1 : LED照明單元 2 :散熱單元 3 :燈帽單元 五、新型說明： 【新型所屬之技術領域】 從西元前三世紀起，油燈與蠟燭照亮了人類社會長達廿二 個世紀之久。在1810年煤油燈的出現，開啟了人類文明史上 的第一代光源。從此之後，每隔一曱子就出現新的光源世代， 譬如愛迪生在1879年發明了白熱燈’揭開了第二代光源的序 幕，讓人類的照明史又邁入劃時代的進展。及至1938年螢光 燈的問世’人類的照明史又刻劃了嶄新的里程碑，第三代光源 也隨之宣告來臨。時序進入1996年白光LED的誕生，正式宣 告第四代光源一LED的照明世代開啟了。 LED的發光效率（luminouseffeciency)其實並不好，因為 LED除了發出可見光之外，其他能量都轉換成熱量集中在小晶 片上’造成一個溫度相當高的熱點(h〇t sp〇t)。溫度越高則哪 晶粒的發光效率越差，所以散熱問題有部份是要提升發光效 率，另一方面是避免LE：D燒毀。LED的積熱現象乃是現階段技 術未成熟而顯現的問題，為了維持LED的正常工作狀態 ，熱交 換的技術也就相當的重要，而加裝散熱器（heatsink)將是最為 經濟的方式。 LED的開發技術曰益精進’應用於照明領域的條件也相當 成熟，若能改善燈具的散熱問題，才能建立消費者對LED照明 品質的信心。有學者以較樂觀的角度預判，日本可能在2〇12 年用LED燈取代螢光燈’美國則是預計在2()i5年。由此看來， LED，具將，未來_市場社流，蚁最具有龐大商機與廣 大市昜之產本新型專利旨在將則為圓柱形輻射狀排列的 散熱器運用於LED燈具，藉以將㈣產生的熱透過敎傳導 (1±围1 c〇ndUCtion^LED模組傳遞至散熱器，再藉由自然 對流(natural convection)與熱輻射（伽_ ―如⑻方 式從散熱器鰭片散逸至外界。 【先前技術】 LED已廣泛而且成功的運用在照明設備，綱燈具已被視 為LED最具有發展潛力的市場。由於高功率技術的發展，使得 LED運用在照明燈具時’亦同樣面臨到嚴苛熱管理問題的挑 戰。近年來，LED燈具的專利如雨後春筍般相繼的提出，其中 包括散熱有相關的燈具設計為數相當可觀。 目前利用LM)做為光源的燈具設計不勝枚舉，在本國公告 的專利中，具有散熱考量的發明專利包括·· rLED嵌燈改良結 構」（2010/05/01’1324235)、「照明裝置」（2010/03/11， 1321631 )、「具有散熱結構之發光二極體燈具」（2〇1〇/〇3/11， 1321630)。 另外，在本國公告的專利中，具有散熱考量的新型專利包 括：「兼具散熱及自動斷電功能之LED照明模組」（2010/05/21， M381031 )、「LED 燈」（2010/05/11 ’M380579)、「有光型 及散熱之LE：D」（2010/05/11，M380446)、「具有反光片之 LED嵌燈構造」（2010/05/11，M380444)、「LE：D燈具構造」 (2010/05/11 ’ M380443 )、「LED 燈具」（2010/05/11，M380434 )、 「具有透光板之LED嵌燈構造」（2010/05/11，M380427)、 M395119 ' t 「LED散熱結構」（2010/05/01，M379720)、「LED 照明燈泡 結構總成」（2010/05/01，M379700)、「發光二極體燈泡」 (2010/04/21 ’ M379021 )、「發光二極體燈具改良結構」（2010/ 04/11，M378339)、「發光二極體之結構」（2〇1〇/〇4/〇1， M377699)、「發光二極體之散熱結構」（2010/04/01，M377698)、 「具外飾板之發光二極體照明裝置」（2010/04/01，M377536)、 「光源裝置」（2010/04/01，M377527)、「LE：D 照明模組」（2010/ 04/01 ’ M377532)、「平板型 LED 燈具」（2010/04/01，M377531 )、 「LED 燈結構改良」（2010/04/01，M377525)、「LED 燈泡」 (2010/04/01 ’M377524)、「燈具及其擠型散熱結構」（2010/ 03/21 ’M376715)、「具有高效能散熱器之LE：D照明燈」（2010/ 03/21，M376712)、「發光二極體燈具」（2010/03/21，M376710)、 「旋轉式之LE：D照明裝置」（2010/03/21，M376703)、「可 產生較佳亮度之透鏡折射LED燈」（2010/03/21，M376694)、 「嵌入式之LE：D 照明裝置」（2010/03/21，M376690)、「LED 燈泡」（2010/03/21，M376689)、「具有散熱器的LE：D照明 燈」（2010/03/11 ’M375835)、「組合式 LED 燈具」（2010/03/01， M375179)、「高效率 LED 燈」（2G1G/G2/2卜 M374538)、「LED 燈」（2010/02/11，M374024)、「具沖壓式燈殼之LED燈具」 (2010/02/11，M374023 )、「LED 燈具」（2010/02/01，M373445)、 「LED 燈具」（2010/02/01，M373443)。 除此之外’在本國公告的專利中，具有散熱考量的新式樣 專利包括：「LED 燈具」（2010/05/11，D134903)、「發光二 極體燈具」（ 2010/05/11，D134898 )、「LED散熱燈」 (2010/05/01，D134762)、「燈」（2010/04/01，D134229)、 「燈具（十）」（2010/03/21，D134014)、「燈具（九）」（2010/ 4 M395119 t 03/21 ’ D134013)、「燈具（八）」（2010/03/21，D134012)、 「燈具（七）」（2010/03/21，D134011)、「燈具（六）」（2010/ 03/21，D134010)、「燈具（四）」（2010/03/21，D134009)、 「燈具（三）」（2010/03/21，D134008)、「LED散熱燈具（三）」 (2010/03/21，D134007)、「LE：D 散熱燈具（二）」（2010/03/21， D134006) '「LED散熱燈具（一）」（2010/03/21，D134005)、 「LED 燈（二）」（2010/03/21’D134004)、「燈具及其擠型散 熱結構」（2010/03/21，M376715)。 【新型内容】 本創作「具有高效能散熱器之LED照明燈」，主要的組成 包含：一 LED照明單元、一散熱單元及一燈帽單元等三個部分。 在LE1D照明單元中，複數le：D模組裝置在金屬基板上；金屬基 板與散熱器藉由螺紋緊密的結合，在LED基板與散熱器接觸介 面塗覆熱介面物質（thermal interface material, TIM)，藉 以減低LED模組散熱時之熱阻(thermal resistance)。散熱單 元包括一金屬散熱器及一風扇，其中散熱器具有圓柱形輻射狀 排列的散熱鰭片，搭配風扇的使用，藉以將1^1)產生的熱，有 效的從LED基板導引出，並從散熱器散逸至外界。 本創作充分的運用目前電子元件的散熱技術，能夠自然、 ^效的排除led模組產生的熱量，使照明燈的LE：D發光效率提 二、，用壽命延長。本創作採用模組化設計，藉由螺紋將led …、月單元、散熱單元及燈帽單元結合，易於組裝與拆卸，不但 具備，利性也擁有可換性，構成—種新型實用的鑛產品。: 創作是極具市場潛力與競爭優勢的照明產品，是相當值得 的照明燈具。 