M376712 五、新型說明： 【新型所屬之技術領域】 目剷發光二極體（light emitting diode, LED)從電能 轉換成光的效率僅約15〜20%，這意味著輸入的電能只有15〜2〇% 會轉變成光能’其餘80〜85%則是轉變成熱能釋出。若led燈具 的設計結構無法將熱量有效的排除，則會導致LED的發光效率 降低，而且會造成發光波長變短，使用壽命也會連帶的減少。 LED的發光效率（luminouseffeciency)其實並不好，因為 LED除了發出可見光之外，其他能量都轉換成熱量集中在小晶 片上’造成一個溫度相當高的熱點(h〇t Sp〇t)。溫度越高則led 晶粒的發光效率越差，所以散熱問題有部份是要提升發光效 率，另一方面是避免LE：D燒毀。LED的積熱現象乃是現階段技 術未成熟而顯現的問題，為了維持LED的正常工作狀態，熱交 換的技術也就相當的重要，而加裝散熱器（heat sink)將是最 為經濟的方式。 LED的開發技術日益精進，應用於照明領域的條件也相當 成熟’若能改善燈具的散熱問題，才能建立消費者對卿照明 品質的信心。有學者以較樂觀的角度預判，日本可能在2〇12 年用LED燈取代螢光燈，美國則是預計在2〇15年。由此看來， LED燈具將是未來到市場的主流’也是最具有龐大商機與廣 大市場之產品。本新型專利旨在將削為圓柱形輕射狀排列的 政熱态運用於LED燈具，藉以將LED產生的熱透過熱傳導 (thermal conduction)從LED模組傳遞至散熱器，再藉由自然 對流(natural convection)與熱輻射（thermai radiati〇n)方 式從散熱器鰭片散逸至外界。 3 M376712 【先前技術】M376712 V. New description: [New technology field] The efficiency of converting light emitting diode (LED) from electric energy into light is only about 15~20%, which means that the input electric energy is only 15~2. 〇% will be converted into light energy' the remaining 80~85% is converted into heat energy release. If the design structure of the LED luminaire cannot effectively eliminate the heat, the luminous efficiency of the LED will be reduced, and the illuminating wavelength will be shortened, and the service life will be reduced. The luminous efficiency (luminouseffeciency) of LEDs is actually not good, because in addition to emitting visible light, other energy is converted into heat concentrated on small wafers, resulting in a relatively high temperature hot spot (h〇t Sp〇t). The higher the temperature, the worse the luminous efficiency of the led die. Therefore, some of the heat dissipation problems are to improve the luminous efficiency, and on the other hand, to avoid LE:D burnout. The phenomenon of LED heat accumulation is a problem that is not mature at this stage. In order to maintain the normal working state of LED, the technology of heat exchange is quite important, and the heat sink is the most economical way. . The development technology of LED is becoming more and more sophisticated, and the conditions applied to the lighting field are quite mature. If the heat dissipation problem of the lamp can be improved, the consumer's confidence in the quality of the lighting can be established. Some scholars have predicted from a more optimistic point of view that Japan may replace fluorescent lamps with LED lights in 2002 and the United States is expected to be in 2-15 years. From this point of view, LED lamps will be the mainstream of the market in the future, and it is also the product with the most huge business opportunities and large markets. The new patent aims to apply the politically hot state of the cylindrical light-emitting arrangement to the LED lamp, whereby the heat generated by the LED is transmitted from the LED module to the heat sink through thermal conduction, and then by natural convection ( Natural convection) and heat radiation (thermai radiati〇n) from the radiator fins to the outside world. 3 M376712 [Prior Art]
攸西元則二世紀起’油燈與堰濁照亮了人類社會長達廿二 個世紀之久。在1810年煤油燈的出現，開啟了人類文明史上 的第一代光源。從此之後，每隔一曱子就出現新的光源世代， 譬如愛迪生在1879年發明了白熱燈，揭開了第二代光源的序 幕，讓人類的照明史又邁入劃時代的進展。及至1938年螢光 燈的問世，人類的照明史又刻劃了崩新的里程碑，第三代光源 也隨之宣告來臨。時序進入1996年白光LED的誕生，正式宣 告第四代光源一LED的照明世代開啟了。 LED已廣泛而且成功的運用在照明設備，昭且 為LED最具有發展潛力的料。由於高功率麟展，使得 led運用在照具時，亦囉面臨到嚴苛鮮理問題的挑 戰。近年來’ LED S具的專利如雨後春荀般相繼的提出，内容 與散熱有關的設計亦不勝枚舉。From the second century onwards, the oil lamps and turbidity illuminated the human society for two centuries. The emergence of kerosene lamps in 1810 opened the first generation of light sources in the history of human civilization. Since then, every new generation of light sources has emerged. For example, Edison invented the white heat lamp in 1879, which opened the prelude of the second generation of light sources, and made the history of human lighting into an epoch-making progress. By the advent of the fluorescent lamp in 1938, the history of human lighting has also marked a new milestone, and the third generation of light sources has also come. The timing entered the birth of the white LED in 1996, and officially announced that the fourth generation of light source-LED lighting generation was opened. LEDs have been widely and successfully used in lighting equipment, and are the most promising materials for LEDs. Due to the high-powered exhibition, when the LED is used in the lighting, it is also facing the challenge of strict and rigorous problems. In recent years, the patents of LED S have been successively proposed in the spring, and the design related to heat dissipation is also numerous.
