CN103104841B - Light-emitting diode (LED) lamp unit with high heat-radiating performance and modular high-power LED lamp thereof - Google Patents
Light-emitting diode (LED) lamp unit with high heat-radiating performance and modular high-power LED lamp thereof Download PDFInfo
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- CN103104841B CN103104841B CN201310025454.XA CN201310025454A CN103104841B CN 103104841 B CN103104841 B CN 103104841B CN 201310025454 A CN201310025454 A CN 201310025454A CN 103104841 B CN103104841 B CN 103104841B
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Abstract
The invention discloses a light-emitting diode (LED) lamp unit with a high heat-radiating performance. The LED lamp unit with the high heat-radiating performance comprises a lens, a chip, an electrode, gold wires and a heat sink. The heat sink comprises an insulation base plate in a circular truncated cone shape, and a cylindrical heat conducting bar. The insulation base plate is welded at the top end of the heat conducting bar. The lens, the chip, the electrode and the gold wires are welded on the insulation base plate. Therefore, heat generated by the chip is conducted to the heat conducting bar below the insulation base plate through the insulation base plate and is radiated. The invention further discloses a modular high-power LED lamp formed by LED lamp units. The LED lamp unit directly conducts the heat generated by the chip to a heat radiating unit through the heat sink to radiate, the number of heat resistance layers is reduced, and therefore heat radiating efficiency is improved so as to improve the reliability of the LED lamp and prolong the service life of the LED lamp.
Description
Technical field
This practicality invention relates to a kind of LED and light fixture thereof, is specifically related to have the high-powered LED lamp unit module of high heat dispersion and the Modularized high power LED lamp tool of composition thereof.
Background technology
LED (light emitting diode) is that one utilizes electric current to be forward passed to coupling place of emitting semiconductor p-n junction, impel electronics in P district with hole-recombination, and unnecessary energy is discharged with the form of light and heat, thus be light and hot light source by electric energy conversion.It has use low-tension supply, power consumption less, applicability is strong, stability is high, the response time is short, environmentally safe, multicolor luminous, long service life and the plurality of advantages such as sturdy and durable, it can use 100,000 hours continuously, life-span is than long 100 times of ordinary incandescent lamp bubble, therefore, it has become the developing direction of following illuminating product, particularly high-power high light leads to the appearance of LED, accelerates the speed that LED replaces conventional illumination sources.
The subject matter of current high-power LED lamp design how to realize safety between electricity, light, hot three, stable, high efficiency conversion.In electricity, the principle of luminosity of LED requires " crossing current drives ", and namely stable electric current is the key of electricity aspect; Optics aspect, except the basic problems such as rational luminous intensity distribution, colour temperature and colour rendering, also require higher light extraction efficiency, namely arrive from chip the luminous energy lost irradiated area the smaller the better, at present due to LED once encapsulate, secondary lens adds light fixture outer cover, generally need through three layers of PC or acrylic material, light loss rate is generally between 20 ~ 30%; Calorifics aspect, the junction temperature of control LED is so that extending its service life is key issue.Because the photothermal conversion efficiency of current LED is approximately 3 to 7, that is most of electric energy of LED is converted into heat energy and distributes, if these heats effectively can not be dissipated, thing followed fuel factor will become clearly: 1. junction temperature raises, the photon of direct minimizing chip injection, makes to get light efficiency rate and reduces; 2. the rising of temperature can make the emission spectrum generation red shift of chip, colour temperature Quality Down, especially even more serious to the white light LED part based on blue LED excited yellow fluorescent material, and wherein the conversion efficiency of fluorescent material also can raise along with temperature and reduce.Therefore the various fuel factors produced because temperature raises can badly influence service life and the reliability of LED component.Make the key issue that the junction temperature of control LED becomes stability and increases the service life.In sum, in heat, optical, electrical three fields, electric current stable at present relatively easily reaches, and topmost problem is heat radiation and luminous intensity distribution two aspects.Heat radiation determines the life-span length of LED, and whether the usability that luminous intensity distribution determines LED is more excellent than other light source.Many kinds are had now to design, all make different trials in the design of the selection of encapsulating structure, light-configuration mode, heat sink material, radiator structure etc., but be take circuit board as cross section substantially, and radiator structure is set at the back side of circuit board dispels the heat.Shown in Fig. 1 is a kind of typical structure of existing high-powered LED lamp cell cube, it is by hemispherical lens 1, chip 2, heat sink 3, circuit board 4, heat-sink unit and electrode, gold thread once encapsulates and forms, the chip 2 that its core is made up of p-type semiconductor and n-type semiconductor, heat-sink unit adopts fin 5, chip 2 is fixed on the heat sink end face of patty by eutectic weldering h, the bottom surface of heat sink 3 then with by printed circuit and accompanying by the circuit board 4 that forms be connected, the aluminium base of circuit board 4 bottom surface is connected with the heat-radiating substrate 51 of fin 5 by heat-conducting cream, 1, lens chip 2 is encapsulated into heat sink on.Pyroconductivity due to heat sink 3 is far away higher than lens 1, therefore the heat that chip 2 produces only has small part to be scioptics 1 transmission, all the other most heats are all distribute along the path of the illustrated direction of arrow by heat sink 3 and fin 5, then carry out heat exchange with air.Although such LED radiator structure is reliable and stable in the conveying of electricity, Shortcomings part on radiator structure: (1) heat dissipation direction is single, the conduction of heat just seems inefficiency.Because the heat major part of LED chip 2 conducts to heat-sink unit by heat sink 3, conduct to air by heat-sink unit again, and the fin 5 that existing heat-sink unit adopts is generally all engaged with the radiating surface of LED by heat-radiating substrate 51, radiated rib 52 is intervally arranged perpendicular to heat-radiating substrate 51, as shown in Figure 1, namely be only limitted to arrange radiated rib 52 on the heat conduction direction of LED, radiating surface is limited; (2) the thermal resistance number of plies is many, and the heat major part that namely LED chip 2 distributes just can be conducted on heat-sink unit by multi-dielectric such as the fin 5 of solder h, heat sink 3, circuit board 4, heat-conducting glue, weakens the conduction efficiency of heat; (3) when without forced draft, its radiating efficiency is not high, and when particularly assembling high-powered LED lamp, radiating efficiency is very unbalanced.Because described radiated rib 52 is arranged along heat conduction direction, when without forced draft, near the region dead space often of heat-radiating substrate 51, cold air is difficult to add in this region, thus affects the radiating efficiency of fin 5.
Summary of the invention
The object of the present invention is to provide a kind of high-powered LED lamp cell cube with high heat dispersion, the heat conduction that LED lamp unit body chips sends directly is dispelled the heat by heat sink by this LED lamp unit body to heat-sink unit, reduce the thermal resistance number of plies, thus raising radiating efficiency, to improve service life and the reliability of LED.
Object of the present invention realizes by following technical measures:
A kind of high-powered LED lamp cell cube with high heat dispersion, comprise lens, chip, electrode, circuit board, heat sink and heat-sink unit, it is characterized in that: the described heat sink heat conducting bar comprising an insulated substrate and a cylindricality, described insulated substrate is connected to described heat conducting bar top and forms " T " character form structure, and heat-sink unit is then arranged on heat sink heat conducting bar; Described chip, electrode and spun gold eutectic are welded on described insulated substrate end face, there is in the middle part of circuit board the through hole holding chip, to make circuit board enclose to draw together at chip circumference and equally with chip to be directly installed on insulated substrate end face, and electrically connect with the electrode on insulated substrate, thus the heat that described chip can be allowed to send is without the need to just directly conducting to the heat conducting bar of below by described insulated substrate by circuit board, then distributed by heat-sink unit.
One as above-mentioned LED lamp unit body is improved: be also provided with one deck heat conducting disk between described heat conducting bar and insulated substrate, described heat conducting disk and heat conducting bar are made into integration, the contour dimension of described heat conduction disk is close or be greater than described insulated substrate, described insulated substrate is connected in described heat conducting disk, to strengthen thermal conductive surface and to make this heat conducting disk play the effect of support insulated substrate.
One of embodiment that the present invention recommends is that described insulated substrate adopts ceramic insulation substrate, and described heat conducting bar is the heat conducting bar of aluminium matter.
