CN110671686A - LED light source heat dissipation platform - Google Patents
LED light source heat dissipation platform Download PDFInfo
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- CN110671686A CN110671686A CN201911033653.9A CN201911033653A CN110671686A CN 110671686 A CN110671686 A CN 110671686A CN 201911033653 A CN201911033653 A CN 201911033653A CN 110671686 A CN110671686 A CN 110671686A
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- heat conduction
- conduction copper
- heat
- heat dissipation
- light source
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 128
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 249
- 229910052802 copper Inorganic materials 0.000 claims abstract description 249
- 239000010949 copper Substances 0.000 claims abstract description 249
- 230000005855 radiation Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an LED light source heat dissipation platform, which comprises a fixed platform, a light source, a heat dissipation assembly and a plurality of heat dissipation fans, wherein the light source, the heat dissipation assembly and the plurality of heat dissipation fans are fixed on the fixed platform; the middle part of the fixed platform is provided with a through hole, the light source is arranged at the through hole, the light emitting surface of the light source faces the through hole, and the heat dissipation assembly is arranged on the backlight surface of the light source and is in close contact with the light source; the heat dissipation assembly is provided with a plurality of heat dissipation fins, and a heat dissipation fan is correspondingly arranged at each heat dissipation fin; the heat dissipation assembly comprises a light source fixing plate, a heat conduction copper pipe clamping plate, a heat conduction copper pipe top plate, a first heat conduction copper pipe module, a second heat conduction copper pipe module, a third heat conduction copper pipe module, a fourth heat conduction copper pipe module and heat dissipation fins. The LED light source heat dissipation platform provided by the invention has the advantages that the overall heat dissipation structure is more reasonable in design, the heat dissipation copper pipes, the heat dissipation fins and the heat dissipation fan are more efficiently matched for use, heat emitted by the light source is dissipated to the periphery through the heat dissipation copper pipes on the heat dissipation assembly, and then heat is dissipated through the heat dissipation fins and the heat dissipation fan, so that the LED light source heat dissipation platform has the characteristics of high heat dissipation efficiency and good heat dissipation effect.
Description
Technical Field
The invention relates to the field of heat dissipation devices, in particular to an LED light source heat dissipation platform.
Background
It is well known that LED lamps operate at high temperatures, especially in the light sources used in professional stage lighting. The stage lamp light source module has high power, generates a large amount of heat, can cause irreversible damage to the light source if the heat cannot be dissipated in time, directly reduces the efficiency of the light source due to overhigh temperature of the light source, and is burnt by thermal corrosion of electronic components, so that the stage lamp light source module needs to dissipate redundant heat in time.
Most of LED lamps in the market are provided with radiators, the conventional radiators are generally formed by arranging flaky radiating fins on a base to form a whole radiating structure, and a complicated pattern structure is added on the radiating fins to increase the radiating area under the common condition of improving the radiating effect.
Disclosure of Invention
The invention aims to provide an LED light source heat dissipation platform aiming at the defects in the prior art, and the LED light source heat dissipation platform has the characteristics of high heat dissipation efficiency and good heat dissipation effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
an LED light source heat dissipation platform comprises a fixed platform, a light source, a heat dissipation assembly and a plurality of heat dissipation fans, wherein the light source, the heat dissipation assembly and the plurality of heat dissipation fans are fixed on the fixed platform; the middle part of the fixed platform is provided with a through hole, the light source is arranged at the through hole, the light emitting surface of the light source faces the through hole, and the heat dissipation assembly is arranged on the backlight surface of the light source and is in close contact with the light source; the heat dissipation assembly is provided with a plurality of heat dissipation fins, and a heat dissipation fan is correspondingly arranged at each heat dissipation fin;
the heat dissipation assembly comprises a light source fixing plate, a heat conduction copper pipe clamping plate, a heat conduction copper pipe top plate, a first heat conduction copper pipe module, a second heat conduction copper pipe module, a third heat conduction copper pipe module, a fourth heat conduction copper pipe module and heat dissipation fins; the light source fixing plate, the heat conduction copper pipe clamping plate and the heat conduction copper pipe top plate are sequentially stacked from bottom to top, and the bottom surface of the light source fixing plate is in close contact with the light source; the first heat conduction copper pipe module and the second heat conduction copper pipe module are clamped between the light source fixing plate and the heat conduction copper pipe clamp plate, and the third heat conduction copper pipe module and the fourth heat conduction copper pipe module are clamped between the heat conduction copper pipe clamp plate and the heat conduction copper pipe top plate;
the first heat conduction copper pipe module and the second heat conduction copper pipe module are respectively provided with a plurality of heat dissipation fins; and a heat radiation fin is fixed on the top surface of the heat conduction copper pipe top plate.
