KR20160064829A - LED lighting apparatus having high heat radiation rate and light weight - Google Patents

LED lighting apparatus having high heat radiation rate and light weight Download PDF

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Publication number
KR20160064829A
KR20160064829A KR1020140169005A KR20140169005A KR20160064829A KR 20160064829 A KR20160064829 A KR 20160064829A KR 1020140169005 A KR1020140169005 A KR 1020140169005A KR 20140169005 A KR20140169005 A KR 20140169005A KR 20160064829 A KR20160064829 A KR 20160064829A
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KR
South Korea
Prior art keywords
heat
led
heat radiation
led lighting
lighting apparatus
Prior art date
Application number
KR1020140169005A
Other languages
Korean (ko)
Inventor
윤석주
Original Assignee
윤석주
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 윤석주 filed Critical 윤석주
Priority to KR1020140169005A priority Critical patent/KR20160064829A/en
Publication of KR20160064829A publication Critical patent/KR20160064829A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to an LED lighting apparatus and, more particularly, to a lightweight LED lighting apparatus with high heat radiation performance, which can effectively radiate heat generated from an LED module. The LED lighting apparatus according to an aspect of the present invention comprises: a heat radiation member including a body made of copper and a plurality of heat radiation wings made of magnesium steel or alloys thereof and radially installed in the body; and a lighting member having one or more LED modules and installed on one surface of the body. The heat radiation wings are coated with heat exchange paint which consumes energy by self-motion of molecules when applied with heat. Therefore, the LED lighting apparatus of the present invention can effectively radiate heat transmitted from an LED by rapidly radiating the heat while continuously diffusing the heat through radially disposed first to third heat radiation wings after rapidly conducting the heat through first to third bodies made of copper and consuming the heat by coating layers of the first to third heat radiation wings, which are made of heat diffusion paint, thereby extending the life of the product and improving operational reliability.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light-

More particularly, the present invention relates to a lightweight LED lighting fixture which is capable of effectively dissipating heat generated from the LED module to provide excellent heat dissipation performance and light heat dissipation performance.

2. Description of the Related Art A light emitting diode (LED) is a type of semiconductor light emitting device. When a current is applied, a light emitting diode (LED) is a semiconductor device capable of generating light of various colors due to recombination of electrons and holes at a junction portion of p- and n-type semiconductors.

These LEDs are eco-friendly, and are capable of high-speed response with a response speed of several nanoseconds. They are effective for video signal streams, can be driven in an impulsive manner, have color reproducibility of more than 100%, and are capable of emitting red, The brightness and the color temperature can be arbitrarily changed by adjusting the amount of light, and LEDs using nitride-based semiconductors are utilized as white light sources for various lighting applications. Due to the advantages mentioned above, LED lamps, which consume less electricity as lighting fixtures, have been used in recent years.

However, when the LED is operated, a lot of heat is generated. If the heat radiation is not sufficiently performed, the self-lifetime is shortened. In addition, the resin packaging portion for sealing the LED and the injection resin forming the package body are deteriorated, There was a problem that it was deteriorated.

In many cases, the LED lighting apparatus is provided with a heat dissipating plate for emitting heat of the LED, and the conventional heat dissipating plate is formed of a wing or a finned plate made of aluminum and having excellent heat dissipation.

However, it is difficult to provide a heat dissipation effect of a desired level to the user as the performance of the LED is improved, because the heat dissipation plate made of only the above-mentioned pin-type or wing-type plate has a characteristic that it is weak in corrosion Accordingly, the life of the product is shortened or the thermal conductivity of the heat sink is lowered depending on the degree of corrosion thereof, so that the heat dissipating property of the heat sink is significantly lowered, and the lifetime and operation reliability of the LED still deteriorate.

Korean Patent Publication No. 2011-0034212

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and it is an object of the present invention to provide a lightweight LED lighting fixture having excellent heat dissipation performance for effectively dissipating heat generated from LEDs, .

According to an aspect of the present invention, there is provided a heat radiator comprising: a body made of copper; a heat radiating member made of magnesium (Mg) or an alloy thereof and including a plurality of heat radiating vanes radially formed in the body; And an illumination member having at least one LED (light emitting diode) module, the illumination member being installed on one surface of the body; And a heat-exchange coating material coated on the heat-dissipating blade, wherein the molecules of the heat-dissipating blade are magnetically moved to consume energy.