目別利用LED做為絲的燈具設計正方興未艾，在本國公 °的發明專财，具有散熱考量的專利包括：「LED (發光二 極體）與液汽相散熱裝置結合總成」（2_/1〇/21，⑶刪） 可使LED晶片職生的減直接料至液汽她置，不會 J其，中介層所產生的熱阻’而可具有更好的導熱/散熱效 LED車燈散熱裝置」（2009/10/2卜1316120)利用冷空 =或〉卻液作為^^之媒界，達到對·所產生之熱能進行散 …，具有散熱保護迴路的照明裝置」⑽9/7/2卜f難〇〇) 的散熱機構包含導熱板、熱管及散熱體，LED燈組連接在 二、’工熱官將熱傳遞至散熱體而散逸掉’·「具散熱韓片之 體(LED)基座」（2〇〇9/7/n，i3J厕）係將散熱鰭 片鉚合立於基板底側之結構，直接做為LE:D基座之散熱模組， 減低LED基座散熱之熱阻；「高功率LED光條結構」 (2009/6/21 ’ 1311181)可讓高功率led模組所產生之熱直接 傳遞至散熱雜，控制電路板_空置於散熱雜之容置區 内，故產生熱源可充分的散逸；「發光二極體燈具」（2〇〇9/5/1， 1309288)燈座之外表面形成複數向外分叉之鰭片，能有效地 增大散熱面積，從而提高該燈具之散熱性能；「發光二極體模 組」（2009/5/1，1309286)每個導熱塊至少冷卻一 LE：D，熱管 則與導熱塊串連，用以將導熱塊之熱量傳遞給基板。The design of LEDs that use LEDs as silk is in the ascendant. In the domestic invention, the patents with thermal considerations include: "LED (light-emitting diode) and liquid-vapor phase heat sink combined assembly" (2_/ 1〇/21, (3) Delete) can reduce the direct charge of the LED chip to the liquid vapor, and it will not have the thermal resistance generated by the interposer, and it can have better heat conduction/heat dissipation LED headlights. "Heat-dissipating device" (2009/10/2 Bu 1316120) uses cold air = or 〉 液液 as the medium of ^^, to achieve the heat generated by the ..., the lighting device with heat-dissipation protection circuit" (10) 9/7/ The heat dissipation mechanism consists of a heat conducting plate, a heat pipe and a heat sink. The LED light group is connected to the second, and the heat is transferred to the heat sink and dissipated. 'The body with the heat sink (LED) The pedestal" (2〇〇9/7/n, i3J toilet) is a structure in which the heat dissipating fins are riveted on the bottom side of the substrate, and directly used as a heat dissipation module of the LE:D pedestal to reduce heat dissipation of the LED pedestal. Thermal resistance; "High-power LED strip structure" (2009/6/21 ' 1311181) allows the heat generated by high-power LED modules to be directly transferred to the heat The control circuit board _ is placed in the heat-dissipating area, so that the heat source can be fully dissipated; the surface of the "light-emitting diode lamp" (2〇〇9/5/1, 1309288) is formed in a plurality of directions. The fins of the outer fork can effectively increase the heat dissipation area, thereby improving the heat dissipation performance of the lamp; the "light emitting diode module" (2009/5/1, 1309286) cools at least one LE: D for each heat conducting block. The heat pipe is connected in series with the heat conducting block for transferring heat of the heat conducting block to the substrate.
在本國公告的新型專利中，具有散熱考量的專利包括：「用 於燈泡型LED燈具的散熱模組」（2〇〇9/11/21，M36943〇) LED 所產生的熱里可以傳導至扁狀導熱構件，然後再透過散熱構件 均勻快速地散逸出去；「LE：D散熱結構」（2009/11/21，_9429) 散熱鰭片透過固定件之二側之凸體夾固，使其可裝設於電路板 上，可進行電路板上led之散熱及達到便於安裝與更換散熱韓 片之目的；「LED燈改良構造」（2009/11/21，M369424)主要 係於LE：D燈之散熱座上設有一可提供變壓器隱藏設置之變壓器 安置槽；「LE1D燈具組裝結構」（2009/11/21’M369422)散熱 體包含中央具有一中心孔之筒形柱，能達成各組成元件之間的 緊密結合及良好密貼效果；「光源裝置」（2〇〇9/11/21，M369419) 一種可依使用者所需調整發光二極體之照射角度而形成不同 光形表現之光源裝置；「LED室外燈具」（2009/11/11，M368765) 風扇設於散熱導流罩内，可令LED室外燈具之散熱結構達到散 熱效果大幅提汁且具有較佳防塵、防雨效果之實用進步性； 「UD燈具的散熱構造」（2009/11/11，M368763)藉由散熱板 將光源模組的熱能向該各散熱器分散傳導，俾供提高散熱效， …、i 率；「一種LED散熱模組」（2009/11/1，M368〇24)直接將基 板與導熱裝置焊接在—起，降低LED散顏組的熱阻和緩和 LED晶片的增溫現象；「LED路燈組裝構造」（2〇〇9/11/1， M368014)位於上蓋座的數個led光源模組的底作接觸面，藉 政熱鰭片板抵靠結合以提供散熱功能；rLED散熱片結構」 (2009/10/11，M366882)利用彎折片達到活動調變led散熱 片結構的尺寸，有效解決LE：D燈具尺寸需要對應規格之散熱器 的缺失，並提供多向的散熱途徑，以將LED晶片所產生的熱快 速導出；「LED光源結構」（2009/10/11，M366646) LED光源 結構包括散熱元件，藉此提高散熱效率；rLED燈用散熱鰭片 ，造改良」（2009/10/01，M366025)係其截熱板兩侧邊呈對 等的雙曲線設計，兩端分別延接導熱板與幾何型散熱板，該導 熱板螺固鎖合於LED燈光源模組背部，可輕易通過截熱板所產 生的溫度梯度上限值，而遇到熱能逆流時，因其非為穩定熱源 體而受該截熱板的阻擋，提供有效傳導散逸熱能；「發光二極 體燈具拉組」（2009/10/01，M366013) LED晶片直接設置於散 熱件上，再將LED晶片與設置於散熱件上的電路層或基板電性 連接，使燈具模組具有良好的散熱效果；「發光二極體燈具」 (2009/09/21 ’M365444)導熱單元包括導熱管及填充於其内 之導熱介質，設置於該燈罩内部且用以將LED所產生的熱量傳 導到燈罩上；「LE：D燈具結構改良」（2009/09/21，M365435) 利用螺絲穿設背蓋並鎖固於固定架，以透過螺鎖令固定架對燈 殼内之LED緊密結合，間接密合電路基板與燈殼，達到更完善 之熱傳導及散熱功效；「改良型LED日光燈」（2009^9/21， M365434) LE：D模組之電路板頂面設有散熱基板’藉以散發LED 工作熱溫；「LED燈散熱結構改良」（2〇〇9Λ)9/11，Μ364817) 5 ί M376712 LED工作熱溫得以藉由固定片之接腳及導電層所形成之延伸面 積予以散發，從而使LED燈可縮小_域散熱結構更為簡 易，應用led光源模組架構投射燈結構」（2〇〇g/〇9/n， M364810)以投射燈之上蓋正面直接設有散熱鰭片，其反面亦 直接固定LED光源模組，使底座透過上蓋之導熱直接由散熱鰭 片散熱，「發光一極體路燈結構」（2009/09/11，M364803) LED模組係連接散熱體並位於靠近燈孔處，散熱體可幫助排除 LED於發亮時所產生之熱能，且通風孔係可促使該殼體内外之 空氣流通，達到更佳的散熱效果；「1^1)燈具散熱模組」 (2009/08/11，M362944)係為一種LED燈具散熱模組，包括 二平板式熱管、一散熱體及一導熱座，將散熱模組嵌設燈罩之 内壁面’糟以快速地逸散LED發光元件所產生的熱；「led嵌 燈」（2009/08/11，M362929)散熱座凸設於基座第二端，包 括有面積延伸型態之散熱部，俾可達到組構件簡單又兼具較佳 散熱效果；「被動排熱式發光二極體燈具」（2〇()9/()8/〇1， M362359)將一殼體製作成環形中空散熱座，其外表面設置複 數散熱鰭片’再透過底座之複數孔洞進行對流，使該熱氣流通 至該燈具之外部達到散熱之效果；「燈具之散熱裝置及燈且」 (2009/08/01，M362356)燈具之散熱裝置藉高面積的散熱面 及複數散熱空間的設計，迅速地導出LE：D所產生之光源熱度； 「照明燈具」（2009/7/21 ’M361608)係將二罩體設置於散熱 塊兩侧，中心形成有一貫穿的通道，外露的散熱塊設計具有散 熱的效果；「模組化LED裝置」（2009/7 /21，M361606)具有 凹槽的散熱板可容置超導元件’ LED模組直接與超導元件接觸 而增進散熱效果；「LE：D照明燈具」（2009/7/21，M361605)透 過印刷電路板側設置之散熱片將熱排除；「崁頂式LED筒燈結 7 M376712 構」（2009 /7/21，M361592)僅利用金屬燈體散熱；「可均勻 散熱之LED燈具」（2009/7/11，M360990)包括導熱塊、熱管 及散熱體之二個散熱模組，藉熱傳遞原理可將LED發光模組所 產生之熱均勻且快速的散逸；「LED燈散熱結構改良」 (2009/7/11 ’ M360989) LED之工作熱，藉由固定片之接腳及 固定片導電層形成之延伸面積予以散發，從而使LED燈可縮小 體積且使散熱結構更簡易；「照明系統及其散熱模組」 (2009/7/11，M360988)具有散熱模組藉由空氣對流達到散熱 之功效；「提高散熱率之燈具」（2009/7/11，M360987)可自 行調整燈條與燈條間的距離，避免整個燈具的散熱性不佳；「具 熱管散熱裝置的大功率LED燈具」（2009 /7/11，M360986) 係將LED燈設置在熱管上，LED燈所產生的熱能由熱管快速吸 收，再藉由燈殼將熱傳導出，由於燈殼與空氣具有大面積接 觸，可達到有效快速散熱的目的；「溫控型LED路燈裝置」 (2009/7/11，M360979)係由散熱燈殼將LED光源產生的熱散 逸至大氣中；「模組化照明單元」（2009/7/1 ’M360342)具 有複數個散熱鰭片所構成之散熱底面，藉以將組設於基板之 LED燈熱量排除。 