TWI417480B - Led lamp - Google Patents
Led lamp Download PDFInfo
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- TWI417480B TWI417480B TW99146821A TW99146821A TWI417480B TW I417480 B TWI417480 B TW I417480B TW 99146821 A TW99146821 A TW 99146821A TW 99146821 A TW99146821 A TW 99146821A TW I417480 B TWI417480 B TW I417480B
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- heat dissipation
- lighting fixture
- heat
- led lighting
- dissipation base
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Description
本發明涉及一種LED照明燈具,特別涉及一種具有散熱結構的LED照明燈具。 The invention relates to an LED lighting fixture, in particular to an LED lighting fixture with a heat dissipation structure.
和傳統光源相比,發光二極體(LED)具有較高之發光效率(光源溫度較一般燈泡低)、低輻射、低耗電、壽命長、低電壓、啟動快速、環保、抗震抗壓、燈具可小型化等優點,以LED作為光源的照明裝置目前被廣泛應用於各種照明,如室內照明、室外照明、可攜式照明(如手電筒)、情境照明等應用中。LED在工作時會產生熱量,帶有這些熱量的空氣與周圍環境中的空氣之間的流通進行散熱,但此散熱方式效果有限,特別在LED長時間工作後,僅用此種散熱方式不能使產生的熱量及時疏散,使LED溫度升高,嚴重影響LED的發光效率及LED燈具的使用壽命。 Compared with traditional light sources, light-emitting diodes (LEDs) have higher luminous efficiency (light source temperature is lower than general bulbs), low radiation, low power consumption, long life, low voltage, fast start-up, environmental protection, anti-seismic compression, Lighting fixtures can be miniaturized. Lighting devices using LEDs as light sources are currently used in a variety of lighting applications, such as indoor lighting, outdoor lighting, portable lighting (such as flashlights), and ambient lighting. The LED generates heat during operation, and the heat between the air with the heat and the air in the surrounding environment dissipates heat, but the heat dissipation method has limited effect, especially after the LED is used for a long time, the heat dissipation method alone cannot be used. The generated heat is evacuated in time, which causes the LED temperature to rise, which seriously affects the luminous efficiency of the LED and the service life of the LED lamp.
為了解決LED燈具的散熱問題,現有技術中多採用在燈具殼體上增設散熱鰭片,此種方式雖然有效的增加了散熱面積,但是會增加LED燈具的體積和重量,另外過小的鰭片間距會引起灰塵雜質等在鰭片間隙內沉積,導致散熱能力降低。 In order to solve the problem of heat dissipation of LED lamps, in the prior art, heat-dissipating fins are added to the lamp housing. Although this method effectively increases the heat dissipation area, it increases the volume and weight of the LED lamps, and the fin spacing is too small. It can cause dust impurities and the like to deposit in the fin gap, resulting in a decrease in heat dissipation capability.
有鑒於此,本發明提供一種輕便且散熱良好的LED照明燈具。 In view of this, the present invention provides an LED lighting fixture that is lightweight and has good heat dissipation.
一種LED照明燈具,包括散熱底座、LED基板、驅動電路板以及電源連接器,所述LED基板上設置有多個發光二極體。所述散熱底座一端與電源連接器連接,另一端與LED基板相固定,驅動電路板收納於該散熱底座內;所述散熱底座側壁上設有導流孔。 An LED lighting fixture includes a heat dissipation base, an LED substrate, a driving circuit board, and a power connector, and the LED substrate is provided with a plurality of light emitting diodes. One end of the heat dissipation base is connected to the power connector, the other end is fixed to the LED substrate, and the driving circuit board is received in the heat dissipation base; and the heat dissipation base sidewall is provided with a flow guiding hole.
LED照明燈具工作時,開設於散熱底座側面的導流孔使散熱底座內部形成一個內流場,冷空氣從靠近電源基板的導流孔進入,從靠近電源連接器的導流孔排出。進入散熱底座內部的冷空氣可以對散熱底座內側壁以及驅動電路板進行熱交換。 When the LED lighting device is working, the air guiding hole formed on the side of the heat dissipating base forms an inner flow field inside the heat dissipating base, and the cold air enters from the diversion hole close to the power substrate, and is discharged from the diversion hole close to the power connector. The cold air entering the inside of the heat sink base can exchange heat between the inner side wall of the heat sink base and the drive circuit board.
