CN211925493U

CN211925493U - LED ceiling spotlight

Info

Publication number: CN211925493U
Application number: CN202020297654.6U
Authority: CN
Inventors: 周庆军
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-03-11
Filing date: 2020-03-11
Publication date: 2020-11-13
Anticipated expiration: 2030-03-11

Abstract

The utility model discloses a LED ceiling spotlight, which comprises a face ring provided with a spring fixing device, a light-transmitting diffusion plate connected with the face ring, a rear cover connected with the face ring and used for heat dissipation, and an LED light-emitting plate arranged on the inner surface of the rear cover; the surface ring, the diffusion plate and the rear cover form an LED mounting cavity, and the LED light-emitting plate is positioned in the LED mounting cavity; the rear cover is of a cylindrical structure and comprises a base connected with the surface ring and a chimney heat dissipation structure arranged on the top surface of the base, wherein the chimney heat dissipation structure comprises 1 large flue, a plurality of small flue groups and a plurality of air inlet channels penetrating through the small flue groups, and the large flue, the plurality of small flue groups are vertically arranged; the air inlet channel is arranged at the position matched with the bottom of the small flue group, the inner end of the air inlet channel is communicated with the large flue, and the outer end of the air inlet channel is communicated with the outside. The utility model adopts the structure, the processing technology is simple, and the production can be realized by the die-casting or punching technology; the chimney heat dissipation structure has high-efficiency heat dissipation performance.

Description

LED ceiling spotlight

Technical Field

The utility model relates to a LED technical field, concretely relates to LED smallpox shot-light.

Background

An LED (Light Emitting Diode) is a semiconductor solid-state Light Emitting device, which uses a solid-state semiconductor chip as a Light Emitting material, and when a forward voltage is applied across two terminals, carriers in a semiconductor are recombined to cause photon emission and generate Light. The LED ceiling spotlight adopts the LED as a light source, and has the advantages of high efficiency, energy conservation, long service life, good color rendering property and the like.

The LED ceiling spotlight is mainly used for key illumination, highlights ornaments to be represented, is used for hanging pictures and the like, and is generally arranged on a ceiling, a gallery, a cabinet and the like. The LED in the existing LED ceiling spotlight can generate a large amount of heat energy during the operation of the LED, if the heat energy cannot be effectively dissipated, the temperature is too high, the service life is seriously influenced, and meanwhile, the luminous intensity and the light emitting quantity of a chip can be seriously influenced due to the too high temperature of the LED, so that the product fails. And the existing heat radiation structure processing technology is complex, which is not beneficial to the production efficiency. Meanwhile, because the LED light source is characterized by directional light emission, light rays are concentrated, and illumination unevenness in an illumination range can be caused, so that dazzling glare is generated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to disclose a LED smallpox shot-light, solved current LED smallpox shot-light and produced a large amount of heat energy, the radiating effect is not good, and the problem that current heat radiation structure processing technology is complicated has further solved the problem that LED produced the glare.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

an LED ceiling spotlight comprises a face ring provided with a spring fixing device, a light-transmitting diffusion plate connected with the face ring, a rear cover connected with the face ring and used for heat dissipation, and an LED light-emitting plate arranged on the inner surface of the rear cover; the surface ring, the diffusion plate and the rear cover form an LED mounting cavity, and the LED light-emitting plate is positioned in the LED mounting cavity; the rear cover is of a cylindrical structure and comprises a base connected with the surface ring and a chimney heat dissipation structure arranged on the top surface of the base, wherein the chimney heat dissipation structure comprises 1 large flue, a plurality of small flue groups and a plurality of air inlet channels penetrating through the small flue groups, and the large flue, the plurality of small flue groups are vertically arranged; the air inlet channel is arranged at the position matched with the bottom of the small flue group, the inner end of the air inlet channel is communicated with the large flue, and the outer end of the air inlet channel is communicated with the outside.

Further, little flue group with the intake duct one-to-one cooperation, the intake duct along the radial extension of back lid.

Further, big flue with the central axis L coaxial cooperation of LED smallpox shot-light, a plurality of little flues are organized around central axis L annular array and are peripheral at big flue.

Furthermore, the small flue group is composed of 3 small flues which are vertically arranged, and the 3 small flues are arranged along the radial direction of the rear cover.

Further, the LED light-emitting panel comprises a heat-conducting substrate, a plurality of LED elements arranged on the heat-conducting substrate and a secondary optical lens covered on the LED elements.

Further, the heat conducting substrate is in a circular ring structure, and the rear cover and/or the heat conducting substrate are/is made of a Cu-based composite material or an Al-based composite material.

Further, the secondary optical lens comprises a base body matched with the LED element, a first total reflection surface, an emergent surface and a second total reflection surface; the bottom of the first total reflection surface is arranged on the substrate, the top of the first total reflection surface is connected with the bottom of the emergent surface, and the top of the emergent surface is connected with the second total reflection surface; the second total reflection surface is a conical surface structure with a wide upper part and a narrow lower part, and the first total reflection surface is parallel to the second total reflection surface.

Further, the LED element is an element packaged by COB technology.

Further, LED smallpox shot-light, its characterized in that: the heat-conducting substrate is made of a high-heat-conducting composite material, and the high-heat-conducting composite material is a composite body of a circuit and a heat sink.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model adopts the chimney heat dissipation structure, has simple processing technology, and can be simply realized through the die-casting or punching technology in production; the chimney heat dissipation structure has high-efficiency heat dissipation performance. The heat can be effectively diffused to the environment from the radiator, and the radiating problem of the LED lamp is solved. The LED light-emitting board is made of a Cu-based composite material or an Al-based composite material, and has the excellent characteristics of high thermal conductivity and adjustable thermal expansion coefficient. The adopted secondary optical lens realizes large-angle irradiation and has no halation and glare.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic front sectional view of an embodiment of an LED ceiling spotlight according to the present invention;

FIG. 2 is a schematic top view of the rear cover of FIG. 1;

fig. 3 is a schematic front sectional view of the secondary optical lens of fig. 1.

In the figure, the face ring 1; a diffusion plate 2; a rear cover 3; a base 31; a chimney heat dissipation structure 32; a large flue 321; a small flue group 322; a small flue 3221; an inlet duct 323; an inner end 3231 of the inlet channel; an outer end 3232 of the inlet channel; an LED light emitting panel 4; a heat conductive substrate 41; an LED element 42; a secondary optical lens 43; a base 431; the first total reflection surface 432; an exit surface 433; a second total reflection surface 434; and an LED mounting cavity 5.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 and fig. 2, the LED ceiling spotlight according to the embodiment includes a surface ring 1 having a spring fixing device, a light-transmitting diffusion plate 2 connected to the surface ring 1, a rear cover 3 connected to the surface ring 1 for heat dissipation, and an LED light board 4 disposed on an inner surface of the rear cover 3. The face ring 1, the diffusion plate 2 and the rear cover 3 form an LED mounting cavity 5, and the LED lighting board 4 is located in the LED mounting cavity 5.

Back lid 3 is cylindrical structure, and back lid 3 includes the base 31 of connecting surface ring 1 and locates the chimney heat radiation structure 32 of base 31 top surface, and chimney heat radiation structure 32 includes a plurality of intake duct 323 that big flue 321, a plurality of little flue group 322 and the little flue group 322 of running through of 1 vertical setting, and little flue group 322 and intake duct 323 one-to-one cooperate, and intake duct 323 is along the radial extension of back lid 3. The large flue 321 is coaxially matched with the central axis L of the present embodiment, and a plurality of small flue groups 322 are annularly arrayed around the central axis L at the periphery of the large flue 321. The small flue group 322 is composed of 3 small flues 3221 arranged vertically, and the 3 small flues 3221 are arranged along the radial direction of the rear cover 3. The air inlet channel 323 is arranged at a position matched with the bottom of the small flue group 322, the inner end 3231 of the air inlet channel is communicated with the large flue 321, and the outer end 3232 of the air inlet channel is communicated with the outside. The large flue 321 and the small flue 3221 are circular in cross section, and are convenient to process. The height H of the chimney heat dissipation structure 42 is 50 mm. The axis of the large flue 321 is parallel to the axis of the small flue 3221, and the axis of the air inlet 323 and the axis of the large flue 321 are perpendicular to each other. In the embodiment, the chimney heat dissipation structure 32 is adopted, the processing technology is simple, and the method can be simply realized through a die-casting or punching technology in production; the chimney heat dissipation structure has high-efficiency heat dissipation performance. The heat can be effectively diffused to the environment from the radiator, and the radiating problem of the LED lamp is solved.

The LED lighting panel 4 includes a heat conductive substrate 41, a plurality of LED elements 42 provided on the heat conductive substrate 41, and a secondary optical lens 43 covering the LED elements 42. The plurality of LED elements 42 are distributed in an annular array around the central axis L, and the LED elements 42 and the secondary optical lenses 43 are fitted in a one-to-one correspondence. The heat conducting substrate 41 is in a circular ring structure, the rear cover 3 and the heat conducting substrate 41 are made of metal-based composite materials, and the metal-based composite materials are Cu-based composite materials or Al-based composite materials and have the excellent characteristics of high heat conductivity (up to 200W/mK) and adjustable thermal expansion coefficient. LED element 42 adopts COB technique encapsulation, and a plurality of LED element adopts the array to set up the position, and COB encapsulation technique is favorable to improving the heat dispersion of LED unit encapsulation subassembly, increases the luminous luminance of LED unit encapsulation subassembly simultaneously. The heat conducting substrate 41 is made of a high heat conducting composite material, the high heat conducting composite material is a composite body of a circuit and a heat sink, the structure is compact, the circuit problem of electrical connection is solved while heat dissipation is achieved, the circuit layer is distributed on a single surface, electric heating performance separation can be achieved, working temperature is further reduced, and reliability and stability of the LED element 42 are guaranteed.

As shown in fig. 3, the secondary optical lens 43 includes a base 431, a first total reflection surface 432, an exit surface 433, and a second total reflection surface 434 that cooperate with the LED element 42; the bottom of the first total reflection surface 432 is arranged on the base 431, the top of the first total reflection surface 432 is connected with the bottom of the emergent surface 433, and the top of the emergent surface 433 is connected with the second total reflection surface 434; the second total reflection surface 434 is a conical surface structure with a wide top and a narrow bottom, and the first total reflection surface 432 and the second total reflection surface 434 are parallel. The structure that the first total reflection surface 432 is parallel to the second total reflection surface 434, and the first total reflection surface 432 is connected with the second total reflection surface 434 through the emergent surface 433 is adopted, so that large-angle irradiation is realized, and no halation or glare exists.

Other structures of this embodiment are seen in the prior art.

The present invention is not limited to the above embodiment, and various modifications and variations of the present invention are also intended to be included within the scope of the claims and the equivalent technical scope of the present invention if they do not depart from the spirit and scope of the present invention.

Claims

1. The utility model provides a LED smallpox shot-light, characterized by: the LED lamp comprises a face ring provided with a spring fixing device, a light-transmitting diffusion plate connected with the face ring, a rear cover connected with the face ring and used for heat dissipation, and an LED light-emitting plate arranged on the inner surface of the rear cover; the surface ring, the diffusion plate and the rear cover form an LED mounting cavity, and the LED light-emitting plate is positioned in the LED mounting cavity; the rear cover is of a cylindrical structure and comprises a base connected with the surface ring and a chimney heat dissipation structure arranged on the top surface of the base, wherein the chimney heat dissipation structure comprises 1 large flue, a plurality of small flue groups and a plurality of air inlet channels penetrating through the small flue groups, and the large flue, the plurality of small flue groups are vertically arranged; the air inlet channel is arranged at the position matched with the bottom of the small flue group, the inner end of the air inlet channel is communicated with the large flue, and the outer end of the air inlet channel is communicated with the outside.

2. The LED ceiling spotlight of claim 1, wherein: little flue group with the intake duct one-to-one cooperation, the intake duct along the radial extension of back lid.

3. The LED ceiling spotlight of claim 1, wherein: big flue with the central axis L coaxial fit of LED smallpox shot-light, a plurality of little flues are organized around central axis L annular array at big flue periphery.

4. An LED ceiling spotlight according to any one of claims 1 to 3, wherein: the small flue group is composed of 3 small flues which are vertically arranged, and the 3 small flues are arranged along the radial direction of the rear cover.

5. An LED ceiling spotlight according to any one of claims 1 to 3, wherein: the LED light-emitting board comprises a heat-conducting substrate, a plurality of LED elements arranged on the heat-conducting substrate and a secondary optical lens covered on the LED elements.

6. The LED ceiling spotlight of claim 5, wherein: the heat conducting substrate is of a circular ring structure, and the rear cover and/or the heat conducting substrate are/is made of a Cu-based composite material or an Al-based composite material.

7. The LED ceiling spotlight of claim 5, wherein: the secondary optical lens comprises a base body matched with the LED element, a first total reflection surface, an emergent surface and a second total reflection surface; the bottom of the first total reflection surface is arranged on the substrate, the top of the first total reflection surface is connected with the bottom of the emergent surface, and the top of the emergent surface is connected with the second total reflection surface; the second total reflection surface is a conical surface structure with a wide upper part and a narrow lower part, and the first total reflection surface is parallel to the second total reflection surface.

8. The LED ceiling spotlight of claim 5, wherein: the LED component is an element packaged by COB technology.

9. The LED ceiling spotlight of claim 5, wherein: the heat-conducting substrate is made of a high-heat-conducting composite material, and the high-heat-conducting composite material is a composite body of a circuit and a heat sink.