CN103322438A - High-power LED projection lamp and manufacturing method thereof - Google Patents

High-power LED projection lamp and manufacturing method thereof Download PDF

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CN103322438A
CN103322438A CN2012100802588A CN201210080258A CN103322438A CN 103322438 A CN103322438 A CN 103322438A CN 2012100802588 A CN2012100802588 A CN 2012100802588A CN 201210080258 A CN201210080258 A CN 201210080258A CN 103322438 A CN103322438 A CN 103322438A
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radiator
housing
light
driving power
power
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李文雄
赵依军
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Abstract

The invention relates to the semiconductor lighting technology, in particular to a high-power lighting device adopting an LED as a light source and a manufacturing method thereof. In the embodiment of the invention, a radiator is sealed in an outer cover and is endowed with the function of a reflective optical system at the same time, so that the structure of the lighting device is simplified. In addition, as the radiator is mounted in a lamp housing, the layout enables possibility in high compatibility of design of the LED projection lamp with simple and mature manufacturing technology of a conventional incandescent lamp to be realized.

Description

Large-power light-emitting diodes Projecting Lamp and manufacture method thereof
Technical field
The present invention relates to the semiconductor lighting technology, particularly adopt light emitting diode (LED) as High Power Illuminator and the manufacture method thereof of light source.
Background technology
The LED that is used as at present light source in lighting device is a kind of solid-state semiconductor devices, and its basic structure generally comprises the support of band lead-in wire, the encapsulating material (for example fluorescence silica gel or epoxy resin) that is arranged on the semiconductor wafer on the support and this wafer is sealed all around.Above-mentioned semiconductor wafer includes the P-N structure, and when electric current passed through, electronics was pushed to the P district, and then electronics sends energy with the form of photon with hole-recombination in the P district, and light wavelength then is to be determined by the material that forms the P-N structure.
Compare with conventional light source, one of them advantage of LED is to have higher photoelectric transformation efficiency.But be subject to the restriction of technical development, LED still has quite a few electric energy to be converted into heat energy in the course of work.When heat energy is trapped in lamp interior, will unavoidably causes the LED temperature to raise, thereby cause light source performance degradation and inefficacy.In high-power LED illuminating device (such as LED street lamp and great power LED handkerchief lamp (being called again a bowl dish shape aluminium reflectoscope) etc.), how expeditiously and the dissipation of heat that in time LED is produced seem particularly outstanding to the problem of lighting device outside.
For high-power LED illuminating device, industry has proposed various Cooling Solutions at present.Such as a part that the more metal radiating fins such as aluminium is used as lamp outer casing, thereby the area that is exposed in the external environment condition by increase improves heat-sinking capability.Another reduces the approach of LED temperature based on the active heat removal mode, for example can be at the inner provided with fan of lamp housing, the air by accelerating spreader surface flow to improve radiating effect.
The Nuventix company of Texas, USA has researched and developed a kind of being called recently
Figure BSA00000689835300011
Ejector, this device inside comprises a barrier film, when the vibration of this barrier film, it is inner and spray fast to radiator by nozzle that air-flow results from device.The air-flow that sprays drives ambient air and arrives near the radiator together, thereby with very high heat exchanger effectiveness the heat of radiator is taken away.Relevant
Figure BSA00000689835300012
Further describing such as the U.S. Patent application No.12/288144 that is entitled as " with a plurality of LED and the synthetic light fixture that sprays heat management system " that can submit on October 16th, 2008 referring to people such as John Stanley Booth of ejector, this patent application as a reference, the mode of quoting in full comprises in this application.
But it is pointed out that above-mentioned various Cooling Solution all rises with manufacturing cost and the fitting structure complexity turns to cost, and this is restricting the popularization and application of led light source in High Power Illuminator.