100‧‧‧LED照明燈具 100‧‧‧LED lighting
10‧‧‧燈罩 10‧‧‧shade
20‧‧‧散熱底座 20‧‧‧heating base
21‧‧‧第一端部 21‧‧‧ first end
22‧‧‧第二端部 22‧‧‧ second end
23‧‧‧凹部 23‧‧‧ recess
24‧‧‧散熱鰭片 24‧‧‧ Heat sink fins
25‧‧‧導流孔 25‧‧‧Inlet
30‧‧‧電源連接器 30‧‧‧Power connector
40‧‧‧LED基板 40‧‧‧LED substrate
41‧‧‧發光二極體 41‧‧‧Lighting diode
42‧‧‧螺絲 42‧‧‧ screws
50‧‧‧驅動模組 50‧‧‧Drive Module
51‧‧‧驅動電路板 51‧‧‧Drive Circuit Board
52‧‧‧上蓋體 52‧‧‧Upper cover
53‧‧‧下蓋體 53‧‧‧ Lower cover
54‧‧‧螺絲 54‧‧‧ screws
圖1為本發明一實施方式中LED照明燈具的立體圖。 1 is a perspective view of an LED lighting fixture in accordance with an embodiment of the present invention.
圖2為圖1中LED照明燈具的爆炸圖。 2 is an exploded view of the LED lighting fixture of FIG. 1.
圖3為圖1中LED照明燈具的散熱底座的結構示意圖。 3 is a schematic structural view of a heat dissipation base of the LED lighting fixture of FIG. 1.
圖4為圖1中LED照明燈具的驅動模組的結構示意圖。 4 is a schematic structural view of a driving module of the LED lighting fixture of FIG. 1.
圖5為圖1中LED照明燈具的散熱方式示意圖。 FIG. 5 is a schematic diagram of a heat dissipation mode of the LED lighting fixture of FIG. 1. FIG.
請參考圖1,LED照明燈具100包括燈罩10、散熱底座20以及電源連接器30。燈罩10與電源連接器30分別固定在散熱底座20的兩端。電源連接器30用來與電源相連接,電源連接器30為通用的電源介面,如螺口電源連接器或者卡口電源連接器。 Referring to FIG. 1 , the LED lighting fixture 100 includes a lamp cover 10 , a heat dissipation base 20 , and a power connector 30 . The lamp cover 10 and the power connector 30 are respectively fixed to both ends of the heat dissipation base 20. The power connector 30 is used to connect to a power source, and the power connector 30 is a universal power interface such as a screw power connector or a bayonet power connector.
請參閱圖2,LED照明燈具100還包括LED基板40和驅動模組50。所述LED基板40上還安裝有多個發光二極體41。驅動模組50與電源連接器30和LED基板40電連接,所述驅動模組50通過電源連接器 30從外界獲取電能以驅動發光二極體41發光。 Referring to FIG. 2 , the LED lighting fixture 100 further includes an LED substrate 40 and a driving module 50 . A plurality of light emitting diodes 41 are also mounted on the LED substrate 40. The driving module 50 is electrically connected to the power connector 30 and the LED substrate 40, and the driving module 50 passes through the power connector. 30 Acquires electric energy from the outside to drive the light-emitting diode 41 to emit light.
燈罩10固定在散熱底座20上,發光二極體41發出的光線穿過燈罩10射出到LED照明燈具100的外部。燈罩10可以通過螺紋連接、卡扣、膠黏等固定方式與散熱底座20相固定。在本實施方式中,燈罩10採用透明塑膠為基材,並在其中混合適當比例的光擴散粒子,增加光散射效果並使光柔和化。在其他實施方式中,還可以在所述燈罩10內表面設置粗糙表面來增加燈罩的光漫散射效果。 The lamp cover 10 is fixed on the heat dissipation base 20, and the light emitted from the light-emitting diode 41 is emitted through the lamp cover 10 to the outside of the LED lighting device 100. The lampshade 10 can be fixed to the heat dissipation base 20 by a screw connection, a snap, an adhesive or the like. In the present embodiment, the lampshade 10 uses a transparent plastic as a substrate, and mixes light diffusion particles in an appropriate ratio therein to increase the light scattering effect and soften the light. In other embodiments, a rough surface may be provided on the inner surface of the lampshade 10 to increase the light diffusing scattering effect of the lampshade.
