200907233 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體燈具，特別涉及一種具有 散熱結構之發光二極體燈具。 【先前技術】 隨著電子產業飛速發展，電子元件運行速度不斷提 升，運行時產生大量熱量，使其本身及系統溫度升高，繼 而影響其系統之穩定性。為確保電子元件能正常運行，通 苇在其上安裝一散熱器，以排出其所產生之熱量。 電子元件散熱問題之傳統解決方案通常係在每個發熱 電子元件上安裝一散熱器’該散熱器包括與電子元件；密 接觸之一底板、設於底板上之複數散熱鰭片。但是，對於 一些特殊之發熱電子元件為❹丨較好之光學效果，往目 對集中，這樣則無法應用普通之散熱器對其散熱。 例如，在-些體積較小之發光二極體燈具内， 體積被限制得相對很小之散熱器來同: 模組進行散熱，這是普通散«光二極 發明内容】 具有散熱結構之發光二極 間内之多個發光二極體模 有鑒於此’有必要提供一種 體燈具’其散熱結構能對有限空 組進行良好之散熱。 其包括一散熱 一種具有散熱結構之發光二極體燈晏 6 200907233 益 么光一極體模組及一罩設該發光二極體模组之燈 f ’該散熱器包括一中空之筒狀導熱體，該導熱體包括一 政’、、、(^ -及熱部’該散熱部外表面延伸有複數散熱鰭 片，該發光二極體模組貼置於導熱體之吸熱部。 本毛明發光二極體燈具藉由散熱器之導熱體之吸熱部 與發光二極體模組接觸吸熱，再將熱量 熱部之鰭片進行散埶，可對严且右阳+ # 疋叮欢熱可對岌具有限之空間内之發光二極 體模組進行良好之散熱，以確保發光二極體模組高效、穩 定地工作。 【實施方式】 如圖1-2所示，本發明發光二極體燈具包括複數發光二 ，體模組⑽、—用於安置該等發光二極體模組⑽之散熱 為200、女裝於該散熱器200内之複數熱管5〇〇、一安裝於 5亥散熱器2〇〇中部之燈置川〇，以芬 m ^ 丁丨之/且卓3〇〇’以及一固定在燈罩300底 之透光鏡400。 。月芩閱圖3和圖4，上述散熱器200為鋁擠型散埶哭， 其包f—中空筒狀之導熱體230及與該導熱體23。連接。之 複數散熱鰭片240。該導熱體230包括-散熱部235與一吸 熱部238。該導熱體23〇之散熱部说自表面沿轴向方向上 L伸有四連接肋（圖未標）。每一連接肋頂部均設有一安裝孔 :藉^連接件連接—燈頭（圖未示），該燈頭為—標準件，可 ，市场上賭買。該等散熱鰭>1 自該導熱體23G之散熱 部235之外表面向外圓周輕射延伸，其中每一連接肋上延 200907233 伸有三散熱鰭片240。每一散熱鰭片240沿導熱體230之軸 向方向延伸平行連接肋。在該導熱體230之表面上均勻間 隔分佈複數短散熱鰭片240，該等短散熱鰭片240在該導熱 體230徑向上之長度比周圍之散熱鰭片240短，而軸向長 度相同。相鄰之散熱鰭片240之間形成複數以供空氣流通 之氣流通道。該導熱體230具有一圓柱形之内表面254，在 内表面254上均勻地設有複數溝槽256，以容置熱管500。 該溝槽256沿導熱體230之軸向延伸，並貫穿連接吸熱部 238與散熱部235。每一熱管500呈直線狀，收容於導熱體 230之對應之溝槽256，並且連接導熱體230之散熱部235 與吸熱部238。 請再參閱圖1和圖2，上述燈罩300呈碗狀結構，具有 一凹面及在該凹面中部設有一開孔310,導熱體230之吸熱 部238藉由該開孔310而收容於該燈罩300内。該燈罩300 用於將發光二極體模組100所發出之光朝一預設之方向反 射。 該透光鏡400通常由塑膠、玻璃等合適之材料做成， 以達到透光之效果。該透光鏡400安裝在燈罩300之底部， 與燈罩300組成一封閉之腔體以容置發光二極體模組100 並且阻止灰塵、蟲子等物體進入燈罩300影響發光二極體 模組100之燈光效果。 上述發光二極體模組100安裝於導熱體230之吸熱部 238之表面形成一三維之光源以增加發光二極體燈具之發 光效果。每一發光二極體模組100包括一電路板120及固 8 200907233 定在該電路板UG上之複數發^極體㈣。該電路板.i2〇 上設财電路（圖未示），以與對應發光二極體ιι〇電性 連接。母-電路板12Q上之電路藉由電線（圖未示）穿過 散熱器200或者其他之方法與—電源電性連接。 在本貫施中’導熱體230之吸熱部238之橫截面為十 二邊形’且吸熱部238外表面包括十二呈縱長方向延伸之 側平面252。上述發光二極體模組1〇〇安裝於這些側平面 252上，每-發光二極體模組⑽包括沿導熱體⑽轴向排 列之六發光二極體110。對應該吸熱部238之十二側平面 252,該導熱體内表面254上均勻地設有十二溝槽，每 -溝槽256對應容置-熱f 5⑽。從而，熱管直接對應 側=面252上之發光二極冑11〇卩吸收發光二極體ιι〇: 熱里。因此，發光二極體11〇產生之熱量可以迅速、均勻 地傳遍整個散熱器200。也就是說，發光二極體ιι〇產生之 熱量分別藉由導熱體230與熱管500向上傳遞，以快速分 佈至整個散熱器200，最後熱量藉由散熱鰭片24〇散發至空 氣中。 本發明發光一極體燈具藉由散熱器2〇〇及熱管5〇〇將集 中於小空間内之發光二極體模組1〇〇之立體光源產生之熱 里政發至空氣中，從而可在有限之體積内實現燈具之良好 月丈熱’進而解決了高功率發光二極體燈具之散熱問題。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 热悉本案技藝之人士，在爰依本發明精神所作之等效修飾 200907233 範圍内。 或變化’皆應涵蓋於以下之申請專利 【圖式簡單說明】 極體燈具之一優 ρ圖1係本發明具有散熱結構之發光 選實施例之立體組合圖。 分解圖 係係圖1中具有散熱結構之發光二極體燈具之立 圖3係圖丨中具有散熱結構之發光二極體燈具之立體 圖，其中不包括燈罩和透光鏡。 圖4係圖3中具有散熱結構之發光二極體燈具之剖視 圖。 【主要元件符號說明】 發光二極體模組 100 發光二極體 110 電路板 120 散熱器 200 導熱體 230 散熱部 235 吸熱部 238 散熱鰭片 240 側平面 252 内表面 254 溝槽 256 燈罩 300 開孔 310 透光鏡 400 熱管 500 10200907233 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp having a heat dissipation structure. [Prior Art] With the rapid development of the electronics industry, the operating speed of electronic components continues to increase, generating a large amount of heat during operation, which increases the temperature of itself and the system, which in turn affects the stability of the system. To ensure proper operation of the electronic components, a heat sink is installed on it to discharge the heat generated by it. A conventional solution to the heat dissipation problem of electronic components is usually to mount a heat sink on each of the heat-generating electronic components. The heat sink includes a plurality of heat-dissipating fins disposed on the bottom plate. However, for some special heat-generating electronic components, the optical effect is better, and the focus is on the focus, so that it is impossible to apply heat to the ordinary heat sink. For example, in some small-sized light-emitting diode lamps, the volume is limited to a relatively small heat sink: the module performs heat dissipation, which is the general dispersion of the «light diode" content. In view of this, it is necessary to provide a body light fixture whose heat dissipation structure can well dissipate heat from a limited air group. The utility model comprises a heat-dissipating light-emitting diode lamp with a heat-dissipating structure 20096 200907233 益光光极体 module and a lamp covering the light-emitting diode module. The heat sink comprises a hollow cylindrical heat conductor The heat conductor comprises a plurality of heat-dissipating fins extending from the outer surface of the heat-dissipating portion, and the light-emitting diode module is placed on the heat-absorbing portion of the heat conductor. The diode lamp is in contact with the light-emitting diode module by the heat-absorbing portion of the heat-conducting body of the heat sink, and then the fin of the heat-heating portion is diverged, which can be strict and right-handed. The light-emitting diode module in the limited space is well cooled to ensure efficient and stable operation of the light-emitting diode module. [Embodiment] As shown in Figure 1-2, the light-emitting diode of the present invention is shown in Figure 1-2. The lamp comprises a plurality of light-emitting diodes, a body module (10), a heat dissipation for arranging the light-emitting diode modules (10), a plurality of heat pipes for the women's heat sink 200, and a heat dissipation device installed in the heat dissipation device. 2, the middle of the lamp is set to Chuanxiong, to the fen m ^ Ding 丨 / / Zhuo 3 〇 And a light-transmitting mirror 400 fixed to the bottom of the lampshade 300. The heat sink 200 is an aluminum-extruded type of heat-dissipating body, and includes a f-hollow-tube heat-conducting body 230 and The heat conductor 23 is connected to the plurality of heat dissipation fins 240. The heat conductor 230 includes a heat dissipating portion 235 and a heat absorbing portion 238. The heat dissipating portion of the heat conductor 23 is said to have four connecting ribs extending from the surface in the axial direction. (The figure is not marked.) The top of each connecting rib is provided with a mounting hole: connected by a connecting piece - a lamp cap (not shown), the lamp cap is - standard part, can be bought on the market. These heat sink fins > 1 The outer surface of the heat dissipating portion 235 of the heat conductor 23G is lightly extended to the outer circumference, wherein each of the connecting ribs extends 200907233 with three heat dissipating fins 240. Each of the heat dissipating fins 240 extends parallel to the axial direction of the heat conductor 230. Connecting the ribs. A plurality of short fins 240 are evenly spaced on the surface of the heat conductor 230. The short fins 240 are shorter in the radial direction of the heat conductor 230 than the surrounding fins 240, and the axial length is short. The same. A plurality of adjacent heat dissipation fins 240 are formed for air. The heat conducting body 230 has a cylindrical inner surface 254, and a plurality of grooves 256 are evenly disposed on the inner surface 254 to accommodate the heat pipe 500. The groove 256 extends along the axial direction of the heat conductor 230. And connecting the heat absorbing portion 238 and the heat dissipating portion 235. Each of the heat pipes 500 is linear, and is received in the corresponding groove 256 of the heat conductor 230, and is connected to the heat radiating portion 235 and the heat absorbing portion 238 of the heat conductor 230. 