1335402 099年08月03日修正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種發光二極體燈具，特別涉及一種具有散 熱結構之發光二極體燈具。 【先前技術】 [0002] 隨著電子產業飛速發展，電子元件運行速度不斷提升， 運行時產生大量熱量，使其本身及系統溫度升高，繼而 影響其系統之穩定性。為確保電子元件能正常運行，通 常在其上安裝一散熱器，以排出其所產生之熱量。 [0003] 電子元件散熱問題之傳統解決方案通常係在每個發熱電 子元件上安裝一散熱器，該散熱器包括與電子元件緊密 接觸之一底板、設於底板上.之複數散熱鰭片。但是，對 於一些特殊之發熱電子元件為達到較好之光學效果，往 往相對集中，這樣則無法應用普通之散熱器對其散熱。1335402 Revision of the replacement page on August 3, 099. Description of the Invention: [Technical Field] [0001] The present invention relates to a light-emitting diode lamp, and more particularly to a light-emitting diode lamp having a heat dissipation structure. [Prior Art] [0002] With the rapid development of the electronics industry, the operating speed of electronic components continues to increase, generating a large amount of heat during operation, which increases the temperature of itself and the system, which in turn affects the stability of the system. To ensure proper operation of the electronic components, a heat sink is usually installed on them to dissipate the heat generated by them. [0003] A conventional solution to the problem of heat dissipation of electronic components is to mount a heat sink on each of the heat-generating electronic components. The heat sink includes a plurality of heat-dissipating fins that are in close contact with the electronic components and are disposed on the substrate. However, for some special heat-generating electronic components, in order to achieve better optical effects, they are relatively concentrated, so that ordinary heat sinks cannot be used for heat dissipation.
[0004] 例如，在一些體積較小之發光二極體燈具内，需要用一 體積被限制得相對很小之散熱器來同時對複數發光二極 體模組進行散熱，這是普通散熱器無法做到。 【發明内容】 [0005] 有鑒於此，有必要提供一種具有散熱結構之發光二極體 燈具，其散熱結構能對有限空間内之多個發光二極體模 組進行良好之散熱。 [0006] 一種具有散熱結構之發光二極體燈具，其包括一散熱器 、一發光二極體模組及一罩設該發光二極體模組之燈罩 ，該散熱器包括一中空之筒狀導熱體，該導熱體包括一 096128533 表單編號A0101 第3頁/共13頁 0993277420-0 1335402 099年08月03日修正替換頁 散熱部和一吸熱部，該散熱部外表面延伸有複數散熱鰭 片，該發光二極體模組貼置於導熱體之吸熱部。 [0007] 本發明發光二極體燈具藉由散熱器之導熱體之吸熱部與 發光二極體模組接觸吸熱，再將熱量傳遞至燈具外部散 熱部之鰭片進行散熱，可對燈具有限之空間内之發光二 極體模組進行良好之散熱，以確保發光二極體模組高效 、穩定地工作。 【實施方式】 [0008] 如圖1-2所示，本發明發光二極體燈具包括複數發光二極 | 體模組100、一用於安置該等發光二極體模組100之散熱 - 器200、安裝於該散熱器20Θ内之複數熱管500、一安裝 於該散熱器200中部之燈罩300，以及一固定在燈罩300 底部之透光鏡400。 [0009] 請參閱圖3和圖4，上述散熱器200為鋁擠型散熱器，其包 括一中空筒狀之導熱體230及與該導熱體230連接之複數 ^ 散熱鰭片240。該導熱體230包括一散熱部235與一吸熱 部238。該導熱體230之散熱部235自表面沿軸向方向上 < 延伸有四連接肋（圖未標）。每一連接肋頂部均設有一安 裝孔以藉由連接件連接一燈頭（圖未示），該燈頭為一標 準件，可從市場上購買。該等散熱鰭片240自該導熱體 230之散熱部235之外表面向外圓周輻射延伸，其中每一 連接肋上延伸有三散熱鰭片240。每一散熱鰭片240沿導 熱體230之軸向方向延伸平行連接肋。在該導熱體230之 表面上均勻間隔分佈複數短散熱鰭片240，該等短散熱鰭 片240在該導熱體230徑向上之長度比周圍之散熱鰭片 096128533 表單编號A0101 第4頁/共13頁 0993277420-0 1335402 099年08月03日修正替换頁 240短，而轴向長度相同。相鄰之散熱鰭片240之間形成 複數以供空氣流通之氣流通道。該導熱體230具有一圓柱 形之内表面254，在内表面254上均勻地設有複數溝槽 256，以容置熱管500。該溝槽256沿導熱體230之軸向延 伸，並貫穿連接吸熱部238與散熱部235。每一熱管500 呈直線狀，收容於導熱體230之對應之溝槽256，並且連 接導熱體230之散熱部235與吸熱部238。 [0010] 請再參閱圖1和圖2，上述燈罩300呈碗狀結構，具有一凹 ^ 面及在該凹面中部設有一開孔310，導熱體230之吸熱部 . 238藉由該開孔310而收容於該燈罩300内。該燈罩300用 於將發光二極體模組100所發出之光朝一預設之方向反射 〇 7；' [0011] 該透光鏡400通常由塑膠、玻璃等合適之材料做成，以達 到透光之效果。該透光鏡400安裝在燈罩300之底部，與 燈罩300組成一封閉之腔體以容置發光二極體模組100並 且阻止灰塵、蟲子等物體進入燈罩300影響發光二極體模 • 組100之燈光效果。 [0012] 上述發光二極體模組100安裝於導熱體230之吸熱部238 之表面形成一三維之光源以增加發光二極體燈具之發光 效果。每一發光二極體模組100包括一電路板120及固定 在該電路板120上之複數發光二極體110。該電路板120 上設置有電路（圖未示），以與對應發光二極體110電性 連接。每一電路板120上之電路藉由電線（圖未示）穿過 散熱器200或者其他之方法與一電源電性連接。 