疋 5 M395119 l1 : LED lighting unit 2 : Heat dissipating unit 3 : Lamp cap unit V. New description: [New technical field] Since the third century BC, oil lamps and candles have illuminated human society for two centuries. The emergence of kerosene lamps in 1810 opened the first generation of light sources in the history of human civilization. Since then, every new generation of light sources has appeared, such as Edison invented the white heat lamp in 1879, which unveiled the prelude of the second generation of light sources, making the history of human lighting a epoch-making progress. And the advent of fluorescent lamps in 1938, the history of human lighting has also marked a new milestone, and the third generation of light sources has also come. The timing entered the birth of the white LED in 1996, and officially announced that the fourth generation of light source-LED lighting generation was opened. The luminous efficiency of LEDs is not good, because in addition to emitting visible light, LEDs are converted into heat concentrated on small wafers, resulting in a relatively high temperature hot spot (h〇t sp〇t). The higher the temperature, the worse the luminous efficiency of the crystal grains. Therefore, some of the heat dissipation problems are to improve the luminous efficiency, and on the other hand, to avoid LE:D burning. The accumulation of LEDs is a problem that is not mature at this stage. In order to maintain the normal working state of LEDs, the technology of heat exchange is also very important, and the addition of heatsinks will be the most economical way. The development technology of LED technology has been improved. The conditions used in the field of lighting are also quite mature. If we can improve the heat dissipation of lamps, we can build consumer confidence in the quality of LED lighting. Some scholars have predicted from a more optimistic point of view that Japan may replace fluorescent lamps with LED lights in 2002. The United States is expected to be in 2 () i5 years. From this point of view, LED, will, the future _ market social flow, ants have the most huge business opportunities and the vast majority of the market. This new patent aims to apply a radiator with a cylindrical radial arrangement to LED lamps, so that (4) The generated heat is transmitted to the heat sink through the 敎 conduction (1±围1 c〇ndUCtion^LED module, and then escaped from the heat sink fin by natural convection and heat radiation (G/_) [Previous technology] LED has been widely and successfully used in lighting equipment, and the luminaire has been regarded as the most promising market for LED. Due to the development of high-power technology, LEDs are also used in lighting fixtures. The challenge of strict heat management issues. In recent years, the patents of LED lamps have been mushrooming, including the related design of heat dissipation related lamps. At present, the design of lamps using LM) as a light source is too numerous to list in the country. Among the patents announced, the invention patents with heat dissipation considerations include: · rLED recessed lamp improved structure" (2010/05/01'1324235), "lighting device" (2010/03/11, 13216 31), "Light-emitting diode lamps with heat-dissipating structure" (2〇1〇/〇3/11, 1321630). In addition, in the nationally announced patents, new patents with thermal considerations