TWM272039U - Heat dissipation structure of lighting appliances - Google Patents
Heat dissipation structure of lighting appliances Download PDFInfo
- Publication number
- TWM272039U TWM272039U TW94201151U TW94201151U TWM272039U TW M272039 U TWM272039 U TW M272039U TW 94201151 U TW94201151 U TW 94201151U TW 94201151 U TW94201151 U TW 94201151U TW M272039 U TWM272039 U TW M272039U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat dissipation
- item
- scope
- casing
- Prior art date
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
M272039 四、創作說明(1) 、 【新型所屬之技術領域】 本創作係有關一種照明設備之散熱結構,尤指一種具 有多種散熱模式組裝及快速散熱效果之照明設備,可以照 安裝不同位置或環境來改變散熱輸出方向,以達增進光源 產生元件使用壽命。 【先前技術】 已知,發光二極體已廣泛被運用在照明設備上,因此 也同時被製作成具有高效率、高功率及高亮度等特性。如M272039 4. Creation Description (1), [Technical Field of New Type] This creation relates to the heat dissipation structure of a lighting device, especially a lighting device with multiple heat dissipation modes for assembly and fast heat dissipation effects. It can be installed in different locations or environments. To change the direction of heat output, in order to improve the service life of the light source generating element. [Prior art] It is known that light-emitting diodes have been widely used in lighting equipment, so they are also manufactured to have characteristics such as high efficiency, high power, and high brightness. Such as
此’高效率、高功率及高亮度之發光二極體在使用時,相 對會產生極高之熱源,在加上發光二極體被封裝於密閉式 殼體内部,在長時間點亮使用下,將導致發光二極體之熱 源無法散去,造成發光二極體因溫度過高而損壞。 於是’業者為了解決上述缺失,在製作發光二極體 時,於發光二極體之腳架或腳座上形成有散熱結構,藉此 散熱結構將發光二極體所產生之熱源吸取並散去,以增長 發光二極體使用壽命。但是,此種散熱結構在吸取發光二 極體所產生之熱源後,同樣也是將熱源散至於穷之殼 ,内部、,無法有效排至於殼體外部,依舊導致&熱效果不 1 ’而造成發光二極體的使用壽命減短。 同時二=^ =系有於燈具内部增設有一散熱導流罩, 5 3 後方配置有一風扇(如本國專利公告第 罩所不),藉由風扇轉動經散熱導流This' high-efficiency, high-power and high-brightness light-emitting diode, when used, will relatively generate a very high heat source. When the light-emitting diode is added, it is packaged in a sealed housing and used for a long time. Will cause the heat source of the light-emitting diode cannot be dissipated, resulting in the light-emitting diode being damaged due to excessive temperature. Therefore, in order to solve the above-mentioned shortcomings, in the manufacture of light-emitting diodes, a heat dissipation structure is formed on the tripod or foot of the light-emitting diode, thereby absorbing and dissipating the heat source generated by the light-emitting diode. To increase the life of the light-emitting diode. However, after absorbing the heat source generated by the light-emitting diode, this heat dissipation structure also dissipates the heat source to the poor shell. The interior can not be effectively discharged to the outside of the housing, which still results in & thermal effect not being 1 '. The life of the light emitting diode is shortened. At the same time, two = ^ = is provided with a heat dissipation shroud inside the lamp, and a fan is arranged at the rear of the lamp (such as the cover of the national patent announcement).
Km:是此種設計散熱速度,,且散熱模式 疋一種,易造成散熱效果不彰。Km: This is the heat dissipation speed of this design, and there is only one heat dissipation mode, which may cause the heat dissipation effect to be poor.