Summary of the invention
The purpose of this invention is to provide a kind of large-power light-emitting diodes Projecting Lamp, it has advantages of simple structure and simple.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of large-power light-emitting diodes Projecting Lamp comprises:
Outer cover, the cover plate that it comprises housing and can cover described housing upper end open;
Radiator, it is arranged at the inside of described housing and has the light reflective inner surface;
Substrate, it is fixed on the described radiator;
At least one light emitting diode, it is arranged on the surface of described substrate;
With the driving power of described light emitting diode electrical connection, the below that it is arranged on described enclosure interior and is positioned at described radiator; And
Lamp holder, it is arranged at the outer surface of described lower housing portion and is electrically connected with described driving power.
In technique scheme of the present invention, radiator is sealed in the outer cover and has simultaneously the function of reflective optical system concurrently, has therefore simplified the structure of lighting device.In addition, because radiator is installed in the lamp housing, this layout is so that be designed to the LED Projecting Lamp to become possibility with simple, ripe ordinary incandescent lamp production technology highly compatible.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described outer cover is made of glass, and described housing is infundibulate.
Preferably, at above-mentioned large-power light-emitting diodes Projecting Lamp, the outer surface of described cover plate or inner surface are processed through frosted.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, the profile of described radiator and the cavity shape of described housing coupling can make thus the contact area of radiator and housing increase, thereby improve heat-sinking capability.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described radiator is made of metal, graphite or normal temperature infrared ceramic radiation material.When adopting graphite as radiator material, can obviously alleviate the weight of Projecting Lamp.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described radiator is made of metal, and its outer surface covers normal temperature infrared ceramic radiation material, and described substrate is positioned at the bottom of described radiator.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described radiator is made of graphite or normal temperature infrared ceramic radiation material, its inner surface covering metal layer, and described substrate is positioned at the bottom of described radiator.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described substrate is made of ceramic material or heat conductive insulating polymer composite.The price that ceramic material is cheap can promote the reduction of cost, and in addition, when adopting ceramic material as substrate, wiring can be starched sintering process by silver and be made, the environmental pollution that this can be avoided the copper etching technics to cause.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described light emitting diode is the light emitting diode monomer, and it is electrically connected by welding manner with the wiring that is formed at described substrate surface.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described light emitting diode is LED core, and it is fixed on the surface of described substrate and realizes electrical connection with the wiring that is formed at described substrate surface by binding technique or FCOB (FCOB) technique.Because tube core is directly installed on substrate surface, therefore saved the link of die package, further reduced manufacturing cost.
Preferably, according in the device, the lead-in wire of described driving power by drawing from described substrate is through described wiring and the electrical connection of described light emitting diode at above-mentioned large-power light-emitting diodes.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described wiring is formed at described substrate surface by printed circuit technique.
Preferably, in above-mentioned large-power light-emitting diodes Projecting Lamp, described wiring is so that a plurality of described light emitting diode is continuous with the form of series, parallel, series-parallel connection or crossed array.
A further object of the invention provides a kind of method of making above-mentioned large-power light-emitting diodes Projecting Lamp, and it has the simple advantage of manufacturing process.
Above-mentioned purpose of the present invention can realize by following technical proposal:
A kind of method of making aforesaid large-power light-emitting diodes Projecting Lamp comprises the following steps:
Radiator and driving power are installed in the housing, wherein, be fixed with substrate on the described radiator, described substrate surface arranges at least one light emitting diode, and described driving power is installed in the below of described radiator and is electrically connected with described light emitting diode;
Make cover plate cover the opening on described housing top; And
Lamp holder is fixed in the outer surface of described lower housing portion and makes it and the electrical connection of described driving power.
Preferably, in said method, described cover plate and housing are made of glass, by utilizing sealing vehicle the contact area burning of described cover plate and housing are melted together, make described cover plate cover the opening on described housing top.Sealing vehicle is the equipment that is widely used in the common bulb manufacture process, so the method for the present embodiment can realize at existing bulb production line.