According to a preferred aspect of the present invention, the heat dissipating member includes a plurality of compartments each having a hollow portion and partitioned by a plurality of partitions, and a plurality of first heat dissipating units disposed in the respective compartments, A first body including a wing, the first body having the illumination member on one surface thereof; A second body coupled to the hollow portion of the first body, the second body including a plurality of second heat radiating vanes disposed radially; A third body coupled to the outer surface of the first body so as to surround the outer surface of the first body and having a plurality of third heat radiating vanes radially formed on an outer surface thereof; . ≪ / RTI >

According to a preferred aspect of the present invention, the first body may be provided with a rainwater drainage groove on one surface of the illuminating member.

According to a preferred aspect of the present invention, the illumination member may further include a light diffusion lens unit that covers the LED module.

The LED lighting apparatus according to an embodiment of the present invention is characterized in that the heat generated in the LED module is rapidly conducted through the first to third bodies made of copper, and then is continuously passed through the first to third heat radiating wings And the heat is dissipated in the coating layer made of the thermal diffusion paints of the first to third heat dissipating vanes to more effectively discharge the heat transferred from the LEDs to thereby extend the service life of the product and increase the reliability of operation .

The first to third bodies receiving the heat serving as a frame are formed of copper and the first to third heat radiating vanes, which occupy a larger area in the heat radiating member, are formed of a low-cost magnesium material, There is an effect that the weight is light and the manufacturing cost can be reduced while ensuring a certain level of heat radiation performance.

1 is a perspective view schematically showing an LED lighting apparatus according to an embodiment of the present invention.
2 is an exploded perspective view of FIG.
3 is a sectional view taken along the line A-A 'in Fig.
Figure 4 is a plan perspective view of Figure 1;

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the following embodiments.

In addition, to include an element throughout the specification does not exclude other elements unless specifically stated otherwise, but may include other elements.

In this embodiment, for convenience of description, the direction in which the illuminating member is disposed is defined as an upward direction and the direction in which the heat radiation member is disposed is defined as a downward direction in Fig. Further, the upward and downward directions may be defined as forward and backward directions depending on the direction in which the LED lighting apparatus is installed.

FIG. 1 is a perspective view schematically showing an LED lighting apparatus according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of FIG. 1, FIG. 3 is a sectional view taken along the line A- FIG.

Referring to Figs. 1 to 4, an LED lighting apparatus 1 according to the present embodiment includes a heat dissipating member 200 and an illumination member 100. Fig.

The heat dissipating member 200 serves to cool the heat of the illumination member 100 by receiving heat generated from the LED module, which will be described later, when the lighting member 100 operates, and discharging the heat to the outside. The heat dissipating member 200 may have a body made of copper, and a plurality of heat dissipating vanes provided on the body and made of magnesium steel or an alloy thereof. The heat dissipating member 200 may include first to third bodies 210, 220, and 230. The first to third bodies 210, 220, and 230 may include first to third heat dissipating units Wings 215, 223, and 232, respectively.

The first body 210 includes a first support 214 having a first hollow portion 214a in the vertical direction, a plurality of partitions 216, a plurality of compartments 213, and upper and lower support plates 211 and 216 . At this time, the first support 214, the plurality of partitions 216, and the upper and lower support plates 211 and 216 may be made of copper preferably having excellent thermal conductivity and heat emission capability.

The shape of the first support body 214 may be determined depending on the number of the compartments 213. The first embodiment of the present invention is illustrated as having eight compartments 213, and the first support body 214 has an octagonal shape in the horizontal direction and in the cross-sectional view. However, the present invention is not limited thereto, and the number of the compartments 213 and the shape of the first support body 214 in the horizontal direction and in the cross-section can be variously changed if necessary.

The barrier ribs 217 are formed on the outer surface of the first support body 214 at predetermined intervals along the horizontal direction and are formed to have the same length as the first support body 214 in the vertical direction. The upper and lower support plates 211 and 216 are disposed to face each other between the partition walls 217. A plurality of compartments 213 whose outer surfaces are opened on the outer surface of the first support body 214 can be partitioned along the lateral direction by the partition 217 and the upper and lower support plates 211 and 216 have.