第5頁 M272039 四、創作說明(2)Page 5 M272039 IV. Creation Instructions (2)
【新型内容J 本創作之主要目的,在於解決上述傳統缺失, 失存在,本創作於照明設備之散熱結構重新設 ^缺 結構具有多種散熱模式組裝,以達快速散熱之目的:A t 也確保光源產生元件的使用壽命。 之目的,同時 為達上述之目的,本創作之照明設 括有:-殼體,於前端面上具-厚實⑨,該;旱實 ;殼體内部㈣之孔;-反射元件,係配置於前述殼:内 ΐ、“ ϊ置於前述反射元件内部;一散熱元件,係配置於 =^ 一.凡件上’其上至有有一接觸部與前述殼體貼合接 i /源產生兀件係配置於前述散熱元件並對應前述反 :2 ^ Z置:一風量產生元件,係配置於前述散熱元件上 攸扣%姐’係配置於前述殼體上;一配置於殼體内部之電 才=構成·,以前述之散熱元件在吸取光源產生元件所產 源後,在風量產生元件將殼體内部空氣與外部空氣 【ϊ施方=散熱元件所吸取之熱源排至於殼體外部。 明如下有關本創作之技術内容及詳細說明,現配合圖式說 請參閱「第一、一同% — μ康外 觀分解及立體U所不」,係本創作之照明設備: 一聚光元件2 3、一 6、一蓋體7及 4、一光源產生元件5、-風量產生元件 電路板8所構成一具有散熱結構之燈具 熱結構’包括有:一殼體卜一:„月反射元件[New content J The main purpose of this creation is to solve the above-mentioned traditional deficiency and absence. The creation of the heat dissipation structure of the lighting equipment is re-established. The lack of structure has multiple heat dissipation modes to achieve the purpose of rapid heat dissipation: A t also ensures the light source. Produce component life. In order to achieve the above-mentioned purpose, the lighting design of this creation includes:-a shell with a thick cymbal on the front face; a dry solid; a hole inside the cymbal;-a reflective element, which is arranged on the The aforementioned shell: the inner shell and the inner shell are placed inside the aforementioned reflective element; a heat-dissipating element is arranged on the ^ one. On each piece, there is at least a contact portion which is in close contact with the aforementioned shell i / source generating element system Arranged in the aforementioned heat-dissipating element and corresponding to the aforementioned inverse: 2 ^ Z: an air volume generating element, which is disposed on the aforementioned heat-dissipating element, is disposed on the aforementioned casing; an electric power disposed inside the casing = Structure · After the aforementioned heat dissipation element absorbs the source generated by the light source generating element, the air volume generating element exhausts the air inside the case and the external air [ϊ 施 方 = The heat source absorbed by the heat dissipation element is discharged to the outside of the case. The following is related. For the technical content and detailed description of this creation, please refer to the “First, Together% — μ Kang Appearance Decomposition and Three-Dimensional U” in conjunction with the illustrations. This is the lighting equipment of this creation: a focusing element 2 3, 6 , A cover 7 and 4, a light source Element 5, - wind generating element lighting circuit board 8 having a heat radiating structure of a structure constituting 'comprising: a housing Bu: "reflective element month
M272039 四、創作說明(3) 〇 上述所提之殼體1係為導熱材質所製成,其内部呈中 空狀態,於前端面上具一厚實段1 1 ,該厚實段1 1上設 有與殼體1内部相通之孔1 2 ,該厚實段1 1 一端向殼體 1内部延伸有一内壁面1 3 ,該内壁面1 3圍成一可組接 反射元件3之入口 1 4 ,前述之内壁面1 3上開設有至少 一個以上之定位孔1 5,供以組接反射元件3 ;另於殼體 1周緣面設有複數通孔1 6 ;又,於殼體1外表面上可以 喷塗一層輻射散熱材料,以增加殼體1的散熱效果; 該聚光元件2係配置於上述反射元件3之開口 3 1上 ,且由一透鏡所構成,用以將光源產生元件5所產生之聚 光後投射於照明之處; 該反射元件3係配置於上述内壁面1 3中,該反射元 件3 —端上具有一開口 3 1 ,其内具有一反射面32 ,此 反射面3 2用以反射光源產生元件5所產生之光源,讓光 源能順利反射於聚光元件2上,該反射元件3之另一端具 有一容置上述光源產生元件5之入口 3 3 ;另,於前述開 口 3 1周緣上設有對應上述定位孔1 5定位之凸部3 4 ; 該散熱元件4係為導熱金屬材質所製成,係配置於上 述入口 3 3之端面上,在散熱元件4吸收光源產生元件5 所產生之熱源後,再傳導至散熱元件4之複數鰭片4 1上 進行散熱動作,且在複數鰭片4 1間具有至少一個以上之 接觸部4 2 ,此接觸部4 2與殼體1内壁緊密貼合,可以 將吸收之熱源傳導至殼體1 ,以達快速散熱之目的;M272039 IV. Creation instructions (3) 〇 The shell 1 mentioned above is made of thermally conductive material, and its interior is hollow, with a thick section 1 1 on the front surface. The thick section 11 is provided with an The inner hole 1 2 of the shell 1 communicates with each other. One end of the thick section 1 1 extends into the shell 1 and has an inner wall surface 1 3. The inner wall surface 13 surrounds an inlet 1 4 which can be connected with the reflective element 3. The wall surface 13 is provided with at least one or more positioning holes 15 for assembling the reflecting element 3; and a plurality of through holes 16 are provided on the peripheral surface of the casing 1; and the outer surface