TWI416045B - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
TWI416045B
TWI416045B TW99146785A TW99146785A TWI416045B TW I416045 B TWI416045 B TW I416045B TW 99146785 A TW99146785 A TW 99146785A TW 99146785 A TW99146785 A TW 99146785A TW I416045 B TWI416045 B TW I416045B
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TW
Taiwan
Prior art keywords
heat dissipation
heat
housing
base
dissipation base
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Application number
TW99146785A
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Chinese (zh)
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TW201226798A (en
Inventor
Shao Han Chang
Qing-Shan Cao
Xiao-Man Pu
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Hon Hai Prec Ind Co Ltd
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Priority to TW99146785A priority Critical patent/TWI416045B/en
Publication of TW201226798A publication Critical patent/TW201226798A/en
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Publication of TWI416045B publication Critical patent/TWI416045B/en

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Abstract

An LED lamp includes a housing, a substrate including a plurality of LEDs, a connector and a circuit board. The LED lamp further includes a base, the substrate is fixed on the top of the base, and the circuit board is received in the base. The base is received in the housing. The housing and the top of the base corporately defines a plurality of air-guiding holes, each of the holes communicate with its adjacent holes. An inner flow field is formed between the housing and the base for air-guiding holes.

Description

LED照明燈具 LED lighting

本發明涉及一種LED照明燈具,特別涉及一種具有散熱結構的LED照明燈具。 The invention relates to an LED lighting fixture, in particular to an LED lighting fixture with a heat dissipation structure.

和傳統光源相比,發光二極體(LED)具有較高之發光效率(光源溫度較一般燈泡低)、低輻射、低耗電、壽命長、低電壓、啟動快速、環保、抗震抗壓、燈具可小型化等優點,以LED作為光源的照明裝置目前被廣泛應用於各種照明,如室內照明、室外照明、可攜式照明(如手電筒)、情境照明等應用中。LED在工作時會產生熱量,帶有這些熱量的空氣與周圍環境中的空氣之間的流通進行散熱,但此散熱方式效果有限,特別在LED長時間工作後,僅用此種散熱方式不能使產生的熱量及時疏散,使LED溫度升高,嚴重影響LED的發光效率及LED燈具的使用壽命。 Compared with traditional light sources, light-emitting diodes (LEDs) have higher luminous efficiency (light source temperature is lower than general bulbs), low radiation, low power consumption, long life, low voltage, fast start-up, environmental protection, anti-seismic compression, Lighting fixtures can be miniaturized. Lighting devices using LEDs as light sources are currently used in a variety of lighting applications, such as indoor lighting, outdoor lighting, portable lighting (such as flashlights), and ambient lighting. The LED generates heat during operation, and the heat between the air with the heat and the air in the surrounding environment dissipates heat, but the heat dissipation method has limited effect, especially after the LED is used for a long time, the heat dissipation method alone cannot be used. The generated heat is evacuated in time, which causes the LED temperature to rise, which seriously affects the luminous efficiency of the LED and the service life of the LED lamp.

為了解決LED燈具的散熱問題,現有技術中多採用在燈具殼體上增設散熱鰭片,此種方式雖然有效的增加了散熱面積,但是會增加LED燈具的體積和重量,另外過小的鰭片間距會引起灰塵雜質等在鰭片間隙內沉積,導致散熱能力降低。 In order to solve the problem of heat dissipation of LED lamps, in the prior art, heat-dissipating fins are added to the lamp housing. Although this method effectively increases the heat dissipation area, it increases the volume and weight of the LED lamps, and the fin spacing is too small. It can cause dust impurities and the like to deposit in the fin gap, resulting in a decrease in heat dissipation capability.

有鑒於此,本發明提供一種輕便且散熱良好的LED照明燈具。 In view of this, the present invention provides an LED lighting fixture that is lightweight and has good heat dissipation.