Preferably, in said method, described housing is infundibulate, and the profile of described radiator and the cavity shape of described housing coupling are by inserting described radiator described housing formation loose fit and described radiator and driving power being installed in the described housing.Perhaps in said method, described housing is infundibulate, the profile of described radiator and the cavity shape of described housing coupling is inserted described housing and is solidified described adhesive and described radiator and driving power are installed in the described housing by the described radiator with the outer surface application of adhesive.
Preferably, in said method, described lamp holder is adhered to the outer surface of described lower housing portion by utilizing head assembling machine, makes described lamp holder be fixed in the outer surface of described lower housing portion and make it and the electrical connection of described driving power.Head assembling machine is the equipment that is widely used in the common bulb manufacture process, so the method for the present embodiment can realize at existing bulb production line.
Description of drawings
Above-mentioned and/or other side of the present invention and advantage will become more clear by the description below in conjunction with the various aspects of accompanying drawing and be more readily understood, and same or analogous unit adopts identical label to represent in the accompanying drawing, and accompanying drawing comprises:
Fig. 1 is the decomposing schematic representation according to the large-power light-emitting diodes Projecting Lamp of one embodiment of the invention.
Fig. 2 is the generalized section of large-power light-emitting diodes Projecting Lamp shown in Figure 1.
Fig. 3 is the schematic diagram of the light source module that comprises in the large-power light-emitting diodes Projecting Lamp shown in Fig. 1 and 2.
Fig. 4 shows the flow chart according to the large-power light-emitting diodes Projecting Lamp manufacture method of one embodiment of the invention.
View when Fig. 5 A shows radiator, light source module and driving power and is assembled together.
Fig. 5 B shows the view after the radiator, light source module and the driving power that have been assembled together are put into outer cover.
Fig. 5 C shows the view after cover plate covers housing 102 upper openings.
Reference list:
1 large-power light-emitting diodes Projecting Lamp
10 outer covers
101 cover plates
102 housings
1021 housings upper end
1022 housing lower ends
20 radiators
30 light source modules
301 substrates
3011 through holes
302 light emitting diodes
303 wirings
3031 pads
3032A, 3032B cabling
304 lead-in wires
305A, 305B wire
40 driving powers
401A the first lead-in wire
401B the second lead-in wire
402A, 402B binding post
50 lamp holders
510 lamp holder ends
520 lamp holder insulated parts
530 cap screw thread parts
The specific embodiment
Below with reference to the accompanying drawing that wherein illustrates illustrative examples of the present invention the present invention is described more all sidedly.But the present invention can realize by multi-form, not only limit to each embodiment that this paper provides and should not be read as.The various embodiments described above that provide are intended to make the disclosure of this paper comprehensively complete, convey to more all sidedly those skilled in the art's protection scope of the present invention.
Term
In this manual, term " lighting device " should be broadly interpreted as all can by providing light to realize the equipment of practical or aesthstic effect, include but not limited to bulb lamp, desk lamp, wall lamp, shot-light, pendent lamp, lamp affixed to the ceiling, street lamp, flashlight, scenery lamp and urban look lamp etc.
Term " Projecting Lamp " refers to and makes the lighting device of specifying the projecting environment of illumination on the face to be illuminated, and the width of its outgoing beam angle can be determined according to using needs.
Unless stated otherwise, in this manual, term " semiconductor crystal wafer " refers to a plurality of independently single circuit that form at semi-conducting material (such as silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical arrangement of semiconductor wafer through forming after encapsulating, in typical this physical arrangement, semiconductor wafer for example is installed on the support and with encapsulant and encapsulates.
Term " light emitting diode " refers to the unit that comprises electroluminescent material, and the example of this unit includes but not limited to P-N knot inorganic semiconductor light emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).
P-N knot inorganic semiconductor light emitting diode can have different version, for example includes but not limited to LED core and light emitting diode monomer.Wherein, " LED core " refers to and includes the semiconductor wafer P-N structure, that have the electroluminescent ability, and " light emitting diode monomer " refers to the physical arrangement that will form after the die package, in typical this physical arrangement, tube core for example is installed on the support and with encapsulant and encapsulates.