of the casing 1 can be sprayed A layer of radiation heat-dissipating material to increase the heat-dissipating effect of the housing 1. The light-concentrating element 2 is arranged on the opening 31 of the above-mentioned reflective element 3 and is composed of a lens for converging the light generated by the light-source generating element 5. After the light is projected on the lighting place, the reflecting element 3 is arranged in the above-mentioned inner wall surface 13. The reflecting element 3 has an opening 3 1 at one end and a reflecting surface 32 therein. The reflecting surface 32 is used for The light source generated by the reflected light source generating element 5 allows the light source to be reflected smoothly on the light collecting element 2 On the other end of the reflective element 3, there is an entrance 3 3 for accommodating the light source generating element 5; in addition, a convex portion 3 4 corresponding to the positioning hole 15 is provided on the periphery of the opening 31; the heat dissipation element 4 is made of a thermally conductive metal material, and is arranged on the end face of the inlet 3 3. After the heat dissipation element 4 absorbs the heat source generated by the light source generating element 5, it is conducted to the plurality of fins 41 of the heat dissipation element 4. The heat dissipation action, and there are at least one contact portion 4 2 between the plurality of fins 41, and the contact portion 42 is in close contact with the inner wall of the casing 1, and can transmit the absorbed heat source to the casing 1 to achieve rapid heat dissipation. Purpose
M272039 產生元件 3之入口 燈泡之任 產生元件 元件6由 散熱元件 7係以配 合之凸垣 熱源排出 板8係配 及風量產 「第三圖 :當光源 3之反射 將光源投 源將直接 傳導至殼 ,透過孔 ’該散熱 殼體1頂 由後進前 風量產生 將外部空 置上述 生元件 所示」 產生元 面3 2 射至照 傳導至 體1上 1 6及 元件4 端之孔 出之散 元件6 氣吸入 ’以提 源。 之散熱 ’光源 上’在 時光源 上,再 同時在 空氣吸 熱源將 排出於 5係配置於上述散熱元件4並對應上 3 3配置,此光源產生元件5可為發 一種所構成; 6係配置於上述散熱元件4之一端, 位向或軸向之任一種風扇所構成,以 4所吸之熱源排至於殼體1外部; 上述殼體1底部,其上具有與殼 ,,此凸垣7 1内部有複數個提供 ,3外部空氣進入於殼體1内部之孔 、創作說明(4) 該光源 述反射元件 光二極體或 該風量 此風量產生 產生風量將 該蓋體 體1底部接 殼體1内部 7 2; 該電路 產生元件5 請參閱 。如圖所示 至反射元件 聚光後,再 所產生之熱 4 2將熱源 件6運轉時 散熱元件4 1 了員端,由 ,以達空氣 或者在 上之孔1 2 殼體1内部 6所需之電 ’係本創作 件5點亮時 聚光元件2 明之處,此 散熱元件4 進行散熱, 7 2將外部 上所吸取之 1 2將熱源 熱效果。 反轉時,可 並吹向散熱 供上述光源 流動示意圖 將直接投射 聚光元件2 產生元件5 透過接觸部 風量產生元 入後並吹向 被吹向殼體 殼體1外部 以透過殼體1頂雜 元件4,讓散熱天M272039 Any of the entrance bulbs of the production element 3, any production element 6 is provided by the heat dissipation element 7 series to match the convex heat source exhaust plate 8 series, and the mass production `` third picture: when the reflection of the light source 3, the light source will be directly transmitted to the source To the shell, through the hole, the top of the heat dissipation casing 1 is generated by the backward and forward air volume, and the outside is vacant as shown above. The generating element surface 3 2 is shot to the hole that is transmitted to the 16 on the body 1 and the 4 ends of the component. Element 6 Air suction 'to lift the source. The heat-dissipating 'light source' is on the time light source, and at the same time, the air-absorbing heat source will be discharged in the 5 series configured on the above-mentioned heat dissipation element 4 and corresponding to the 3 3 configuration. At one end of the above-mentioned heat-dissipating element 4, any type of fan, which is oriented or axial, is discharged to the outside of the casing 1 with the heat source absorbed by 4; the bottom of the casing 1 has a shell thereon, and this convex wall 7 1 There are a plurality of supplies in the interior, 3 The external air enters the holes in the casing 1 and the creation description (4) The light source is the reflective element light diode or the air volume. This air volume generates the air volume, and the bottom of the cover body 1 is connected to the housing. 