一種LED照明燈具,包括散熱殼體、LED基板、驅動電路板以及電源連接器,所述LED基板上設置有多個發光二極體。LED照明燈具還包括一散熱底座,所述LED基板固定在該散熱底座頂部,驅動電路板收納於該散熱底座底部。所述散熱殼體為兩端開口的空心殼體,散熱殼體一端與電源連接器連接,另一端與散熱底座頂部相固定,散熱底座容納於散熱殼體內部。所述散熱底座頂部和散熱殼體上設有相互連通的導流孔。 An LED lighting fixture includes a heat dissipation housing, an LED substrate, a driving circuit board, and a power connector, and the LED substrate is provided with a plurality of light emitting diodes. The LED lighting fixture further includes a heat dissipation base, the LED substrate is fixed on the top of the heat dissipation base, and the driving circuit board is received at the bottom of the heat dissipation base. The heat dissipation housing is a hollow housing that is open at both ends, and one end of the heat dissipation housing is connected to the power connector, the other end is fixed to the top of the heat dissipation base, and the heat dissipation base is accommodated inside the heat dissipation housing. The heat dissipation base top and the heat dissipation housing are provided with flow guiding holes that communicate with each other.

LED照明燈具工作時,散熱底座頂部與散熱殼體上開設的導流孔使散熱殼體與散熱底座之間形成一個內流場,冷空氣從散熱殼體上開設的導流孔進入,從散熱底座上開設的導流孔排出。冷空氣可以對散熱底座底部以及散熱殼體內側壁進行熱交換,有效提升散熱效率。由於利用散熱殼體和散熱底座同時散熱,在LED照明燈具的工作過程中,散熱殼體表面的溫度的較低,用戶無意間觸摸到LED照明燈具也不會因為散熱殼體過熱受到傷害。 When the LED lighting device is working, the air guiding hole formed on the top of the heat dissipating base and the heat dissipating housing forms an internal flow field between the heat dissipating housing and the heat dissipating base, and the cold air enters from the diversion hole opened in the heat dissipating housing to dissipate heat. The diversion hole opened on the base is discharged. The cold air can exchange heat with the bottom of the heat dissipation base and the inner side wall of the heat dissipation housing, thereby effectively improving the heat dissipation efficiency. Since the heat dissipation housing and the heat dissipation base simultaneously dissipate heat, during the operation of the LED lighting fixture, the temperature of the surface of the heat dissipation housing is low, and the user inadvertently touches the LED lighting fixture and is not damaged by the overheating of the heat dissipation housing.

100‧‧‧LED照明燈具 100‧‧‧LED lighting

10‧‧‧燈罩 10‧‧‧shade

20‧‧‧散熱底座 20‧‧‧heating base

21‧‧‧頂部 21‧‧‧ top

22‧‧‧底部 22‧‧‧ bottom

23‧‧‧凹部 23‧‧‧ recess

24‧‧‧容納部 24‧‧‧ Housing

25‧‧‧後蓋 25‧‧‧ Back cover

26‧‧‧散熱鰭片 26‧‧‧ Heat sink fins

30‧‧‧散熱殼體 30‧‧‧Solid housing

31‧‧‧第一開口部 31‧‧‧First opening

32‧‧‧第二開口部 32‧‧‧second opening

40‧‧‧電源連接器 40‧‧‧Power connector

50‧‧‧LED基板 50‧‧‧LED substrate

51‧‧‧發光二極體 51‧‧‧Lighting diode

52‧‧‧螺絲 52‧‧‧ screws

60‧‧‧驅動電路板 60‧‧‧Drive Circuit Board

71‧‧‧第一導流孔 71‧‧‧First diversion hole

72‧‧‧第二導流孔 72‧‧‧Second diversion hole

圖1為本發明一實施方式中LED照明燈具的立體圖。 1 is a perspective view of an LED lighting fixture in accordance with an embodiment of the present invention.

圖2為圖1中LED照明燈具的爆炸圖。 2 is an exploded view of the LED lighting fixture of FIG. 1.

圖3為圖1中LED照明燈具的散熱底座的結構示意圖。 3 is a schematic structural view of a heat dissipation base of the LED lighting fixture of FIG. 1.

圖4為圖1中LED照明燈具的散熱殼體的結構示意圖。 4 is a schematic structural view of a heat dissipation housing of the LED lighting fixture of FIG. 1.

圖5為圖1中LED照明燈具的散熱方式示意圖。 FIG. 5 is a schematic diagram of a heat dissipation mode of the LED lighting fixture of FIG. 1. FIG.