The present invention can also do following improvement: the structure of described heat-sink unit is middle part is column, axis along this column is provided with the installing hole coordinated with described heat sink heat conducting bar, for by described heat-sink unit and describedly heat sinkly to connect as one, column outer wall is distributed with multiple radiating fin.
The present invention can also do following improvement further: the radiating fin of described heat-sink unit is parallel to described column axis vertical array on the outer wall of this column, thus formation radiating fin radially arranges around heat sink heat conducting bar.Its advantage is not only and can be distributed directly to surrounding by the heat of radial arrangement radiating fin by heat conducting bar, greatly expands heat sink area of dissipation and heat-dissipating space, therefore effectively can improve the radiating efficiency of LED lamp unit body; And the vertical passageway that vertically disposed radiating fin is formed easily allows outer gas stream circulate, and avoids the formation of dead space, can improve the radiating efficiency of heat-sink unit further; Also help when multiple LED lamp unit body module is turned to high-powered LED lamp simultaneously and form cellular radiator structure, namely the parallel rectilinear louvre of one or more and heat sink heat conducting bar can be formed in the structure of high-powered LED lamp, to make in the middle part of high-powered LED lamp heat radiation and outer rim dispel the heat same basis equalization, solve the low and unbalanced problem of high-powered LED lamp radiating efficiency well.
Another object of the present invention is aforementioned LED lamp unit body to carry out modularity design, and multiple LED lamp unit body cluster is packaged into the high-power LED lamp with high-cooling property.
Another object of the present invention realizes by following technical measures:
The high-power LED lamp be made up of aforementioned LED lamp unit body modularity, is characterized in that: comprise at least two LED lamp unit bodies, heat-sink unit, circuit board and the lamp housing consistent with LED lamp unit body quantity;
Described circuit board is provided with the lamp hole consistent with described LED lamp unit quantity, described circuit board is corresponding with the insulated substrate position of LED lamp unit body and be installed on described insulated substrate by described lamp hole, described circuit board is electrically connected with the electrode of described LED lamp unit body, thus provides power supply for described LED lamp unit body;
Described lamp housing comprises can the upper shell of snapping and lower house mutually, described lower house offers the lamp hole consistent with described LED lamp unit body quantity, described LED lamp unit body and circuit board are installed in described lamp housing, and the heat conducting bar of described LED lamp unit body stretches out outside lower house by described lamp hole;
Be provided with between described adjacent heat-sink unit empty every, and described upper shell with lower house to offer with described sky every corresponding heat emission space hole, make the passage of whole LED lamp formation up/down perforation.Thus the heat produced after the energising of described chip heat sinkly to be passed on described heat conducting bar by described, then conducts to heat-sink unit by heat conducting bar, finally by the sky between described radiating fin and heat-sink unit every distributing.
Described upper shell and lower house are bowl-type and edge butt joint, and described interface is provided with groove, are provided with leakproof rubber washer in described groove.
The edge butt joint in the heat emission space hole of described upper shell and lower house, the interface in described heat emission space hole is provided with groove, is provided with leakproof rubber washer in groove.
Rubber blanket is provided with between described heat conduction disk and the lamp hole of described lower house.LED lamp unit body in whole lamp housing seals by rubber washer and rubber blanket, plays good waterproof leakproof effect.
Described upper shell is PC transparent material.
Compared with prior art, the present invention has following beneficial effect: 1, the heat conduction that LED lamp unit body chip sends is dispelled the heat by the heat conducting bar of LED lamp unit body by LED of the present invention to the heat-sink unit of below, thus achieves the structure of electric heating separation;
2, each LED lamp unit body in this Modular LED lamp not only has respective heat-sink unit to dispel the heat, and between the heat-sink unit of adjacent LED lamp unit body due to the sky that is provided with up/down perforation every,
form cellular heat radiation knot structuredispel the heat, therefore this Modular LED lamp not only can be dispelled the heat on all round the horizon direction by radiating fin, and can be dispelled the heat in vertical direction by the interval between heat-sink unit, achieves omnibearing heat radiation, improves radiating efficiency;
The insulated substrate of 3, this LED lamp unit body directly welds LED chip etc., and circuit board is directly connected with the electrode of the LED that substrate welds, thus, the heat that chip sends directly is conducted to by the insulated substrate of below on the heat conducting bar of below, compare traditional LED and reduce the thermal resistance number of plies, such as decrease the level such as printed circuit, heat-conducting cream, efficiently realize heat transfer and heat radiation;
4, this Modularized high power LED lamp tool achieves the modularity of multiple LED lamp unit body, as long as produce corresponding lamp housing as required, and mix LED lamp unit body and the heat-sink unit of respective numbers, assemble, can modularity be realized, thus be applicable to various different application demand, in addition, have and change feature easily, if one of them LED lamp unit body damages, as long as change this LED lamp unit body;
Be provided with rubber blanket and rubber washer in the lamp housing of 5, this Modularized high power LED lamp tool, can LED lamp unit body be packaged in lamp housing, prevent electric leakage of leaking.
Accompanying drawing explanation
Fig. 1 is the structural representation of common LED lamp;
Fig. 2 is the overall structure schematic diagram (in figure, upper shell is transparent, not shown) that the embodiment of the present invention one has the modular high-power LED lamp of high heat dispersion;
Fig. 3 is the exploded perspective view of Fig. 2 LED lamp;
Fig. 4 is the sectional view of Fig. 2 LED lamp;
Fig. 5 is the A place enlarged drawing of Fig. 4;
Fig. 6 is the structural representation of the LED lamp unit body in the embodiment of the present invention one and embodiment three LED lamp;
Fig. 7 is the scheme of installation a of the embodiment of the present invention one LED lamp;
Fig. 8 is the scheme of installation b of the embodiment of the present invention one LED lamp;
Fig. 9 is the scheme of installation c of the embodiment of the present invention one LED lamp;
Figure 10 is the scheme of installation d of the embodiment of the present invention one LED lamp;
Figure 11 is the overall structure schematic diagram (in figure, upper shell is transparent, not shown) that the embodiment of the present invention two has the modular high-power LED lamp of high heat dispersion;
Figure 12 is the structural representation that the embodiment of the present invention three has the high-powered LED lamp cell cube of high heat dispersion;
Figure 13 is that LED lamp unit body of the present invention is triangularly arranged the schematic diagram of mode;
The schematic diagram of Figure 14 to be LED lamp unit body of the present invention be hexagonal array mode.
Detailed description of the invention
Embodiment one
Fig. 2 to Figure 10 shows the installation process that the present invention has the high-powered LED lamp cell cube of high heat dispersion and the embodiment one of modular high-power LED lamp and this LED lamp.The key problem of existing large LED Design of Luminaires is heat radiation, and the basic principle of heat radiation is more few better to air structure layer from chip, and the thickness of layer gets over Bao Yuehao, and the area of layer is the bigger the better, and the thermal conductivity coefficient of material is more high better.
The LED lamp of this invention can form a modular high-power LED lamp by multiple LED lamp unit body 15, and this LED lamp comprises multiple LED lamp unit body 15.Each LED unit body 15 comprises lens 141 and chip 14, electrode 151, spun gold (not marking in figure), heat sink, this is heat sink comprises the heat conducting bar 154 of the insulated substrate 152 of the pottery of a circular platform type and the aluminum of a column type, in the present embodiment, this column type heat conducting bar 154 top is also provided with an aluminum heat conduction disk 153, heat conduction disk 153 and the one-body molded design of heat conducting bar 154, insulated substrate 152 is welded on the heat conduction disk 153 on the top of heat conducting bar 154, the diameter of this heat conduction disk 153 is slightly larger than insulated substrate 152, play the effect of support insulated substrate 152, lens 141 and chip 14, electrode 151 and spun gold then eutectic are welded on insulated substrate 152.Each LED lamp unit body 15 is furnished with a heat-sink unit 18, the close-fitting louvre of heat conducting bar 154 with LED lamp unit body 15 is provided with in this heat-sink unit 18, louvre outer wall is provided with radiating fin 181, be provided with between adjacent heat-sink unit empty every, heat-sink unit 18 and heat conducting bar 154 compact siro spinning technology are installed, thus, when the heat produced after the chip energising in lens 141 passes on heat conducting bar 154 by heat sink, conduct to heat-sink unit 18 by heat conducting bar 154 again, distribute finally by radiating fin 181.This radiating fin 181 adopts vertical array and radially arranges around heat sink seat outer wall.Other spread pattern can certainly be adopted, rounded projections arranged mode as shown in figure 12 and hexagonal array mode as shown in fig. 13 that.
Use above-mentioned LED lamp unit body 15 and heat-sink unit 18 can assemble modular high-power LED lamp, a LED lamp be made up of 9 LED lamp unit bodies 15 and 9 heat-sink units 18 is illustrated in the present embodiment, this LED lamp also comprises lamp housing and circuit board 12, this lamp housing comprises upper shell 11 and lower house 17, and 9 above-mentioned LED lamp unit bodies 15 and circuit board 12 are installed in lamp housing.Upper shell can adopt PC transparent material, thus is conducive to divergence of beam and goes out.
This circuit board 12 and lower house 17 all offer the lamp hole corresponding with LED lamp unit body, wherein, circuit board 12 is corresponding with insulated substrate 152 position of LED lamp unit body 15 and be installed on insulated substrate 152 by this lamp hole 121, simultaneously, circuit board 12 is electrically connected with the electrode 151 on insulated substrate 152, thus provides power supply for LED lamp unit body 15.In addition, the lamp hole 171 lower house 17 offered can be stretched out outside lower house 17 by this lamp hole 171 for the heat conducting bar 154 of LED lamp unit body.Heat-sink unit and heat conducting bar 154 compact siro spinning technology reached outside lower house 17 are installed.
The heat emission space hole that above-mentioned lamp housing is corresponding with interval circuit board is also provided with between heat-sink unit, upper shell 11 offers 4 heat emission space holes 111, lower house 17 offers 4 heat emission space holes 172, circuit board 12 offers 4 heat emission space holes 122.Above-mentioned heat emission space hole is corresponding up and down with the interval between heat-sink unit, makes whole LED lamp form the passage of up/down perforation.Thus the heat produced after described chip energising is passed on heat conducting bar 154 by heat sink, then conducts to heat-sink unit 18 by heat conducting bar 154, finally by the sky between described radiating fin 181 and heat-sink unit 18 every distributing.
Upper shell 11 and lower house 17 are bowl-type and edge butt joint, and the edge butt joint in the heat emission space hole of upper shell 11 and lower house 17, junction is provided with groove, is provided with leakproof rubber washer 13 in groove.In addition, between the lamp hole 171 of heat conduction disk 153 and lower house 17, be provided with rubber blanket 16, on this rubber blanket 16 same arrange with heat radiation empty every and the lamp hole 161 that passes through of LED lamp unit body heat conducting bar and heat emission space hole 162.LED lamp unit body in whole lamp housing seals by rubber washer 13 and rubber blanket 16, plays good waterproof leakproof effect.
In sum, this cell module LED lamp is the frame mode being similar to type printing, its assembling process step a to d as shown in Figure 7 to 10.Step a: loaded in lower house 17 by rubber blanket 16, makes corresponding hole location corresponding; Step b: be installed in lower house 17 by LED lamp unit body, makes each heat conducting bar stretch out outside lower house, then is installed on by heat-sink unit on the heat conducting bar that stretches out below lower house, makes LED lamp unit body, lower house and heat-sink unit compact siro spinning technology; Step c: by being positioned over above LED lamp unit body of wiring board 12 correspondence, and make the corresponding formation path that connects of the electrode 151 of each LED lamp unit body and the corresponding hole location on circuit board; Steps d: again upper shell 11 to be placed in groove rubber washer 13 being placed in the edge of upper shell 11 above already installed LED lamp and to make itself and lower house 17 closely snapping, namely having assembled whole LED lamp structure as shown in Figure 2.
Embodiment two
As shown in figure 11 for the present invention has the high-powered LED lamp cell cube of high heat dispersion and the embodiment two of modular high-power LED lamp thereof, the present embodiment two is with the difference of embodiment one: embodiment shows a LED lamp be made up of 4 LED lamp unit bodies 15 and 4 heat-sink units 18, upper shell 11 adopts PC transparent material (therefore Figure 11 in not shown), thus is conducive to divergence of beam and goes out.Upper shell 11 offer in 1 heat emission space hole 111(Figure 11 not shown), lower house 17 offers 1 heat emission space hole 172, circuit board 12 offers 1 heat emission space hole 122, correspondence arranges the hole of wiring board 12, rubber washer 13 and rubber blanket 16, loads in upper shell 11 and lower house 17 for correspondence.Above-mentioned heat emission space hole is corresponding up and down with the interval between heat-sink unit, makes whole LED lamp form the passage of up/down perforation.Thus, the heat produced after described chip energising passes on heat conducting bar 154 by heat sink, conducting to heat-sink unit 18 by heat conducting bar 154 again, finally by the sky between described radiating fin 181 and heat-sink unit 18 every distributing, can radiating efficiency be improved equally.
Embodiment three
As Fig. 6, Figure 12 shows that the present invention has a specific embodiment of the high-powered LED lamp cell cube of high heat dispersion, the present embodiment three is with the difference of embodiment one: the present embodiment is a LED lamp unit body 15, comprise lens 141 and chip 14, electrode 151, spun gold (not marking in figure), heat sink, this is heat sink comprises the heat conducting bar 154 of the insulated substrate 152 of the pottery of a circular platform type and the aluminum of a column type, in the present embodiment, this column type heat conducting bar 154 top is also provided with an aluminum heat conduction disk 153, heat conduction disk 153 and the one-body molded design of heat conducting bar 154, insulated substrate 152 is welded on the heat conduction disk 153 on the top of heat conducting bar 154, the diameter of this heat conduction disk 153 is slightly larger than insulated substrate 152, play the effect of support insulated substrate 152, lens 141 and chip 14, electrode 151 and spun gold then eutectic are welded on insulated substrate 152.This LED lamp unit body 15 is all furnished with a heat-sink unit 18, the close-fitting louvre of heat conducting bar 154 with LED lamp unit body 15 is provided with in this heat-sink unit 18, louvre outer wall is provided with radiating fin 181, when the heat produced after the chip energising in lens 141 passes on heat conducting bar 154 by heat sink, conduct to heat-sink unit 18 by heat conducting bar 154 again, distribute finally by radiating fin 181.
Embodiments of the present invention are not limited thereto, according to foregoing, according to ordinary technical knowledge and the customary means of this area, do not departing under the present invention's above-mentioned basic fundamental thought prerequisite, the present invention can also make the equivalent modifications of other various ways, replacement or change, such as can according to the needs of LED lamp volume size, the quantity of LED lamp unit body 15 and heat-sink unit 18 is set to one or more other corresponding number, correspondence arranges heat emission space hole, can improve radiating efficiency equally, these changes all can realize the object of the invention.
Claims (9)
1. one kind has the high-power LED lamp of high heat dispersion, to comprise by lens (141), chip (14), electrode (151), spun gold and the heat sink LED lamp unit body formed, wherein, described LED lamp unit body (15) in heat sinkly comprise the insulated substrate (152) of a circular platform type and the heat conducting bar (154) of a column type, described insulated substrate is welded in described heat conducting bar top; Described lens (141), chip, electrode and spun gold eutectic are welded on described insulated substrate (152), and the heat (14) sent by described chip conducts to the heat conducting bar (154) of below by described insulated substrate and distributes; It is characterized in that: this high-power LED lamp comprise at least two LED lamp unit bodies (15), consistent with LED lamp unit body quantity heat-sink unit (18), circuit board (12) and lamp housing;
(12) described circuit board is provided with the lamp hole (121) consistent with described LED lamp unit body quantity, described circuit board is corresponding with the insulated substrate position of LED lamp unit body and be installed on described insulated substrate (152) by described lamp hole (121), described circuit board is electrically connected with described LED lamp unit body electrode (15), thus provides power supply for described LED lamp unit body;
Described lamp housing comprise can mutually snapping upper shell (11) with lower house (17), described lower house (17) on offer the lamp hole (171) consistent with described LED lamp unit body quantity, described LED lamp unit body (15) and circuit board be installed in described lamp housing, and the heat conducting bar (154) of described LED lamp unit body by described lamp hole (171) stretch out lower house (17) outside;
(18) described heat-sink unit is provided with the close-fitting louvre of heat conducting bar with described LED lamp unit body, described louvre outer wall is provided with radiating fin (181), heat conducting bar (154) compact siro spinning technology that described heat-sink unit is (17) outer with reaching lower house.