1 Internal 7 2; This circuit generates components 5 See also. As shown in the figure, the heat generated after the reflective element is concentrated 4 2 When the heat source element 6 is operated, the heat dissipation element 4 1 has a member end, so as to reach the air or an upper hole 1 2 6 inside the housing 1 The electricity required 'is where the light-concentrating element 2 is clear when this creation 5 is lit. This heat-dissipating element 4 dissipates heat, and 7 2 draws 1 2 from the outside to heat the heat source. When reversed, it can be blown to the heat sink for the above light source flow diagram. The direct-projection light-concentrating element 2 generating element 5 passes through the contact part to generate airflow and is blown to the outside of the casing 1 to pass through the top of the casing 1 Miscellaneous components 4
M272039 四、創作說明(5) ^ 件4所吸取之熱源直接由孔1 6及7 2排出於殼體1外部 ,以達空氣由前進後出之散熱效果。 請參閱「第四圖所示」,係本創作之另一散熱流動示 意圖。如圖所示:當殼體1上未開設孔1 6及蓋體7上未 開設孔7 2時,同時利用未與殼體1内壁接觸之散熱元件 4’ ,以及在殼體1内部增設通道1 7,當風量產生元件 6轉動時,外部的空氣由殼體1頂端一側之孔1 2進入後 ,經過通道17及風量產生元件6而吹向散熱元件4’ , 此時風流量再由散熱元件4 ’ 一側經另一通道1 8由殼體 ® 1頂端另一側之孔1 2排至殼體1外部,以達到前進前出 之散熱效果。 請參閱「第五圖所示」,係本創作之再一散熱流動示 意圖。如圖所示:本實施例與第四圖大致相同,所不同處 在於風量產生元件6配置散熱元件4 ’ 一側,當風量產生 元件6轉動時,外部的空氣由殼體1頂端一側之孔1 2進 入後,經過通道1 7及風量產生元件6而吹向散熱元件 4 ’,此時風流量再由散熱元件4 ’ 一側經另一通道1 8由 殼體1頂端另一側之孔1 2排至殼體1外部,以達到另一 φ 種前進前出之散熱效果。 進一步,在於蓋體7另一面可增設一電源輸入端 7 3,以供插接於電源插座上。 更進一步,在於本創作所運用之散熱元件4、4 ’除 .了可運用鰭片式之散熱方式外,還可為導熱板、均溫板或 熱管之任一種所構成。M272039 IV. Creative Instructions (5) ^ The heat source absorbed by Part 4 is directly discharged from the casing 1 through the holes 16 and 72 to achieve the heat dissipation effect of the air from the front to the rear. Please refer to "shown in the fourth picture", which is another illustration of the heat dissipation flow of this creation. As shown in the figure: when there are no holes 16 in the casing 1 and no holes 7 2 in the cover 7, the heat dissipation element 4 'which is not in contact with the inner wall of the casing 1 is used at the same time, and a channel is added inside the casing 1. 17. When the air volume generating element 6 rotates, the outside air enters through the hole 1 2 on the top side of the housing 1 and passes through the channel 17 and the air volume generating element 6 to the heat dissipation element 4 '. The heat-dissipating element 4 ′ is discharged from the hole 1 2 on the other side of the top of the case ® 1 to the outside of the case 1 through another channel 18 to achieve the heat-dissipating effect. Please refer to the "fifth picture", which is another illustration of the heat dissipation flow of this creation. As shown in the figure: This embodiment is substantially the same as the fourth figure, except that the air volume generating element 6 is provided with a heat dissipating element 4 ′ side. When the air volume generating element 6 is rotated, the external air is drawn from the top side of the casing 1. After the hole 12 is entered, it passes through the channel 17 and the air volume generating element 6 and blows to the heat dissipation element 4 ′. At this time, the air flow is passed from the heat dissipation element 4 ′ side through the other channel 18 to the other side of the top of the housing 1. The holes 12 are arranged to the outside of the casing 1, so as to achieve another heat dissipation effect of φ forward and forward. Further, a power input terminal 73 can be added on the other side of the cover 7 for plugging into a power socket. Furthermore, the heat-dissipating elements 4, 4 ′ used in this creation can be composed of any one of a heat-conducting plate, a temperature equalizing plate, or a heat pipe, in addition to the fin-type heat-dissipating method.
第9頁 M272039 3、創作說明(6) 上述僅為本創作之較佳實施例而已,並非用來限定本 創作實施範圍。即凡依本創作申請專利範圍所做的均等變 化與修飾,皆為本創作專利範圍所涵蓋。Page 9 M272039 3. Creation Instructions (6) The above is only a preferred embodiment of this creation, and is not intended to limit the scope of implementation of this creation. That is to say, all equal changes and modifications made in accordance with the scope of the patent application for this creation are covered by the scope of this creation patent.