Term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern that is electrically connected between components and parts in insulating surface being used for of arranging, and include but not limited to cabling (trace) and hole (such as pad, component hole, fastener hole and plated through-hole etc.).
Term " heat radiation " refers to object owing to having temperature and the phenomenon of radiated electromagnetic wave.
Term " heat conduction " refers to heat is sent to the lower part of temperature from the higher part of temperature in solid transfer mode.
Term " ceramic material " general reference needs high-temperature process or densified non-metal inorganic material, includes but not limited to silicate, oxide, carbide, nitride, sulfide, boride etc.
Term " heat conductive insulating polymer composite " refers to such macromolecular material, by metal or inorganic filler section's formation within it heat conduction network chain of filling high-termal conductivity, thereby possesses high thermal conductivity factor.Heat conductive insulating polymer composite such as the polypropylene material that includes but not limited to add aluminium oxide, the Merlon that adds aluminium oxide, carborundum and bismuth oxide and acrylonitrile-butadiene-styrene terpolymer etc.The specific descriptions of relevant heat conductive insulating polymer composite can be referring to paper " research of Merlon and polycarbonate alloy heat conductive insulating macromolecular material " (" material heat treatment journal " in August, 2007 of the people such as Li Li, Vol.28, No.4, pp51-54) and paper " application of aluminium oxide in the heat conductive insulating polymer composite " (" plastic additive " the 3rd phase in 2008 of the people such as Li Bing, pp14-16), the mode quoted in full of these documents comprises in this manual.
" electrical connection " should be understood to be included in the situation that directly transmits electric flux or the signal of telecommunication between two unit, perhaps indirectly transmits the situation of electric flux or the signal of telecommunication through one or more Unit the 3rd.
" driving power " or " LED driving power " refers to the interchange (AC) that is connected to the lighting device outside or direct current (DC) power supply and as " electronic-controlled installation " between the light emitting diode of light source, is used to light emitting diode that required curtage (such as constant current, constant voltage or firm power etc.) is provided.In specific embodiment, driving power can modular structure be realized, for example it comprises printed circuit board (PCB) and one or more components and parts that also are electrically connected by connecting up on the printed circuit board (PCB) together that are installed in, and the example of these components and parts includes but not limited to LED driving governor chip, rectification chip, resistor, capacitor and coil etc.In addition, alternatively, printed circuit board (PCB) and components and parts can be installed in the shell.
Term such as " comprising " and " comprising " represent except have in specification and claims, have directly and the unit and step of clearly statement, technical scheme of the present invention is not got rid of yet and is had not by directly or other unit of clearly explaining and the situation of step.
Term such as " first " and " second " does not represent that the unit only is to be used as to distinguish each unit in the order of the aspects such as time, space, size.
Below by accompanying drawing embodiments of the invention are described.
The large-power light-emitting diodes Projecting Lamp
Fig. 1 is the decomposing schematic representation according to the large-power light-emitting diodes Projecting Lamp of one embodiment of the invention.Fig. 2 is the generalized section of large-power light-emitting diodes Projecting Lamp shown in Figure 1.
Large-power light-emitting diodes Projecting Lamp 1 according to the present embodiment mainly comprises outer cover 10, radiator 20, light source module 30, driving power 40 and lamp holder 50.
Outer cover 10 comprises cover plate 101 and housing 102, its middle shell 102 is funnel-form, radiator 20, light source module 30 and driving power 40 can be put into enclosure interior by the opening of upper end 1021, the lower end 1022 of housing 102 is the opening that inwardly shrinks, 50 outer surfaces that are fixed on housing lower end 1022 of lamp holder.Cover plate 101 is suitable for covering the opening of the upper end 1021 of housing 102, thereby radiator 20, light source module 30 and driving power 40 etc. are enclosed in outer cover 10 inside.