Furthermore, the first heat conduction copper pipe module comprises a plurality of heat conduction copper pipes arranged in parallel, and the middle parts of the plurality of heat conduction copper pipes are clamped and fixed between the light source fixing plate and the heat conduction copper pipe clamping plate; in the first heat conduction copper pipe module, two ends of the plurality of heat conduction copper pipes are bent to one side of the light source fixing plate and one side of the heat conduction copper pipe clamping plate, and two ends of each heat conduction copper pipe are fixedly provided with a heat dissipation fin;
the second heat conduction copper pipe module comprises a plurality of heat conduction copper pipes arranged in parallel, and the middle parts of the plurality of heat conduction copper pipes are clamped and fixed between the light source fixing plate and the heat conduction copper pipe clamping plate; in the second heat conduction copper pipe module, two ends of the plurality of heat conduction copper pipes are bent to the other sides of the light source fixing plate and the heat conduction copper pipe clamping plate, and two ends of each heat conduction copper pipe are respectively fixedly provided with a heat dissipation fin.
Furthermore, the heat conduction copper pipes in the first heat conduction copper pipe module are bent to be waist-shaped, and all the heat conduction copper pipes are sequentially arranged in a parallel nested manner from inside to outside; the heat conduction copper pipes in the second heat conduction copper pipe module are bent to be waist-shaped, and the heat conduction copper pipes are sequentially nested and arranged in parallel from inside to outside; the distribution of the heat conduction copper pipes in the second heat conduction copper pipe module is symmetrical to that of the first heat conduction copper pipe module.
Furthermore, a fixing frame is arranged on the fixing platform, and the heat conduction copper pipes in the first heat conduction copper pipe module and the second heat conduction copper pipe module are fixed on the fixing platform through the fixing frame.
Furthermore, a heat dissipation fan is correspondingly arranged below each heat dissipation fin arranged on the first heat conduction copper pipe module and the second heat conduction copper pipe module respectively, the heat dissipation fan is fixed on the fixed platform, and the air outlet side of the heat dissipation fan faces the heat dissipation fins.
Furthermore, the third heat conduction copper pipe module comprises a plurality of heat conduction copper pipes bent into a U shape, and the plurality of heat conduction copper pipes are sequentially arranged in a parallel nested manner from inside to outside in the third heat conduction copper pipe module; the fourth heat conduction copper pipe module comprises a plurality of heat conduction copper pipes bent into a U shape, and the plurality of heat conduction copper pipes are sequentially arranged in a parallel nested manner from inside to outside in the fourth heat conduction copper pipe module; the U-shaped opening between the heat conduction copper pipes of the third heat conduction copper pipe module and the fourth heat conduction copper pipe module is arranged oppositely and mutually interpenetrated.
Furthermore, the middle parts of the heat conduction copper pipes in the third heat conduction copper pipe module and the fourth heat conduction copper pipe module are clamped and fixed between the heat conduction copper pipe clamping plate and the heat conduction copper pipe top plate, and the U-shaped end and the other tail end of the heat conduction copper pipe are exposed outside.
Furthermore, the heat conducting copper pipes in the third heat conducting copper pipe module and the fourth heat conducting copper pipe module are respectively and correspondingly provided with a heat radiating fan below two ends exposed outside, the heat radiating fans are fixed on the fixed platform, and the air outlet sides of the heat radiating fans face the heat conducting copper pipes.