第10頁 M272039 圖式簡單說明 【圖式簡 第一圖, 第二圖, 第三圖, 第四圖, 第五圖, 【主要元 殼體 孑L 入口 通孔 聚光元件 開口 凸部 籍片 光源產生 蓋體 電路板 單說明】 係本創作 係本創作 係本創作 係本創作 係本創作 件符號說12、 14、 元件 之照明設備外觀分解示意圖 之照明設備外觀立體示意圖 之散熱流動不意圖。 之另一散熱流動示意圖。 之再一散熱流動示意圖。 明】 1 厚實段 7 2 内壁面 3 3 定位孔 16 通道 17、 2 反射元件 3 1 反射面 3 4 散熱元件 4、 4 1 接觸部 5 風量產生元件 7 凸垣 8 電源輸入端 32 4 4 7 7 6M272039 on the 10th page [Simplified illustration of the first diagram, the second diagram, the third diagram, the fourth diagram, the fifth diagram, [the main element housing 孑 L entrance through-hole condensing element opening convex part film light source generation Description of the cover circuit board sheet] The design of this design is based on the symbols of 12, 14, the components of the lighting equipment appearance decomposition schematic diagram of the lighting equipment appearance three-dimensional schematic diagram of the heat flow is not intended. Another heat dissipation flow diagram. Another schematic diagram of heat dissipation flow. Ming】 1 Thick section 7 2 Inner wall surface 3 3 Positioning hole 16 Channel 17, 2 Reflective element 3 1 Reflective surface 3 4 Radiating element 4, 4 1 Contact part 5 Air flow generating element 7 Convex 8 Power input terminal 32 4 4 7 7 6
第11頁Page 11
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94201151U TWM272039U (en) | 2005-01-21 | 2005-01-21 | Heat dissipation structure of lighting appliances |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94201151U TWM272039U (en) | 2005-01-21 | 2005-01-21 | Heat dissipation structure of lighting appliances |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM272039U true TWM272039U (en) | 2005-08-01 |
Family
ID=36792481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94201151U TWM272039U (en) | 2005-01-21 | 2005-01-21 | Heat dissipation structure of lighting appliances |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM272039U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101828069A (en) * | 2007-10-16 | 2010-09-08 | 东芝照明技术株式会社 | Light emitting element lamp and lighting equipment |
TWI409408B (en) * | 2008-07-18 | 2013-09-21 | Hon Hai Prec Ind Co Ltd | Illuminating apparatus |
-
2005
- 2005-01-21 TW TW94201151U patent/TWM272039U/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101828069A (en) * | 2007-10-16 | 2010-09-08 | 东芝照明技术株式会社 | Light emitting element lamp and lighting equipment |
TWI409408B (en) * | 2008-07-18 | 2013-09-21 | Hon Hai Prec Ind Co Ltd | Illuminating apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5160973B2 (en) | Vehicle lighting | |
US8092054B2 (en) | LED illuminating device and light engine thereof | |
TWI428533B (en) | Light emitting diode lamp | |
TWI408312B (en) | Lamp | |
TW201024611A (en) | Heat dissipation device and light emitting device comprising the same | |
WO2006128318A1 (en) | A high power led illuminating equipment having high thermal diffusivity | |
TW200944710A (en) | Illuminating lamp | |
TW201005215A (en) | Light emitting diode lamp | |
TW201300693A (en) | Illuminating apparatus | |
JP3112794U (en) | Radiator for light-emitting diode lamp | |
US20100097810A1 (en) | Ultra high efficient encapsulation structure having metal heat sink | |
TWM272039U (en) | Heat dissipation structure of lighting appliances | |
JP2014150031A (en) | Heat sink and heat exhaust device | |
WO2009140838A1 (en) | Led lamp structure | |
TW200907233A (en) | LED lamp with a heat sink | |
TW201002976A (en) | Light emitting diode lamp and light engine thereof | |
CN110671686A (en) | LED light source heat dissipation platform | |
KR20080002836A (en) | A high power led illuminating equipment having high thermal diffusivity | |
TWM449903U (en) | LED lamp | |
TWM359644U (en) | Heat-dissipation device of lamp | |
TWI416045B (en) | Led lamp | |
TW200910547A (en) | Heat sink | |
TWI409408B (en) | Illuminating apparatus | |
CN103867960A (en) | Light emitting diode (LED) spotlight | |
TWI417480B (en) | Led lamp |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |