CN201336305Y - Diamond LED module group with lamp cups - Google Patents
Diamond LED module group with lamp cups Download PDFInfo
- Publication number
- CN201336305Y CN201336305Y CN 200820203412 CN200820203412U CN201336305Y CN 201336305 Y CN201336305 Y CN 201336305Y CN 200820203412 CN200820203412 CN 200820203412 CN 200820203412 U CN200820203412 U CN 200820203412U CN 201336305 Y CN201336305 Y CN 201336305Y
- Authority
- CN
- China
- Prior art keywords
- led
- module group
- housing
- led module
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The utility model discloses a diamond LED module group with lamp cups. The LED module group comprises a diamond frame-shaped insulating housing (1); a cooling fin (2) is arranged at the bottom of the central part of an inner ring of the housing; at least two lamp cups (5) which can form light-focusing reflection surfaces are arranged on the upper surface of the cooling fin; an LED (3) is arranged in each lamp cup; a heat conductive insulation adhesive is filled between the LED and the lamp cup; and a pin (4) of the LED is guided out from the side wall of the housing. At least two LEDs are placed in the same round housing, so that indexes of the LED module group such as the illumination intensity, the luminous efficiency and the like can match those of a high-power LED; and at the same time, the LED module group saves PCB space, is convenient for the layout of an electronic element, and has good radiating effect. Dispersedly arrayed LEDs in the same module group can achieve mutual light distribution, thereby saving the cost of lenses needed by the high-power LED; as LEDs in different colors are arrayed in the housing, and an external circuit is designed, the LED module group can transmit mixed lights in different colors in different periods; and besides, the lamp cups can condense the LEDs, thereby strengthening the directivity and the concentricity of the LED power source. The LED module group has the advantages of simple structure and low cost.
Description
Technical field
The utility model belongs to the technical field of semiconductor device, is specifically related to a kind of LED module that uses light-emitting diode as light source.
Background technology
The same with conventional light source, semiconductor light-emitting-diode (LED) also can produce heat during operation, and how much it depends on whole luminous efficiency.Power up outside under the energy, the radiation recombination generation electroluminescence in electronics and hole, semiconductor medium and encapsulation medium that near the light that radiates the P-N knot also need pass through wafer (chip) itself just can arrive at external world's (air).Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, wafer exterior light are taken out efficient etc., finally probably have only the input electric energy of 30-40% to be converted into luminous energy, the energy of all the other 60-70% mainly transforms heat energy with the form of the lattice vibration of non-radiative compound generation.And the rising of chip temperature then can strengthen non-radiative compoundly, further slackens luminous efficiency.
LED lighting on the market is that many LED are carried out the connection in series-parallel combination now.If carry out the connection in series-parallel combination with great power LED, the light fixture heat dissipation problem is an insoluble problem of present stage; If carry out the connection in series-parallel combination with the 20mA low-power LED, the usage quantity of LED can roll up, and in limited space, also is a necessary considerable problem to the components and parts layout on the circuit board.In addition, the concentration structure of existing LED lamp also exists cost to compare problem of higher.
The utility model content
The purpose of this utility model is to provide that a kind of good heat dissipation, layout are convenient, concentration structure is simply with the rhombus LED module of Lamp cup.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: the rhombus LED module of band Lamp cup, the housing that comprises insulation, housing is the diamond shape, the inner ring central bottom of housing is provided with fin, is provided with at least two Lamp cups that can constitute the optically focused reflecting surface on fin, is provided with LED in the described Lamp cup, be filled with thermal conductive insulation glue between LED and the Lamp cup, the pin of LED extracts from the sidewall of housing.