Further, a heat radiation fan is arranged above the heat radiation fins on the top surface of the heat conduction copper pipe top plate, the heat radiation fan is fixed on the fixed platform, and the air outlet side of the heat radiation fan faces back to the heat conduction copper pipe top plate.
Furthermore, a plurality of semicircular fixing grooves which are parallel to each other and matched with the outer contour of the heat conduction copper pipe are arranged on the opposite surfaces among the light source fixing plate, the heat conduction copper pipe clamping plate and the heat conduction copper pipe top plate; the two sides of the light source fixing plate, the heat conducting copper pipe clamping plate and the heat conducting copper pipe top plate are fixed through fastening screws.
The LED light source heat dissipation platform provided by the invention has the advantages that the overall heat dissipation structure is more reasonable in design, the heat dissipation copper pipes, the heat dissipation fins and the heat dissipation fan are more efficiently matched for use, heat emitted by the light source is dissipated to the periphery through the heat dissipation copper pipes on the heat dissipation assembly, and then heat is dissipated through the heat dissipation fins and the heat dissipation fan, so that the LED light source heat dissipation platform has the characteristics of high heat dissipation efficiency and good heat dissipation effect.
Drawings
Fig. 1 is a schematic view of an overall structure of a backlight surface of an LED light source heat dissipation platform according to an embodiment of the present invention.
Fig. 2 is a schematic view of an overall structure of a light emitting surface of an LED light source heat dissipation platform according to an embodiment of the present invention.
Fig. 3 is an exploded view of an LED light source heat dissipation platform according to an embodiment of the present invention.
Fig. 4 is another exploded view of a heat dissipation platform for an LED light source according to an embodiment of the present invention.
Fig. 5 is a schematic view of the overall structure of the heat dissipation assembly in the embodiment of the present invention.
Fig. 6 is an exploded view of a heat sink assembly in an embodiment of the present invention.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 6, the LED light source heat dissipation platform provided by the present invention comprises a fixed platform 1, and a light source 2, a heat dissipation assembly 3 and a plurality of heat dissipation fans 4 fixed thereon; the middle part of the fixed platform 1 is provided with a through hole, the light source 2 is arranged at the through hole, wherein the light-emitting surface of the light source 2 faces the through hole, and the heat dissipation assembly 3 is arranged on the backlight surface of the light source 2 and is tightly contacted with the light source 2; a plurality of radiating fins 30 are arranged on the radiating component 3, and a radiating fan 4 is correspondingly arranged at each radiating fin 30; the air outlet side of each heat dissipation fan 4 faces one side of the backlight surface of the light source 2, so that the overall air flow direction of the LED light source heat dissipation platform faces the backlight surface of the light source 2.
As shown in fig. 5 and 6, the heat sink assembly 3 includes a light source fixing plate 31, a heat conducting copper pipe clamping plate 32, a heat conducting copper pipe top plate 33, first to fourth heat conducting copper pipe modules 61, 62, 63, 64, and heat sink fins 30. The light source fixing plate 31, the heat conduction copper pipe clamping plate 32 and the heat conduction copper pipe top plate 33 are sequentially stacked from bottom to top, and the bottom surface of the light source fixing plate 31 is tightly contacted with the light source 2; the first heat conduction copper pipe module 61 and the second heat conduction copper pipe module 62 are clamped between the light source fixing plate 31 and the heat conduction copper pipe clamping plate 32, and the third heat conduction copper pipe module 63 and the fourth heat conduction copper pipe module 64 are clamped between the heat conduction copper pipe clamping plate 32 and the heat conduction copper pipe top plate 33;
a plurality of heat dissipation fins 30 are respectively arranged on the first heat conduction copper pipe module 61 and the second heat conduction copper pipe module 62; a heat dissipation fin 30 is fixed on the top surface of the heat conduction copper tube top plate 33.