Cover plate 101 and housing 102 can adopt glass material to make, in order to merge by mode of heating.But also can adopt other can satisfy the printing opacity of LED lighting device and the material of diathermanous requirement, and cover plate 101 and housing 102 combination between the two also is not limited to hot amalgamation mode, for example also comprises the mechanical system such as bolt connects.
It may be noted that, housing 102 also not only is confined to the funnel-form shown in Fig. 1 and 2, and it is such as also can being other shapes such as socket shape and prism-shaped.
Referring to Fig. 1 and 2, radiator 20 is arranged in the inner chamber of housing 102, it absorbs the heat of light source module 30 and driving power 40 generations, these heat parts are with thermal-radiating form, seeing through outer cover 10 diffuses in the surrounding environment, some heat then passes to outer cover 10 in heat conducting mode, exhales through outer cover 10 again.In order to increase the contact area of radiator 20 and outer cover 10, as shown in Figure 1, the shape that the shape fabricating of radiator can be become the inner chamber with housing 102 to be complementary.
On the other hand, in the present embodiment, radiator 20 can also play reflective optical system.For this purpose, at least part of zone of radiator 20 inner surfaces is light reflective surface, also namely has the surface of higher luminous reflectivity.Can adopt such as metal materials such as aluminium and make radiator 20.For the radiator 20 of being made by graphite and normal temperature infrared ceramic radiation material, in order to satisfy the requirement of light reflective properties aspect, the layer of metal layer (for example utilizing evaporation of aluminum technique) of the upper formation in surface within it.When adopting metal material to make radiator 20, for heat-sinking capability is provided, can consider to cover one deck infrared radiant material (for example normal temperature infrared ceramic radiation material or graphite) at the radiator outer surface.
Light source module 30 comprises substrate 301 and one or more light emitting diode 302 that is arranged on the substrate 301.As shown in Figure 2, substrate 301 is arranged on the bottom of radiator 20, and the light that light emitting diode 302 sends directly sees through cover plate 101 outside outgoing on the one hand, sees through on the other hand cover plate 101 outgoing behind the internal surface reflection of radiator 20.By suitable optical design, can obtain preferably outgoing beam of directionality.For example the inner surface of radiator 20 can be designed to parabola and substrate 301 is arranged on this paraboloidal focus place, thus so that substantially parallelly ejaculation from large-power light-emitting diodes Projecting Lamp 1 of the light that light emitting diode 302 sends.
Fig. 3 is the schematic diagram of the light source module that comprises in the large-power light-emitting diodes Projecting Lamp shown in Fig. 1 and 2.
The infrared radiant material (for example carborundum) that substrate 301 can adopt insulating heat-conduction material (such as ceramic material or heat conductive insulating polymer composite etc.) or have the insulating heat-conductive ability concurrently is made, and also can adopt the printed circuit board material of aluminium base and so on to make.Referring to Fig. 3, light emitting diode 302 is arranged on the surface of substrate 301, and by being formed on lip-deep wiring 303, light emitting diode 302 links together.Preferably, can adopt the mould pressing to make the substrate that ceramic material consists of, substrate thicker (for example 1.5-3mm) and hardness that this method is made are high.
In the embodiment shown in fig. 3, light emitting diode 302 adopts die form, and they are arranged on by the adhesion mode on the surface of substrate 301 to form preferably heat between light emitting diode 302 and substrate 301 conducts.On the other hand, be positioned at lip-deep wiring 303 and comprise a plurality of pads 3031 and cabling 3032A and 3032B (for example forming wiring by the silver of sintering on ceramic material or infrared radiant material slurry pattern), light emitting diode 302 is by lead-in wire 304 (spun gold for example, filamentary silver or B alloy wire) be connected directly to pad 3031 to form the light emitting diode group of series connection, the light emitting diode at these light emitting diode group two ends 304 is connected to cabling 3032A and 3032B by going between, the driving power 40 that cabling 3032A and 3032B will describe below then the wire 305A through passing through through hole 3011 and 305B are connected to.In the present embodiment, can utilize binding technique to realize that LED core is through the connection of lead-in wire to wiring.
If need to adjust the emission wavelength of light emitting diode 302, can light emitting diode 302 be sticked on the surface of substrate 301 with epoxy resin or the silica gel of mixed fluorescent powder, perhaps apply fluorescence coating on the surface of light emitting diode 302, again it is adhered on the surface of substrate 301 by epoxy resin or silica gel.
It is worthy of note, although in the embodiment shown in fig. 3, utilize binding technique that the light emitting diode 302 of die form is directly connected in the wiring 303, but also can utilize onboard flip-chip (FCOB) technique with LED core and wiring electrical connection.In addition, light emitting diode 302 also can adopt the form of light emitting diode monomer, and can be connected electrically to light emitting diode by welding manner the wiring of substrate surface this moment.Moreover although in the embodiment shown in fig. 3, light emitting diode 302 links together with series system, also can be in parallel, the form of series-parallel connection or crossed array links together.
Driving power 40 can multiple type of drive (modes such as constant voltage power supply, constant current-supplying and constant pressure and flow power supply) provide suitable curtage to light emitting diode 302.According to the mode of externally fed, driving power 40 can adopt the circuit of various topological structures, such as including but not limited to non-isolated buck-type topological circuit structure, reverse exciting topological circuit structure and half-bridge LLC topological circuit structure etc.Can be referring to " LED illumination driving power source and Design of Luminaires " book of the 1st edition in People's Telecon Publishing House's May in 2011 about the detailed description of driving power circuit, this publication in full way of reference comprises in this manual.
Referring to Fig. 2, driving power 40 is arranged in the inner chamber of housing 102 and is positioned at the below of radiator 20.Driving power 40 comprises to binding post 402A and the 402B of light source module 30 output electric energy, and it links to each other with 305B with wire 305A shown in Figure 3, thereby is electrically connected with light emitting diode 302.Alternatively, can adopt wire to substitute binding post 402A and 402B and realize electrical connection between driving power and the light emitting diode.
Alternatively, the circuit of all right other function of integration realization in driving power 40, such as adjusting control circuit, sensing circuit, circuit of power factor correction, intelligent lighting control circuit, telecommunication circuit and holding circuit etc.
Lamp holder 50 provides interface with external power source (for example various dc sources or AC power) electrical connection for driving power 40, and it is such as the forms such as mouth or rotary bayonet that can employing spin with ordinary incandescent lamp and the similar shape of threads of electricity-saving lamp.As shown in Figure 2, lamp holder 50 comprises the threaded portion 530 that end 510, insulated part 520 and the outer surface made by the conductive material such as metal are screw-shaped, are made by conductive material, wherein, insulated part 520 is arranged between end 510 and the threaded portion 530, and it can adopt the insulating materials of plastics and so on to make.End 510 is suitable for respectively being connected with two electrodes of lamp socket (not shown) with threaded portion 530.
Continuation is referring to Fig. 2, the first lead-in wire 401A of driving power 40 extends to end 510 and joins, and the second lead-in wire 401B upwards turns back after stretching out housing 102 and against outer surface or the inner surface of living threaded portion 530, external power source can be through lamp holder 50 to driving power 40 power supplies thus.
In the present embodiment, lamp holder 50 and housing 102 for example can be fixed together by adhesive (for example clay), thereby realize structure as shown in Figure 2.In this structure, threaded portion 530 inside are stretched in the lower end 1022 of housing 102.In addition, by filling adhesive in the space between threaded portion 530 and lower end 1021, the inner surface of lower end 1021 with threaded portion 530 can be fixed together.
The manufacture method of large-power light-emitting diodes Projecting Lamp
Fig. 4 shows the flow chart according to the large-power light-emitting diodes Projecting Lamp manufacture method of one embodiment of the invention.For the purpose of setting forth conveniently, the present embodiment is described as an example of the large-power light-emitting diodes Projecting Lamp shown in Fig. 1-3 example.