請參考圖1,LED照明燈具100包括燈罩10、散熱底座20、散熱殼 體30以及電源連接器40。燈罩10固定在散熱底座20上,散熱底座20與電源連接器40分別固定在散熱殼體30的兩端。電源連接器40用來與電源相連接,電源連接器40為通用的電源介面,如螺口電源連接器或者卡口電源連接器。 Referring to FIG. 1 , the LED lighting fixture 100 includes a lampshade 10 , a heat dissipation base 20 , and a heat dissipation shell . Body 30 and power connector 40. The lamp cover 10 is fixed on the heat dissipation base 20, and the heat dissipation base 20 and the power connector 40 are respectively fixed at both ends of the heat dissipation housing 30. The power connector 40 is used to connect to a power source, and the power connector 40 is a universal power interface such as a screw power connector or a bayonet power connector.

請參閱圖2,LED照明燈具100還包括LED基板50和驅動電路板60。所述LED基板50上還安裝有多個發光二極體51。驅動電路板60與電源連接器40和LED基板50電連接,所述驅動電路板60通過電源連接器40從外界獲取電能以驅動發光二極體51發光。 Referring to FIG. 2, the LED lighting fixture 100 further includes an LED substrate 50 and a driving circuit board 60. A plurality of light emitting diodes 51 are also mounted on the LED substrate 50. The driving circuit board 60 is electrically connected to the power connector 40 and the LED substrate 50, and the driving circuit board 60 obtains electric energy from the outside through the power connector 40 to drive the light emitting diode 51 to emit light.

燈罩10固定在散熱底座20的一端,發光二極體51發出的光線穿過燈罩10射出到LED照明燈具100的外部。燈罩10可以通過螺紋連接、機械卡扣、膠黏等固定方式與散熱底座20相固定。在本實施方式中,燈罩10採用透明塑膠為基材,並在其中混合適當比例的光擴散粒子,增加光散射效果並使光柔和化。在其他實施方式中,還可以在所述燈罩10內表面設置粗糙表面來增加燈罩的光漫散射效果。 The lamp cover 10 is fixed to one end of the heat dissipation base 20, and the light emitted from the light-emitting diode 51 is emitted through the lamp cover 10 to the outside of the LED lighting device 100. The lampshade 10 can be fixed to the heat dissipation base 20 by a screw connection, a mechanical snap, an adhesive or the like. In the present embodiment, the lampshade 10 uses a transparent plastic as a substrate, and mixes light diffusion particles in an appropriate ratio therein to increase the light scattering effect and soften the light. In other embodiments, a rough surface may be provided on the inner surface of the lampshade 10 to increase the light diffusing scattering effect of the lampshade.

請一併結合圖3,散熱底座20的頂部21為圓盤狀,該圓盤的上表面形成有一凹部23,所述LED基板50固定在凹部23內。在本實施方式中,LED基板50通過螺絲52固定在凹部23內。優選的,所述LED基板50與散熱底座20的頂部21之間還設有導熱介質(圖未示出),用於將LED基板50工作時散發的熱量均勻地傳導至散熱底座20。在本實施方式中,LED基板50與散熱底座20的頂部21之間的導熱介質是石墨導熱片、導熱膠帶或者陶瓷導熱板中的一種。散熱底座20的頂部21的邊緣設置有至少一個第一導流孔71。 Referring to FIG. 3 together, the top portion 21 of the heat dissipation base 20 has a disk shape, and the upper surface of the disk is formed with a recess 23, and the LED substrate 50 is fixed in the recess 23. In the present embodiment, the LED substrate 50 is fixed in the recess 23 by a screw 52. Preferably, a heat conducting medium (not shown) is disposed between the LED substrate 50 and the top portion 21 of the heat dissipation base 20 for uniformly conducting heat emitted by the LED substrate 50 to the heat dissipation base 20. In the present embodiment, the heat transfer medium between the LED substrate 50 and the top portion 21 of the heat sink base 20 is one of a graphite heat conductive sheet, a heat conductive tape, or a ceramic heat conductive plate. The edge of the top portion 21 of the heat dissipation base 20 is provided with at least one first flow guiding hole 71.