096128533 表單編號A0101 第5頁/共13頁 0993277420-0 1335402 099年08月03日修正替换頁 [0013] 在本實施中，導熱體230之吸熱部238之橫截面為十二邊 形，且吸熱部238外表面包括十二呈縱長方向延伸之側平 面252。上述發光二極體模組100安裝於這些側平面252 上，每一發光二極體模組100包括沿導熱體230軸向排列 之六發光二極體110。對應該吸熱部238之十二側平面 252，該導熱體内表面254上均勻地設有十二溝槽256， 每一溝槽256對應容置一熱管500。從而，熱管500直接 對應側平面252上之發光二極體110以吸收發光二極體 110之熱量。因此，發光二極體110產生之熱量可以迅速 、均勻地傳遍整個散熱器200。也就是說，發光二極體 110產生之熱量分別藉由導熱體230與熱管500向上傳遞 ，以快速分佈至整個散熱器200，最後熱量藉由散熱鰭片 240散發至空氣中》 [0014] 本發明發光二極體燈具藉由散熱器200及熱管500將集中 於小空間内之發光二極體模組100之立體光源產生之熱量 散發至空氣中，從而可在有限之體積内實現燈具之良好 散熱，進而解決了高功率發光二極體燈具之散熱問題。 [0015] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0016] 圖1係本發明具有散熱結構之發光二極體燈具之一優選實 施例之立體組合圖。 096128533 圖2係係圖1中具有散熱結構之發光二極體燈具之立體分 表單編號A0101 第6頁/共13頁 0993277420-0 [0017] 1335402 099年08月03日按正替换頁 解圖。 [0018] 圖3係圖1中具有散熱結構之發光二極體燈具之立體圖， 其中不包括燈罩和透光鏡。 [0019] 圖4係圖3中具有散熱結構之發光二極體燈具之剖視圖。 【主要元件符號說明】 [0020] 發光二極體模組：100 [0021] 電路板：120[0004] For example, in some small-sized light-emitting diode lamps, it is necessary to use a heat sink with a relatively small volume to simultaneously dissipate heat from the plurality of light-emitting diode modules. Do it. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a light-emitting diode lamp having a heat dissipation structure, the heat dissipation structure capable of performing good heat dissipation on a plurality of light-emitting diode modules in a limited space. [0006] A light-emitting diode lamp having a heat dissipation structure includes a heat sink, a light-emitting diode module, and a lamp cover covering the light-emitting diode module, the heat sink including a hollow cylindrical shape The heat conductor includes a 096128533 Form No. A0101 Page 3 / 13 pages 0993277420-0 1335402 Modified on August 03, 2003, the replacement page heat dissipation portion and a heat absorption portion, the heat dissipation portion has a plurality of heat dissipation fins extending on the outer surface thereof The light emitting diode module is placed on the heat absorption portion of the heat conductor. [0007] The light-emitting diode lamp of the present invention absorbs heat by contacting the heat-absorbing portion of the heat-conducting body of the heat sink with the light-emitting diode module, and then transfers the heat to the fin of the heat-dissipating portion of the lamp for heat dissipation, which can be limited to the lamp. The light-emitting diode module in the space performs good heat dissipation to ensure efficient and stable operation of the light-emitting diode module. [Embodiment] As shown in FIG. 1-2, a light-emitting diode lamp of the present invention includes a plurality of light-emitting diodes, a body module 100, and a heat-dissipating device for arranging the light-emitting diode modules 100. 200. A plurality of heat pipes 500 installed in the heat sink 20, a lamp cover 300 installed in the middle of the heat sink 200, and a light transmitting mirror 400 fixed to the bottom of the lamp cover 300. Referring to FIG. 3 and FIG. 4, the heat sink 200 is an aluminum extruded heat sink, and includes a hollow cylindrical heat conductor 230 and a plurality of heat dissipation fins 240 connected to the heat conductor 230. The heat conductor 230 includes a heat dissipation portion 235 and a heat