include: "both heat dissipation and LED lighting module with automatic power-off function" (2010/05/21, M381031), "LED light" (2010/05/11 'M380579), "LE and D with light and heat dissipation" (2010/05/ 11, M380446), "LED recessed lamp structure with reflector" (2010/05/11, M380444), "LE: D lamp structure" (2010/05/11 'M380443), "LED lamp" (2010/05 /11,M380434), "LED recessed light structure with light-transmitting plate" (2010/05/11, M380427), M395119't "LED heat-dissipation structure" (2010/05/01, M379720), "LED lighting bulb structure" "Assembly" (2010/05/01, M379700), "Light Emitting Diode Bulb" (2010/04/21 'M379021), "Improved Structure of Luminous Diode Lamps" (2010/04/11, M378339), "Light-emitting diode structure" (2〇1〇/〇4/〇1, M377699), "Light-emitting structure of light-emitting diode" (2010/04/01, M377698), "Light-emitting diode with external trim body Lighting device" (2010/04/01, M377536), "light source device" (2010/04/01, M377527), "LE: D lighting module" (2010/ 04/01 'M377532), "flat LED lamp (2010/04/01, M377531), "LED lamp structure improvement" (2010/04/01, M377525), "LED bulb" (2010/04/01 'M377524), "Lamps and extruded heat dissipation structure" (2010/ 03/21 'M376715), "LE:D Lighting with High Efficiency Radiator" (2010/ 03/21, M376712), "Light Emitting Diode" (2010/03/21, M376710), "Rotary LE: D Lighting Device" (2010/03/21, M376703), "Lens Refractive LED Lamp for Better Brightness" (2010/03/21, M376694), "Embedded LE: D Lighting" Device" (2010/03/21, M376690), "LED Bulb" (2010/03/21, M376689), "LE:D Illuminator with Radiator" (2010/03/11 'M375835), "Combination LED lamps" (2010/03/01, M375179), "High-efficiency LED lights" (2G1G/G2/2 Bu M374538), "LED lights" (2010/02/11, M374024), "with stamped lamp housings" LED Lamps" (2010/02/11, M 374023 ), "LED Lamps" (2010/02/01, M373445), "LED Lamps" (2010/02/01, M373443). In addition to the patents announced in the country, new patents with thermal considerations include: "LED Fixtures" (2010/05/11, D134903), "Light Emitting Diodes" (2010/05/11, D134898) ), "LED Cooling Light" (2010/05/01, D134762), "Lamp" (2010/04/01, D134229), "Lamps (Ten)" (2010/03/21, D134014), "Lamps (nine) )(2010/ 4 M395119 t 03/21 'D134013), "Lamps (eight)" (2010/03/21, D134012), "Lamps (seven)" (2010/03/21, D134011), "Lamps ( 6)" (2010/ 03/21, D134010), "Lamps (4)" (2010/03/21, D134009), "Lamps (3)" (2010/03/21, D134008), "LED Cooling Fixtures ( 3)" (2010/03/21, D134007), "LE: D Cooling Fixtures (2)" (2010/03/21, D134006) "LED Cooling Fixtures (1)" (2010/03/21, D134005) , "LED Lights (2)" (2010/03/21 'D134004), "Lamps and Extruded Heat Dissipation Structures" (2010/03/21, M376715). [New content] The main component of this creation is "LED lighting with high-efficiency heatsink". The main components include: an LED lighting unit, a cooling unit and a lamp cap unit. In the LE1D lighting unit, a plurality of le:D module devices are mounted on a metal substrate; the metal substrate and the heat sink are tightly coupled by a screw, and a thermal interface material (TIM) is applied to the LED substrate and the heat sink contact interface. In order to reduce the thermal resistance of the LED module when it is cooled. The heat dissipating unit comprises a metal heat sink and a fan, wherein the heat sink has a heat radiating