散熱底座20的底部22設有一容納部24,驅動電路板60收納於該容納部24內。在本實施方式中,容納部24上還扣合了一後蓋25,該後蓋25將驅動電路板60密封於容納部24內,提高LED照明燈具100的氣密性與水密性。所述後蓋25可以採用膠黏的方式扣合在容納部24上。在散熱底座20的底部22還設置有相互間隔一定距離的多個散熱鰭片26,所述散熱鰭片26與容納部24相背的設置在散熱底座20的底部。散熱鰭片26用來增加散熱底座20的表面積,從而增加了與空氣的接觸面積,進而提高了散熱效率。 The bottom portion 22 of the heat dissipation base 20 is provided with a receiving portion 24 in which the driving circuit board 60 is housed. In the present embodiment, a rear cover 25 is also fastened to the accommodating portion 24, and the rear cover 25 seals the driving circuit board 60 in the accommodating portion 24 to improve the airtightness and watertightness of the LED lighting device 100. The back cover 25 can be snap-fitted onto the receiving portion 24 in an adhesive manner. The bottom portion 22 of the heat dissipation base 20 is further provided with a plurality of heat dissipation fins 26 spaced apart from each other by a distance, and the heat dissipation fins 26 are disposed opposite to the receiving portion 24 at the bottom of the heat dissipation base 20. The heat dissipation fins 26 are used to increase the surface area of the heat dissipation base 20, thereby increasing the contact area with the air, thereby improving the heat dissipation efficiency.

在本實施方式中,散熱底座20採用導熱性佳的散熱材料製成,如鋁合金等,所述容納部24內填充有導熱材料,用以將驅動電路板60散發的熱量傳導至散熱鰭片26散發到外部。由LED基板50工作時散發的熱量經由導熱介質傳導至散熱底座20,然後傳導至散熱鰭片26散發。 In the present embodiment, the heat dissipation base 20 is made of a heat-dissipating heat-dissipating material, such as an aluminum alloy, and the receiving portion 24 is filled with a heat-conducting material for conducting heat radiated from the driving circuit board 60 to the heat-dissipating fins. 26 is distributed to the outside. The heat radiated by the LED substrate 50 is conducted to the heat dissipation base 20 via the heat conductive medium, and then conducted to the heat dissipation fins 26 for dissipation.

請一併結合圖2和圖4,散熱殼體30為兩端開口的空心殼體,採用導熱性佳的散熱材料製成,如鋁合金等。散熱殼體30包括相對設置的第一開口部31與第二開口部32。散熱殼體30在第一開口部31與散熱底座20頂部通過螺紋結合,散熱底座20容納於散熱殼體30內部。散熱底座20與散熱殼體30通過螺紋的方式固定,可以增大散熱底座20與散熱殼體30之間的接觸面積,加快散熱速度。在散熱底座20與散熱殼體30的螺紋結合處還可以填充導熱膠或者其他導熱介質,進一步改善間隙間的空氣熱阻。散熱殼體30的第二開口部32與電源連接器40相固定。散熱殼體30在所述第二開口部32處設置有至少一個第二導流孔72。該第二導流孔72與第一導流孔 71相互連通。 Referring to FIG. 2 and FIG. 4 together, the heat dissipating housing 30 is a hollow shell which is open at both ends, and is made of a heat dissipating material having good thermal conductivity, such as an aluminum alloy. The heat dissipation housing 30 includes a first opening portion 31 and a second opening portion 32 that are oppositely disposed. The heat dissipation housing 30 is screwed to the top of the heat dissipation base 20 at the first opening portion 31, and the heat dissipation base 20 is housed inside the heat dissipation housing 30. The heat dissipation base 20 and the heat dissipation housing 30 are fixed by screws, so that the contact area between the heat dissipation base 20 and the heat dissipation housing 30 can be increased, and the heat dissipation speed can be accelerated. At the screw joint of the heat dissipation base 20 and the heat dissipation housing 30, a thermal conductive adhesive or other heat conductive medium may be further filled to further improve the air thermal resistance between the gaps. The second opening portion 32 of the heat dissipation housing 30 is fixed to the power connector 40. The heat dissipation housing 30 is provided with at least one second flow guiding hole 72 at the second opening portion 32. The second air guiding hole 72 and the first air guiding hole 71 are connected to each other.