As shown in Figure 4, at first in step S410, radiator 20, light source module 30 and the driving power 40 that is assembled together put into the housing 102 of outer cover 10.
View when Fig. 5 A shows radiator, light source module and driving power and is assembled together.Shown in Fig. 5 A, the substrate 301 of light source module 30 is installed in radiator 20 inside and is positioned at its lower surface 201.In order to reduce thermal resistance, can adopt heat-conducting glue that substrate 301 is bonded on the lower surface 201.
Binding post 402A and the 402B of driving power 40 is fixed on the bottom outer surface of radiator 20 and is connected with 305B with wire 305A shown in Figure 3.When the electrical connection between the alternative binding post 402A of employing wire and 402B realization driving power and the light emitting diode, can driving power 40 be fixed on by bonding or bolted mode the lower surface of radiator 20.
It is worthy of note, the operation that radiator 20, light source module 30 and driving power 40 are assembled together can be used as preposition step, finish at the same production line of completing steps S410-S450, but this is not to be essential.Preferably, when utilizing typical bulb production line (for example incandescent lamp production line) to make large-power light-emitting diodes Projecting Lamp according to the embodiment of the invention, can directly adopt assembled in advance radiator 20, light source module 30 and driving power 40 together, by artificial or machinery they be put into outer cover 10.
Fig. 5 B shows the view after the radiator, light source module and the driving power that have been assembled together are put into outer cover.At this moment, thus the lower end abutment of radiator 20 live the inner surface of housing 102 lower ends and form loose fit.
Enter subsequently step S420, cover plate 101 is covered the opening of housing 102 upper ends 1021.Fig. 5 C shows the view after cover plate covers the housing upper end open.
Under the situation of loose fit, in order to prevent that radiator 20 is in housing 102 interior slips, the outer of radiator 20 upper ends can be made to such an extent that basically be in sustained height with the outer of housing 102 upper ends, like this, when cover plate 101 covers the opening of housing 102 upper ends, also radiator 20 is pushed down simultaneously, thereby stoped radiator 20 with respect to housing 102 inner surface movements.Alternatively, also can utilize adhesive that the outer surface of radiator 20 and the inner surface of housing 102 are bonded together with anti-slip before step S420, it will be favourable making the profile of radiator 20 and the cavity shape coupling of housing 102 this moment.
When cover plate 101 and housing 102 are made of glass, can utilize typical bulb production line (for example incandescent lamp production line) to come completing steps S420.Particularly, for example can cover plate 101 and the contact area burning of housing 102 be melted together by sealing vehicle.
Then enter step S430, at the inner surface covering adhesive (for example clay) of lamp holder 50.Equally, this step also can be finished by typical bulb production equipment, for example can utilize the clay machine clay to be expressed into the inner surface of lamp holder 50.Alternatively, in this step, also adhesive can be coated in the outer surface of housing 102 lower ends; Perhaps alternatively, can consider all to cover adhesive at the inner surface of lamp holder 50 and the outer surface of housing 102 lower ends.
Subsequently, in step S440, the lower end of the outer cover 10 shown in Fig. 5 C is stretched in the lamp holder 50 so that lamp holder 50 and outer cover 10 are assembled together.As shown in Figure 2, under this confined state, lamp holder 50 surrounds the outer surface of housing 102 lower ends, at this moment, the end 510 that the first lead-in wire 401A of driving power 40 extends to lamp holder 50 joins, and the second lead-in wire 401B upwards turns back stretching out housing 102 after and against the inner surface of the threaded portion 530 of lamp holder 50 firmly.
Equally, the assembly manipulation of this step also can be finished at typical bulb production line.For example for only in the situation of lamp holder 50 inner surface application of adhesive, the outer cover 10 of finishing assembling among the step S430 can be transported to corresponding assembly station by transport tape, the lamp holder 50 that by artificial or machinery inner surface is covered adhesive there covers the outer surface of housing 102 lower ends.