Each of the compartments 213 is provided with a plurality of first heat radiating vanes 215 at predetermined intervals along the outer surface of the first support body 214, And has a radial arrangement structure around one hollow portion 214a. The plurality of first heat radiating vanes 215 are formed such that one end portion in the width direction is coupled to the first support body 214 and both longitudinal end portions are in contact with the upper and lower support plates 211 and 216, respectively.

At this time, the first heat radiating vane 215 may be made of magnesium steel or an alloy thereof. The magnesium has a lower thermal conductivity and a lower heat emission ability than copper, but has a comparatively excellent thermal conductivity and heat releasing ability. The magnesium has a low cost and can reduce the production cost of the product.

The first heat radiating vane 215 is formed to have a maximally wide area in order to maximize the heat radiation effect, and may be formed to have the same length as the partition 217.

The first heat radiating vane 215 may be coated with a heat exchange coating material to form a coating layer. The heat-exchange coating material dissolves heat energy when molecules are heated by heat, more specifically, an inorganic substance is adhered to the outer surface of the organic nucleus. When the heat is contacted, the organic nucleus first starts to expand, When the heat is applied, the inorganic component surrounding the outer membrane causes transformation of the character. Such continuous movement of the deformation is a rapid left and right movement, thereby consuming heat. Accordingly, the heat transferred to the first heat radiating vane 215 having the coating layer formed therein is consumed by the above-described operation, and the heat radiation performance can be greatly improved.

The upper support plate 211 located on the side of the illumination member 100 may be provided with an upper support plate 211 on the upper surface so as to prevent rainwater from entering the LED module when the LED lighting fixture 1 is installed outside, The rainwater drainage groove 218 may be formed along the circumferential surface of the rainwater drainage groove 218. At this time, the rainwater drainage grooves 218 are formed to be cut into at least two or more based on the partition 217, and the water is discharged to the outside at the broken point.

The second body 220 includes a second support body 221 having a second hollow portion 221a in the vertical direction. At this time, the second support 221 may be made of copper, which is preferably excellent in thermal conductivity and heat releasing ability.

A plurality of second heat dissipating blades 223 are provided on the outer surface of the second support body 221 at predetermined intervals along the transverse direction of the second support body 221, They are arranged in a radial configuration. At this time, the second heat radiating vane 223 may be made of magnesium steel or an alloy thereof. In addition, the second heat radiating vane 223 is formed long in the vertical direction, and may be formed to have the same length as that of the second support 221.

The second heat radiating vane 223 may be coated with a heat exchange coating material to form a coating layer. The coating layer can greatly improve the heat dissipation performance of the second heat dissipating vane 223.

A ring-shaped side cover 222 may be disposed on the outer surface of the second body 220. The side cover 222 covers the ends of the plurality of second heat radiating vanes 223 and is in contact with the end of each second heat radiating vane 223. The second body 220 is inserted into the first hollow portion 214a of the first support body 214 of the first body 210 and is attached to the first body 210 by the side cover 222, The contact surface of the heat exchanger 220 may be enlarged to further improve the heat transfer effect.

The third body 230 includes a third support body 231 having a third hollow portion 233 in the vertical direction. At this time, the third support body 231 may be made of copper, which is preferably excellent in thermal conductivity and heat releasing ability. The third hollow portion 233 has a size and shape corresponding to the outer surface of the first body 210 and is inserted into the third hollow portion 233 such that the first body 210 is in contact with the third hollow portion 233.

A plurality of third heat dissipating vanes 232 are provided on the outer circumferential surface of the third support body 231 at predetermined intervals along the lateral direction of the third support body 231. The plurality of third heat dissipating vents 232 are radially Respectively. At this time, the third heat dissipating blade 232 may be made of magnesium steel or an alloy thereof. The third heat radiating vane 232 is formed to be long in the vertical direction, and may be formed to have the same length as that of the third support body 231.

The third heat radiating vane 232 may be coated with a heat exchange coating material to form a coating layer. The coating layer can greatly improve the heat radiation performance of the third heat dissipating vane 232.

The lighting member 100 is installed so as to be in close contact with the upper support plate 211 of the first body 210 of the heat dissipating member 200 as much as possible. Each of the LED modules 140 includes a substrate 141 having a conductive pattern and a plurality of LEDs 140 mounted to be electrically connected to the substrate 141. The LED module 140 includes a light emitting diode (142).

At this time, a wire (not shown) for receiving power from the power supply unit (not shown), which is discharged through the second hollow portion 221a of the second body 220 of the heat dissipating member 200, May be provided.

The LED 142 is a light source that generates light by voltage application and can emit light of three colors of red, green, and blue, and can emit white light by mixing these three colors. By providing a light emitting diode chip and making a difference in the applied voltage of each chip, a desired specific hue can also be expressed.

On the other hand, the expression of white light may be generated by a single-color light-emitting diode chip, for example, a blue light-emitting diode chip and a phosphor having a specific color. This is because light emitted from the light- The colors are mixed to produce white light.

The LED 142 may be mounted on the top surface of the substrate 141 by surface mount technology (SMT) and may be in close contact with the upper supporting plate 211 of the heat dissipating member 200 disposed on the lower surface of the substrate 141 It is preferable that the heat generated from the LED 142 through the substrate 141 is directly conducted so as to accelerate the heat dissipation rate.

Also, a first cover 120 may be provided on the upper support plate 211 to cover the LED 142. The first cover 120 includes at least one first lens portion 121 having a hollow portion 122 and a lower surface opened and protruding upward convexly as a glass or transparent / translucent plastic material. The first lens unit 121 is preferably made of glass and serves to diffuse the light emitted from the LED 142 of the LED module 140. The first cover 120 serves to fix the second cover while the second lens part of the second cover, which will be described later, is fitted to the first lens part 121.

At this time, each first lens portion 121 is disposed at a position corresponding to each LED 142 so as to cover each LED 142 when the first cover 120 is coupled. In this embodiment, the first lens units 121 correspond to each LED 142, but the present invention is not limited thereto, and the first lens unit of the first cover 120 may include And may be formed in a ring shape so that one covers all of the plurality of LEDs 142 if necessary.

Further, a second cover 130 may be further provided on the first cover 120 if necessary.

The second cover 130 is for preventing moisture or foreign matter from contacting the LED 142 and protecting the LED 142 from an external impact. The second cover 130 is made of a material such as plastic that provides a lightweight and constant strength. The second cover 130 includes a hollow portion 132 corresponding to the second hollow portion 221a of the second body 220 and a plurality of second hollow portions 132 corresponding to the first lens portion 121 of the first cover 120. [ And a second lens unit 131 of a second lens unit. At this time, the second lens unit 131 may be made of transparent or semitransparent plastic having a certain level of strength and easy to transmit light. It is preferable that the second cover 130 and the second lens unit 131 are integrally formed by, for example, injecting resin, but the present invention is not limited thereto.

The LED module cover plate 110 may be installed between the upper support plate 211 of the heat dissipating member 200 and the first cover 120 of the illumination member 100. The LED module cover plate 110 has a hollow portion 112 and includes a plurality of grooves 111 having a shape corresponding to each substrate 141 of the LED module 140. Therefore, it is possible to prevent the gap between the upper support plate 211 and the first cover 120 from being generated by the thickness of the substrate 141 of the LED module 140.

When the LED module 140 is operated, heat generated in the LED 142 is generated. This heat is transmitted through the upper support plate 211 of the first body 210 installed in contact with the lower surface of the substrate 141. The heat transferred to the upper support plate 211 is transferred to the first support 214, the plurality of partitions 217 and the lower support plate 216 through thermal conduction. The heat transferred to the upper support plate 211, the first support body 214, the partition wall 217 and the lower support plate 216 is diffused through the respective first heat radiating vanes 215.

According to the present embodiment, after the heat of the LED module 140 is quickly conducted to the upper support plate 211, the first support body 214, the partition 217 and the lower support plate 216 of the first body 210, The heat is rapidly diffused through the respective first radiating vanes 215 arranged radially, so that excellent heat conduction and heat radiation effect can be expected. At this time, in the plurality of first heat radiating vanes 215, heat is consumed in the coating layer made of the heat exchange paint, and the heat radiating effect can be further improved.