請參考圖5,LED照明燈具100工作時,發光二極體51產生的熱量經由導熱介質傳導至散熱底座20頂部,再由散熱底座20頂部傳導至散熱殼體30以及散熱底座20底部的散熱鰭片26。傳導至散熱殼體30的熱量直接與空氣進行熱交換,從而將熱量散發散熱。散熱底座20頂部的第一導流孔71與散熱殼體30第二開口部32的第二導流孔72使散熱殼體30與散熱底座20之間形成一個內流場,冷空氣從遠離發光二極體51的第二導流孔72進入,從第一導流孔71排出。從第一導流孔71進入的冷空氣可以對散熱鰭片26以及散熱殼體30內側壁進行熱交換,有效提升散熱效率。由於利用散熱殼體30和散熱底座20同時散熱,在LED照明燈具100的工作過程中,散熱殼體30表面的溫度較低,用戶無意間觸摸到LED照明燈具100也不會因為散熱殼體30過熱受到傷害。 Referring to FIG. 5 , when the LED lighting fixture 100 is in operation, the heat generated by the LEDs 51 is conducted to the top of the heat dissipation base 20 via the heat conductive medium, and then radiated from the top of the heat dissipation base 20 to the heat dissipation housing 30 and the heat dissipation fins at the bottom of the heat dissipation base 20 . Sheet 26. The heat conducted to the heat dissipation case 30 is directly exchanged with the air to dissipate heat. The first air guiding hole 71 at the top of the heat dissipation base 20 and the second air guiding hole 72 of the second opening portion 32 of the heat dissipation housing 30 form an internal flow field between the heat dissipation housing 30 and the heat dissipation base 20, and the cold air is emitted from the far side. The second air guiding hole 72 of the diode 51 enters and is discharged from the first air guiding hole 71. The cold air entering from the first air guiding hole 71 can exchange heat between the heat dissipation fins 26 and the inner side walls of the heat dissipation housing 30, thereby effectively improving heat dissipation efficiency. Since the heat dissipation housing 30 and the heat dissipation base 20 simultaneously dissipate heat, during the operation of the LED lighting fixture 100, the temperature of the surface of the heat dissipation housing 30 is low, and the user inadvertently touches the LED lighting fixture 100 without the heat dissipation housing 30. Overheating is hurt.

本技術領域的普通技術人員應當認識到,以上的實施方式僅是用來說明本發明,而並非用作為對本發明的限定,只要在本發明的實質精神範圍之內,對以上實施例所作的適當改變和變化都落在本發明要求保護的範圍之內。 It is to be understood by those skilled in the art that the above embodiments are only intended to illustrate the invention, and are not intended to limit the invention, as long as it is within the spirit of the invention Changes and modifications are intended to fall within the scope of the invention.

10‧‧‧燈罩 10‧‧‧shade

20‧‧‧散熱底座 20‧‧‧heating base

21‧‧‧頂部 21‧‧‧ top

22‧‧‧底部 22‧‧‧ bottom

23‧‧‧凹部 23‧‧‧ recess

25‧‧‧後蓋 25‧‧‧ Back cover

26‧‧‧散熱鰭片 26‧‧‧ Heat sink fins

30‧‧‧散熱殼體 30‧‧‧Solid housing

31‧‧‧第一開口部 31‧‧‧First opening

32‧‧‧第二開口部 32‧‧‧second opening

40‧‧‧電源連接器 40‧‧‧Power connector

50‧‧‧LED基板 50‧‧‧LED substrate

51‧‧‧發光二極體 51‧‧‧Lighting diode

52‧‧‧螺絲 52‧‧‧ screws

60‧‧‧驅動電路板 60‧‧‧Drive Circuit Board

71‧‧‧第一導流孔 71‧‧‧First diversion hole

Claims (7)