更多的新型專利中，具有散熱考量的專利尚包括：「led 室内照明結構改良」（2009/6/21，M359651 )本體係為大面積 之鏤空設計，可產生較佳的熱對流，搭配本體設置反射散熱片 後，可產生最佳的散熱功效；「LED光源箱結構」（2009/6/21， M359648)係利用設置於led光源模組相鄰之散熱模組將熱予 以散除；「發光二極體燈具」（2〇〇9/6/21，M359643)設有二 個氣流單元，分別用以帶走散熱鰭片上及散熱鰭片傳導至殼體 的熱能；「LED燈具結構」（2009/6/21，M359637) LED燈具， 8 M376712 本體的後端没有多數散熱韓片错以散熱；「led照明燈;^ (2009/6/21，M359634)包括一組管狀式的散熱結構體二 氣流提高LE：D照明燈管散熱效果；「發光二極體照明條^ (2009/6/11 ’M359060)藉由反射背板的高反射與高散^^寺 性’將熱快速的導出而降溫；「高功率led投射燈之散熱纟士構 (2009/6/11 ’M358931)係在導熱塊之一側嵌設平板式熱管而 - 呈垂直狀態，另複數散熱鰭片呈傾斜堆疊的穿設平板式熱管， • 藉此加速將高功率LED所產生的熱散逸；「溫差導流的散熱裝 • 置」（2009/6/11，M358929)利用冷熱空氣對流原理與基體進 行熱交換的氣流，藉此熱交換程序快速且均勻的散熱；「led 燈具」（2009/6/11，M358923)係利用裸露式設計的光條，藉 以提升散熱的效果；「燈具之結構」（2〇〇9/6/11，M358920) 係將LED發光元件產生的熱能，藉由透氣孔傳導至散熱裝置； 「發光二極體之燈具模組」（2009/6/11，M358918)在LE1D燈 座的基板上没有凸出成型的金屬導熱柱；「Lej)路燈燈頭結構」 (2009/6/n ’ M358917)在燈罩内設有散熱裝置，包括貼附於 鲁 LE1D單元的基座、均溫板及散熱元件，散熱元件設有受熱座且 ' 座上具備複數散熱鰭片。 除此之外，具有散熱考量的新型專利還有：「發光二極體 燈具的固裝散熱板結構」（2009/5/21，M357848) LED發散的 熱通過殼座、邊轉導至具有絲面陽極處理的散熱板表面散 逸出；「有内定位結構的LE：d光源散熱模組」（2〇〇9 /5/21 , M357567)散熱組件具有一中央筒體和複數個散熱鰭片，每一 散熱鰭片之内側邊與中央筒體相接而呈輕射狀排列；「高功率 LED照明燈具及其散熱結構」（2〇〇9/5/21，M357566)可使散 熱縛片加熱之高溫空氣沿著氣流導引罩急速向外移動，並強迫1 9 M376712 冷空氣吸入，將LED晶片的熱量快速消散；「LED (2_/5/21，M357554)於本體相反之端面及 緣’分別凸設有複數個散熱錯片供LED基板所產生之高溫得以 快速傳導至本體；「多孔性材質鮮之散熱結構」（細/5/11， M356856)發光單元容設於料之容置孔内，所產生的熱經由 燈罩而傳導至金屬套而逸散；「具渦輪排風機之散熱裝置及包 括該裝置之LE：D燈具」（2009/5/11，M356853)散熱體之一侧 貼接LE：D發光模組，另一側連接有渦輪排風機，在不需額外供 應電源即可將LED發光模組之熱排除；「具有卡掣固定結構的 LED燈具」（2009/5/11 ’M356852)成型之散熱器具有一環牆， 而LE)D發光模組連接於散熱器遠離燈頭之一端；「LE：D路燈」 (2009/5/11 ’ M356839)之LED模組和散熱模組均設置於外殼 之内並直接與散熱模組貼合，藉以將LE：D所產生的熱散逸。 除上述列舉的新型專利外，擁有散熱考量的新型專利還 有·「具散熱結構之LED燈源改良」（2009/5/1，M356067) 散熱元件具有本體與周邊為渦狀彎曲之稽片，其整體外觀為中 間腹大之形狀，LED電路基板以底面所含之導熱板與本體相接 而導出熱；「可分散熱源之LE：D照明燈具」（2009/5/1，M356066 ) LED元件具有導熱座部組設於散熱框體内側面，各led元件所 產生的熱源可被分散，並快速透過散熱框體排散熱溫；「可散 熱的UED投射燈」（2009/5/1，M356056)電路單元是設置於 容置空間内’並具有與金屬材質散熱座抵接的基板；「led投 射燈具結構」（2009/5/1，M356051 )該投射燈殼體容室底部 設置與其全面貼觸的導熱片，導熱片上設有可供LED發光二極 體定位的數凸出栓，達到散熱及導熱之目的。 M376712 最後，在本國公告的新式樣專利中，具有散熱考量的專利 包括：「發光二極體燈具」（2009/11/21 ’D132205)包括一 燈架及裝設於燈架上之複數發光二極體模組，其中發光二極體 模組兩兩相背以一定角度傾斜設置，該等發光二極體模組呈波 浪狀設計；「發光二極體燈具」（罚卯/丨丨/丨丨’以“的⑺該 燈體包括一散熱器及貼設於該散熱器底面之發光二極體模 組，該散熱器兩側與燈架之管體頂端連接，且相對水平面以一Among the new patents announced in the country, the patents with heat dissipation include: "The heat dissipation module for bulb-type LED lamps" (2〇〇9/11/21, M36943〇) The heat generated by the LED can be conducted to the flat The heat-conducting member is then evenly and quickly dissipated through the heat-dissipating member; "LE: D heat-dissipating structure" (2009/11/21, _9429) The heat-dissipating fins are clamped through the convex bodies on the two sides of the fixing member, so that they can be mounted It is installed on the circuit board to dissipate heat from the LED on the circuit board and to facilitate the installation and replacement of the heat-dissipating Korean film. The "LED lamp improved structure" (2009/11/21, M369424) is mainly used for the heat dissipation of the LE:D lamp. The seat is provided with a transformer placement slot that provides a hidden arrangement of the transformer; the "LE1D luminaire assembly structure" (2009/11/21 'M369422) heat sink includes a cylindrical column with a central hole in the center, which can achieve between the components Close combination and good adhesion effect; "Light source device" (2〇〇9/11/21, M369419) A light source device that can adjust the illumination angle of the LED to form different light shapes according to the user's needs; LED outdoor lighting" (2009/1 1/11, M368765) The fan is installed in the heat-dissipating shroud, which can make the heat-dissipation structure of the LED outdoor lamp reach the heat-dissipating effect and greatly improve the practicality of dustproof and rain-proof effect; "The heat dissipation structure of the UD lamp" (2009/11/11, M368763) The heat energy of the light source module is dispersed and transmitted to the heat sinks by the heat dissipation plate, so as to improve the heat dissipation effect, ..., i rate; "an LED heat dissipation module" (2009/11/ 1, M368〇24) directly solder the substrate and the heat-conducting device, reduce the thermal resistance of the LED-dissipation group and alleviate the temperature increase of the LED chip; "LED street lamp assembly structure" (2〇〇9/11/1, M368014) The bottom of several LED light source modules in the upper cover is used as the contact surface, and the thermal fin plate is pressed against the joint to provide heat dissipation; the rLED heat sink structure (2009/10/11, M366882) utilizes the bent piece Achieve the size of the active modulated led heat sink structure, effectively solve the lack of the size of the LE:D lamp, and provide a multi-directional heat dissipation path to quickly derive the heat generated by the LED chip; "LED light source structure (2009/10/11, M366646) LED light source structure package Including the heat dissipating component, thereby improving the heat dissipation efficiency; the fins for the rLED lamp are improved. (2009/10/01, M366025) is a hyperbolic design with the opposite sides of the heat intercepting plate, and the two ends are respectively extended. The heat conducting plate and the geometric heat radiating plate are screwed to the back of the LED light source module, and can easily pass the upper limit of the temperature gradient generated by the heat intercepting plate, and when the heat energy is reversed, it is not stable. The heat source body is blocked by the heat intercepting plate to provide effective