處接合’而殼體4〇夕Η ^ ., υ之另一端側壁44則從基板 12遠離進風口 12〇之—#从山甘， 柒伸出基板12並在該侧壁 44頂端與基板12之間形士 山^ / 〜间形成一出風口 1〇〇 (如圖工 所示）。此外，殼體4Π / 4W· _ 0在對應進風口 120及出風 口 100之角落上形成用 軎引& X用於導引虱流之圓弧形倒角 (未標號）。 上述燈蓋50由有機玻璃或樹脂等透明或 明材料一體形成，其安裝於散熱器10基板12之頂 面上並正好將發光二極體模組3〇罩設其内，該燈 蓋50位於基板12進氣口 uo之一側並未覆蓋 氣口 120上。該燈蓋50包括覆蓋在發光二極體模 組30上之一蓋板52和從蓋板52周緣向下再向外 延伸之安裝緣520。該安裝緣520圍繞在發光i極 體模組30周圍並與基板12連接。 上述發光二極體照明裝置在使用時，外界命氣 在鼓風機20之作用下從基板12 —端之進風口二= 進入，並在殼體40之引導下經過散熱片14間之氣 9 201000813 流通道後從基座12另一端出風口 100處流出， 而在發光二極體照明裝置内形成通暢之冷卻氣 循環系統，進而，能及時地將由發光二極體模 30產生並經過基板12傳遞到散熱片14上之熱 散發到外界中去。上述發光二極體照明裝置通過 風機20在其内形成之氣流循環對發光二極體30 行主動散熱，來有效提高發光二極體照明裝置内 熱結構之散熱效率，從而滿足大功率一些發光二 體照明設備之散熱需求。 此外，在其他實施例中，發光二極體照明裝 之氣流循環方向可以與上一實施例相反，鼓風 20產生之氣流從出風口 100進入，流經散熱片 後從進風口 120流出。 綜上所述，本發明符合發明專利要件，爰依 提出專利申請。惟，以上所述者僅為本發明之較 實施例，舉凡熟悉本案技藝之人士，在爰依本發 精神所作之等效修飾或變化，皆應涵蓋於以下之 請專利範圍内。 【圖式簡單說明】 圖 1係本發明發光二極體照明裝置之一較 實施例之立體組合圖。 圖2係圖1中發光二極體照明裝置之立體分 圖。 圖3係圖2中發光二極體照明裝置之倒置分 從 流 組 量 鼓 進 散 極 置 機 14 法 佳 明 中 佳 解 解 10 201000813 圖。 【主要元件符號說明】 散 熱 器 10 基 板 12 進 氣 Π 120 散 熱 片 14 鼓 風 機 20 安 裝 架 22 葉 輪 組 24 發 光 二 極 體 模 組 30 電 路 板 32 發 光 二 極 體 元 件 34 殼 體 40 頂 壁 42 侧 壁 44 燈 蓋 50 蓋 板 52 安 裝 緣 520 出 風 σ 100 11The housing 40 is a rectangular body that is open to the radiator A. It is a rectangular body that is open to the radiator 10. It includes four side walls 44 surrounding the heat sink 6 14 and the fan 2 and connecting the four side walls 44. From the & k edge one of the top walls 42. The housing 40 is sized to fit the long edges of the opposite sides of the substrate 12 of the heat sink 110 to form a substrate 1 2 , and a space between the double body 40 for receiving the heat sink 14 and the blower 20 And the housing 40 is adjacent to the one end side of the air inlet 12 0 of the substrate 12 | 4 4 is joined to the bottom surface of the substrate 12 near the short edge thereof, and the housing 4 is the other side wall 44 from the substrate 12 away from the air inlet 12〇—#From Shangan, the 柒 protrudes from the substrate 12 and forms an air outlet 1 形 between the top of the side wall 44 and the substrate 12 (formed as shown in the figure) ). Further, the housing 4Π / 4W· _ 0 forms a circular chamfer (not labeled) for guiding the turbulence at the corners of the corresponding air inlet 120 and the air outlet 100. The lamp cover 50 is integrally formed of a transparent or bright material such as plexiglass or resin, and is mounted on the top surface of the substrate 12 of the heat sink 10 and is disposed inside the LED module 3, and the lamp cover 50 is located therein. One side of the inlet port uo of the substrate 12 is not covered on the port 120. The lamp cover 50 includes a cover 52 that covers the light-emitting diode module 30 and a mounting edge 520 that extends downwardly and outwardly from the periphery of the cover 52. The mounting edge 520 surrounds the light-emitting i-pole module 30 and is connected to the substrate 12. When the above-mentioned light-emitting diode lighting device is used, the external life gas enters from the air inlet 2 of the substrate 12 under the action of the blower 20, and passes through the air between the heat sinks 14 under the guidance of the casing 40. After the road flows out from the air outlet 100 at the other end of the susceptor 12, an unobstructed cooling gas circulation system is formed in the illuminating diode illuminating device, and further, the light-emitting diode mold 30 can be generated in time and transmitted to the heat sink through the substrate 12. The heat on the sheet 14 is dissipated to the outside world. The above-mentioned light-emitting diode lighting device actively radiates heat to the light-emitting diodes 30 through the airflow formed by the fan 20, thereby effectively improving the heat-dissipating efficiency of the heat structure in the light-emitting diode lighting device, thereby satisfying the high-power some light-emitting two. The heat dissipation requirements of body lighting equipment. In addition, in other embodiments, the airflow direction of the light-emitting diode lighting device may be opposite to that of the previous embodiment, and the airflow generated by the air blower 20 enters from the air outlet 100 and flows out of the air inlet 120 after flowing through the heat sink. In summary, the present invention complies with the requirements of the invention patent, and the patent application is filed. However, the above-mentioned embodiments are only the preferred embodiments of the present invention, and equivalent modifications or variations made by those skilled in the art to the present invention should be included in the following patent claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of one embodiment of a light-emitting diode lighting device of the present invention. Figure 2 is a perspective view of the illumination diode device of Figure 1. Fig. 3 is an inverted sub-distribution of the light-emitting diode lighting device of Fig. 2, and the drum is inserted into the pole-disconnecting machine. 14 Method Jiaming Zhongjia explained 10 201000813. [Main component symbol description] Heat sink 10 Substrate 12 Intake Π 120 Heat sink 14 Blower 20 Mounting bracket 22 Impeller group 24 Light-emitting diode module 30 Circuit board 32 Light-emitting diode element 34 Housing 40 Top wall 42 Side wall 44 Lamp cover 50 Cover plate 52 Mounting edge 520 Outlet σ 100 11