Enter subsequently step S450, by heating adhesive is solidified, the outer cover 10 of finishing assembly manipulation among the step S440 is fixed together with lamp holder 50, thereby produce the large-power light-emitting diodes Projecting Lamp 1 as finished product.
The curing of adhesive also can utilize typical bulb production equipment to finish.For example can utilize transport tape that the outer cover 10 of finishing assembly manipulation among the step S440 is transported to the head assembling machine that is used for sealing-in lamp holder and glass outer cover in the incandescent lamp production process with lamp holder 50, the outer surface by heating lamp holder 50 solidifies adhesive there.Although head assembling machine generally all is to utilize flame to heat the outer surface of lamp holder, also can adopt other mode of heating, for example utilizes high-temperature gas as heat medium.
Although represented and aspects more of the present invention be discussed, but those skilled in the art are to be appreciated that, can change aspect above-mentioned under the condition that does not deviate from the principle of the invention and spirit, therefore scope of the present invention will be limited by claim and the content that is equal to.

Claims (10)

1. large-power light-emitting diodes Projecting Lamp comprises:
Outer cover, the cover plate that it comprises housing and can cover described housing upper end open;
Radiator, it is arranged at the inside of described housing and has the light reflective inner surface;
Substrate, it is fixed on the described radiator;
At least one light emitting diode, it is arranged on the surface of described substrate;
With the driving power of described light emitting diode electrical connection, the below that it is arranged on described enclosure interior and is positioned at described radiator; And
Lamp holder, it is arranged at the outer surface of described lower housing portion and is electrically connected with described driving power.
2. large-power light-emitting diodes Projecting Lamp as claimed in claim 1, described outer cover is made of glass, and described housing is infundibulate.
3. large-power light-emitting diodes Projecting Lamp as claimed in claim 1, the profile of described radiator and the cavity shape of described housing coupling.
4. large-power light-emitting diodes Projecting Lamp as claimed in claim 1, described radiator is made of metal, graphite or normal temperature infrared ceramic radiation material.
5. large-power light-emitting diodes Projecting Lamp as claimed in claim 4, described radiator is made of metal, and its outer surface covers normal temperature infrared ceramic radiation material, and described substrate is positioned at the bottom of described radiator.
6. a method of making large-power light-emitting diodes Projecting Lamp as claimed in claim 1 comprises the following steps:
Radiator and driving power are installed in the housing, wherein, be fixed with substrate on the described radiator, described substrate surface arranges at least one light emitting diode, and described driving power is installed in the below of described radiator and is electrically connected with described light emitting diode;
Make cover plate cover the opening on described housing top; And
Lamp holder is fixed in the outer surface of described lower housing portion and makes it and the electrical connection of described driving power.
7. method as claimed in claim 6, described cover plate and housing are made of glass, melt together by utilizing sealing vehicle that the contact area of described cover plate and housing is burnt, and make described cover plate cover the opening on described housing top.
8. method as claimed in claim 6, described housing is infundibulate, the profile of described radiator and the cavity shape of described housing coupling are by inserting described radiator described housing formation loose fit and described radiator and driving power being installed in the described housing.
9. method as claimed in claim 6, described housing is infundibulate, the profile of described radiator and the cavity shape of described housing coupling is inserted described housing and is solidified described adhesive and described radiator and driving power are installed in the described housing by the described radiator with the outer surface application of adhesive.
10. method as claimed in claim 6 is adhered to described lamp holder the outer surface of described lower housing portion by utilizing head assembling machine, makes described lamp holder be fixed in the outer surface of described lower housing portion and makes it and the electrical connection of described driving power.
CN2012100802588A 2012-03-22 2012-03-22 High-power LED projection lamp and manufacturing method thereof Pending CN103322438A (en)

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Application publication date: 20130925