absorption portion 238. The heat radiating portion 235 of the heat conductor 230 extends from the surface in the axial direction and has four connecting ribs (not shown). A mounting hole is formed in the top of each connecting rib to connect a lamp cap (not shown) by a connecting member, which is a standard member and is commercially available. The heat dissipation fins 240 radiate from the outer surface of the heat dissipation portion 235 of the heat conductor 230 to the outer circumference, and three heat dissipation fins 240 extend from each of the connection ribs. Each of the heat dissipation fins 240 extends in parallel with the connecting ribs in the axial direction of the heat conductor 230. A plurality of short heat dissipation fins 240 are evenly spaced on the surface of the heat conductor 230. The length of the short heat dissipation fins 240 in the radial direction of the heat conductor 230 is smaller than the surrounding heat dissipation fins 096128533. Form No. A0101 Page 4 / Total 13 pages 0993277420-0 1335402 Modified on August 03, 099, the replacement page 240 is short and the axial length is the same. An air flow passage is formed between the adjacent heat dissipation fins 240 for air circulation. The heat conductor 230 has a cylindrical inner surface 254, and a plurality of grooves 256 are evenly disposed on the inner surface 254 to accommodate the heat pipe 500. The groove 256 extends in the axial direction of the heat conductor 230 and penetrates through the heat absorbing portion 238 and the heat radiating portion 235. Each of the heat pipes 500 is linearly received, and is received in a corresponding groove 256 of the heat conductor 230, and is connected to the heat radiating portion 235 and the heat absorbing portion 238 of the heat conductor 230. Referring to FIG. 1 and FIG. 2, the lampshade 300 has a bowl-like structure, has a concave surface, and has an opening 310 in the middle of the concave surface, and the heat absorbing portion 238 of the heat conductor 230 is through the opening 310. It is housed in the lamp cover 300. The lamp cover 300 is configured to reflect the light emitted by the LED module 100 toward a predetermined direction; [0011] The transmissive mirror 400 is generally made of a suitable material such as plastic or glass to achieve transparency. The effect of light. The light transmissive mirror 400 is mounted on the bottom of the lamp cover 300, and forms a closed cavity with the lamp cover 300 to accommodate the light emitting diode module 100 and prevent objects such as dust, insects and the like from entering the lamp cover 300 to affect the light emitting diode module. Light effects. The light emitting diode module 100 is mounted on the surface of the heat absorbing portion 238 of the heat conductor 230 to form a three-dimensional light source to increase the light emitting effect of the light emitting diode lamp. Each of the LED modules 100 includes a circuit board 120 and a plurality of LEDs 110 mounted on the circuit board 120. The circuit board 120 is provided with a circuit (not shown) for electrically connecting to the corresponding light-emitting diode 110. The circuit on each circuit board 120 is electrically connected to a power source through a heat sink 200 or other means by wires (not shown). 096128533 Form No. A0101 Page 5 of 13 0993277420-0 1335402 Correction Replacement Page of August 03, 099 [0013] In the present embodiment, the heat absorbing portion 238 of the heat conductor 230 has a cross section of a dodecagonal shape and absorbs heat. The outer surface of portion 238 includes twelve side faces 252 that extend longitudinally. The LED module 100 is mounted on the side planes 252. Each of the LED modules 100 includes six LEDs 110 arranged along the axial direction of the heat conductor 230. The twelve heat-conducting surfaces 254 of the heat-receiving portion 238 are uniformly provided with twelve grooves 256, and each of the grooves 256 accommodates a heat pipe 500. Thus, the heat pipe 500 directly corresponds to the light-emitting diode 110 on the side plane 252 to absorb the heat of the light-emitting diode 110. Therefore, the heat generated by the light-emitting diode 110 can be transmitted throughout the heat sink 200 quickly and uniformly. That is to say, the heat generated by the LEDs 110 is respectively transmitted upward by the heat conductor 230 and the heat pipe 500 to be quickly distributed to the entire heat sink 200, and finally the heat is radiated to the air by the heat dissipation fins 240. [0014] The invention discloses that the light-emitting diode lamp emits heat generated by the three-dimensional light source of the light-emitting diode module 100 concentrated in the small space into the air by the heat sink 200 and the heat pipe 500, so that the lamp can be implemented in a limited volume. The heat dissipation further solves the heat dissipation problem of the high-power light-emitting diode lamp. [0015] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0016] FIG. 1 is a perspective assembled view of a preferred embodiment of a light-emitting diode lamp having a heat dissipation structure of the present invention. 096128533 Figure 2 is a three-dimensional subsection of the light-emitting diode lamp with heat dissipation structure in Figure 1. Form No. A0101 Page 6 of 13 0993277420-0 [0017] 1335402 August 3, 099, according to the replacement page. 3 is a perspective view of a light-emitting diode lamp having a heat dissipation structure in FIG. 1, which does not include a lamp cover and a light-transmitting mirror. [0018] FIG. 4 is a cross-sectional view of the light-emitting diode lamp having the heat dissipation structure of FIG. 3. [Main component symbol description] [0020] Light-emitting diode module: 100 [0021] Circuit board: 120
[0022] 導熱體：230 [0023] 吸熱部：238 [0024] 側平面：25 2 [0025] 溝槽：256 [0026] 開孔：310 [0027] 熱管：500[0022] Thermal conductor: 230 [0023] Heat sink: 238 [0024] Side plane: 25 2 [0025] Trench: 256 [0026] Opening: 310 [0027] Heat pipe: 500
[0028] 發光二極體：110 [0029] 散熱器：200 [0030] 散熱部：235 [0031] 散熱鰭片：240 [0032] 内表面：254 [0033] 燈罩：30 0 [0034] 透光鏡：40 0 096128533 表單編號A0101 第7頁/共13頁 0993277420-0[0028] Light-emitting diode: 110 [0029] Heat sink: 200 [0030] Heat sink: 235 [0031] Heat sink fin: 240 [0032] Inner surface: 254 [0033] Lampshade: 30 0 [0034] Light-transmitting Mirror: 40 0 096128533 Form No. A0101 Page 7 / Total 13 Page 0993277420-0