conduction heat dissipation; "Light emitting diode lamp pull group" (2009/10/01, M366013) LED chip is directly disposed on the heat sink, and then the LED chip and the setting The circuit layer or the substrate on the heat sink is electrically connected to make the lamp module have good heat dissipation effect; the "light emitting diode lamp" (2009/09/21 'M365444) heat conduction unit includes a heat pipe and is filled therein a heat-conducting medium disposed inside the lamp cover for conducting heat generated by the LED to the lamp cover; "LE:D lamp structure improvement" (2009/09/21, M365435), the back cover is screwed and fixed by screws Rack to secure the bracket to the light through the screw The LEDs in the inside are tightly combined to indirectly close the circuit substrate and the lamp housing to achieve better heat conduction and heat dissipation; "Improved LED fluorescent lamp" (2009^9/21, M365434) LE:D module circuit board top surface design There is a heat-dissipating substrate 'to dissipate the LED working heat temperature; "LED lamp heat dissipation structure improvement" (2〇〇9Λ) 9/11, Μ364817) 5 ί M376712 LED working heat temperature can be formed by the pins of the fixing piece and the conductive layer The extended area is distributed, so that the LED light can be reduced. The domain heat dissipation structure is simpler, and the LED light source module structure is used to project the lamp structure (2〇〇g/〇9/n, M364810) to directly front the projection lamp. It is provided with heat-dissipating fins, and the LED light source module is directly fixed on the reverse side, so that the base is directly radiated by the heat-dissipating fins through the heat conduction of the upper cover, and the "light-emitting one-pole street lamp structure" (2009/09/11, M364803) LED module system The heat sink is connected to the lamp hole, and the heat sink can help to eliminate the heat generated by the LED when it is illuminated, and the vent hole can promote the air circulation inside and outside the casing to achieve better heat dissipation effect; "1^1 ) Lamp Cooling Module" (2009/08/ 11, M362944) is an LED lamp heat dissipation module, comprising two flat heat pipes, a heat sink and a heat conducting seat, and the heat dissipation module is embedded with the inner wall surface of the lamp cover to quickly dissipate the LED light emitting component. Heat; "LED recessed light" (2009/08/11, M362929) heat sink is protruding from the second end of the base, including a heat dissipation part with an area extension type, which can achieve a simple set of components and a better heat dissipation effect. "Passive heat-dissipating LED lamp" (2〇()9/()8/〇1, M362359) is made into a ring-shaped hollow heat sink with a plurality of heat-dissipating fins on its outer surface and then through the base. The plurality of holes are convected to allow the hot air to pass to the outside of the lamp to achieve the effect of dissipating heat; "The heat sink of the lamp and the lamp" (2009/08/01, M362356) The heat sink of the lamp borrows a high area of heat dissipation surface and plural The design of the heat dissipation space quickly derives the heat of the light source generated by LE:D; "Lighting Fixture" (2009/7/21 'M361608) is to arrange the two covers on both sides of the heat sink block, and the center is formed with a through passage, exposed Heat sink design with heat dissipation "Modular LED device" (2009/7 / 21, M361606) has a grooved heat sink for accommodating superconducting components' LED module directly contacts the superconducting component to enhance heat dissipation; "LE: D lighting fixture (2009/7/21, M361605) The heat is removed through the heat sink provided on the side of the printed circuit board; "The dome-type LED downlight 7 M376712" (2009 / 7/21, M361592) uses only the metal body to dissipate heat. "The LED lamp with uniform heat dissipation" (2009/7/11, M360990) includes two heat-dissipating modules of heat-conducting block, heat pipe and heat sink. The heat generated by the LED light-emitting module can be evenly and quickly. Dissipation; "LED lamp heat dissipation structure improvement" (2009/7/11 'M360989) The working heat of the LED is dissipated by the extension area formed by the pin of the fixing piece and the conductive layer of the fixing piece, so that the LED lamp can be reduced in volume And the heat dissipation structure is simpler; "Lighting System and Its Heat Dissipation Module" (2009/7/11, M360988) has the effect of cooling the air module to achieve heat dissipation by air convection; "Lamps with improved heat dissipation rate" (2009/7/ 11, M360987) can adjust the distance between the light bar and the light bar by itself. The heat dissipation of the entire lamp is not good; "High-power LED lamp with heat pipe heat sink" (2009 / 7/11, M360986) is to set the LED lamp on the heat pipe, and the heat generated by the LED lamp is quickly absorbed by the heat pipe. The heat is conducted by the lamp housing, and the lamp housing has a large area contact with the air, so that the purpose