Owing to adopted above-mentioned structure, the utlity model has following beneficial effect:
1), two even more a plurality of 3V/20mALED chip dispersed combination in same circular shell, can be suitable in indexs such as illumination, light efficiencies with great power LED, also save the PCB space simultaneously, make things convenient for the layout of electronic component;
2), the heat that produces of LED is delivered to the dew copper zone of the PCB that is installed by fin, reveals the copper zone by PCB then and distributes, and has better heat radiating effect;
3), distributing is arranged in the same module LED can realize mutual luminous intensity distribution, can save the lens cost that great power LED need be used, the LED of discharging different colours in housing, by the external circuit design, the different periods can be sent the mixed light of different colours again;
4), according to external circuit design, can take the connection in series-parallel connected mode flexibly to LED in the module;
5), Lamp cup can carry out optically focused to LED, strengthens the directivity and the centrality of led light source, it is simple in structure, cost is low.
Description of drawings
Below in conjunction with accompanying drawing embodiment of the present utility model is described in further detail, but does not constitute any restriction of the present utility model.
Fig. 1 is the stereogram of the rhombus LED module of band Lamp cup;
Fig. 2 is the phantom of Fig. 1.
Embodiment
As depicted in figs. 1 and 2, the rhombus LED module of band Lamp cup described in the utility model comprises housing 1, and housing 1 is made by insulating material, is shaped as the diamond shape.Ask in the inner ring of housing 1 that the bottom is provided with fin 2, fin 2 can be made by the good material of heat conduction such as metal, is provided with at least two Lamp cups 5 that can constitute the optically focused reflecting surface on fin 2, and described Lamp cup 5 can be formed by the shrinkage pool that is located on the fin 2, it is more easily made, and cost is low.Select 9 Lamp cups 5 among the figure for use, also can be other numbers certainly.Be provided with LED3 in each Lamp cup 5, be filled with thermal conductive insulation glue between LED3 and the Lamp cup 5, the shape of thermal conductive insulation glue and LED3 is not clearly drawn in the drawings.9 LED3 have 18 pins, and pin 4 extracts from the sidewall of housing 1, and the power supply that is used for LED3 connects.
Claims (3)
1. rhombus LED module with Lamp cup, it is characterized in that: the housing (1) that comprises insulation, housing (1) is the diamond shape, the inner ring central bottom of housing (1) is provided with fin (2), on fin (2), be provided with at least two Lamp cups (5) that can constitute the optically focused reflecting surface, be provided with LED (3) in the described Lamp cup (5), be filled with thermal conductive insulation glue between LED (3) and the Lamp cup (5), the pin (4) of LED (3) extracts from the sidewall of housing (1).
2. according to the rhombus LED module of the described band Lamp cup of claim 1, it is characterized in that: described Lamp cup (5) is provided in a side of the shrinkage pool on the fin (2).
3. according to the rhombus LED module of claim 1 or 2 described band Lamp cups, it is characterized in that: described LED (3) is 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820203412 CN201336305Y (en) | 2008-11-14 | 2008-11-14 | Diamond LED module group with lamp cups |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820203412 CN201336305Y (en) | 2008-11-14 | 2008-11-14 | Diamond LED module group with lamp cups |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201336305Y true CN201336305Y (en) | 2009-10-28 |
Family
ID=41287966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200820203412 Expired - Fee Related CN201336305Y (en) | 2008-11-14 | 2008-11-14 | Diamond LED module group with lamp cups |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201336305Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105355625A (en) * | 2010-06-01 | 2016-02-24 | Lg伊诺特有限公司 | Light emitting device package |
US9991241B2 (en) | 2010-06-01 | 2018-06-05 | Lg Innotek Co., Ltd. | Light emitting device package |
-
2008
- 2008-11-14 CN CN 200820203412 patent/CN201336305Y/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105355625A (en) * | 2010-06-01 | 2016-02-24 | Lg伊诺特有限公司 | Light emitting device package |
US9991241B2 (en) | 2010-06-01 | 2018-06-05 | Lg Innotek Co., Ltd. | Light emitting device package |
US10283491B2 (en) | 2010-06-01 | 2019-05-07 | Lg Innotek Co., Ltd | Light emitting device package |
US10541235B2 (en) | 2010-06-01 | 2020-01-21 | Lg Innotek Co., Ltd. | Light emitting device package |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20121114 |