CN206310277U - LED illumination lamp - Google Patents
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- CN206310277U CN206310277U CN201621266188.5U CN201621266188U CN206310277U CN 206310277 U CN206310277 U CN 206310277U CN 201621266188 U CN201621266188 U CN 201621266188U CN 206310277 U CN206310277 U CN 206310277U
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- 238000005286 illumination Methods 0.000 title 1
- 230000017525 heat dissipation Effects 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
本实用新型提供了一种LED照明灯具,包括灯罩、散热壳体、固定于散热壳体上的LED基板以及容置有驱动电路板的座体,所述LED基板上设置有多个发光二极管,所述散热壳体为中空壳体,所述座体固定于所述散热壳体内并与所述散热壳体的内壁之间形成有间隙,所述散热壳体的侧壁上开设有与所述间隙相连通的导气孔,所述散热壳体内还设置有散热风扇。本实用新型提供的这种LED照明灯具,LED基板产生的热量通过散热壳体与空气进行热交换,从而达到散热的目的,散热壳体内壁与座体之间的间隙作为导流槽,冷空气通过导气孔进入散热壳体内壁与座体之间的间隙,从而可以对散热壳体的内壁进行热交换,而散热风扇可以加速空气的流动,增强散热效果,有效提升散热效率。
The utility model provides an LED lighting fixture, which comprises a lampshade, a heat dissipation shell, an LED base plate fixed on the heat dissipation shell, and a base for accommodating a driving circuit board. The LED base plate is provided with a plurality of light emitting diodes. The heat dissipation shell is a hollow shell, the seat body is fixed in the heat dissipation shell and forms a gap with the inner wall of the heat dissipation shell, and the side wall of the heat dissipation shell is provided with a The gaps are connected with air guide holes, and a heat dissipation fan is also arranged in the heat dissipation housing. In the LED lighting fixture provided by the utility model, the heat generated by the LED substrate is exchanged with the air through the heat dissipation shell, so as to achieve the purpose of heat dissipation. The air guide hole enters the gap between the inner wall of the heat dissipation housing and the base body, so that heat exchange can be performed on the inner wall of the heat dissipation housing, and the cooling fan can accelerate the flow of air, enhance the heat dissipation effect, and effectively improve the heat dissipation efficiency.
Description
技术领域technical field
本实用新型涉及一种LED照明灯具,尤其涉及一种具有散热结构的LED照明灯具。The utility model relates to an LED lighting fixture, in particular to an LED lighting fixture with a heat dissipation structure.
背景技术Background technique
和传统光源相比,发光二极管(LED) 具有较高之发光效率( 光源温度较一般灯泡低)、低辐射、低耗电、寿命长、低电压、启动快速、环保、抗震抗压、灯具可小型化等优点,以LED作为光源的照明装置目前被广泛应用于各种照明,如室内照明、室外照明、可携式照明( 如手电筒)、情境照明等应用中。LED在工作时会产生热量,带有这些热量的空气与周围环境中的空气之间的流通进行散热,但此散热方式效果有限,特别在LED长时间工作后,仅用此种散热方式不能使产生的热量及时疏散,使LED温度升高,严重影响LED的发光效率及LED灯具的使用寿命。Compared with traditional light sources, light-emitting diodes (LEDs) have higher luminous efficiency (the temperature of the light source is lower than that of ordinary bulbs), low radiation, low power consumption, long life, low voltage, fast startup, environmental protection, shock resistance and pressure resistance, lamps can be Due to the advantages of miniaturization, lighting devices using LEDs as light sources are currently widely used in various lighting applications, such as indoor lighting, outdoor lighting, portable lighting (such as flashlights), and situational lighting. LEDs will generate heat when they work, and the circulation between the air with this heat and the air in the surrounding environment will dissipate heat, but the effect of this cooling method is limited, especially after the LED has been working for a long time, this cooling method alone cannot be used. The generated heat is evacuated in time, which increases the temperature of the LED and seriously affects the luminous efficiency of the LED and the service life of the LED lamp.
为了解决LED灯具的散热问题,现有技术中多采用在灯具壳体上增设散热鳍片,此种方式虽然有效的增加了散热面积,但是会增加LED灯具的体积和重量,另外过小的鳍片间距会引起灰尘杂质等在鳍片间隙内沉积,导致散热能力降低。In order to solve the heat dissipation problem of LED lamps, heat dissipation fins are often added to the lamp housing in the prior art. Although this method effectively increases the heat dissipation area, it will increase the volume and weight of LED lamps. In addition, too small fins Fin spacing will cause dust and impurities to deposit in the fin gap, resulting in reduced heat dissipation.