2. high-power LED lamp according to claim 1, it is characterized in that: described LED lamp unit body (15) in heat conducting bar (154) and insulated substrate (152) between be also provided with one deck heat conduction disk (153), described heat conduction disk (153) and heat conducting bar (154) Integral design, the diameter of described heat conduction disk (153) is greater than described insulated substrate (152), and described insulated substrate is welded on described heat conduction disk.
3. high-power LED lamp according to claim 2, is characterized in that: described insulated substrate (152) is ceramic insulation substrate, and described heat conducting bar (154) is aluminium heat conducting bar.
4. the high-power LED lamp according to any one of claims 1 to 3, it is characterized in that: adjacent heat-sink unit (18) between be provided with empty every, and described upper shell (11) with lower house (17) with circuit board (12) on offer with described sky every corresponding heat emission space hole (111), (172), (122), make described heat emission space hole corresponding up and down with the interval between heat-sink unit, whole LED lamp forms the passage of up/down perforation, dispels the heat to form cellular radiator structure.
5. high-power LED lamp according to claim 4, is characterized in that: described radiating fin (181) vertical array and radially arranging around heat sink seat outer wall.
6. high-power LED lamp according to claim 5, is characterized in that: (17) (11) described upper shell be bowl-type and edge butt joint with lower house, and interface is provided with groove, is provided with leakproof rubber washer (13) in described groove.
7. high-power LED lamp according to claim 4, is characterized in that: (11) described upper shell also docks with the edge in lower house heat emission space hole (17), the interface in described heat emission space hole is also provided with groove, is provided with leakproof rubber washer (13) in groove.
8. high-power LED lamp according to claim 7, it is characterized in that: be provided with rubber blanket between the lamp hole of heat conduction disk and described lower house (16), this rubber blanket (16) on be provided with dispel the heat empty every lamp hole (161) that is corresponding and that allow LED lamp unit body heat conducting bar (154) pass through and heat emission space hole (162).
9. high-power LED lamp according to claim 8, is characterized in that: described upper shell is PC transparent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310025454.XA CN103104841B (en) | 2013-01-23 | 2013-01-23 | Light-emitting diode (LED) lamp unit with high heat-radiating performance and modular high-power LED lamp thereof |
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| CN201310025454.XA CN103104841B (en) | 2013-01-23 | 2013-01-23 | Light-emitting diode (LED) lamp unit with high heat-radiating performance and modular high-power LED lamp thereof |
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| CN103104841B true CN103104841B (en) | 2015-03-04 |
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| CN103884000A (en) * | 2014-04-16 | 2014-06-25 | 金丽秋 | Heat-dissipating device for LED lamp |
| CN109410393A (en) * | 2018-10-11 | 2019-03-01 | 郴州金通信息科技有限公司 | A kind of ordering dishes and remotely enter device for hotel's catering business |
| CN109922573B (en) * | 2019-04-09 | 2020-01-14 | 上海大学 | Deep sea lighting device |
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| TW200846595A (en) * | 2007-05-18 | 2008-12-01 | Jarrer Co Ltd | Lamp having heat-dissipation structure |
| CN101539250A (en) * | 2009-04-21 | 2009-09-23 | 薛信培 | LED lamp with high power |
| CN201407537Y (en) * | 2009-05-19 | 2010-02-17 | 姚锐锋 | LED lighting device |
| CN201507851U (en) * | 2009-09-11 | 2010-06-16 | 光炬科技有限公司 | LED street lamp |
| CN201661928U (en) * | 2009-10-15 | 2010-12-01 | 苏州中泽光电科技有限公司 | Combined type LED street lamp |
| CN102537747A (en) * | 2010-12-28 | 2012-07-04 | 嘉善三思光电技术有限公司 | Led lamp strip |
| CN102759025A (en) * | 2011-04-28 | 2012-10-31 | 东莞勤上光电股份有限公司 | Cup-shaped LED lamp and radiating structure thereof |
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