fin arranged in a cylindrical shape, and is used together with a fan to effectively guide the heat generated by the 1^1) from the LED substrate, and Dissipate from the radiator to the outside world. This creation makes full use of the current heat dissipation technology of electronic components, which can naturally and effectively eliminate the heat generated by the LED module, so that the LE:D luminous efficiency of the illumination lamp is improved, and the service life is prolonged. The creation adopts modular design, which combines led ..., moon unit, heat dissipating unit and lamp cap unit by thread, which is easy to assemble and disassemble. It not only has the advantage, but also has the interchangeability, and constitutes a new type of practical mineral product. . : Creation is a lighting product with great market potential and competitive advantage. It is quite worthy of lighting.疋 5 M395119 l
.Λ I 【實施方式】 第一圖為本創作具有高效能散熱器之LED照明燈實施例的 立體組合圖。從第-圖可看出本創作的整體外觀，從外觀可將 本創作區分成三個主要部分，包括LED照明單元丨、散埶單元 2及燈帽單元3。 … 第二圖為具有高效能散熱器之LED照明燈實施例分解圖 ' (一），第二圖為具有高效能散熱器之LE：D照明燈實施例分解 ®(一）。從第二圖與第三圖可詳細的看到本創作的各組成元 • 件，其中第一部分為LED照明單元，本單元包括一燈罩u、一 燈罩螺紋12、一基板13、一上基板螺紋14、複數LED模組15、 一電線16及一下基板螺紋17。燈罩n的材質選用聚碳酸醋 (polycarbonate, PC)或聚乙稀(p〇iyethyiene，pe)，燈罩殼的 形狀則為弧形凸面並具有可透光性，俾能產生整體衡亮光源； 又藉由上舰形凸面結構，細絲光線之重4而不會產生眩 光，故可增進照明效果而增加視覺的舒適感。在燈罩内部具有 燈罩螺紋12 ’可與金屬基板13上方的上基板螺紋14配對結 φ 合，藉此可將燈罩固定在金屬基板上。 LE：D模組15係由複數LED對稱的均佈在一金屬基板上所構 成’金屬基板為具有高熱傳導係數(thermal c〇nductivity^ 材質（在27C情況下’ 、銅的熱傳導餘分別為挪、 401W/mK);金屬基板擁有將LED產生的熱均勻傳導至整塊板 片的能力。LED模組藉由電線16提供必要的電能，電線金屬裸 線頭係直接焊接在金屬基板上。 LED照明單元的金屬基板下方具有下基板螺紋17，此外螺 紋用以和散熱器哺紋21配對結合，使得LED照明單元能與 6 M395119 ，熱早7C緊密的結合。在金屬基板與散熱器的接觸賴塗覆熱 介面物質，藉以減低金屬基板散熱時之熱阻；熱介面物質通常、 採用熱傳導錄佳的賴Kthermal grease)。 從第一圖、第二圖以及第四圖可看出本創作的散熱單元， 主要包括-散熱H螺紋2卜複數散熱則2 散 熱孔23、複數母卡榫24、複數風扇螺絲25、—風扇葉片^ 及-風扇馬達27。由於散熱單元夾置在⑽照明單元與燈帽單 元之間，主要採用散熱器螺紋21與LED 單元結合，並利 用卡榫與燈帽單元組合，對於維修拆卸更具有極佳的便捷性。 散熱單元採用輻射狀的散熱鰭片22,密集的排列方式提供 更大的散熱面積’加上輕射狀多向的熱散逸特性，更能使埶從 散熱器的中空柱心至韓片外圍，提供絕佳自然對流與熱輕射的 途徑，使熱能經由大面積、多方位的鰭片散逸出，達到最佳的 散熱效果。另外’散熱糾在同，㈣具有複數散熱器散孰孔 23 ’使得熱氣流由散熱器底部沿著軸向往上傳遞時，複 器散熱孔會破壞熱邊界層（thermal b_dary 的成長'·，、 如此有助於促進自然對流的散熱效果。散熱器的中空柱心可用 以做為電線連接通道，而且可減少金屬材料的使用量，連帶亦 可降低散=的重量，材制選驗材即足以達職熱需求。 散熱單元之風扇使用複數風扇螺絲25固定在燈帽單元 上’藉由電能驅動旋轉造成強制對流，向下之氣流由散敎哭的 中空柱心直接沖擊LED照明單元的基板，因而促進模^ 熱散逸效果。 在第一圖與第二圖同時呈現本創作的燈帽單元，盆中 -電線31、-電路模組容置室32、複數公卡棒如、複數燈帽 散熱孔34、-螺旋座35及一電接觸頭％。電線31是將電能 7 傳輪至LED的途徑，用以供應Lm)所需的電能；電線從燈帽單 =端面拉出之後，，經由散熱器的中空柱心連接到led模組的金 屬基板。 在燈帽單元的上方、外側採用複數公卡榫33與散熱器内 的母卡榫崎結合’如此可使雜H在制時沒有方向性的限 制。電路模組容置室32係用以容置驅動le：D發出光的電子元 件空間，本模組表殼可銑複數燈帽散熱孔，以便散發電路模 組產生的熱，以及經由散熱器中空柱心對流而上的熱。螺旋座 35為具有公螺紋之圓弧螺峰與螺谷，係用以將照明燈旋轉安裝 在燈座内，透過電接觸頭36與燈座之電源接觸，藉以將電流 導引至照明燈。 【圖式簡單說明】 第一圖為具有高效能散熱器之LED照明燈實施例立體組合圖。 第二圖為具有高效能散熱器之Led照明燈實施例分解圖（一）。 第三圖為具有高效能散熱器之Lf：i)照明燈實施例分解圖（二）。 第四圖為具有高效能散熱器之LED照明燈實施例分解圖（三）。 M395119 k Λ 【主要元件符號說明】 11 :燈罩 12 :燈罩螺紋 13 :基板 14 :上基板螺紋 15 : UED模組 16 :電線 17 :下基板螺紋 ^ 21 :散熱器螺紋 22 :散熱鰭片（fin) 23 :散熱器散熱孔 24 :母卡榫 25 :風扇螺絲 26 :風扇葉片 27 :風扇馬達 31 :電線 ^ 32:電路模組容置室 . 