一種LED照明燈具,包括散熱殼體、LED基板、驅動電路板以及電源連接器,所述LED基板上設置有多個發光二極體,其改良在於,還包括一散熱底座,所述LED基板固定在該散熱底座頂部,散熱底座底部設有一容納部,驅動電路板收納於該容納部內,散熱底座的頂部的邊緣設置有至少一個第一導流孔,所述散熱底座底部還設置有相互間隔一定距離的多個散熱鰭片,該散熱鰭片與容納部相背的設置在散熱底座底部;所述散熱殼體為兩端開口的空心殼體,散熱殼體包括相對設置的第一開口部與第二開口部,散熱殼體的第二開口部與電源連接器連接,所述第一開口部與散熱底座頂部相固定,散熱底座容納於散熱殼體內部,散熱殼體在所述第二開口部處設置有至少一個第二導流孔;該第二導流孔與第一導流孔相互連通,使散熱殼體與散熱底座之間形成一個內流場。 An LED lighting fixture includes a heat dissipating housing, an LED substrate, a driving circuit board, and a power connector. The LED substrate is provided with a plurality of light emitting diodes, and the improvement thereof comprises: a heat dissipating base, wherein the LED substrate is fixed The bottom of the heat dissipation base is provided with a receiving portion at the bottom of the heat dissipation base, and the driving circuit board is received in the receiving portion, and at least one first guiding hole is disposed at an edge of the top of the heat dissipation base, and the bottom of the heat dissipation base is further disposed at a distance from each other. a plurality of heat dissipating fins disposed at a bottom of the heat dissipating base opposite to the receiving portion; the heat dissipating housing is a hollow shell that is open at both ends, and the heat dissipating housing includes a first opening portion opposite to the receiving portion a second opening portion, the second opening portion of the heat dissipation housing is connected to the power connector, the first opening portion is fixed to the top of the heat dissipation base, the heat dissipation base is received in the heat dissipation housing, and the heat dissipation housing is in the second opening At least one second guiding hole is disposed at the portion; the second guiding hole and the first guiding hole communicate with each other to form an internal flow field between the heat dissipation housing and the heat dissipation base 如申請專利範圍第1項所述之LED照明燈具,其中,所述散熱底座頂部為圓盤狀,該圓盤的上表面形成有一凹部,所述LED基板固定在凹部內。 The LED lighting fixture of claim 1, wherein the top of the heat dissipation base has a disk shape, and the upper surface of the disk is formed with a recess, and the LED substrate is fixed in the recess. 如申請專利範圍第2項所述之LED照明燈具,其中,所述LED基板與散熱底座之間還設置有導熱介質,LED基板產生的熱量經由導熱介質傳導至散熱底座。 The LED lighting fixture of claim 2, wherein a heat conductive medium is disposed between the LED substrate and the heat dissipation base, and heat generated by the LED substrate is conducted to the heat dissipation base via the heat conductive medium. 如申請專利範圍第3項所述之LED照明燈具,其中,所述導熱介質是石墨導熱片、導熱膠帶或者陶瓷導熱板中的一種。 The LED lighting fixture of claim 3, wherein the heat conducting medium is one of a graphite heat conducting sheet, a heat conducting tape or a ceramic heat conducting plate. 如申請專利範圍第1項所述之LED照明燈具,其中,所述容納部上還扣合了一後蓋,該後蓋將驅動電路板密封於容納部內。 The LED lighting fixture of claim 1, wherein the receiving portion further engages a rear cover, and the rear cover seals the driving circuit board in the receiving portion. 如申請專利範圍第1項所述之LED照明燈具,其中,所述散熱殼體與散熱底座頂部通過螺紋結合。 The LED lighting fixture of claim 1, wherein the heat dissipation housing is screwed to the top of the heat dissipation base. 如申請專利範圍第1項所述之LED照明燈具,其中,所述散熱底座頂部與散熱殼體的螺紋結合處填充有導熱介質。 The LED lighting fixture of claim 1, wherein the threaded joint of the top of the heat dissipating base and the heat dissipating housing is filled with a heat conducting medium.
TW99146785A 2010-12-30 2010-12-30 Led lamp TWI416045B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206104A (en) * 2005-04-08 2009-09-10 Toshiba Lighting & Technology Corp Self-ballasted lamp
TWM379021U (en) * 2009-10-26 2010-04-21 Ray-Tang Chen Light-emitting diode bulb
TWM385659U (en) * 2010-02-04 2010-08-01 Forson Dev Co Ltd Lamp with heat dissipation structure
TWM391626U (en) * 2010-06-15 2010-11-01 Gem Sun Technologies Co Ltd LED lamp having air flow guiding function

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206104A (en) * 2005-04-08 2009-09-10 Toshiba Lighting & Technology Corp Self-ballasted lamp
TWM379021U (en) * 2009-10-26 2010-04-21 Ray-Tang Chen Light-emitting diode bulb
TWM385659U (en) * 2010-02-04 2010-08-01 Forson Dev Co Ltd Lamp with heat dissipation structure
TWM391626U (en) * 2010-06-15 2010-11-01 Gem Sun Technologies Co Ltd LED lamp having air flow guiding function

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