Specifically, the first heat conducting copper pipe module 61 includes a plurality of heat conducting copper pipes arranged in parallel, and the middle portions of the plurality of heat conducting copper pipes are clamped and fixed between the light source fixing plate 31 and the heat conducting copper pipe clamping plate 32; in the first heat conducting copper tube module 61, two ends of the plurality of heat conducting copper tubes are bent to one side of the light source fixing plate 31 and one side of the heat conducting copper tube clamping plate 32, and two ends of each heat conducting copper tube are respectively fixedly provided with a heat radiating fin 30;
the second heat conduction copper pipe module 62 is the same as the first heat conduction copper pipe module 61, and also comprises a plurality of heat conduction copper pipes arranged in parallel, and the middle parts of the plurality of heat conduction copper pipes are clamped and fixed between the light source fixing plate 31 and the heat conduction copper pipe clamping plate 32; in the second heat conducting copper tube module 62, two ends of the plurality of heat conducting copper tubes are bent to the other sides of the light source fixing plate 31 and the heat conducting copper tube clamping plate 32, and two ends of each heat conducting copper tube are respectively and fixedly provided with a heat dissipating fin 30.
More specifically, the heat conducting copper pipes in the first heat conducting copper pipe module 61 are bent to be waist-shaped, and the heat conducting copper pipes are sequentially arranged in parallel from inside to outside in a nested manner, that is, the heat conducting copper pipes are sequentially arranged from small to large and from inside to outside according to the outer contour to form an outward-diffusion multilayer ring shape; the heat conducting copper pipes in the second heat conducting copper pipe module 62 are bent to be waist-shaped, and the heat conducting copper pipes are sequentially nested and arranged in parallel from inside to outside; the distribution of the heat conducting copper pipes in the second heat conducting copper pipe module 62 is symmetrical to that of the first heat conducting copper pipe module 61.
As an improvement, a fixing frame 5 is arranged on the fixing platform 1, and the heat conduction copper pipes in the first heat conduction copper pipe module 61 and the second heat conduction copper pipe module 62 are fixed on the fixing platform 1 through the fixing frame 5. And the fixing frame 5 is provided with a hole matched with the diameter of the heat conduction copper pipe and used for installing and fixing the heat conduction copper pipe.
Further, a heat dissipation fan 4 is correspondingly disposed below each of the heat dissipation fins 30 mounted on the first heat conduction copper tube module 61 and the second heat conduction copper tube module 62, the heat dissipation fan 4 is fixed on the fixed platform 1, and an air outlet side of the heat dissipation fan 1 faces the heat dissipation fins 30.
Further, the third heat conduction copper pipe module 63 includes a plurality of heat conduction copper pipes bent into a U shape, and in the third heat conduction copper pipe module 63, the plurality of heat conduction copper pipes are sequentially nested and arranged in parallel from inside to outside, that is, the plurality of heat conduction copper pipes are sequentially arranged from inside to outside according to the outer contour from small to large to form a plurality of layers of mutually surrounded U shapes; the fourth heat conduction copper pipe module 64 comprises a plurality of heat conduction copper pipes bent into a U shape, and the plurality of heat conduction copper pipes are sequentially arranged in parallel in a nested manner from inside to outside in the fourth heat conduction copper pipe module 64; the U-shaped opening between the heat conducting copper tubes of the third heat conducting copper tube module 63 and the fourth heat conducting copper tube module 64 is arranged relatively, and the heat conducting copper tubes of the third heat conducting copper tube module 63 and the fourth heat conducting copper tube module 64 are arranged alternately, i.e. one end of the heat conducting copper tube of the third heat conducting copper tube module 63 is inserted into the U-shaped opening of the heat conducting copper tube of the fourth heat conducting copper tube module 64, and one end of the heat conducting copper tube of the fourth heat conducting copper tube module 64 is inserted into the U-shaped opening of the heat conducting copper.
Further, the middle portions of the heat conduction copper pipes in the third heat conduction copper pipe module 63 and the fourth heat conduction copper pipe module 64 are clamped and fixed between the heat conduction copper pipe clamping plate 32 and the heat conduction copper pipe top plate 33, and the U-shaped end and the other end of the heat conduction copper pipe are exposed to the outside.