33 :公卡榫 34 :燈帽散熱孔 35 :螺旋座（screw base) 36 電接觸頭（electrical contact) 9Λ I [Embodiment] The first figure is a three-dimensional combination diagram of an embodiment of an LED lighting lamp with a high-performance heat sink. From the first picture, the overall appearance of the creation can be seen. From the appearance, the creation can be divided into three main parts, including LED lighting unit 埶, diverging unit 2 and lamp cap unit 3. The second figure shows an exploded view of an embodiment of an LED illuminator with a high-efficiency heatsink ('1), and the second figure shows an decomposition of the LE:D illuminator embodiment with high-efficiency heatsinks (1). The components of the present invention can be seen in detail from the second and third figures. The first part is an LED lighting unit. The unit includes a lamp cover u, a lamp cover thread 12, a substrate 13, and an upper substrate thread. 14. A plurality of LED modules 15, a wire 16 and a lower substrate thread 17. The material of the lampshade n is made of polycarbonate (PC) or polyethylene (p〇iyethyiene, pe), and the shape of the lampshade shell is curved convex surface and has light transmissivity, and the whole light source can be produced; By the upper ship-shaped convex structure, the weight of the filament light is 4 without glare, so the lighting effect can be enhanced and the visual comfort can be increased. A lamp cover thread 12' inside the lampshade can be mated with the upper substrate thread 14 above the metal substrate 13, whereby the lamp cover can be fixed to the metal substrate. The LE:D module 15 is composed of a plurality of LEDs symmetrically distributed on a metal substrate. The metal substrate has a high thermal conductivity (thermal c〇nductivity^ material (in the case of 27C', the heat conduction of copper is moved separately 401W/mK); the metal substrate has the ability to uniformly conduct the heat generated by the LED to the entire plate. The LED module provides the necessary electric energy by the wire 16, and the wire bare metal wire is directly soldered on the metal substrate. The metal substrate of the lighting unit has a lower substrate thread 17 underneath, and the thread is used for mating with the heat sink lining 21, so that the LED lighting unit can be closely combined with the 6 M395119, hot 7C. The contact between the metal substrate and the heat sink The thermal interface material is coated to reduce the thermal resistance of the metal substrate when the heat is dissipated; the thermal interface material is usually a thermal conductivity recording. From the first picture, the second picture and the fourth picture, the heat dissipation unit of the present invention can be seen, mainly including: heat dissipation H thread 2, plural heat dissipation, 2 heat dissipation holes 23, plural mother card 榫 24, plural fan screws 25, fan Blade ^ and - fan motor 27. Since the heat dissipating unit is sandwiched between the (10) lighting unit and the lamp cap unit, the heat sink thread 21 is mainly used in combination with the LED unit, and the combination of the cassette and the lamp cap unit is used, which is extremely convenient for maintenance and disassembly. The heat dissipating unit uses radiating fins 22, which provide a larger heat dissipating area in a dense arrangement. The light-emitting and multi-directional heat dissipation characteristics enable the crucible to pass from the hollow core of the radiator to the periphery of the Korean film. Provides excellent natural convection and heat wicking, allowing heat to escape through large, multi-directional fins for optimum heat dissipation. In addition, the 'heat dissipation is the same, (4) having a plurality of heat sink holes 23', so that the hot air flow is transmitted upward from the bottom of the heat sink, the heat dissipation hole of the complex will destroy the thermal boundary layer (the growth of thermal b_dary'·, This helps to promote the heat dissipation effect of natural convection. The hollow core of the radiator can be used as a wire connecting passage, and the amount of metal material can be reduced, and the weight of the material can be reduced, and the material selection is sufficient. The thermal unit needs to be fixed. The fan of the heat dissipation unit is fixed on the lamp cap unit by using a plurality of fan screws 25. The forced air convection is caused by the rotation of the electric energy, and the downward airflow directly impacts the substrate of the LED illumination unit by the hollow core of the crying crying. Therefore, the heat dissipation effect of the mold is promoted. In the first figure and the second figure, the lamp cap unit of the present invention is presented at the same time, the pot-wire 31, the circuit module housing chamber 32, the plurality of bus bars, and the plurality of lamp caps dissipate heat. The hole 34, the screw seat 35 and an electrical contact head %. The electric wire 31 is a means for transferring the electric energy 7 to the LED to supply the electric energy required for the Lm); after the electric wire is pulled out from the lamp cap = end face, Scatter The hollow core of the heater is connected to the metal substrate of the led module. In the upper and outer sides of the lamp cap unit, a plurality of male ferrules 33 are used in combination with the female card 榫崎 in the heat sink. Thus, the miscellaneous H can be made without limitation of directionality. The circuit module accommodating chamber 32 is for accommodating the space of the electronic component that drives the light of the light source: the module case can be milled and multiplexed with the heat dissipation holes of the lamp cap to dissipate heat generated by the circuit module and hollow through the heat sink. The heat of the convection of the column core. The screw base 35 is a circular screw peak and a screw valley having a male thread for rotating the illumination lamp in the socket and contacting the power supply of the socket through the electrical contact 36 to guide the current to the illumination lamp. [Simple Description of the Drawings] The first figure is a three-dimensional combination diagram of an embodiment of an LED lighting lamp with a high-efficiency heat sink. The second figure is an exploded view (I) of an embodiment of a Led illuminator with a high efficiency heat sink. The third figure is an exploded view of the Lf:i) illuminator with high efficiency heat sink (2). The fourth figure is an exploded view (3) of an embodiment of an LED illuminator with a high efficiency heat sink. M395119 k Λ [Main component symbol description] 11 : Shade 12 : Shade thread 13 : Substrate 14 : Upper substrate thread 15 : UED module 16 : Wire 17 : Lower substrate thread ^ 21 : Radiator thread 22 : Heat sink fin (fin 23: Radiator cooling hole 24: female card 榫 25: fan screw 26: fan blade 27: fan motor 31: wire ^ 32: circuit module housing chamber. 33: male card 榫 34: lamp cap cooling hole 35: Screw base 36 electrical contact 9