of effective rapid heat dissipation can be achieved; the "temperature-controlled LED street light device" (2009/7/11, M360979) is the LED of the heat-dissipating lamp housing. The heat generated by the light source is dissipated into the atmosphere; the "modular lighting unit" (2009/7/1 'M360342) has a heat-dissipating bottom surface formed by a plurality of heat-dissipating fins, thereby eliminating the heat of the LED lamp set on the substrate. Among the more new patents, the patents with thermal considerations include: "LED indoor lighting structure improvement" (2009/6/21, M359651) This system is a large-area hollow design, which can produce better thermal convection with the body. After the reflective heat sink is set, the best heat dissipation effect can be produced; the "LED light source box structure" (2009/6/21, M359648) uses the heat dissipation module disposed adjacent to the LED light source module to dissipate heat; "Light-emitting diode lamps" (2〇〇9/6/21, M359643) are provided with two airflow units for taking away heat energy from the heat-dissipating fins and the heat-dissipating fins to the casing; "LED lamp structure" 2009/6/21, M359637) LED lamps, 8 M376712 The back end of the body does not have much heat dissipation to dissipate heat; "LED lighting; ^ (2009/6/21, M359634) includes a set of tubular heat dissipation structures The two airflows improve the heat dissipation effect of the LE:D lighting tube; "Lighting diode lighting strip ^ (2009/6/11 'M359060) is quickly exported by the high reflection of the reflective backing plate and the high dispersion ^^ temple' And cooling; "high-power led projection lamp cooling gentleman structure (2009/6/11 'M358931) A flat-plate heat pipe is embedded on one side of the heat-conducting block - in a vertical state, and a plurality of heat-dissipating fins are arranged in a slant-stacked plate-type heat pipe, thereby accelerating heat dissipation from the high-power LED; "temperature difference diversion "Heat Dissipation Device" (2009/6/11, M358929) uses the hot and cold air convection principle to exchange heat with the substrate, thereby quickly and evenly dissipating heat through the heat exchange program; "led lamps" (2009/6/11, M358923) uses a bare-shaped light strip to enhance the heat dissipation effect; "The structure of the lamp" (2〇〇9/6/11, M358920) is the heat energy generated by the LED light-emitting element, which is conducted to the heat dissipation through the vent hole. "Lighting diode module" (2009/6/11, M358918) has no protruding metal heat-conducting column on the substrate of LE1D lamp holder; "Lej" street lamp base structure" (2009/6/n 'M358917' has a heat sink inside the lampshade, including a base attached to the Lu1D unit, a temperature equalizing plate and a heat dissipating component. The heat dissipating component has a heated seat and the housing has a plurality of fins. In addition, the new patents with thermal considerations include: "Fixed heat sink structure for LEDs" (2009/5/21, M357848). The heat of LED divergence passes through the housing and turns to the wire. The surface of the surface-anodized heat sink is dissipated; the "LE:d light source heat-dissipating module with internal positioning structure" (2〇〇9 /5/21, M357567) heat-dissipating component has a central cylinder and a plurality of heat-dissipating fins. The inner side of each fin is connected to the central cylinder and arranged in a light-emitting manner. The "high-power LED lighting fixture and its heat dissipation structure" (2〇〇9/5/21, M357566) can be used to dissipate heat-dissipating tabs. The heated high-temperature air rapidly moves outward along the airflow guiding cover, and forces 19 9376376 air to be sucked in, which quickly dissipates the heat of the LED chip; "LED (2_/5/21, M357554) is on the opposite end of the body and the edge 'There are a plurality of heat dissipation staggers respectively for the high temperature generated by the LED substrate to be quickly transmitted to the body; the "heat-dissipating structure of the porous material" (fine 5/11, M356856) is accommodated in the material. In the hole, the generated heat is transmitted to the metal sleeve through the lampshade and is dissipated "The heat sink with turbine exhaust fan and the LE:D lamp including the device" (2009/5/11, M356853) one side of the heat sink is attached to the LE:D light-emitting module, and the other side is connected with a turbine exhaust fan. The heat of the LED lighting module can be eliminated without additional power supply; the "LED lamp with a fixed structure" (2009/5/11 'M356852) has a ring with a ring and LE) D The group is connected to the heat sink away from one end of the lamp head; the LED module and the heat dissipation module of the "LE:D street light" (2009/5/11 'M356839) are disposed in the outer casing and directly fit with the heat dissipation module, thereby LE: D produces heat dissipation. In addition to the new patents listed above, the new patents with thermal considerations include "Improvement of LED light source with heat dissipation structure" (2009/5/1, M356067). The heat dissipating component has a slab with a body and a periphery. The overall appearance is the shape of the middle abdomen, and the LED circuit substrate is connected to the body by the heat conducting plate contained on the bottom surface to derive heat; "LE: D lighting fixture with dispersible heat source" (2009/5/1, M356066) LED component The heat-dissipating seat portion is disposed on the inner side of the heat-dissipating frame, the heat source generated by each led component can be dispersed, and the heat-dissipating temperature of the heat-dissipating frame body can be quickly dissipated; "a heat-dissipating UED projection lamp" (2009/5/1, M356056) The circuit unit is disposed in the accommodating space and has a substrate abutting against the metal material heat sink; "LED projection lamp structure" (2009/5/1, M356051), the bottom of the projection lamp housing chamber is fully attached The conductive sheet of the touch, the heat-conducting sheet is provided with a number of protruding plugs for positioning the LED light-emitting diodes, so as to achieve the purpose of heat dissipation and heat conduction. M376712 Finally, in the new model patents announced in the country, the patents with thermal considerations include: "Light-emitting diode lamps" (2009/11/21 'D132205) including a light stand and a plurality of light-emitting lights mounted on the light stand The polar body module, wherein the two sides of the light-emitting diode module are inclined at an angle, and the light-emitting diode modules have a wave-like design; "light-emitting diode lamps" (a fine/卯/丨(7) The lamp body comprises a heat sink and a light emitting diode module attached to the bottom surface of the heat sink, the heat sinks are connected to the top end of the tube body of the lamp holder, and the water level is opposite to the horizontal plane.
定角度傾斜設置；「路燈之燈頭」（2009/11/1，D131771)LED 燈產生光線穿過透明板向外照明，熱量經傳導作用由背部的散 熱鰭片直接發散於空氣中，以提供增加散發熱量及氣流通風的 效果；「LED嵌燈」（2009/09/21，D131080)嵌燈上方具有一 散熱模組，侧邊凸設有兩組相互對應之凸塊，側邊另凸設有複 數散熱鰭片，凸塊與散熱鰭片呈放射狀，散熱模組中央具有兩 組相互對應且貫穿散熱模組之散熱孔，呈現出特別之新式樣設 計；「發光二極體燈具」（2009/7/1，D12962{))在燈殼頂板 上安裝有複數長條狀之散熱器，散熱器之側面設有凸出於燈殼 外之複數鰭片；「發光二極體燈具」（2〇〇9/5/21，D1289〇2) 係在殼體之周面上環，設有與上殼體内部相連通之兩排氣孔； 「發光二極體燈具」（2009/5/11，D128756)將LED燈架貼置 在政熱器上，該散熱器之兩側面呈弧形；「發光二極體燈具」 (2009/4/21 ’ D128464)每一發光源之兩端設有散熱器，用以 對LED發光源散熱；「發光二極體燈具」（2〇〇9/4/21，趴狀祁幻 貼设於散熱器之複數LE：D模組，利用安裝於燈架一侧之散熱器 將熱散逸。 11 M376712 【新型内容】 LED是利㈣晶献技術與半導體材料製成的發光元件， LED具有體積小、耗電低、壽命長、堅固耐用及符合環保等諸 多優點，膽光效率從1_年朗世以鱗持升，不僅 早已超越了鶴絲燈泡（效能約為10〜2〇lni/w)，目前也已凌駕 在曰光燈管（效能約為㈣0 lm/W)之上。由於的相· 術不斷的在進展’預估在近年内將可望達到1〇〇 lm/w的水準。 由於LED已成為新世代随光源最受矚目的焦點，隨著號魏 燈、路燈、豕用照明燈、車燈、廣告燈...逐漸擴大並普及使用， LED成為照明市場的主流趨勢已銳不可擋。 本創作具散熱器之LE：D照明燈的主要組成元件包含：一 LED照明單元、-散熱料元及-燈帽單元等三個單元。在⑽ 照明，元中’複數LED模組裝置在金屬基板上；金屬基板與散 熱器藉由觀緊密的結合’在LED基板與散熱n鋪介面塗覆 熱介面物質（thermal interface material)，藉以減低⑽模 組散熱時之熱阻(thermal resistance)。散熱器具有圓柱形輻 射狀排列的散熱鰭片，藉以將1^1)產生的熱散逸至外界。 本創作充分的運用目前電子元件的散熱技術，能夠自然、 有效的排除LE：D模組產生的熱量，使照明燈的LE：D發光效率提The angle is tilted; the "light of the street lamp" (2009/11/1, D131771) LED light produces light that illuminates through the transparent plate, and the heat is radiated directly from the heat fins on the back to the air to provide an increase. The effect of heat dissipation and airflow ventilation; "LED recessed light" (2009/09/21, D131080) has a heat-dissipating module above the recessed light, and two sets of corresponding convex bumps are arranged on the side, and the side is convexly arranged. The plurality of heat-dissipating fins, the bumps and the heat-dissipating fins are radial, and the heat-dissipating module has two sets of heat-dissipating holes corresponding to each other and extending through the heat-dissipating module, presenting a special new design; "Light-emitting diode lamp" (2009) /7/1, D12962{)) A plurality of long strip-shaped heat sinks are mounted on the top plate of the lamp housing, and a plurality of fins protruding from the lamp housing are arranged on the side of the heat sink; "Light-emitting diode lamps" (2 〇〇9/5/21, D1289〇2) is attached to the circumference of the casing and has two venting holes communicating with the inside of the upper casing; "Light-emitting diode lamps" (2009/5/11, D128756) The LED light stand is placed on the political heater, and the two sides of the heat sink are curved; "Polar Body Lamps" (2009/4/21 'D128464) Each radiator has a heat sink at both ends for heat dissipation from the LED light source; "Light Emitting Diode Lamp" (2〇〇9/4/21, The LE 祁 祁 贴 贴 LE LE LE LE LE LE LE LE LE LE LE LE LE 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 Light-emitting components, LEDs have many advantages such as small size, low power consumption, long life, ruggedness and environmental protection. The efficiency of bile light rises from the scale of 1 year, and has not only surpassed the crane light bulb (the performance is about 10~) 2〇lni/w), currently over the dawn light tube (efficiency is about (4) 0 lm/W). Due to the continuous progress of the phase, it is expected to reach 1〇〇 in recent years. The level of lm/w. Since LED has become the focus of the new generation with the light source, with the Wei, street, lighting, lights, advertising lights... gradually expanded and popularized, LED becomes lighting The mainstream trend of the market has become unstoppable. The main components of the LE:D lighting with this radiator The components include: an LED lighting unit, a heat dissipating material element, and a lamp cap unit. In (10) lighting, the 'multiple LED module device is mounted on the metal substrate; the metal substrate and the heat sink are closely combined by the view. 