Next, after the heat of each first heat radiating vane 215 is conducted to the third support body 231 of the third body 230 in contact with the third support body 231, 3 heat spreading vane 232 and can be discharged to the outside. At this time, in the plurality of third heat radiating vanes 232, heat is consumed in the coating layer made of the heat exchange paint, and the heat radiation effect can be further improved.

A part of the heat transmitted to the first support body 214 of the first body 210 is absorbed by the side cover 222 of the second body 220 which is in contact with the second body 220 and the second heat radiating vane 223, 221, and then may be transmitted to the illumination member 100 through the second hollow portion 221a and may be emitted to the outside. At this time, in the plurality of second heat radiating vanes 223, heat is consumed in the coating layer made of the thermal diffusion coating, and the heat radiating effect can be further improved.

Therefore, according to the present embodiment, the first to third bodies 210-230 and the first to third heat radiating vanes 215, 215 of the heat dissipating member 200 configured to connect the heat generated from the LED module 140 to each other, 223 and 232, and the heat is quickly dissipated in the coating layer made of the heat-exchange coating material in the first to third heat-radiating vanes 215, 223 and 232, so that a quick and improved heat radiation effect can be expected .

In addition, since the heat dissipation action occurs not only at the position where the LED is installed but also at the entire heat dissipation member, the heat dissipation effect can be expected faster and improved.

According to the present embodiment, since aluminum is not used as a material of the heat dissipating member 200, it is possible to solve the corrosion problem of the conventional heat dissipating member 200, and the first to third bodies 210-230 And the first to third heat radiating vanes 215, 223 and 232, which occupy a large area in the heat radiating member 200, are formed of low-cost magnesium steel or an alloy thereof, have.

The present invention is not limited by the above-described embodiment and the accompanying drawings, but is intended to be limited by the appended claims.

It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

One ; LED lighting fixtures
100; Illumination member
110; LED module cover plate
120; The first cover
121; The first lens unit
130; The second cover
131; The second lens unit
140; LED module
141; Board
142; LED
200; The heat-
210; The first body
211; The upper support plate
213; Compartment
214; The first support
215; The first heat-
216; Lower support plate
217; septum
220; The second body
221; The second support
222; Side cover
223; The second heat-
230; Third body
231; The third support
232; Third heat sink

Claims (4)

A heat dissipating member comprising a body made of copper, magnesium, magnesium or an alloy thereof, and a plurality of heat dissipating vanes radially formed on the body; And
An illumination member having at least one LED (light emitting diode) module, the illumination member being installed on one side of the body; / RTI >
Wherein the heat-dissipating blade is coated with a heat-exchange coating material that dissipates energy when the heat sink receives heat. The heat sink according to claim 1,
A plurality of compartments each having a hollow portion and partitioned by a plurality of partition walls and a plurality of first heat radiating vanes installed in the respective compartments and radially arranged around the hollow portion, 1 body;
A second body coupled to the hollow portion of the first body, the second body including a plurality of second heat radiating vanes disposed radially; And
A third body coupled to the outer surface of the first body so as to surround the outer surface of the first body and having a plurality of third heat radiating vanes radially formed on the outer surface thereof; And a light emitting diode (LED). [3] The light weight LED lighting fixture of claim 2, wherein the first body is formed with a rainwater drainage groove on one side of the lighting member. 2. The lightweight LED lighting fixture according to claim 1, wherein the lighting member further comprises a light diffusion lens unit covering the LED module.
KR1020140169005A 2014-11-28 2014-11-28 LED lighting apparatus having high heat radiation rate and light weight KR20160064829A (en)

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Application Number Priority Date Filing Date Title
KR1020140169005A KR20160064829A (en) 2014-11-28 2014-11-28 LED lighting apparatus having high heat radiation rate and light weight

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102032419B1 (en) 2019-03-11 2019-10-15 주식회사 제이케이테크원 Copper based metal PCB

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110034212A (en) 2009-09-28 2011-04-05 김용철 A led light apparatus for easily attachment and separation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110034212A (en) 2009-09-28 2011-04-05 김용철 A led light apparatus for easily attachment and separation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102032419B1 (en) 2019-03-11 2019-10-15 주식회사 제이케이테크원 Copper based metal PCB

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