請一併結合圖3,在本實施方式中,散熱底座20為空心的類圓錐體,該類圓錐體由兩個對稱的半圓錐體相對接而成。散熱底座20包括第一端部21和第二端部22,該第一端部21的直徑大於第二端部22的直徑。該散熱底座20的第一端部21上形成有一凹部23,所述LED基板40固定在凹部23內。在本實施方式中,LED基板40通過螺絲42固定在凹部23內。所述第二端部22與電源連接器30相固定。散熱底座20的外側面還設置有相互間隔一定距離的多個散熱鰭片24,所述散熱鰭片24用來增加散熱底座20的表面積,從而增加了與空氣的接觸面積,進而提高了散熱效率。散熱底座20的側邊還設置有導流孔25,在本實施方式中,所述散熱底座20包括至少一列沿徑向分佈於散熱底座20的側邊的導流孔25,所述至少一列導流孔25中導流孔25的數量至少為兩個。 Referring to FIG. 3 together, in the present embodiment, the heat dissipation base 20 is a hollow cone-like body, and the cone is formed by opposing two symmetric semi-cones. The heat sink base 20 includes a first end portion 21 and a second end portion 22 having a diameter that is greater than a diameter of the second end portion 22. A recess 23 is formed in the first end portion 21 of the heat dissipation base 20, and the LED substrate 40 is fixed in the recess 23. In the present embodiment, the LED substrate 40 is fixed in the recess 23 by the screw 42. The second end 22 is fixed to the power connector 30. The outer surface of the heat dissipation base 20 is further provided with a plurality of heat dissipation fins 24 spaced apart from each other. The heat dissipation fins 24 are used to increase the surface area of the heat dissipation base 20, thereby increasing the contact area with the air, thereby improving the heat dissipation efficiency. . The side of the heat dissipation base 20 is further provided with a flow guiding hole 25. In the embodiment, the heat dissipation base 20 includes at least one row of flow guiding holes 25 distributed radially on the side of the heat dissipation base 20, the at least one column guide The number of the flow holes 25 in the flow holes 25 is at least two.
在本實施方式中,散熱底座20採用導熱性佳的散熱材料製成,如鋁合金等。優選的,所述LED基板40與散熱底座20的第一端部21之間還設有導熱介質(圖未示出),用於將LED基板40工作時散發的熱量均勻地傳導至散熱底座20。在本實施方式中,LED基板 40與散熱底座20的第一端部21之間的導熱介質是導熱膠帶。 In the present embodiment, the heat dissipation base 20 is made of a heat dissipation material having good thermal conductivity, such as an aluminum alloy. Preferably, a heat conducting medium (not shown) is disposed between the LED substrate 40 and the first end portion 21 of the heat dissipation base 20 for uniformly conducting heat emitted by the LED substrate 40 to the heat dissipation base 20 during operation. . In the present embodiment, the LED substrate The thermally conductive medium between the 40 and the first end 21 of the heat sink base 20 is a thermally conductive tape.
請一併結合圖2和圖4,驅動模組50收納於散熱底座20的內部。所述驅動模組50包括驅動電路板51、上蓋體52以及下蓋體53,該驅動電路板51容納於上蓋體52與下蓋體53之間。所述上蓋體52通過螺絲54鎖附於下蓋體53上,該上蓋體52和下蓋體53可以對驅動電路板起到絕緣和防水保護的作用。所述上蓋體52和下蓋體53上均設有開口55,該開口55供導線(圖未示出)穿出,從而允許驅動電路板51與LED基板40以及電源連接器30電連接。 Referring to FIG. 2 and FIG. 4 together, the driving module 50 is housed inside the heat dissipation base 20. The driving module 50 includes a driving circuit board 51, an upper cover body 52, and a lower cover body 53. The driving circuit board 51 is accommodated between the upper cover body 52 and the lower cover body 53. The upper cover 52 is locked to the lower cover 53 by screws 54. The upper cover 52 and the lower cover 53 can provide insulation and waterproof protection for the drive circuit board. The upper cover 52 and the lower cover 53 are each provided with an opening 55 through which a wire (not shown) is passed, thereby allowing the drive circuit board 51 to be electrically connected to the LED substrate 40 and the power connector 30.
請參考圖5,LED照明燈具100工作時,發光二極體41產生的熱量經由導熱介質傳導至散熱底座20的第一端部21,再由第一端部21傳導至散熱鰭片24。散熱鰭片24與空氣進行熱交換,從而將熱量散發散熱。同時開設於散熱底座20側面的導流孔25使散熱底座20內部形成一個內流場,冷空氣從靠近第一端部21的導流孔25進入,從靠近第二端部22的導流孔25排出。進入散熱底座20內部的冷空氣可以對散熱底座20內側壁以及驅動模組50進行熱交換,有效提升散熱效率。 Referring to FIG. 5 , when the LED lighting fixture 100 is in operation, the heat generated by the LEDs 41 is conducted to the first end portion 21 of the heat dissipation base 20 via the heat conductive medium, and then conducted to the heat dissipation fins 24 by the first end portion 21 . The heat sink fins 24 exchange heat with the air to dissipate heat. At the same time, the flow guiding hole 25 formed on the side of the heat dissipation base 20 forms an internal flow field inside the heat dissipation base 20, and the cold air enters from the flow guiding hole 25 near the first end portion 21, and the flow guiding hole from the second end portion 22 25 discharge. The cold air entering the heat dissipation base 20 can exchange heat with the inner side wall of the heat dissipation base 20 and the driving module 50, thereby effectively improving the heat dissipation efficiency.
本技術領域的普通技術人員應當認識到,以上的實施方式僅是用來說明本發明,而並非用作為對本發明的限定,只要在本發明的實質精神範圍之內,對以上實施例所作的適當改變和變化都落在本發明要求保護的範圍之內。 It is to be understood by those skilled in the art that the above embodiments are only intended to illustrate the invention, and are not intended to limit the invention, as long as it is within the spirit of the invention Changes and modifications are intended to fall within the scope of the invention.
10‧‧‧燈罩 10‧‧‧shade
30‧‧‧電源連接器 30‧‧‧Power connector
Claims (8)
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TW99146821A TWI417480B (en) | 2010-12-30 | 2010-12-30 | Led lamp |
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TW99146821A TWI417480B (en) | 2010-12-30 | 2010-12-30 | Led lamp |
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TW201226796A TW201226796A (en) | 2012-07-01 |
TWI417480B true TWI417480B (en) | 2013-12-01 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM386439U (en) * | 2010-01-15 | 2010-08-11 | Qi-Bao Tang | LED lamp having heat dissipation fins |
CN201555144U (en) * | 2009-11-20 | 2010-08-18 | 周安平 | Led lighting bulb |
TWM392312U (en) * | 2010-05-21 | 2010-11-11 | zhen-yuan Liao | Bulb structure |
TWM395119U (en) * | 2010-06-09 | 2010-12-21 | Feng-Chyi Duh | The LED light with high efficient heatsink |
-
2010
- 2010-12-30 TW TW99146821A patent/TWI417480B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201555144U (en) * | 2009-11-20 | 2010-08-18 | 周安平 | Led lighting bulb |
TWM386439U (en) * | 2010-01-15 | 2010-08-11 | Qi-Bao Tang | LED lamp having heat dissipation fins |
TWM392312U (en) * | 2010-05-21 | 2010-11-11 | zhen-yuan Liao | Bulb structure |
TWM395119U (en) * | 2010-06-09 | 2010-12-21 | Feng-Chyi Duh | The LED light with high efficient heatsink |
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