'The thermal interface material is coated on the LED substrate and the heat sink n interface to reduce the thermal resistance of the module when it is dissipated. The heat sink has a cylindrical radial arrangement of heat sink fins. 1^1) The generated heat is dissipated to the outside world. This creation makes full use of the current heat dissipation technology of electronic components, which can naturally and effectively eliminate the heat generated by the LE:D module, so that the LE:D luminous efficiency of the illumination lamp is improved.
昇、使用壽命延長。本創作採用模組化設計，藉由螺紋將LED 照明單元、散熱器單元及燈帽單元結合，易於組裝與拆卸，不 但具備便利性也擁有可換性，構成—種新型實用的創新產品。 士創作是極具市場潛力與競爭優勢的照明產品，是相當值得肯 定的照明燈具。 12 M376712 【實施方式】 第一圖為本創作具散熱器之LED照明燈實施例的立體組合 圖。從第-圖可看出本創作的整體外觀，從外觀可將本創作區 分成二個主要部分’包括Led照明單元1、散熱器單元2及燈 帽單元3。 第二圖為本創作具散熱器之LED照明燈實施例的立體分解 圖（一），第二圖為本創作具散熱器之LED照明燈實施例的立 體分解圖（二）。從第二_第三圖可詳_相本創作的各 組成元件’ Λ中第-部分為LED照明單元，本單元包括一燈罩 1卜一燈罩螺紋12、一基板13、-上基板敎14、複數LED 模組15、一電線16及一下基板螺紋17。燈罩u的材質選用 聚礙酸醋（polycarbonate，PC)或聚乙稀(polyethylene，pE)， 燈罩殼的形狀則為弧形凸面並具有可透光性，俾能產生整體衡 受光源’又藉由上述弧形凸面結構，藉㈣除光線之重疊而不 會產生眩光，故可增進照明效果而增加視覺的舒適感。在燈罩 内部具有料微12，可與金祕板13上方的上基板螺紋14 配對結合，藉此可將燈罩固定在金屬基板上。 LED模組15係由複數LED對稱的均佈在一金屬基板上所構 成，金屬基板為具有高熱傳導係數(thermal⑺加此七“沅幻的 材質（在27°C情況下’銘、銅的熱傳導係數分別為挪、 401[raK) ’·金屬基板擁有將LED產生的熱均勻傳導至整塊板 片的能力。MD模組藉由電線16提供必要的電能，電線金屬裸 線頭係直接焊接在金屬基板上。 LED照明單元的金屬基板下方具有下基板螺紋17，此外螺 紋用以和放熱器内螺紋21配對結合，使得⑽照明單元能與 13 早7G緊密的結合。在金屬基板與散無的接觸面須塗覆 藉以減低金屬基板散熱時之熱阻;熱介面物質通 吊铋用熱傳導性較佳的散熱膏（让ermal grease)。 從第二圖、第三_及第四圖可看出摘作的散執器單 主要包括-散熱器螺紋2卜複數散熱則22 ’數環 燈帽早兀之間，主要採用散熱器螺紋21與另二單元結合， 散熱器二端皆採肋同明紋，不但使散熱器沒有方向性的限 制’而且擁有可互舰_點，對於維修拆卸更具有極佳的便 捷性。 散熱器單元採用輻射狀的散熱鰭片22,密集的排列方式提 供更大的散熱_ ’加上H射狀料的熱散逸特性，更能使献 從散熱器的中空柱心片相，提供絕佳自然與熱賴身; 的途徑’使熱能經由大面積、多方位的韓片散逸出達到最佳 的散熱效果。另外，散熱器的散熱鰭片具有同心的複數溝槽 23，使每一散熱鰭片均變成等間距的複數小散熱鰭片，當熱氣 流由散熱器底部沿著軸向往上流動時，複數小散熱鰭片會破壞 熱邊界層（thermal boundary layer)的成長’如此有助於促進 自然對流的散熱效果。散熱器的中空柱心24用以做為電線連 接通道，而且可減少金屬材料的使用量，連帶亦可降低散熱器 的重董，中空柱心與散熱鰭片係為一體成型，材質則選用鋁材 即足以達到散熱需求。 在第二圖與第三圖同時呈現本創作的燈帽單元，其中包括 一電線31、一燈帽螺紋32、一電路模組33、複數燈帽上散熱 孔34、複數燈帽側散熱孔35、一螺旋座36及一電接觸頭37。 電線31是將電能傳輸至LED的途徑，用以供應le：D所需的電{ M376712 能，·電線從燈帽單元端面拉出之後，經由散熱器的中空柱心連 接到LE：D模組的金屬基板。 在燈帽單元的上方採用燈帽螺紋32與散熱器内螺紋配對 結合，燈帽螺紋與下基板螺紋完全相同，如此可使散熱器在使 用時沒有方向性的限制。電路模組33係用以容置驅動led發 出光的電子元件空間，本模組表殼可銑複數燈帽上散熱孔34 及複數燈帽側散熱孔35之散熱溝槽，以便散發電路模組產生 的熱，以及經由散熱器中空柱心對流而上的熱。螺旋座36為 具有公螺紋之圓弧螺峰與螺谷，係用以將照明燈旋轉安裝在燈 座内，透過電接觸頭37與燈座之電源接觸，藉以將電流導引 至照明燈。 【圖式簡單說明】 第一圖為本創作具散熱器之LED照明燈實施例的立體組合圖。 第二圖為本創作具散熱器之LE1D照明燈實施例的立體分解圖（一）。 第三圖為本創作具散熱器之LED照明燈實施例的立體分解圖（二)。 第四圖為本創作具散熱器之LE：D照明燈實施例的散熱器平面圖。 15 M376712 【主要元件符號說明】 11 :燈罩 12 :燈罩螺紋 13 :基板 14 :上基板螺紋 15 : LE：D 模組 16 :電線 17 :下基板螺紋 21 :散熱器螺紋 22 :散熱鰭片（fin) 23 :環狀溝槽 24 :中空柱心 31 :電線 32 :燈帽螺紋 33 :電路模組 34 :燈帽上散熱孔 35 :燈帽側散熱孔 36 :螺旋座（screw base) 37 :電接觸頭（electrical contact) 16l, extended service life. This creation adopts a modular design, which combines the LED lighting unit, the radiator unit and the lamp cap unit with threads to facilitate assembly and disassembly. It not only has convenience but also has interchangeability, and constitutes a new and practical innovative product. Shishi is a lighting product with great market potential and competitive advantages. It is quite worthy of lighting fixtures. 12 M376712 [Embodiment] The first figure is a three-dimensional combination diagram of an embodiment of an LED lighting lamp with a heat sink. From the first figure, the overall appearance of the creation can be seen. From the appearance, the creation area can be divided into two main parts' including the Led lighting unit 1, the radiator unit 2 and the lamp unit 3. The second figure is a perspective exploded view (1) of an embodiment of an LED lighting lamp with a heat sink, and the second figure is a perspective view (2) of an embodiment of an LED lighting lamp with a heat sink. From the second to the third figure, the first component of the component is the LED lighting unit. The unit includes a lampshade 1 and a lampshade thread 12, a substrate 13, an upper substrate 敎14, and a plurality of The LED module 15, a wire 16 and a lower substrate thread 17. The material of the lampshade u is made of polycarbonate (PC) or polyethylene (pE). The shape of the lampshade shell is curved convex surface and has light transmissibility, so that the overall balance can be generated by the light source. By the above-mentioned curved convex structure, the radiance is not generated by the overlapping of the light, so that the illumination effect can be enhanced and the visual comfort is increased. Inside the lampshade, there is a material 12 which can be mated with the upper substrate thread 14 above the gold plate 13, whereby the lamp cover can be fixed to the metal