实用新型内容Utility model content
本实用新型的目的在于提供一种LED照明灯具,旨在用于解决现有的LED照明灯具体积和重量大、散热能力低的问题。The purpose of the utility model is to provide an LED lighting fixture, aiming at solving the problems of the existing LED lighting fixtures such as large volume and weight, and low heat dissipation capacity.
本实用新型是这样实现的:The utility model is achieved in that:
本实用新型提供一种LED照明灯具,包括灯罩、散热壳体、固定于散热壳体上的LED基板以及容置有驱动电路板的座体,所述LED基板上设置有多个发光二极管,所述散热壳体为中空壳体,所述座体固定于所述散热壳体内并与所述散热壳体的内壁之间形成有间隙,所述散热壳体的侧壁上开设有与所述间隙相连通的导气孔,所述散热壳体内还设置有散热风扇。The utility model provides an LED lighting fixture, which comprises a lampshade, a heat dissipation shell, an LED base plate fixed on the heat dissipation shell, and a base for accommodating a driving circuit board. The LED base plate is provided with a plurality of light-emitting diodes. The heat dissipation shell is a hollow shell, the seat body is fixed in the heat dissipation shell and forms a gap with the inner wall of the heat dissipation shell, and the side wall of the heat dissipation shell is provided with a The gaps are connected with air guide holes, and a heat dissipation fan is also arranged in the heat dissipation housing.
进一步地,所述导气孔包括第一导气孔与第二导气孔,所述第二导气孔相对第一导气孔远离LED基板。Further, the air guide hole includes a first air guide hole and a second air guide hole, and the second air guide hole is farther away from the LED substrate than the first air guide hole.
进一步地,所述散热壳体具有一顶壁,所述座体的顶面与所述散热壳体的顶壁之间具有空隙,所述散热风扇位于该空隙内。Further, the heat dissipation housing has a top wall, there is a gap between the top surface of the base and the top wall of the heat dissipation housing, and the heat dissipation fan is located in the gap.
进一步地,所述LED基板与散热壳体之间还设置有散热底盘,LED基板固定在该散热底盘上,LED基板产生的热量传导至该散热底盘,然后通过散热底盘传导至散热壳体。Further, a heat dissipation chassis is provided between the LED substrate and the heat dissipation housing, and the LED substrate is fixed on the heat dissipation chassis. The heat generated by the LED substrate is conducted to the heat dissipation chassis, and then to the heat dissipation housing through the heat dissipation chassis.
进一步地,所述散热底盘采用金属材料或者陶瓷材料制造。Further, the heat dissipation chassis is made of metal material or ceramic material.
进一步地,所述LED基板与散热底盘之间还设置有导热介质。Further, a heat conduction medium is also arranged between the LED substrate and the heat dissipation chassis.
进一步地,所述导热介质是石墨导热片、导热胶带或者陶瓷导热板中的一种。Further, the heat conduction medium is one of graphite heat conduction sheet, heat conduction tape or ceramic heat conduction plate.
进一步地,所述座体包括上座体与下座体,上座体和下座体之间通过卡扣的方式固定,上座体和下座体之间形成有一空腔,所述驱动电路板容置于该空腔内。Further, the base body includes an upper base body and a lower base body, the upper base body and the lower base body are fixed by buckling, a cavity is formed between the upper base body and the lower base body, and the drive circuit board accommodates in this cavity.
与现有技术相比,本实用新型具有以下有益效果:Compared with the prior art, the utility model has the following beneficial effects:
本实用新型提供的这种LED照明灯具,LED基板产生的热量通过散热壳体与空气进行热交换,从而达到散热的目的,散热壳体内壁与座体之间的间隙作为导流槽,冷空气通过导气孔进入散热壳体内壁与座体之间的间隙,从而可以对散热壳体的内壁进行热交换,而散热风扇可以加速空气的流动,增强散热效果,有效提升散热效率。In the LED lighting fixture provided by the utility model, the heat generated by the LED substrate is exchanged with the air through the heat dissipation shell, so as to achieve the purpose of heat dissipation. Through the air guide hole, it enters the gap between the inner wall of the heat dissipation housing and the base body, so that heat exchange can be performed on the inner wall of the heat dissipation housing, and the cooling fan can accelerate the flow of air, enhance the heat dissipation effect, and effectively improve the heat dissipation efficiency.
附图说明Description of drawings
图1为本实用新型实施例提供的一种LED照明灯具的立体图;Fig. 1 is a perspective view of an LED lighting fixture provided by an embodiment of the present invention;
图2为本实用新型实施例提供的一种LED照明灯具的散热方式图。Fig. 2 is a heat dissipation diagram of an LED lighting fixture provided by an embodiment of the present invention.