1 and FIG. 2, the lamp cover 300 has a bowl-like structure and has a concave surface and an opening 310 in the middle of the concave surface. The heat absorbing portion 238 of the heat conductor 230 is received in the lamp cover 300 by the opening 310. The lamp cover 300 is configured to reflect the light emitted by the LED module 100 toward a predetermined direction. The light transmitting mirror 400 is usually made of a suitable material such as plastic or glass to achieve the effect of light transmission. The light-transmitting mirror 400 is mounted on the bottom of the lamp cover 300, and forms a closed cavity with the lamp cover 300 to accommodate the light-emitting diode module 100 and prevent objects such as dust, insects and the like from entering the lamp cover 300 to affect the light-emitting diode module 100. Lighting effects. The light emitting diode module 100 is mounted on the surface of the heat absorbing portion 238 of the heat conductor 230 to form a three-dimensional light source to increase the light emitting effect of the light emitting diode lamp. Each of the LED modules 100 includes a circuit board 120 and a plurality of transistors (4) that are fixed on the circuit board UG. The circuit board .i2〇 is provided with a circuit (not shown) for electrically connecting to the corresponding light-emitting diode. The circuit on the mother-board 12Q is electrically connected to the power source by wires (not shown) through the heat sink 200 or by other means. In the present embodiment, the heat absorbing portion 238 of the heat conductor 230 has a cross section of a dodecagonal shape, and the outer surface of the heat absorbing portion 238 includes twelve side faces 252 extending in the longitudinal direction. The light emitting diode module 1 is mounted on the side planes 252, and each of the light emitting diode modules (10) includes six light emitting diodes 110 arranged along the axial direction of the heat conductor (10). On the twelve side planes 252 of the heat absorbing portion 238, the heat conducting body surface 254 is uniformly provided with twelve grooves, and each of the grooves 256 is correspondingly accommodating - heat f 5 (10). Therefore, the heat pipe directly corresponds to the light-emitting diode 胄11〇卩 on the side=face 252 to absorb the light-emitting diode ιι〇: heat. Therefore, the heat generated by the light-emitting diode 11 can be quickly and uniformly propagated throughout the heat sink 200. That is to say, the heat generated by the light-emitting diodes ιι is respectively transmitted upward by the heat conductor 230 and the heat pipe 500 to be quickly distributed to the entire heat sink 200, and finally the heat is radiated into the air by the heat radiating fins 24. The light-emitting one-pole lamp of the present invention emits heat generated by the three-dimensional light source of the light-emitting diode module concentrated in a small space into the air by the heat sink 2〇〇 and the heat pipe 5〇〇, thereby In the limited volume, the good monthly heat of the lamp is realized, thereby solving the heat dissipation problem of the high-power light-emitting diode lamp. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and those skilled in the art will be within the scope of the equivalent modification 200907233 in accordance with the spirit of the present invention. The invention is not limited to the following patent application. [Simplified description of the drawings] One of the polar body lamps is shown in Fig. 1 as a three-dimensional combination of the light-emitting embodiments of the present invention having a heat dissipation structure. The exploded view is the vertical view of the light-emitting diode lamp having the heat dissipation structure in Fig. 1. Fig. 3 is a perspective view of the light-emitting diode lamp with the heat dissipation structure in the figure, which does not include the lamp cover and the light-transmitting mirror. 4 is a cross-sectional view of the light-emitting diode lamp having the heat dissipation structure of FIG. 3. [Main component symbol description] LED module 100 LED diode 110 Circuit board 120 Heat sink 200 Thermal conductor 230 Heat sink 235 Heat sink 238 Heat sink fin 240 Side plane 252 Inner surface 254 Groove 256 Shade 300 Opening 310 Transmissive mirror 400 Heat pipe 500 10