substrate. The LED module 15 is composed of a plurality of LEDs symmetrically distributed on a metal substrate, and the metal substrate is a material having a high thermal conductivity (thermal (7) plus seven "illusive materials" (in the case of 27 ° C, the heat conduction of copper) The coefficients are respectively, 401 [raK) '· The metal substrate has the ability to conduct the heat generated by the LED evenly to the entire plate. The MD module provides the necessary electric energy by the wire 16, and the bare metal wire of the wire is directly soldered. On the metal substrate, the metal substrate of the LED lighting unit has a lower substrate thread 17 underneath, and the thread is used for mating with the internal thread 21 of the radiator, so that the (10) lighting unit can be tightly coupled with the early 7G. The contact surface shall be coated to reduce the thermal resistance of the metal substrate when the heat is dissipated; the thermal interface material is passed through the thermal grease with better thermal conductivity. Let the ermal grease be seen from the second, third and fourth figures. The abstracted single-handler includes: the radiator thread 2, the plural heat dissipation, and the 22' number ring cap between the early and the second, mainly using the heat sink thread 21 and the other two units. Grain, not only The radiator has no directional restrictions, and it has a cross-ship _ point, which is extremely convenient for maintenance and disassembly. The radiator unit uses radial fins 22, which provide more heat dissipation in a dense arrangement. In addition, the heat dissipation characteristics of the H-ray material can provide the natural column and the core of the heat sink from the heat sink. The way to make the heat escape through large-area and multi-faceted Korean films. To achieve the best heat dissipation effect, in addition, the heat sink fins have concentric plurality of grooves 23, so that each heat sink fin becomes a plurality of small fins at equal intervals, when the hot air flow is from the bottom of the heat sink along the axis When moving upwards, multiple small heat sink fins will break the growth of the thermal boundary layer. This helps to promote the heat dissipation effect of natural convection. The hollow core 24 of the heat sink is used as a wire connection channel, and It can reduce the amount of metal materials used, and it can also reduce the weight of the heat sink. The hollow core and the heat sink fins are integrally formed, and the material is made of aluminum, which is enough to meet the heat dissipation requirements. The second and third figures simultaneously show the lamp cap unit of the present invention, which includes a wire 31, a cap thread 32, a circuit module 33, a plurality of lamp cap cooling holes 34, a plurality of lamp cap side heat dissipation holes 35, a screw holder 36 and an electric contact head 37. The electric wire 31 is a means for transmitting electric energy to the LED for supplying electric power required for the le: D. [M376712 can be, after the electric wire is pulled out from the end face of the lamp cap unit, via the radiator The hollow core is connected to the metal substrate of the LE:D module. The cap screw thread 32 is matched with the internal thread of the heat sink above the lamp cap unit, and the cap thread is exactly the same as the lower substrate thread, so that the heat sink can be There is no directional limitation in use. The circuit module 33 is used for accommodating the space of the electronic component that drives the LED to emit light. The module case can be used for milling the heat dissipation hole 34 of the lamp cap and the heat dissipation hole of the plurality of lamp cap side heat dissipation holes 35. a trench to dissipate the heat generated by the circuit module and the heat convection through the hollow core of the heat sink. The screw base 36 is a circular arc peak and a screw valley having a male thread for rotating the illumination lamp in the socket and contacting the power supply of the socket through the electrical contact 37 to guide the current to the illumination lamp. [Simple Description of the Drawings] The first figure is a three-dimensional combination diagram of an embodiment of an LED lighting lamp with a heat sink. The second figure is an exploded perspective view (I) of an embodiment of a LE1D illumination lamp with a heat sink. The third figure is an exploded perspective view (2) of an embodiment of an LED lighting lamp with a heat sink. The fourth figure is a plan view of the heat sink of the embodiment of the LE:D lighting with a heat sink. 15 M376712 [Description of main component symbols] 11 : Shade 12 : Shade thread 13 : Substrate 14 : Upper substrate thread 15 : LE: D Module 16 : Wire 17 : Lower substrate thread 21 : Radiator thread 22 : Heat sink fin (fin 23: annular groove 24: hollow core 31: wire 32: lamp cap thread 33: circuit module 34: heat dissipation hole 35 on the lamp cap: lamp cap side heat dissipation hole 36: screw base 37: electric Contact (electrical contact) 16