附图标记说明:1-灯罩、2-散热底盘、3-散热壳体、31-第一导气孔、32-第二导气孔、33-空隙、34-间隙、4-座体、41-上座体、42-下座体、43-空腔、44-驱动电路板、5-电源连接器、6-LED基板、7-散热风扇。Explanation of reference numerals: 1-lampshade, 2-radiating chassis, 3-radiating housing, 31-first air guiding hole, 32-second air guiding hole, 33-gap, 34-gap, 4-seat body, 41-upper seat Body, 42-lower seat body, 43-cavity, 44-drive circuit board, 5-power connector, 6-LED substrate, 7-cooling fan.
具体实施方式detailed description
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
如图1和图2所示,本实用新型实施例提供一种LED照明灯具,包括灯罩1、散热壳体3、固定于散热壳体3上的LED基板6以及容置有驱动电路板44的座体4,所述座体4底端还连接有一电源连接器5。所述LED基板6上设置有多个发光二极管,所述驱动电路板44与所述电源连接器5和所述LED基板6连接,所述驱动电路板44通过所述电源连接器5从外界获取电能以驱动发光二极管发光。As shown in Fig. 1 and Fig. 2, the embodiment of the utility model provides an LED lighting fixture, which includes a lampshade 1, a heat dissipation housing 3, an LED substrate 6 fixed on the heat dissipation housing 3, and a drive circuit board 44 accommodated therein. The base body 4 is further connected with a power connector 5 at the bottom end of the base body 4 . The LED substrate 6 is provided with a plurality of light-emitting diodes, the driving circuit board 44 is connected to the power connector 5 and the LED substrate 6, and the driving circuit board 44 is obtained from the outside through the power connector 5 Electric energy to drive light-emitting diodes to emit light.
所述散热壳体3为一端开口的圆柱形中空壳体,采用导电性能佳的散热材料制成,如铝合金等。所述座体4固定于所述散热壳体3内并与所述散热壳体3的内壁之间形成有间隙34,所述散热壳体3的侧壁上开设有与所述间隙34相连通的导气孔,本优选实施例中,所述导气孔包括第一导气孔31与第二导气孔32,散热壳体3包括相对设置的开口部与顶壁,散热壳体3靠近顶壁一端的外围侧壁上开设有若干第一导气孔31,散热壳体3靠近开口部一端的外围侧壁上开设有若干第二导气孔32,所述第二导气孔32相对第一导气孔31远离LED基板6。所述散热壳体3内还设置有散热风扇7,所述座体4的顶面与所述散热壳体3的顶壁之间具有空隙33,所述散热风扇7位于该空隙33内。The heat dissipation shell 3 is a cylindrical hollow shell with one end open, and is made of a heat dissipation material with good electrical conductivity, such as aluminum alloy. The seat body 4 is fixed in the heat dissipation housing 3 and forms a gap 34 with the inner wall of the heat dissipation housing 3 , and a gap 34 is formed on the side wall of the heat dissipation housing 3 to communicate with the gap 34 . In this preferred embodiment, the air guide holes include a first air guide hole 31 and a second air guide hole 32. The heat dissipation housing 3 includes an opening and a top wall that are oppositely arranged. A number of first air guide holes 31 are opened on the peripheral side wall, and a number of second air guide holes 32 are opened on the peripheral side wall of the end of the heat dissipation housing 3 near the opening. Substrate6. A heat dissipation fan 7 is also arranged in the heat dissipation housing 3 , there is a gap 33 between the top surface of the base body 4 and the top wall of the heat dissipation housing 3 , and the heat dissipation fan 7 is located in the gap 33 .
本优选实施例中,所述LED基板6与散热壳体3之间还设置有散热底盘2,所述散热底盘2采用导热性良好的铝基材制成,在其他实施例中所述散热底盘2可以采用其他金属材料或者陶瓷材料制造。LED基板6固定在该散热底盘2上,散热底盘2固定在所述LED基板6上,LED基板6产生的热量传导至该散热底盘2,然后通过散热底盘2传导至散热壳体3。所述LED基板6与散热底盘2之间还设置有导热介质,本实施例中所述导热介质采用石墨导热片,在其他实施例中,所述导热介质还可以采用导热胶带或者陶瓷导热板等,所述导热介质用于将LED基板6工作时散发的热量均匀地传导至散热底盘2。In this preferred embodiment, a heat dissipation chassis 2 is also provided between the LED substrate 6 and the heat dissipation housing 3, and the heat dissipation chassis 2 is made of an aluminum substrate with good thermal conductivity. In other embodiments, the heat dissipation chassis 2 can be made of other metal materials or ceramic materials. The LED substrate 6 is fixed on the heat dissipation chassis 2 , and the heat dissipation chassis 2 is fixed on the LED substrate 6 . The heat generated by the LED substrate 6 is conducted to the heat dissipation chassis 2 , and then to the heat dissipation housing 3 through the heat dissipation chassis 2 . A heat conduction medium is also arranged between the LED substrate 6 and the heat dissipation chassis 2. In this embodiment, the heat conduction medium adopts a graphite heat conduction sheet. In other embodiments, the heat conduction medium can also use a heat conduction tape or a ceramic heat conduction plate, etc. , the heat conduction medium is used to evenly conduct the heat dissipated by the LED substrate 6 to the heat dissipation chassis 2 during operation.