The heat conducting copper pipes in the third heat conducting copper pipe module 63 and the fourth heat conducting copper pipe module 64 are respectively and correspondingly provided with a heat radiation fan 4 under the two ends exposed outside, the heat radiation fan 4 is fixed on the fixed platform 1, and the air outlet side of the heat radiation fan 4 faces the heat conducting copper pipes.
As an improvement, a plurality of semicircular fixing grooves which are parallel to each other and matched with the outer contour of the heat conducting copper pipe are arranged on the opposite surfaces among the light source fixing plate 31, the heat conducting copper pipe clamping plate 32 and the heat conducting copper pipe top plate 33; the light source fixing plate 31, the heat conducting copper pipe clamping plate 32 and the heat conducting copper pipe top plate 33 are fixed at two sides through fastening screws 34.
Further, a heat dissipation fan 4 is arranged above the heat dissipation fins 30 on the top surface of the heat conduction copper tube top plate 33, the heat dissipation fan 4 is fixed on the fixed platform 1, and the air outlet side of the heat dissipation fan 4 faces away from the heat conduction copper tube top plate 33.
The LED light source heat dissipation platform provided by the invention has the advantages that the overall heat dissipation structure is more reasonable in design, the heat dissipation copper pipes, the heat dissipation fins and the heat dissipation fan are more efficiently matched for use, heat emitted by the light source is dissipated to the periphery through the heat dissipation copper pipes on the heat dissipation assembly, and then heat is dissipated through the heat dissipation fins and the heat dissipation fan, so that the LED light source heat dissipation platform has the characteristics of high heat dissipation efficiency and good heat dissipation effect.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An LED light source heat dissipation platform is characterized by comprising a fixed platform, a light source, a heat dissipation assembly and a plurality of heat dissipation fans, wherein the light source, the heat dissipation assembly and the plurality of heat dissipation fans are fixed on the fixed platform; the middle part of the fixed platform is provided with a through hole, the light source is arranged at the through hole, the light emitting surface of the light source faces the through hole, and the heat dissipation assembly is arranged on the backlight surface of the light source and is in close contact with the light source; the heat dissipation assembly is provided with a plurality of heat dissipation fins, and a heat dissipation fan is correspondingly arranged at each heat dissipation fin;
the heat dissipation assembly comprises a light source fixing plate, a heat conduction copper pipe clamping plate, a heat conduction copper pipe top plate, a first heat conduction copper pipe module, a second heat conduction copper pipe module, a third heat conduction copper pipe module, a fourth heat conduction copper pipe module and heat dissipation fins; the light source fixing plate, the heat conduction copper pipe clamping plate and the heat conduction copper pipe top plate are sequentially stacked from bottom to top, and the bottom surface of the light source fixing plate is in close contact with the light source; the first heat conduction copper pipe module and the second heat conduction copper pipe module are clamped between the light source fixing plate and the heat conduction copper pipe clamp plate, and the third heat conduction copper pipe module and the fourth heat conduction copper pipe module are clamped between the heat conduction copper pipe clamp plate and the heat conduction copper pipe top plate;
the first heat conduction copper pipe module and the second heat conduction copper pipe module are respectively provided with a plurality of heat dissipation fins; and a heat radiation fin is fixed on the top surface of the heat conduction copper pipe top plate.
2. The LED light source heat dissipation platform according to claim 1, wherein the first heat conduction copper tube module comprises a plurality of heat conduction copper tubes arranged in parallel, and the middle parts of the plurality of heat conduction copper tubes are clamped and fixed between the light source fixing plate and the heat conduction copper tube clamping plate; in the first heat conduction copper pipe module, two ends of the plurality of heat conduction copper pipes are bent to one side of the light source fixing plate and one side of the heat conduction copper pipe clamping plate, and two ends of each heat conduction copper pipe are fixedly provided with a heat dissipation fin;
the second heat conduction copper pipe module comprises a plurality of heat conduction copper pipes arranged in parallel, and the middle parts of the plurality of heat conduction copper pipes are clamped and fixed between the light source fixing plate and the heat conduction copper pipe clamping plate; in the second heat conduction copper pipe module, two ends of the plurality of heat conduction copper pipes are bent to the other sides of the light source fixing plate and the heat conduction copper pipe clamping plate, and two ends of each heat conduction copper pipe are respectively fixedly provided with a heat dissipation fin.
3. The LED light source heat dissipation platform of claim 2, wherein the heat conducting copper tubes in the first heat conducting copper tube module are bent into a waist-shaped shape, and the heat conducting copper tubes are sequentially nested and arranged in parallel from inside to outside; the heat conduction copper pipes in the second heat conduction copper pipe module are bent to be waist-shaped, and the heat conduction copper pipes are sequentially nested and arranged in parallel from inside to outside; the distribution of the heat conduction copper pipes in the second heat conduction copper pipe module is symmetrical to that of the first heat conduction copper pipe module.
4. The LED light source heat dissipation platform of claim 2, wherein a fixing frame is disposed on the fixing platform, and the heat conduction copper tubes of the first heat conduction copper tube module and the second heat conduction copper tube module are fixed on the fixing platform through the fixing frame.
5. The LED light source heat sink platform as claimed in claim 2, wherein a heat sink fan is disposed under each of the heat sink fins mounted on the first and second heat conducting copper tube modules, the heat sink fan is fixed on the fixed platform, and an air outlet side of the heat sink fan faces the heat sink fins.
6. The LED light source heat dissipation platform of claim 1, wherein the third heat conduction copper tube module comprises a plurality of heat conduction copper tubes bent in a U shape, and the plurality of heat conduction copper tubes are sequentially nested in parallel from inside to outside in the third heat conduction copper tube module; the fourth heat conduction copper pipe module comprises a plurality of heat conduction copper pipes bent into a U shape, and the plurality of heat conduction copper pipes are sequentially arranged in a parallel nested manner from inside to outside in the fourth heat conduction copper pipe module; the U-shaped opening between the heat conduction copper pipes of the third heat conduction copper pipe module and the fourth heat conduction copper pipe module is arranged oppositely and mutually interpenetrated.
7. The LED light source heat dissipation platform of claim 6, wherein the middle portions of the heat conduction copper tubes in the third and fourth heat conduction copper tube modules are sandwiched and fixed between the heat conduction copper tube clamp plate and the heat conduction copper tube top plate, and the U-shaped end and the other end of the heat conduction copper tube are exposed to the outside.
8. The LED light source heat dissipation platform of claim 7, wherein a heat dissipation fan is correspondingly disposed below each of two ends of the heat conductive copper tube exposed outside of the third and fourth heat conductive copper tube modules, the heat dissipation fan is fixed on the fixing platform, and an air outlet side of the heat dissipation fan faces the heat conductive copper tube.
9. The LED light source heat dissipation platform of claim 1, wherein a heat dissipation fan is disposed above the heat dissipation fins on the top surface of the heat conduction copper tube top plate, the heat dissipation fan is fixed on the fixed platform, and an air outlet side of the heat dissipation fan faces away from the heat conduction copper tube top plate.
10. The LED light source heat dissipation platform of claim 1, wherein a plurality of semicircular fixing grooves parallel to each other are formed in opposite surfaces among the light source fixing plate, the heat conduction copper tube clamping plate and the heat conduction copper tube top plate, and are matched with the outer contour of the heat conduction copper tube; the two sides of the light source fixing plate, the heat conducting copper pipe clamping plate and the heat conducting copper pipe top plate are fixed through fastening screws.
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Cited By (1)
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WO2021212764A1 (en) * | 2020-04-24 | 2021-10-28 | 深圳市爱图仕影像器材有限公司 | Heat dissipation device and lighting device |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2021212764A1 (en) * | 2020-04-24 | 2021-10-28 | 深圳市爱图仕影像器材有限公司 | Heat dissipation device and lighting device |
US11719429B2 (en) | 2020-04-24 | 2023-08-08 | Aputure Imaging Industries Co., Ltd. | Heat dissipation device and lighting device |
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