进一步地,所述座体4包括上座体41与下座体42,上座体41和下座体42均采用绝缘材料制成,如塑胶材料。上座体41和下座体42之间通过卡扣的方式固定,在上座体41和下座体42之间形成有一空腔43,所述驱动电路板44容置于该空腔43内。在其他实施方式中,上座体41和下座体42之间可通过胶粘或者螺纹锁附等其他方式固定。Further, the base body 4 includes an upper base body 41 and a lower base body 42, both of which are made of insulating materials, such as plastic materials. The upper base body 41 and the lower base body 42 are fixed by buckling, and a cavity 43 is formed between the upper base body 41 and the lower base body 42 , and the driving circuit board 44 is accommodated in the cavity 43 . In other embodiments, the upper base body 41 and the lower base body 42 may be fixed by other methods such as gluing or screw locking.
如图2所示,LED照明灯具工作时,发光二极管产生的热量经由导热介质传导至散热底盘2,再由散热底盘2传导至散热壳体3,通过散热壳体3与空气进行热交换,从而达到散热的目的。散热壳体3内壁与上座体41之间的间隙34和空隙33作为导流槽,在所述散热风扇7的作用下,冷空气从远离发光二极管的第二导气孔32进入散热壳体3的内侧壁与上座体41之间的间隙34,经由上座体41的顶面与散热壳体3的顶壁之间的空隙33从第一导气孔31排出。 从第二导气孔32进入间隙34和空隙33的冷空气可以对散热壳体3的内侧壁与顶壁进行热交换,有效提升散热效率。As shown in Figure 2, when the LED lighting fixture is working, the heat generated by the light-emitting diode is conducted to the heat dissipation chassis 2 through the heat conduction medium, and then conducted to the heat dissipation housing 3 by the heat dissipation chassis 2, and the heat exchange with the air is carried out through the heat dissipation housing 3, thereby To achieve the purpose of heat dissipation. The gap 34 and the gap 33 between the inner wall of the heat dissipation housing 3 and the upper base 41 are used as guide grooves. Under the action of the heat dissipation fan 7, cold air enters the heat dissipation housing 3 from the second air guide hole 32 away from the light-emitting diodes. The gap 34 between the inner side wall and the upper base body 41 is discharged from the first air guide hole 31 through the gap 33 between the top surface of the upper base body 41 and the top wall of the heat dissipation housing 3 . The cold air entering the gap 34 and the gap 33 from the second air guide hole 32 can perform heat exchange on the inner wall and the top wall of the heat dissipation housing 3 , effectively improving the heat dissipation efficiency.
以上所述仅为本实用新型的较佳实施例而已,并不用以限制本实用新型,凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included in the Within the protection scope of the present utility model.
Claims (8)
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| CN201621266188.5U CN206310277U (en) | 2016-11-24 | 2016-11-24 | LED illumination lamp |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109323140A (en) * | 2018-09-12 | 2019-02-12 | 上海三思电子工程有限公司 | LED lighting equipment |
| WO2020052078A1 (en) * | 2018-09-12 | 2020-03-19 | 上海三思电子工程有限公司 | Led illumination device |
| CN113370678A (en) * | 2021-06-01 | 2021-09-10 | 深圳市源铭科技有限公司 | High-strength LED-UV lamp bead module |
-
2016
- 2016-11-24 CN CN201621266188.5U patent/CN206310277U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109323140A (en) * | 2018-09-12 | 2019-02-12 | 上海三思电子工程有限公司 | LED lighting equipment |
| WO2020052078A1 (en) * | 2018-09-12 | 2020-03-19 | 上海三思电子工程有限公司 | Led illumination device |
| CN113370678A (en) * | 2021-06-01 | 2021-09-10 | 深圳市源铭科技有限公司 | High-strength LED-UV lamp bead module |
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Granted publication date: 20170707 |